CN111850660A - Simple device for preparing inner surface of super-hydrophobic pipe based on electroplating method - Google Patents
Simple device for preparing inner surface of super-hydrophobic pipe based on electroplating method Download PDFInfo
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- CN111850660A CN111850660A CN202010680250.XA CN202010680250A CN111850660A CN 111850660 A CN111850660 A CN 111850660A CN 202010680250 A CN202010680250 A CN 202010680250A CN 111850660 A CN111850660 A CN 111850660A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
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- Chemical Kinetics & Catalysis (AREA)
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- Electroplating Methods And Accessories (AREA)
Abstract
A simple device for preparing the inner surface of a super-hydrophobic pipe based on an electroplating method comprises a pipe fitting and an electroplating anode, wherein the pipe fitting and the electroplating anode are coaxially arranged between a base and a top plate; the screw rod penetrates through the top plate and the base to enclose the electroplating anode and the pipe fitting into a closed reaction cavity; the upper surfaces of the electroplating anode and the top end of the pipe fitting are provided with conductive copper sheets, the upper side surfaces of the conductive copper sheets are connected with leads, the leads are connected to a power supply through holes of a top plate, holes of the top plate and a base are opened and connected into a circulating pipeline, a peristaltic pump drives a solution in a plating solution tank to enter the pipe fitting to react and then flow back to the plating solution tank to complete circulation, and an ultrasonic transducer is arranged at the lower end of the base and coaxially arranged with the pipe. The invention solves the problem of difficult preparation of the super-hydrophobic surface in the pipe, has high cost performance, quick and convenient pipe replacement and strong sealing performance, reduces the retention of bubbles in the electroplating process by adopting the ultrasonic cavitation and accelerates the surface reaction, thereby improving the uniformity of the hydrophobic surface structure, and programming the specified current output can achieve the purpose of regulating and controlling the surface appearance.
Description
Technical Field
The invention belongs to the technical field of material surface modification, and particularly relates to a simple device for preparing the inner surface of a super-hydrophobic pipe based on an electroplating method.
Background
The surface wettability is an important property of the surface of the solid material, and the wettability of the solid surface is changed into hydrophilicity or hydrophobicity, so that certain defects of the material can be effectively improved, and the application range of the material is expanded. The solid surface with the super-hydrophobic property is almost in a non-wetting state after being contacted with water drops, the state plays an important role in the aspects of anti-freezing, microfluid, pipeline drag reduction, corrosion prevention, self-cleaning and the like, and further research finds that the micro-nano rough structure on the surface is the main reason for achieving the super-hydrophobic property.
Although many methods for preparing the superhydrophobic surface exist at present, most of the methods are prepared on a small flat plate sample, are difficult to be applied to the inner wall of a pipeline, and have self limitations, such as strong acid, complicated procedures, low processing efficiency, high dependence on the type, size and shape of materials and the like, so that the preparation of the superhydrophobic surface on the inner wall of the pipeline is greatly limited; for example, CN 103047485A adopts a super-hydrophobic coating to fill a pipeline to realize a super-hydrophobic surface, but the super-hydrophobic surface cannot reach a super-hydrophobic state due to lack of a specific micro-nano structure of the super-hydrophobic surface, so that the super-hydrophobic coating has poor anti-scouring capability, and the consistency of the coating thickness cannot be controlled by a filling method; CN110340532A utilizes laser ablation technology to prepare a super-hydrophobic structure, but high-precision laser equipment is expensive in manufacturing cost, and during the ablation process, the super-hydrophobic structure is difficult to work in a pipeline; therefore, a device for preparing the super-hydrophobic surface of the inner wall of the pipeline, which has strong bonding force, uniform structure, low manufacturing cost and environmental friendliness, is urgently needed.
Disclosure of Invention
The invention aims to solve the problems of limited operation of the inner surface, high equipment cost, complex process flow and low surface uniformity in the existing technology of the super-hydrophobic surface in the circular pipe, and provides a simple device for preparing the inner surface of the super-hydrophobic pipe based on an electroplating method.
The technical scheme of the invention is as follows:
a simple device for preparing the inner surface of a super-hydrophobic pipe based on an electroplating method comprises a pipe fitting 5 and an electroplating anode 4 which are coaxially arranged between a base 2 and a top plate 6, wherein the pipe fitting 5 surrounds the outside of the electroplating anode 4; threaded through holes are formed in the two sides of the base 2 and the top plate 6, the screw rod 9 penetrates through the top plate 6 and the base 2 through the threaded through holes, and the electroplating anode 4 and the pipe fitting 5 are enclosed into a closed reaction cavity; the bottom surface of the top plate 6 and the top surface of the base 2 are respectively provided with an anode limiting groove and a pipe fitting limiting groove for limiting the radial movement of the electroplating anode 4 and the pipe fitting 5, and the anode limiting groove and the pipe fitting limiting groove are respectively in clearance fit with the outer circles of the electroplating anode 4 and the pipe fitting 5 correspondingly; the upper surfaces of the electroplating anode 4 and the top end of the pipe fitting 5 are also provided with conductive copper sheets 7 with the same cross section shapes, the upper side surfaces of the conductive copper sheets 7 are connected with leads, and the leads are connected to a power supply 8 through holes on the top plate 6; the top plate 6 and the base 2 are both provided with holes and connected into a circulating pipeline, and the peristaltic pump 11 is used as a power source to drive the solution in the plating solution tank 10 to enter the pipe fitting 5 for reaction and then flow back to the plating solution tank 10 to complete circulation; the ultrasonic transducer 1 is arranged at the lower end of the base 2 and is coaxially arranged with the pipe fitting 5.
The plating solution tank 10 is placed in a constant-temperature water bath.
The upper end and the lower end of the electroplating anode 4 and the pipe fitting 5 are sealed by sealing gaskets, and the sealing gasket at the upper end is provided with a through hole which is convenient for a power line to pass through and be communicated with the conductive copper sheet 7.
A temperature sensor 3 for detecting the reaction temperature in the pipe 5 is also provided inside the base 2.
The upper side surface of the conductive copper sheet 7 is connected with a lead in a welding mode, the power supply 8 is a programmable power supply, and programming regulation and control are carried out according to the required topography characteristics of the super-hydrophobic surface.
The whole pipeline is wrapped by an aluminum silicate composite heat-insulating layer, glass fiber cloth wound outside the aluminum silicate composite heat-insulating layer and aluminum foil paper adhered outside the glass fiber cloth.
Compared with the prior art, the invention has the following beneficial effects:
(1) the invention solves the problem of difficult preparation of the super-hydrophobic surface of the inner wall of the pipeline by using a lower device cost and a simple operation method, reduces the dependence on an expensive high-precision adjusting device, can ensure that the device achieves good consistency by clamping the base and the top plate, has high coaxiality between the pipe fitting and the electroplating anode, provides a foundation for the uniformity of a plating layer, is also quick to disassemble when a test piece is replaced, and does not need a complex disassembly and assembly process.
(2) According to the invention, the ultrasonic transducer is arranged under the pipe fitting, so that ultrasonic energy can be concentrated and penetrate through the whole pipe fitting, and during working, the ultrasonic transducer performs an intense cavitation effect, and the ultrasonic wave generates high-frequency vibration on the plating solution, so that the inner surface reaction of the pipe fitting is accelerated, the homogenization and refinement are realized, the bubble escape speed is accelerated, and the surface reaction blockage caused by the retention of bubbles is avoided.
Drawings
FIG. 1 is a schematic view of the structure of the apparatus of the present invention.
In the figure: 1, an ultrasonic transducer; 2, a base; 3 a temperature sensor; 4, electroplating an anode; 5, pipe fittings; 6 a top plate; 7 a conductive copper sheet; 8, a power supply; 9, a screw rod; 10 plating solution tank; 11 peristaltic pump.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
As shown in FIG. 1, the device for preparing the inner surface of the simple super-hydrophobic pipe based on the electroplating method comprises a pipe 5 and an electroplating anode 4, wherein the pipe 5 and the electroplating anode are coaxially arranged between a base 2 and a top plate 6; the two sides of the top plate 6 and the base 2 are both provided with threaded through holes, and the screw rod 9 penetrates through the top plate 6 and the base 2 through the threaded through holes to enclose the electroplating anode 4 and the pipe fitting 5 into a closed reaction cavity; the bottom surface of the top plate 6 and the top surface of the base 2 are respectively provided with an anode limiting groove and a pipe fitting limiting groove, a sealing gasket matched with the electroplating anode 4 and the pipe fitting 5 is arranged in the limiting groove, the sealing gasket and the top plate 6 are provided with a through hole so that a power line can pass through and the electrode can be communicated, the limiting groove is in clearance fit with the electroplating anode 4 and the excircle of the pipe fitting 5, and a conductive copper sheet interlayer is further arranged between the gasket at the top plate and the electrode. The base 2 and the top plate 6 are respectively provided with a liquid inlet and a liquid outlet, and plating solution in the constant-temperature plating solution tank 10 sequentially enters the liquid inlet of the base 2, the interior of the pipe fitting 5 and the liquid outlet of the top plate 6 through pipelines and then flows back to the constant-temperature plating solution tank 10 to complete circulation; the ultrasonic transducer 1 is fixed on the bottom surface of the base, the axis of the ultrasonic transducer coincides with the axis of the pipe fitting 5, and the ultrasonic transducer generates ultrasonic vibration, so that the aim of enabling the pipe fitting and the plating solution to react uniformly can be achieved, and the escape behavior of generated bubbles can be accelerated.
In order to improve the internal tightness of the pipe fitting 5, the circular limiting groove is arranged to be consistent with the cross section of the electroplating anode 4, the annular limiting groove is consistent with the cross section of the pipe fitting 5, and the circular limiting groove and the annular limiting groove are arranged coaxially.
In order to reduce the space of an electrode mounting structure while maintaining the sealing property, the conductive copper sheet 7 is mounted with the electroplating anode 4 and the pipe fitting 5 in a matching way, the upper side surface of the conductive copper sheet 7 is welded with a lead, and the other end of the lead is connected with a power supply; the power supply is a programmable power supply and can be programmed and controlled according to the required topography of the super-hydrophobic surface.
In order to keep the temperature of the plating solution stable in the reaction process, the device pipelines are wrapped with an aluminum silicate composite heat-insulating layer, glass fiber cloth wound outside the aluminum silicate composite heat-insulating layer and aluminum foil paper wrapped outside the glass fiber cloth.
When the super-hydrophobic surface preparation device based on the electroplating method works, firstly, a sealing gasket and a temperature sensor 3 are placed in a groove of a base 2, a pipe fitting 5 is embedded into an annular groove of the base and is tightly attached to the sealing gasket, in order to prevent the plating anode 4 from scraping against the pipe fitting 5 in the placing process, the plating anode 4 is vertically inserted downwards into the groove of the base 2 along the axial lead of the pipe fitting 5, the top plate 6 is buckled and then fixed through a screw rod 9, plating solution in a plating solution tank 10 is adjusted to a required temperature, a peristaltic pump 11 is started to pump the plating solution into the pipe fitting 5 for circulation, the vibration frequency and the programming power output of the ultrasonic transducer 1 are adjusted, electroplating work is carried out, after the work is finished, the plated pipe fitting 5 is cleaned and dried by using absolute ethyl alcohol and deionized water, and the super-hydrophobic pipe fitting with the micro-nano structure on the inner wall can be obtained according to a required electroplating method.
Example 1:
1. pretreatment of the pipe fitting: taking a red copper tube with the length of 500mm and the inner diameter of 10mm as a pipe fitting to be plated, carrying out surface polishing, stain removal and oil removal treatment, then activating for 30S, cleaning with deionized water, and drying by blowing to obtain a treated workpiece; the components of the activating solution: 10% by volume of HCl.
2. Pipe fitting installation: firstly, the pipe 5 to be plated is installed on the base 2, the electroplating anode 4 is slowly moved to vertically move downwards to contact with the groove of the base 2, and then the screw rod 9 is screwed in to complete the sealing of the device.
3. Electroplating: use the nickel stick as electroplating anode 4, the work piece after the preliminary treatment is negative pole 5, and two poles of the earth radial distance is 4mm, electroplates in basic electroplate liquid, and the distance is 2mm between the electrode, the concrete parameter of electrodeposition: the pumping flow is 50L/h, and the component NiCl of the plating solution is NiCl2·6H2O1 mol/L, KCL 1mol/L, pH 4, plating solution temperature of 60 deg.C, and 50mA/cm 20min before programming with power supply2And then at 100mA/cm for 5min2Current density of (d); ultrasonic transducerThe circle center position of 1 is located the positive center of base 2, and the frequency of ultrasonic wave is between 15KHz and 30KHz, and the scale according to required cladding material structure minimum unit is adjusted the frequency and is 30KHz, utilizes absolute ethyl alcohol and deionized water to wash and dry in the vacuum drying oven of 50 degrees centigrade with the pipe fitting 5 that has plated after the electroplating, need not to obtain the super hydrophobic copper pipe that the inner wall has the structure of receiving a little through low surface energy processing.
Example 2:
1. pretreatment of the pipe fitting: taking a Q235 steel pipe with the length of 500mm and the inner diameter of 10mm as a pipe fitting to be plated, carrying out surface polishing, stain removal and oil removal treatment, then activating for one minute, cleaning with deionized water, and blow-drying to obtain a treated workpiece; the components of the activating solution: 0.07mol/L of H2SO4。
2. Pipe fitting installation: firstly, the pipe 5 to be plated is installed on the base 2, the electroplating anode 4 is slowly moved to vertically move downwards to contact with the groove of the base 2, and then the screw rod 9 is screwed in to complete the sealing of the device.
3. Electroplating: use copper tubing as electroplating anode 4, the work piece after the preliminary treatment is negative pole 5, and the radial distance of the two poles of the earth is 2mm, electroplates in basic electroplate liquid, and the distance is 4mm between the electrode, the concrete parameter of electrodeposition: the pumping flow is 50L/h, and the plating solution components are 50g/L and C4O10H12KNa 100g/L, plating solution temperature 60 deg.C, 1A/dm 20min before programming with power supply2After 5min at 4A/dm2Current density of (d); the center of the ultrasonic transducer 1 is located at the center of the base 2, the frequency of ultrasonic is 15KHz to 30KHz, the frequency is adjusted to 30KHz according to the scale of the minimum unit of the required coating structure, the plated pipe fitting is cleaned and dried by using absolute ethyl alcohol and deionized water after electroplating, and the super-hydrophobic steel pipe with the inner wall having the micro-nano structure can be obtained after being modified by 0.05mol/L stearic acid.
The device provided by the invention is reliable in work and convenient to operate, and can better develop related scientific research work.
While the invention has been described in further detail with reference to specific preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The simple super-hydrophobic pipe inner surface preparation device based on the electroplating method is characterized by comprising a pipe piece (5) and an electroplating anode (4), wherein the pipe piece (5) and the electroplating anode (4) are coaxially arranged between a base (2) and a top plate (6), and the pipe piece (5) is surrounded outside the electroplating anode (4); threaded through holes are formed in the two sides of the base (2) and the top plate (6), and the screw rod (9) penetrates through the top plate (6) and the base (2) through the threaded through holes to enclose the electroplating anode (4) and the pipe fitting (5) into a closed reaction cavity; an anode limiting groove and a pipe fitting limiting groove are respectively formed in the bottom surface of the top plate (6) and the top surface of the base (2) and used for limiting the radial movement of the electroplating anode (4) and the pipe fitting (5), and the anode limiting groove and the pipe fitting limiting groove are respectively in clearance fit with the outer circles of the electroplating anode (4) and the pipe fitting (5) correspondingly; the upper surfaces of the electroplating anode (4) and the top end of the pipe fitting (5) are also provided with conductive copper sheets (7) with the same cross section shapes, the upper side surfaces of the conductive copper sheets (7) are connected with leads, and the leads are connected to a power supply (8) through holes in the top plate (6); the top plate (6) and the base (2) are both provided with holes and connected into a circulating pipeline, and a peristaltic pump (11) is used as a power source to drive the solution in the plating solution tank (10) to enter the pipe fitting (5) for reaction and then flow back to the plating solution tank (10) to complete circulation; the ultrasonic transducer (1) is arranged at the lower end of the base (2) and is coaxially arranged with the pipe fitting (5).
2. The device for preparing the inner surface of the simple super-hydrophobic pipe according to the claim 1, wherein the plating solution tank (10) is placed in a constant temperature water bath.
3. The device for preparing the inner surface of the simple super-hydrophobic pipe according to the claim 1 or 2, wherein the upper and lower ends of the electroplating anode (4) and the pipe (5) are sealed by sealing gaskets, and the upper sealing gasket is provided with through holes for passing a power line and communicating with the conductive copper sheets (7).
4. The device for preparing the inner surface of the simple super-hydrophobic pipe according to the claim 1 or 2, characterized in that a temperature sensor (3) for detecting the reaction temperature in the pipe (5) is arranged in the base (2).
5. The device for preparing the inner surface of the simple super-hydrophobic pipe according to the claim 3, wherein a temperature sensor (3) for detecting the reaction temperature in the pipe (5) is further arranged in the base (2).
6. The device for preparing the inner surface of the simple superhydrophobic tube according to the claim 1, 2 or 5, wherein the connection mode of the upper side surface of the conductive copper sheet (7) and a lead is welding, the power supply (8) is a programmable power supply, and programming regulation and control are performed according to the morphological characteristics of the required superhydrophobic surface.
7. The device for preparing the inner surface of the simple superhydrophobic tube according to claim 3, wherein the upper side surface of the conductive copper sheet (7) is connected with a lead in a welding manner, and the power supply (8) is a programmable power supply and is programmed and controlled according to the morphological characteristics of the required superhydrophobic surface.
8. The device for preparing the inner surface of the simple superhydrophobic tube according to claim 4, wherein the upper side surface of the conductive copper sheet (7) is connected with a lead in a welding manner, and the power supply (8) is a programmable power supply and is programmed and controlled according to the morphological characteristics of the required superhydrophobic surface.
9. The device for preparing the inner surface of the simple super-hydrophobic pipe as claimed in claim 1, 2, 5, 7 or 8, wherein the whole pipeline is wrapped with an aluminum silicate composite heat-insulating layer, glass cloth wound outside the aluminum silicate composite heat-insulating layer and aluminum foil paper adhered outside the glass cloth.
10. The device for preparing the inner surface of the simple super-hydrophobic pipe as claimed in claim 6, wherein the whole pipeline is wrapped with an aluminum silicate composite heat-insulating layer, glass cloth wound outside the aluminum silicate composite heat-insulating layer, and aluminum foil paper adhered outside the glass cloth.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010680250.XA CN111850660A (en) | 2020-07-15 | 2020-07-15 | Simple device for preparing inner surface of super-hydrophobic pipe based on electroplating method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010680250.XA CN111850660A (en) | 2020-07-15 | 2020-07-15 | Simple device for preparing inner surface of super-hydrophobic pipe based on electroplating method |
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| CN111850660A true CN111850660A (en) | 2020-10-30 |
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| CN202010680250.XA Withdrawn CN111850660A (en) | 2020-07-15 | 2020-07-15 | Simple device for preparing inner surface of super-hydrophobic pipe based on electroplating method |
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Cited By (3)
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| CN112522748A (en) * | 2020-11-23 | 2021-03-19 | 北京科技大学 | Automatic continuous flow electroplating device and method for inner wall of pipe fitting |
| CN114318442A (en) * | 2022-03-07 | 2022-04-12 | 河南科技学院 | Pulse-assisted electrochemical deposition metal pipeline inner wall coating device and preparation method |
| CN114507888A (en) * | 2022-01-20 | 2022-05-17 | 江苏大学 | Electro-deposition preparation method and device for super-hydrophobic structure on inner wall of pipeline |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112522748A (en) * | 2020-11-23 | 2021-03-19 | 北京科技大学 | Automatic continuous flow electroplating device and method for inner wall of pipe fitting |
| CN112522748B (en) * | 2020-11-23 | 2021-10-15 | 北京科技大学 | Automatic continuous flow electroplating device and method for inner wall of pipe fitting |
| CN114507888A (en) * | 2022-01-20 | 2022-05-17 | 江苏大学 | Electro-deposition preparation method and device for super-hydrophobic structure on inner wall of pipeline |
| CN114507888B (en) * | 2022-01-20 | 2023-09-26 | 江苏大学 | Electrodeposition preparation method and device for pipeline inner wall super-hydrophobic structure |
| CN114318442A (en) * | 2022-03-07 | 2022-04-12 | 河南科技学院 | Pulse-assisted electrochemical deposition metal pipeline inner wall coating device and preparation method |
| CN114318442B (en) * | 2022-03-07 | 2022-05-24 | 河南科技学院 | Pulse-assisted electrochemical deposition metal pipeline inner wall coating device and preparation method |
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Application publication date: 20201030 |
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| WW01 | Invention patent application withdrawn after publication |