CN112053980A - Micro-wire connecting device - Google Patents
Micro-wire connecting device Download PDFInfo
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- CN112053980A CN112053980A CN202011037539.6A CN202011037539A CN112053980A CN 112053980 A CN112053980 A CN 112053980A CN 202011037539 A CN202011037539 A CN 202011037539A CN 112053980 A CN112053980 A CN 112053980A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/431—Pre-treatment of the preform connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/43985—Methods of manufacturing wire connectors involving a specific sequence of method steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a micro-wire connecting device, and belongs to the technical field of electrochemical machining. The device comprises an electrodeposition unit, a chip positioning unit, a solution circulating unit, a Z-direction moving unit and a horizontal moving unit. Wherein, the electrodeposition unit consists of a spray head, a spray head cover, an annular anode and a sleeve. After assembly, the inner surface of the conical part of the sleeve and the outer surface of the conical part of the spray head matched with the inner surface form a cavity with an open lower end and a sealed upper end. When the pump starts to work, the electrolyte flows out of the liquid outlet of the electrodeposition unit, flows through the micro-wire and the surface of the chip, is sucked into the cavity at the lower end of the electrodeposition unit from the liquid suction port, and then returns to the solution circulation unit from the electrolyte outlet hole. The invention can form a controllable electro-deposition micro area on the surface of the chip, realizes the rapid positioning and connection of the micro wire and the micro chip in the vertical direction, and has high positioning accuracy and good domain limitation.
Description
Technical Field
The invention relates to a micro-wire connecting device, in particular to a device for realizing the connection of a micro-wire and a chip by adopting an electrodeposition mode.
Background
In the existing chip lead connection technology, ultrasonic bonding (bonding) is a commonly used connection method, but for connection materials with too high hardness or too high melting point and chip lead connection with too small chip area, the ultrasonic bonding method cannot obtain good connection quality and high connection efficiency. Welding methods based on the melting principle (such as laser welding, resistance welding and the like) often cause the conductive film on the chip to be heated and wrinkled or cannot be heated to the required connection temperature due to the heat source problem, so that reliable and effective connection quality cannot be obtained. Therefore, a new process and apparatus is needed for chip wire bonding for special cases.
The electrochemical deposition technology is a processing mode which makes metal atoms grow gradually on the surface of a conductive substrate by utilizing an electrochemical principle, and is characterized in that the manufacturing process starts from an atom scale, conditions such as high temperature, high pressure and the like are not needed, fixed-point positioning filling growth of materials is easy to realize, the connection strength is high, and the reliability is good. For example, patent publication No. CN210506578U proposes an electroplating connection device for micro wires, which utilizes a liftable connection pressure head to lightly press the micro wires onto the conductive film of the chip, and starts to deposit a metal layer between the micro wires and the conductive film under the action of an electric field, thereby realizing the electroplating connection between the micro wires and the chip. The connecting device proposed in this patent can realize parallel fixation and parallel connection of the micro-wires and the conductive film, unlike the conventional ultrasonic bonding in which the chip and the micro-wires are perpendicularly connected. With the development of technology, more chips with smaller sizes are available, and how to realize connection between micro wires and chips in a smaller area in various ways is a problem to be solved by the connection process.
Disclosure of Invention
In view of the above problems, the present invention provides a micro-wire connection device, which is used to realize the vertical connection of micro-wires on a chip, and aims to solve the problem of precise vertical connection between micro-wires and a chip by using an electrodeposition technology. The device realizes the vertical accurate positioning of the micro-conducting wire on the chip through the displacement sensor and the Z-direction moving unit, realizes the continuous circulation of electrolyte in a small range of an electrodeposition area through the suction force of a pump, controls the size of the electrodeposition area on the chip through the designed special structure of the electrodeposition unit, and finally realizes the reliable connection of the micro-conducting wire and the chip.
In order to achieve the purpose, the technical scheme of the invention is as follows: a micro-wire connecting device comprises an electro-deposition unit, a chip positioning unit, a solution circulating unit, a Z-direction moving unit and a horizontal moving unit. The electro-deposition unit is arranged on a positioning ring of the Z-direction moving unit, the Z-direction moving unit is arranged on a supporting frame, and the supporting frame is arranged on the base; the chip is fixed on the chip positioning unit, the chip positioning unit is arranged in the liquid storage tank, the liquid storage tank is arranged on the horizontal moving unit, and the horizontal moving unit is arranged on the base. .
The electrodeposition unit comprises a spray head, a spray head cover, an annular anode and a sleeve. The sprayer is a hollow structure of an upper cylinder and a lower cone, a larger cavity on the inner surface of the upper cylinder is a solution buffer cavity, an external thread structure is arranged on the outer surface of the upper cylinder, and solution channel grooves for absorbing electrolyte are arranged on two sides of the lower cone. The sprayer cover is assembled at the upper part of the sprayer, and a closed cavity is formed by the sprayer cover and the solution buffer cavity at the upper part of the sprayer; the sprayer cover is provided with a wire fixing pipe hole and a solution diversion hole, the wire fixing pipe hole is used for inserting a wire fixing pipe, and the solution diversion hole is used for connecting an electrolyte circulation pipeline. The annular anode is arranged in the solution buffer cavity at the upper part of the spray head and is connected with the anode of the electrodeposition power supply. The sleeve is of a hollow structure with an upper cylinder and a lower cone with flanges, and the inner surface of the upper cylinder is provided with an internal thread structure which can be coaxially assembled and matched with the external thread on the outer surface of the spray head cylinder; the flange is used for fixing the electrodeposition unit on the positioning ring of the Z-direction moving unit; electrolyte outlet holes are formed in two sides of the lower cone of the sleeve and are used for being connected with a circulating pipeline of the solution circulating unit.
And an annular groove is formed below the external thread on the outer surface of the spray head cylinder and used for placing a sealing gasket so as to ensure the matching tightness of the spray head and the sleeve.
After the sleeve and the nozzle are assembled, the inner surface of the conical part of the sleeve and the outer surface of the conical part of the nozzle matched with the inner surface form a cavity with a certain space, the lower end of the cavity is open, and the upper end of the cavity is sealed.
The diameter of a liquid suction port and the diameter of a liquid outlet of the electrodeposition unit can be adjusted according to the requirement of the size of an electrodeposition area.
After the electro-deposition unit is assembled, in order to be beneficial to forming negative pressure when the pump works, the liquid suction port of the sleeve exceeds the liquid outlet of the spray head by a certain length, and the optional length is 2-4 mm.
After the electro-deposition unit is assembled, the height of the liquid suction port of the sleeve from the surface of the chip is adjustable and can be selected to be 1-2 mm. .
The lead fixing pipe is assembled in a lead fixing pipe hole of the sprayer cover, the outer diameter of the lead fixing pipe is equal to the size of the lead fixing pipe hole, the inner diameter of the lead fixing pipe is equal to the diameter of a micro-lead, the lower end of the lead fixing pipe exceeds a sprayer liquid outlet for a certain length, the length can be adjusted according to the distance from a sleeve liquid suction port to the surface of a chip, and the optional length is 1-3 mm.
The micro-wire is assembled in the wire fixing tube and exceeds the lower end of the wire fixing tube by a certain length, and the selectable length is 0.5-1 mm.
The solution circulating unit comprises a circulating pipeline, a pump and a solution tank; one end of the circulating pipeline is connected with the solution guide hole on the sprayer cover, and the other end of the circulating pipeline is connected with the electrolyte outlet holes on the two sides of the sleeve.
The chip positioning unit comprises a clamping bolt, a movable block and a fixed block, and can realize the fixation and clamping of the chip on the chip positioning unit.
The Z-direction moving unit comprises a Z-direction stepping motor, a Z-direction coupler, a Z-direction lead screw, a Z-direction guide rail, a positioning ring and a Z-direction nut slider; the positioning ring is arranged on the Z-direction nut sliding block and is used for being matched with a sleeve of the electro-deposition unit.
The horizontal moving unit comprises an X-direction moving unit and a Y-direction moving unit; wherein, the X-direction moving unit comprises an X-direction sliding table and a spiral handle; the Y-direction moving unit comprises a Y-direction stepping motor, a Y-direction lead screw, a Y-direction coupler, a Y-direction guide rail and a Y-direction nut slider; the X-direction moving unit is arranged on a Y-direction nut slider of the Y-direction moving unit, and the Y-direction moving unit is arranged on the base.
When the chip starts to work, the electrolyte flows through the solution diversion holes along the circular pipeline from the solution tank under the action of the height difference, enters the solution buffer cavity, then flows through the gap between the spray head and the lead fixing pipe from the lower part of the solution buffer cavity, and then flows out of the spray head liquid outlet to reach the surface of the chip; when the pump works, a certain negative pressure is generated at a cavity formed by the inner surface of the conical part of the sleeve and the outer surface of the conical part of the spray head matched with the inner surface of the conical part of the sleeve, electrolyte is sucked into the solution channel grooves and the negative pressure cavity arranged at two sides of the outer surface of the spray head under the action of the negative pressure, and finally flows out from the electrolyte outlet holes arranged at two sides of the sleeve and enters the pump body from the circulating pipeline, so that the circulation of the electrolyte is realized.
The invention has the beneficial effects that: the micro-wire connecting device provided by the invention can conveniently and quickly realize the vertical positioning and fixing of the micro-wire in the connecting area, realizes the connection between the micro-wire and the chip in the vertical direction through the continuous growth of metal atoms in the electrodeposition process, has no residual stress and thermal stress in the processing process, and is quick, accurate and reliable in positioning and connection.
Drawings
FIG. 1 is a schematic view of the overall structure of an electrodeposition connection device.
FIG. 2 is a schematic structural view of an electrodeposition unit.
FIG. 3 is a schematic view showing the flow of electrolyte in the region between the electrodeposition cell and the chip before the pump is operated.
FIG. 4 is a schematic view showing the flow of the electrolyte in the region between the electrodeposition cell and the chip when the pump is operated.
Reference numbers in the figures: 1. an electrodeposition unit, wherein: 1-1 spray head cover, 1-1-1 lead fixing pipe hole, 1-1-2 solution guide hole, 1-1-3 spray head cover, 1-2 solution buffer cavity, 1-3 annular anode, 1-4 spray head, 1-5 sleeve, 1-6 solution channel groove, 1-7 electrolyte outlet hole, 1-8 liquid outlet and 1-9 liquid suction port; 2. an electrodeposition power supply; 3. A chip; 4. a chip positioning unit, wherein: 4-1 clamping bolt, 4-2 movable block and 4-3 fixed block; 5. a liquid storage tank; 6. a base; 7. a Z-direction mobile unit, wherein: the device comprises a 7-1Z-direction stepping motor, a 7-2Z-direction coupler, a 7-3Z-direction lead screw, a 7-4Z-direction guide rail, a 7-5 positioning ring and a 7-6Z-direction nut slider; 8. A solution circulation unit, wherein: an 8-1 solution tank, 8-2 circulating pipelines and 8-3 pumps; 9. a flange; 10. a support frame; 11. a sealing gasket; 12. an annular groove; 13. A horizontal movement unit, wherein: 13-1Y-direction moving unit, 13-1-1Y-direction stepping motor, 13-1-2Y-direction screw rod, 13-1-3Y-direction coupler, 13-1-4Y-direction guide rail, 13-1-5Y-direction nut slider, 13-2X-direction moving unit, 13-2-1X-direction sliding table and 13-2-2 spiral handle; 14. a displacement sensor; 15. A lead fixing tube; 16. a micro-wire.
Detailed Description
The following further describes the implementation of the present invention with reference to the accompanying drawings.
A micro-wire connection device, comprising: comprises an electro-deposition unit 1, a chip positioning unit 4, a solution circulating unit 8, a Z-direction moving unit 7 and a horizontal moving unit 13. The chip 3 is fixed on the chip positioning unit 4, the chip positioning unit 4 is fixed in the liquid storage tank 5, the liquid storage tank 5 is fixed on the horizontal moving unit 13, and the horizontal moving unit 13 is arranged on the base 6; the electro-deposition unit 1 is fixed on a positioning ring 7-5 of a Z-direction moving unit 7, the Z-direction moving unit 7 is arranged on a supporting frame 10, and the supporting frame 10 is arranged on a base 6.
The electrodeposition unit 1 comprises a spray head 1-4, a spray head cover 1-1, an annular anode 1-3 and a sleeve 1-5; the spray head 1-4 is a hollow structure with an upper cylinder and a lower cone, the larger cavity at the center of the upper part is a cavity with an external thread structure on the outer surface of the cylinder, and solution channel grooves 1-6 for absorbing electrolyte are arranged at two sides of the lower cone; the spray head cover 1-1 is assembled at the upper part of the spray head 1-4, and a solution buffer chamber 1-2 at the upper part of the spray head 1-4 forms a closed cavity; the sprayer cover 1-1 is provided with a lead fixing tube hole 1-1-1 and a solution guide hole 1-1-2, the lead fixing tube hole 1-1-1 is used for inserting a lead fixing tube 15, and the solution guide hole 1-1-2 is used for connecting an electrolyte circulating pipeline 8-2; the annular anode 1-3 is arranged in the solution buffer chamber 1-2 at the upper part of the spray head 1-4 and is connected with the anode of the electrodeposition power supply 2; the sleeve 1-5 is a hollow structure with an upper cylinder and a lower cone of a flange 9, the inner surface of the upper cylinder is provided with an internal thread structure, and the internal thread structure can be coaxially assembled and matched with the external thread on the outer surface of the cylinder of the spray head 1-4; the flange 9 is used for fixing the electrodeposition unit 1 on a positioning ring 7-5 of the Z-direction moving unit 7; electrolyte outlet holes 1-7 are formed in two sides of the lower cone of the sleeve 1-5 and used for being connected with a circulating pipeline 8-2 of a solution circulating unit 8.
An annular groove 12 is arranged below the external thread of the spray head 1-4 and used for placing a sealing gasket 11 so as to ensure the matching tightness of the spray head 1-4 and the sleeve 1-5.
The solution circulating unit 8 comprises a solution tank 8-1, a circulating pipeline 8-2 and a pump 8-3; one end of the circulating pipeline 8-2 is connected with the solution guide hole 1-1-2 on the sprayer cover 1-1, and the other end is connected with the electrolyte outlet holes 1-7 at the two sides of the sleeve 1-5.
The chip positioning unit 4 comprises a clamping bolt 4-1, a movable block 4-2 and a fixed block 4-3, and can realize the fixation and clamping of the chip 3 on the chip positioning unit.
The Z-direction moving unit 7 comprises a Z-direction stepping motor 7-1, a Z-direction coupler 7-2, a Z-direction lead screw 7-3, a Z-direction guide rail 7-4, a positioning ring 7-5 and a Z-direction nut slider 7-6; the positioning ring 7-5 is arranged on the Z-direction nut sliding block 7-6 and is used for being matched with the sleeve 1-5 of the electro-deposition unit 1.
The horizontal moving unit 13 comprises a Y-direction moving unit 13-1 and an X-direction moving unit 13-2; wherein, the X-direction moving unit 13-2 comprises an X-direction sliding table 13-2-1 and a spiral handle 13-2-2; the Y-direction moving unit 13-1 comprises a Y-direction stepping motor 13-1-1, a Y-direction lead screw 13-1-2, a Y-direction coupler 13-1-3, a Y-direction guide rail 13-1-4 and a Y-direction nut slider 13-1-5; the X-direction moving unit 13-2 is arranged on a Y-direction nut slider 13-1-5 of the Y-direction moving unit 13-1, and the Y-direction moving unit 13-1 is arranged on the base 6.
When in work, the following steps are executed:
(1) the chip 3 is arranged between a movable block 4-2 and a fixed block 4-3 of a chip positioning unit 4, and a clamping bolt 4-1 is adjusted to clamp and fix the chip 3 on the chip positioning unit 4;
(2) the sleeve 1-5 is fitted over the nozzle head 1-4, the nozzle head cover 1-1 is fitted over the nozzle head 1-4, the wire fixing tube 15 is inserted into the wire fixing tube hole 1-1-1 of the nozzle head cover 1-1, the micro-wire 16 is inserted into the wire fixing tube 15, and then the electrodeposition unit 1 is fitted over the positioning ring 7-5 of the Z-direction moving unit 7. Because the inner surface of the conical part of the sleeve 1-5 and the outer surface of the conical part of the spray head have a fit clearance with a certain distance, after the sleeve 1-5 and the spray head 1-4 are assembled, a cavity with an open lower end and a sealed upper end is formed between the sleeve 1-5 and the spray head 1-4. The length of the liquid suction port 1-9 exceeding the liquid outlet 1-8 is set to be 3 mm;
(3) adjusting the distance of the lower end of the lead fixing tube 15 exceeding the liquid outlet by 1-8 mm to be 2.5 mm; the distance of the micro-wire 16 beyond the lower end of the wire fixing tube 15 is 1 mm;
(4) the electro-deposition unit 1 is driven by a Z-direction stepping motor 7-1 to move downwards to a position right above a connection area of the chip 3, so that the distance from a liquid suction port 1-9 to the upper surface of the chip 3 is 1mm, and the distance from the lower end of the micro-wire 16 to the upper surface of the chip 3 is 0.5 mm;
(5) the solution tank 8-1 is connected with the pump 8-3 by a circulating pipeline 8-2, the circulating pipeline 8-2 led out from one end of the solution tank 8-1 is connected with the solution guide hole 1-1-2 on the sprayer cover 1-1, and the circulating pipeline 8-2 led out from one end of the pump 8-3 is connected with the electrolyte outlet holes 1-7 on two sides of the sleeve 1-5. Placing a solution tank 8-1 above the electrodeposition unit 1, and enabling the electrolyte to flow to the surfaces of the micro-wires 16 and the chip 3 through a gap between a solution diversion hole 1-1-2, a solution buffer cavity 1-2, an inner cavity of the spray head 1-4 and a wire fixing pipe 15 in sequence by utilizing height difference;
(6) opening a pump 8-3, generating suction force between a matching gap between a sleeve 1-5 and a spray head 1-4, adjusting the diameters of liquid beams of a liquid suction port 1-9 and a liquid outlet 1-8 of an electrodeposition unit 1 to proper sizes according to electrodeposition process parameters and the size of an electrodeposition area, so that the electrolyte flowing to the surface of the micro lead 16 and the chip 3 is sucked into a solution channel tank 1-6 under the action of the suction force and flows back to a solution tank 8-1 through an electrolyte outlet hole 1-7;
(7) and (3) connecting the annular anodes 1-3 with the anode of the electrodeposition power supply 2, and connecting the chip 3 with the cathode of the electrodeposition power supply 2 to start electrodeposition. The deposited metal layer starts to grow on the chip 3 and the connection is completed when the grown metal layer fills the gap between the micro-wire 16 and the chip 3 and covers a portion of the micro-wire 16.
Claims (8)
1. A micro-wire connecting device is characterized by comprising an electro-deposition unit, a chip positioning unit, a solution circulating unit, a Z-direction moving unit and a horizontal moving unit; the electro-deposition unit is arranged on a positioning ring of the Z-direction moving unit, the Z-direction moving unit is arranged on a support frame, the support frame is arranged on the base, the chip is fixed on the chip positioning unit, the chip positioning unit is arranged in the liquid storage tank, the liquid storage tank is arranged on the horizontal moving unit, and the horizontal moving unit is arranged on the base.
2. The micro-wire connection device of claim 1, wherein the electrodeposition unit comprises:
the spray head is of a hollow structure of an upper cylinder and a lower cone, a cavity with a larger inner surface of the upper cylinder is a solution buffer cavity, an external thread structure is arranged on the outer surface of the upper cylinder, and solution channel grooves for absorbing electrolyte are arranged on two sides of the lower cone;
the spray head cover is assembled at the upper part of the spray head, and a closed cavity is formed by the spray head cover and the solution buffer cavity at the upper part of the spray head; the spray head cover is provided with a wire fixing pipe hole and a solution diversion hole, the wire fixing pipe hole is used for inserting a wire fixing pipe, and the solution diversion hole is used for connecting an electrolyte circulation pipeline;
the annular anode is arranged in the solution buffer cavity at the upper part of the spray head and is connected with the anode of the electrodeposition power supply;
the sleeve is of a hollow structure with an upper cylinder and a lower cone with flanges; the flange of the sleeve is used for fixing the electrodeposition unit on the positioning ring of the Z-direction moving unit; the inner surface of the upper cylinder of the sleeve is provided with an internal thread structure which can be coaxially matched with the external thread of the outer surface of the cylinder of the spray head in an assembling way; electrolyte outlet holes are formed in two sides of the lower cone of the sleeve and are used for being connected with a circulating pipeline of the solution circulating unit.
3. A micro-wire connecting device as claimed in claims 1 and 2, wherein the spray head has an annular groove below the external thread on the cylindrical outer surface for receiving a sealing washer to ensure the sealing of the spray head and the sleeve.
4. The micro-wire connecting device as claimed in claims 1 and 2, wherein the inner surface of the conical portion of the sleeve and the outer surface of the conical portion of the nozzle head fitted thereto form a hollow space having an open lower end and a sealed upper end after the sleeve and the nozzle head are assembled.
5. The micro-wire connecting device as claimed in claim 1, wherein the diameter of the liquid suction port and the diameter of the liquid discharge port of the electrodeposition unit are adjustable according to the size of the electrodeposition region.
6. The micro-wire connecting device as claimed in claims 1 and 2, wherein the length of the liquid sucking port of the sleeve exceeds the liquid outlet of the nozzle by a certain length, and is selected to be 2-4 mm, so as to facilitate the negative pressure formation during the operation of the pump after the electro-deposition unit is assembled.
7. The micro-wire connecting device as claimed in claims 1 and 2, wherein the height of the liquid suction port of the sleeve from the surface of the chip is adjustable, optionally 1-2 mm, after the electrodeposition unit is assembled.
8. The micro-wire connecting device as claimed in claims 1 and 2, wherein the wire fixing tube is fitted in the wire fixing tube hole, has an outer diameter equal to the diameter of the wire fixing tube hole and an inner diameter equal to the diameter of the micro-wire, has a lower end extending beyond the liquid outlet of the nozzle by a length adjustable according to the distance from the liquid suction port of the sleeve to the surface of the chip, and has an optional length of 1 to 3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011037539.6A CN112053980A (en) | 2020-09-28 | 2020-09-28 | Micro-wire connecting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011037539.6A CN112053980A (en) | 2020-09-28 | 2020-09-28 | Micro-wire connecting device |
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| CN112053980A true CN112053980A (en) | 2020-12-08 |
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| CN202011037539.6A Pending CN112053980A (en) | 2020-09-28 | 2020-09-28 | Micro-wire connecting device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115976617A (en) * | 2022-11-23 | 2023-04-18 | 西安空间无线电技术研究所 | Silver plating process method for auxiliary anode and aluminum alloy multi-bend waveguide part |
-
2020
- 2020-09-28 CN CN202011037539.6A patent/CN112053980A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115976617A (en) * | 2022-11-23 | 2023-04-18 | 西安空间无线电技术研究所 | Silver plating process method for auxiliary anode and aluminum alloy multi-bend waveguide part |
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