CN212461621U - Micro-wire connecting device - Google Patents
Micro-wire connecting device Download PDFInfo
- Publication number
- CN212461621U CN212461621U CN202022162633.6U CN202022162633U CN212461621U CN 212461621 U CN212461621 U CN 212461621U CN 202022162633 U CN202022162633 U CN 202022162633U CN 212461621 U CN212461621 U CN 212461621U
- Authority
- CN
- China
- Prior art keywords
- unit
- sleeve
- electrodeposition
- chip
- spray head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The patent of the utility model discloses a little wire connecting device belongs to electrochemical machining technical field. The device comprises an electrodeposition unit, a chip positioning unit, a solution circulating unit, a Z-direction moving unit and a horizontal moving unit. Wherein, the electrodeposition unit consists of a spray head, a spray head cover, an annular anode and a sleeve. After assembly, the inner surface of the conical part of the sleeve and the outer surface of the conical part of the spray head matched with the inner surface form a cavity with an open lower end and a sealed upper end. When the pump starts to work, the electrolyte flows out of the liquid outlet of the electrodeposition unit, flows through the micro-wire and the surface of the chip, is sucked into the cavity at the lower end of the electrodeposition unit from the liquid suction port, and then returns to the solution circulation unit from the electrolyte outlet hole. The utility model discloses can form controllable electrodeposition micro region on the chip surface, realize that fine wire and small chip fix a position and be connected at the quick of vertical direction, positioning accuracy is high, and the zone limiting nature is good.
Description
Technical Field
The utility model relates to a little wire connecting device especially relates to a device that little wire and chip are connected is realized to mode that adopts electrodeposition.
Background
In the existing chip lead connection technology, ultrasonic bonding (bonding) is a commonly used connection method, but for connection materials with too high hardness or too high melting point and chip lead connection with too small chip area, the ultrasonic bonding method cannot obtain good connection quality and high connection efficiency. Welding methods based on the melting principle (such as laser welding, resistance welding and the like) often cause the conductive film on the chip to be heated and wrinkled or cannot be heated to the required connection temperature due to the heat source problem, so that reliable and effective connection quality cannot be obtained. Therefore, a new process and apparatus is needed for chip wire bonding for special cases.
The electrochemical deposition technology is a processing mode which makes metal atoms grow gradually on the surface of a conductive substrate by utilizing an electrochemical principle, and is characterized in that the manufacturing process starts from an atom scale, conditions such as high temperature, high pressure and the like are not needed, fixed-point positioning filling growth of materials is easy to realize, the connection strength is high, and the reliability is good. For example, patent publication No. CN210506578U proposes an electroplating connection device for micro wires, which utilizes a liftable connection pressure head to lightly press the micro wires onto the conductive film of the chip, and starts to deposit a metal layer between the micro wires and the conductive film under the action of an electric field, thereby realizing the electroplating connection between the micro wires and the chip. The connecting device proposed in this patent can realize parallel fixation and parallel connection of the micro-wires and the conductive film, unlike the conventional ultrasonic bonding in which the chip and the micro-wires are perpendicularly connected. With the development of technology, more chips with smaller sizes are available, and how to realize connection between micro wires and chips in a smaller area in various ways is a problem to be solved by the connection process.
Disclosure of Invention
To the above problem, the utility model aims at adopting electrodeposition technology to solve the difficult problem of accurate perpendicular connection between little wire and the chip, providing a little wire connecting device, realizing the perpendicular connection of little wire on the chip. The device realizes the vertical accurate positioning of the micro-conducting wire on the chip through the displacement sensor and the Z-direction moving unit, realizes the continuous circulation of electrolyte in a small range of an electrodeposition area through the suction force of a pump, controls the size of the electrodeposition area on the chip through the designed special structure of the electrodeposition unit, and finally realizes the reliable connection of the micro-conducting wire and the chip.
In order to achieve the above purpose, the technical scheme of the utility model is that: a micro-wire connecting device comprises an electro-deposition unit, a chip positioning unit, a solution circulating unit, a Z-direction moving unit and a horizontal moving unit. The electro-deposition unit is arranged on a positioning ring of the Z-direction moving unit, the Z-direction moving unit is arranged on a supporting frame, and the supporting frame is arranged on the base; the chip is fixed on the chip positioning unit, the chip positioning unit is arranged in the liquid storage tank, the liquid storage tank is arranged on the horizontal moving unit, and the horizontal moving unit is arranged on the base.
The electrodeposition unit comprises a spray head, a spray head cover, an annular anode and a sleeve. The sprayer is a hollow structure of an upper cylinder and a lower cone, a larger cavity on the inner surface of the upper cylinder is a solution buffer cavity, an external thread structure is arranged on the outer surface of the upper cylinder, and solution channel grooves for absorbing electrolyte are arranged on two sides of the lower cone. The sprayer cover is assembled at the upper part of the sprayer, and a closed cavity is formed by the sprayer cover and the solution buffer cavity at the upper part of the sprayer; the sprayer cover is provided with a wire fixing pipe hole and a solution diversion hole, the wire fixing pipe hole is used for inserting a wire fixing pipe, and the solution diversion hole is used for connecting an electrolyte circulation pipeline. The annular anode is arranged in the solution buffer cavity at the upper part of the spray head and is connected with the anode of the electrodeposition power supply. The sleeve is of a hollow structure with an upper cylinder and a lower cone with flanges, and the inner surface of the upper cylinder is provided with an internal thread structure which can be coaxially assembled and matched with the external thread on the outer surface of the spray head cylinder; the flange is used for fixing the electrodeposition unit on the positioning ring of the Z-direction moving unit; electrolyte outlet holes are formed in two sides of the lower cone of the sleeve and are used for being connected with a circulating pipeline of the solution circulating unit.
And an annular groove is formed below the external thread on the outer surface of the spray head cylinder and used for placing a sealing gasket so as to ensure the matching tightness of the spray head and the sleeve.
After the sleeve and the nozzle are assembled, the inner surface of the conical part of the sleeve and the outer surface of the conical part of the nozzle matched with the inner surface form a cavity with a certain space, the lower end of the cavity is open, and the upper end of the cavity is sealed.
The diameter of a liquid suction port and the diameter of a liquid outlet of the electrodeposition unit can be adjusted according to the requirement of the size of an electrodeposition area.
After the electro-deposition unit is assembled, in order to be beneficial to forming negative pressure when the pump works, the liquid suction port of the sleeve exceeds the liquid outlet of the spray head by a certain length, and the optional length is 2-4 mm.
After the electro-deposition unit is assembled, the height of the liquid suction port of the sleeve from the surface of the chip is adjustable and can be selected to be 1-2 mm.
The lead fixing pipe is assembled in a lead fixing pipe hole of the sprayer cover, the outer diameter of the lead fixing pipe is equal to the size of the lead fixing pipe hole, the inner diameter of the lead fixing pipe is equal to the diameter of a micro-lead, the lower end of the lead fixing pipe exceeds a sprayer liquid outlet for a certain length, the length can be adjusted according to the distance from a sleeve liquid suction port to the surface of a chip, and the optional length is 1-3 mm.
The micro-wire is assembled in the wire fixing tube and exceeds the lower end of the wire fixing tube by a certain length, and the selectable length is 0.5-1 mm.
The solution circulating unit comprises a circulating pipeline, a pump and a solution tank; one end of the circulating pipeline is connected with the solution guide hole on the sprayer cover, and the other end of the circulating pipeline is connected with the electrolyte outlet holes on the two sides of the sleeve.
The chip positioning unit comprises a clamping bolt, a movable block and a fixed block, and can realize the fixation and clamping of the chip on the chip positioning unit.
The Z-direction moving unit comprises a Z-direction stepping motor, a Z-direction coupler, a Z-direction lead screw, a Z-direction guide rail, a positioning ring and a Z-direction nut slider; the positioning ring is arranged on the Z-direction nut sliding block and is used for being matched with a sleeve of the electro-deposition unit.
The horizontal moving unit comprises an X-direction moving unit and a Y-direction moving unit; wherein, the X-direction moving unit comprises an X-direction sliding table and a spiral handle; the Y-direction moving unit comprises a Y-direction stepping motor, a Y-direction lead screw, a Y-direction coupler, a Y-direction guide rail and a Y-direction nut slider; the X-direction moving unit is arranged on a Y-direction nut slider of the Y-direction moving unit, and the Y-direction moving unit is arranged on the base.
When the chip starts to work, the electrolyte flows through the solution diversion holes along the circular pipeline from the solution tank under the action of the height difference, enters the solution buffer cavity, then flows through the gap between the spray head and the lead fixing pipe from the lower part of the solution buffer cavity, and then flows out of the spray head liquid outlet to reach the surface of the chip; when the pump works, a certain negative pressure is generated at a cavity formed by the inner surface of the conical part of the sleeve and the outer surface of the conical part of the spray head matched with the inner surface of the conical part of the sleeve, electrolyte is sucked into the solution channel grooves and the negative pressure cavity arranged at two sides of the outer surface of the spray head under the action of the negative pressure, and finally flows out from the electrolyte outlet holes arranged at two sides of the sleeve and enters the pump body from the circulating pipeline, so that the circulation of the electrolyte is realized.
The utility model has the advantages that: the utility model provides a little wire connecting device, the device can realize that little wire is at the vertical location of connection area and fixed convenient and fast ground, and the continuous growth through metal atom in the electrodeposition process realizes connecting between little wire and the chip at the vertical direction to the course of working does not have residual stress and thermal stress, and the location is connected fast, accurately, reliably.
Drawings
FIG. 1 is a schematic view of the overall structure of an electrodeposition connection device.
FIG. 2 is a schematic structural view of an electrodeposition unit.
FIG. 3 is a schematic view showing the flow of electrolyte in the region between the electrodeposition cell and the chip before the pump is operated.
FIG. 4 is a schematic view showing the flow of the electrolyte in the region between the electrodeposition cell and the chip when the pump is operated.
Reference numbers in the figures: 1. an electrodeposition unit, wherein: 1-1 spray head cover, 1-1-1 lead fixing pipe hole, 1-1-2 solution guide hole, 1-1-3 spray head cover, 1-2 solution buffer cavity, 1-3 annular anode, 1-4 spray head, 1-5 sleeve, 1-6 solution channel groove, 1-7 electrolyte outlet hole, 1-8 liquid outlet and 1-9 liquid suction port; 2. an electrodeposition power supply; 3. A chip; 4. a chip positioning unit, wherein: 4-1 clamping bolt, 4-2 movable block and 4-3 fixed block; 5. a liquid storage tank; 6. a base; 7. a Z-direction mobile unit, wherein: the device comprises a 7-1Z-direction stepping motor, a 7-2Z-direction coupler, a 7-3Z-direction lead screw, a 7-4Z-direction guide rail, a 7-5 positioning ring and a 7-6Z-direction nut slider; 8. A solution circulation unit, wherein: an 8-1 solution tank, 8-2 circulating pipelines and 8-3 pumps; 9. a flange; 10. a support frame; 11. a sealing gasket; 12. an annular groove; 13. A horizontal movement unit, wherein: 13-1Y-direction moving unit, 13-1-1Y-direction stepping motor, 13-1-2Y-direction screw rod, 13-1-3Y-direction coupler, 13-1-4Y-direction guide rail, 13-1-5Y-direction nut slider, 13-2X-direction moving unit, 13-2-1X-direction sliding table and 13-2-2 spiral handle; 14. a displacement sensor; 15. A lead fixing tube; 16. a micro-wire.
Detailed Description
The following describes the present invention with reference to the accompanying drawings.
A micro-wire connection device, comprising: comprises an electro-deposition unit 1, a chip positioning unit 4, a solution circulating unit 8, a Z-direction moving unit 7 and a horizontal moving unit 13. The chip 3 is fixed on the chip positioning unit 4, the chip positioning unit 4 is fixed in the liquid storage tank 5, the liquid storage tank 5 is fixed on the horizontal moving unit 13, and the horizontal moving unit 13 is arranged on the base 6; the electro-deposition unit 1 is fixed on a positioning ring 7-5 of a Z-direction moving unit 7, the Z-direction moving unit 7 is arranged on a supporting frame 10, and the supporting frame 10 is arranged on a base 6.
The electrodeposition unit 1 comprises a spray head 1-4, a spray head cover 1-1, an annular anode 1-3 and a sleeve 1-5; the spray head 1-4 is a hollow structure with an upper cylinder and a lower cone, the larger cavity at the center of the upper part is a cavity with an external thread structure on the outer surface of the cylinder, and solution channel grooves 1-6 for absorbing electrolyte are arranged at two sides of the lower cone; the spray head cover 1-1 is assembled at the upper part of the spray head 1-4, and a solution buffer chamber 1-2 at the upper part of the spray head 1-4 forms a closed cavity; the sprayer cover 1-1 is provided with a lead fixing tube hole 1-1-1 and a solution guide hole 1-1-2, the lead fixing tube hole 1-1-1 is used for inserting a lead fixing tube 15, and the solution guide hole 1-1-2 is used for connecting an electrolyte circulating pipeline 8-2; the annular anode 1-3 is arranged in the solution buffer chamber 1-2 at the upper part of the spray head 1-4 and is connected with the anode of the electrodeposition power supply 2; the sleeve 1-5 is a hollow structure with an upper cylinder and a lower cone of a flange 9, the inner surface of the upper cylinder is provided with an internal thread structure, and the internal thread structure can be coaxially assembled and matched with the external thread on the outer surface of the cylinder of the spray head 1-4; the flange 9 is used for fixing the electrodeposition unit 1 on a positioning ring 7-5 of the Z-direction moving unit 7; electrolyte outlet holes 1-7 are formed in two sides of the lower cone of the sleeve 1-5 and used for being connected with a circulating pipeline 8-2 of a solution circulating unit 8.
An annular groove 12 is arranged below the external thread of the spray head 1-4 and used for placing a sealing gasket 11 so as to ensure the matching tightness of the spray head 1-4 and the sleeve 1-5.
The solution circulating unit 8 comprises a solution tank 8-1, a circulating pipeline 8-2 and a pump 8-3; one end of the circulating pipeline 8-2 is connected with the solution guide hole 1-1-2 on the sprayer cover 1-1, and the other end is connected with the electrolyte outlet holes 1-7 at the two sides of the sleeve 1-5.
The chip positioning unit 4 comprises a clamping bolt 4-1, a movable block 4-2 and a fixed block 4-3, and can realize the fixation and clamping of the chip 3 on the chip positioning unit.
The Z-direction moving unit 7 comprises a Z-direction stepping motor 7-1, a Z-direction coupler 7-2, a Z-direction lead screw 7-3, a Z-direction guide rail 7-4, a positioning ring 7-5 and a Z-direction nut slider 7-6; the positioning ring 7-5 is arranged on the Z-direction nut sliding block 7-6 and is used for being matched with the sleeve 1-5 of the electro-deposition unit 1.
The horizontal moving unit 13 comprises a Y-direction moving unit 13-1 and an X-direction moving unit 13-2; wherein, the X-direction moving unit 13-2 comprises an X-direction sliding table 13-2-1 and a spiral handle 13-2-2; the Y-direction moving unit 13-1 comprises a Y-direction stepping motor 13-1-1, a Y-direction lead screw 13-1-2, a Y-direction coupler 13-1-3, a Y-direction guide rail 13-1-4 and a Y-direction nut slider 13-1-5; the X-direction moving unit 13-2 is arranged on a Y-direction nut slider 13-1-5 of the Y-direction moving unit 13-1, and the Y-direction moving unit 13-1 is arranged on the base 6.
When in work, the following steps are executed:
(1) the chip 3 is arranged between a movable block 4-2 and a fixed block 4-3 of a chip positioning unit 4, and a clamping bolt 4-1 is adjusted to clamp and fix the chip 3 on the chip positioning unit 4;
(2) the sleeve 1-5 is fitted over the nozzle head 1-4, the nozzle head cover 1-1 is fitted over the nozzle head 1-4, the wire fixing tube 15 is inserted into the wire fixing tube hole 1-1-1 of the nozzle head cover 1-1, the micro-wire 16 is inserted into the wire fixing tube 15, and then the electrodeposition unit 1 is fitted over the positioning ring 7-5 of the Z-direction moving unit 7. Because the inner surface of the conical part of the sleeve 1-5 and the outer surface of the conical part of the spray head have a fit clearance with a certain distance, after the sleeve 1-5 and the spray head 1-4 are assembled, a cavity with an open lower end and a sealed upper end is formed between the sleeve 1-5 and the spray head 1-4. The length of the liquid suction port 1-9 exceeding the liquid outlet 1-8 is set to be 3mm;
(3) adjusting the distance of the lower end of the lead fixing tube 15 exceeding the liquid outlet by 1-8 mm to be 2.5 mm; the distance of the micro-wire 16 beyond the lower end of the wire fixing tube 15 is 1mm;
(4) the electro-deposition unit 1 is driven by a Z-direction stepping motor 7-1 to move downwards to a position right above a connection area of the chip 3, so that the distance from a liquid suction port 1-9 to the upper surface of the chip 3 is 1mm, and the distance from the lower end of the micro-wire 16 to the upper surface of the chip 3 is 0.5mm;
(5) the solution tank 8-1 is connected with the pump 8-3 by a circulating pipeline 8-2, the circulating pipeline 8-2 led out from one end of the solution tank 8-1 is connected with the solution guide hole 1-1-2 on the sprayer cover 1-1, and the circulating pipeline 8-2 led out from one end of the pump 8-3 is connected with the electrolyte outlet holes 1-7 on two sides of the sleeve 1-5. Placing a solution tank 8-1 above the electrodeposition unit 1, and enabling the electrolyte to flow to the surfaces of the micro-wires 16 and the chip 3 through a gap between a solution diversion hole 1-1-2, a solution buffer cavity 1-2, an inner cavity of the spray head 1-4 and a wire fixing pipe 15 in sequence by utilizing height difference;
(6) opening a pump 8-3, generating suction force between a matching gap between a sleeve 1-5 and a spray head 1-4, adjusting the diameters of liquid beams of a liquid suction port 1-9 and a liquid outlet 1-8 of an electrodeposition unit 1 to proper sizes according to electrodeposition process parameters and the size of an electrodeposition area, so that the electrolyte flowing to the surface of the micro lead 16 and the chip 3 is sucked into a solution channel tank 1-6 under the action of the suction force and flows back to a solution tank 8-1 through an electrolyte outlet hole 1-7;
(7) and (3) connecting the annular anodes 1-3 with the anode of the electrodeposition power supply 2, and connecting the chip 3 with the cathode of the electrodeposition power supply 2 to start electrodeposition. The deposited metal layer starts to grow on the chip 3 and the connection is completed when the grown metal layer fills the gap between the micro-wire 16 and the chip 3 and covers a portion of the micro-wire 16.
Claims (8)
1. A micro-wire connecting device is characterized by comprising an electro-deposition unit, a chip positioning unit, a solution circulating unit, a Z-direction moving unit and a horizontal moving unit; the electro-deposition unit is arranged on a positioning ring of the Z-direction moving unit, the Z-direction moving unit is arranged on a support frame, the support frame is arranged on the base, the chip is fixed on the chip positioning unit, the chip positioning unit is arranged in the liquid storage tank, the liquid storage tank is arranged on the horizontal moving unit, and the horizontal moving unit is arranged on the base.
2. The micro-wire connection device of claim 1, wherein the electrodeposition unit comprises:
the spray head is of a hollow structure of an upper cylinder and a lower cone, a cavity with a larger inner surface of the upper cylinder is a solution buffer cavity, an external thread structure is arranged on the outer surface of the upper cylinder, and solution channel grooves for absorbing electrolyte are arranged on two sides of the lower cone;
the spray head cover is assembled at the upper part of the spray head, and a closed cavity is formed by the spray head cover and the solution buffer cavity at the upper part of the spray head; the spray head cover is provided with a wire fixing pipe hole and a solution diversion hole, the wire fixing pipe hole is used for inserting a wire fixing pipe, and the solution diversion hole is used for connecting an electrolyte circulation pipeline;
the annular anode is arranged in the solution buffer cavity at the upper part of the spray head and is connected with the anode of the electrodeposition power supply;
the sleeve is of a hollow structure with an upper cylinder and a lower cone with flanges; the flange of the sleeve is used for fixing the electrodeposition unit on the positioning ring of the Z-direction moving unit; the inner surface of the upper cylinder of the sleeve is provided with an internal thread structure which can be coaxially matched with the external thread of the outer surface of the cylinder of the spray head in an assembling way; electrolyte outlet holes are formed in two sides of the lower cone of the sleeve and are used for being connected with a circulating pipeline of the solution circulating unit.
3. The micro-wire connection device according to claim 2, wherein an annular groove is formed below the external thread of the cylindrical outer surface of the nozzle for receiving a sealing gasket to ensure the tightness of the fit between the nozzle and the sleeve.
4. The micro-wire connecting device according to claim 2, wherein the inner surface of the conical portion of the sleeve and the outer surface of the conical portion of the nozzle fitting therewith form a hollow space having an open lower end and a sealed upper end when the sleeve and the nozzle are assembled.
5. The micro-wire connecting device as claimed in claim 1, wherein the diameter of the liquid suction port and the diameter of the liquid discharge port of the electrodeposition unit are adjustable according to the size of the electrodeposition region.
6. The micro-wire connecting device according to claim 1, wherein the length of the liquid sucking port of the sleeve exceeds the liquid outlet of the nozzle by a certain length, and is selected to be 2-4 mm, so as to facilitate the negative pressure formation during the operation of the pump after the electrodeposition unit is assembled.
7. The micro-wire connecting device according to claim 1, wherein the height of the liquid suction port of the sleeve from the surface of the chip is adjustable, optionally 1-2 mm, after the electrodeposition unit is assembled.
8. The micro-wire connecting device as claimed in claim 2, wherein the wire fixing tube is fitted in the wire fixing tube hole, has an outer diameter equal to the diameter of the wire fixing tube hole and an inner diameter equal to the diameter of the micro-wire, has a lower end extending beyond the liquid outlet of the nozzle by a length adjustable according to the distance from the liquid suction port of the sleeve to the surface of the chip, and is optionally 1 to 3mm long.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022162633.6U CN212461621U (en) | 2020-09-28 | 2020-09-28 | Micro-wire connecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022162633.6U CN212461621U (en) | 2020-09-28 | 2020-09-28 | Micro-wire connecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212461621U true CN212461621U (en) | 2021-02-02 |
Family
ID=74474887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022162633.6U Active CN212461621U (en) | 2020-09-28 | 2020-09-28 | Micro-wire connecting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212461621U (en) |
-
2020
- 2020-09-28 CN CN202022162633.6U patent/CN212461621U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2023284431A1 (en) | Method and apparatus for implementing localized electrodeposition induced by using laser irradiation on back of thin-walled part | |
| CN104014880A (en) | Laser-electrolysis composite machining device and method of tiny holes in non-recast layer | |
| CN102794516A (en) | Blisk blade profile subtle electrochemical machining electrode and machining method | |
| CN110000434A (en) | Sandwich-type cathode assembly, cathode group hole Electrolyzed Processing frock clamp and process | |
| TW201509573A (en) | Electrolytic machining apparatus and method | |
| CN111850660A (en) | Simple device for preparing inner surface of super-hydrophobic pipe based on electroplating method | |
| CN212461621U (en) | Micro-wire connecting device | |
| CN112053980A (en) | Micro-wire connecting device | |
| CN109352102A (en) | A kind of laser and electrolysis composite rotating processing unit (plant) | |
| CN212885536U (en) | Vertical electrolytic machining tool for small-caliber complex internal spiral line | |
| CN107442920B (en) | High-energy beam precision welding tool and welding method for thin-wall cylindrical body | |
| CN205817003U (en) | Flexible boundling group act on sets jet electrolytic machining device | |
| CN110614411A (en) | Pipe fitting drilling equipment based on electrolytic machining | |
| CN210506578U (en) | Electroplating connection device for micro-wire | |
| CN107695467B (en) | Preparation method and device for pressure type circulating jet flow electrolytic machining micro array electrode | |
| CN114717641A (en) | Runner surface aftertreatment device in laser powder bed melting forming piece | |
| CN210176989U (en) | Electroplating device for inner hole of pipe fitting | |
| CN102489803A (en) | Electrochemical machining device for multi-taper inner bores | |
| CN208293102U (en) | Crystallizer copper pipe stream plating appts | |
| CN109331191B (en) | High-voltage electric field coupling ultrasonic treatment liquid sterilization testing device and method | |
| CN210787978U (en) | Automatic rubber coating device of bridge assembly welding copper wire | |
| CN110184634B (en) | Plane type automatic brush plating device | |
| CN110257884B (en) | Electroplating device and electroplating method for inner hole of pipe fitting | |
| CN220318007U (en) | Pipe fitting deep hole electroplating upper die | |
| CN113118573A (en) | Method and device for machining deep and narrow groove by electrolytic milling of tube electrode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |