CN218728935U

CN218728935U - Novel heat dissipation module

Info

Publication number: CN218728935U
Application number: CN202222735982.1U
Authority: CN
Inventors: 熊伟
Original assignee: Dongguan Aikang Industrial Co ltd
Current assignee: Dongguan Aikang Industrial Co ltd
Priority date: 2022-10-15
Filing date: 2022-10-15
Publication date: 2023-03-24
Anticipated expiration: 2032-10-15

Abstract

The utility model discloses a novel heat dissipation module, wherein, include: the surface of the radiating bottom shell is inwards sunken to form a first accommodating cavity, the bottom of the first accommodating cavity is inwards sunken to form a second accommodating cavity, an accommodating platform is connected between the side wall of the second accommodating cavity and the side wall of the first accommodating cavity, and the second accommodating cavity is used for mounting a CPU; the radiator comprises a radiating bottom plate and a plurality of radiating fins which are arranged on the radiating bottom plate at equal intervals, wherein the radiating bottom plate is arranged on the accommodating platform and is sealed at the top of the second accommodating cavity. The utility model discloses in, the CPU mountable is in second holding intracavity, through the radiating bottom plate can realize right second holding intracavity CPU's is sealed, avoids CPU to go up the dust and piles up, can improve whole ventilation cooling's effect.

Description

Novel heat dissipation module

Technical Field

The utility model relates to a heat dissipation module technical field, concretely relates to novel heat dissipation module.

Background

The central processing unit, referred to as CPU for short, is used as the operation and control core of the computer system, and is the final execution unit for information processing and program operation. In order to prolong the service life of the CPU, a heat radiation fan is often adopted in the prior art to directly ventilate and radiate the exposed CPU, but the CPU is directly exposed in the air, dust is easily accumulated, the heat radiation effect is influenced, and further the working performance of the CPU is influenced.

Thus, there is a need for improvements and enhancements in the art.

SUMMERY OF THE UTILITY MODEL

In view of the foregoing prior art, an object of the present invention is to provide a novel heat dissipation module, the CPU can be installed in the novel heat dissipation module, thereby avoiding the accumulation of dust and improving the overall ventilation and heat dissipation effect.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a novel heat dissipation module, wherein, includes:

the surface of the radiating bottom shell is inwards sunken to form a first accommodating cavity, the bottom of the first accommodating cavity is inwards sunken to form a second accommodating cavity, an accommodating platform is connected between the side wall of the second accommodating cavity and the side wall of the first accommodating cavity, and the second accommodating cavity is used for mounting a CPU;

the radiator comprises a radiating bottom plate and a plurality of radiating fins which are arranged on the radiating bottom plate at equal intervals, wherein the radiating bottom plate is arranged on the accommodating platform and is sealed at the top of the second accommodating cavity.

In a further technical solution, the novel heat dissipation module has a plurality of air inlets formed through a sidewall of the second accommodating cavity, and a plurality of heat dissipation holes formed through the heat dissipation bottom plate and between the two heat dissipation fins.

In a further technical scheme, the novel heat dissipation module, wherein the bottom of second holding chamber is equipped with a plurality of support columns, just the top of support column is equipped with fixed screw.

In a further technical scheme, the novel heat dissipation module, wherein, be equipped with the dust screen in the inlet port.

In a further technical solution, the novel heat dissipation module, wherein a sealing ring is arranged between the heat dissipation bottom plate and the accommodating platform.

In a further technical solution, the novel heat dissipation module is characterized in that the heat dissipation bottom plate is fixed to the accommodating platform through screws.

In a further technical solution, the novel heat dissipation module further includes a heat dissipation fan disposed at one end of the heat sink, and a wind direction blown by the heat dissipation fan is parallel to an extending direction of the heat dissipation fins.

Compared with the prior art, the utility model provides a novel heat dissipation module, wherein, include: the surface of the radiating bottom shell is inwards sunken to form a first accommodating cavity, the bottom of the first accommodating cavity is inwards sunken to form a second accommodating cavity, an accommodating platform is connected between the side wall of the second accommodating cavity and the side wall of the first accommodating cavity, and the second accommodating cavity is used for mounting a CPU; the radiator comprises a radiating bottom plate and a plurality of radiating fins which are arranged on the radiating bottom plate at equal intervals, wherein the radiating bottom plate is arranged on the accommodating platform and is sealed at the top of the second accommodating cavity. The utility model discloses in, the CPU mountable is in second holding intracavity, through the radiating bottom plate can realize right second holding intracavity CPU's is sealed, avoids CPU to go up the dust and piles up, can improve whole ventilation cooling's effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a novel heat dissipation module according to an embodiment of the present invention.

Fig. 2 is a schematic structural view of the heat dissipation bottom case in fig. 1.

Fig. 3 is a top view of the heat sink of fig. 1.

Reference numerals: 1. the heat dissipation device comprises a heat dissipation bottom shell, 11, a first accommodating cavity, 12, a second accommodating cavity, 121, air inlets, 122, support columns, 13, an accommodating platform, 2, a heat radiator, 21, a heat dissipation bottom plate, 22, heat dissipation fins, 23, heat dissipation holes, 3 and a sealing ring.

Detailed Description

In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the following description of the present invention will refer to the accompanying drawings and illustrate embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

In the description of the present invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or assembly referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may for example be fixedly connected, detachably connected, or integrally connected; the two can be mechanically connected or electrically connected, or electrically connected (meaning that there is both electrical and signal connection between the two); the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. When an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The specific meaning of the above terms in the present invention can be understood as specific cases to those skilled in the art.

In the description of the present invention, the terms "comprising," "including," "having," "containing," and the like, as used herein, are open-ended terms that mean including, but not limited to. Reference to the description of the terms "one embodiment," "a particular embodiment," "some embodiments," "for example," etc., means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. The sequence of steps involved in the various embodiments is provided to illustrate the practice of the present application, and the sequence of steps is not limited thereto and can be adjusted as needed.

Various non-limiting embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Referring to fig. 1-3, an embodiment of the present invention provides a novel heat dissipation module, which includes:

the heat dissipation bottom shell comprises a heat dissipation bottom shell 1, wherein a first accommodating cavity 11 is formed by inwards recessing the surface of the heat dissipation bottom shell 1, a second accommodating cavity 12 is formed by inwards recessing the bottom of the first accommodating cavity 11, an accommodating platform 13 is connected between the side wall of the second accommodating cavity 12 and the side wall of the first accommodating cavity 11, and a CPU (not shown) is installed in the second accommodating cavity 12;

radiator 2, radiator 2 includes radiating bottom plate 21 and even equidistance is arranged polylith heat radiation fins 22 on the radiating bottom plate 21, radiating bottom plate 21 installs on holding platform 13, and right the top of second holding chamber 12 is realized sealedly.

Further, the novel heat dissipation module further includes a heat dissipation fan (not shown) disposed at one end of the heat sink 2, and a wind direction (as indicated by an arrow in fig. 3) blown by the heat dissipation fan is parallel to an extending direction of the heat dissipation fins 22.

Further, in the novel heat dissipation module, a plurality of air inlets 121 are formed through a sidewall of the second accommodating cavity 12, a plurality of heat dissipation holes 23 are uniformly formed through two heat dissipation fins 22 on the heat dissipation bottom plate 21, and a dust screen is disposed in the air inlets 121 and used for preventing external dust from entering the second accommodating cavity 12, and of course, preferably, the dust screen may be disposed in the heat dissipation holes 23; wherein, in some embodiments, the dustproof net is preferably made of breathing paper.

Further, the novel heat dissipation module, wherein the bottom of the second accommodating cavity 12 is provided with a plurality of supporting columns 122, and the top of the supporting columns 122 is provided with fixing screw holes.

Further, the novel heat dissipation module, wherein, the heat dissipation bottom plate 21 with be equipped with sealing washer 3 between the holding platform 13, can improve the heat dissipation bottom plate 21 with the seal between the second holding chamber 12 avoids gaseous by the heat dissipation bottom plate 21 with leak between the holding platform 13, influence this novel heat dissipation module's radiating effect.

Further, in the novel heat dissipation module, the heat dissipation bottom plate 21 and the accommodating platform 13 are fixed by screws.

In this embodiment, the CPU is installed on the supporting column 122 in the second accommodating chamber 12, and is screwed into the fixing screw hole on the supporting column 122 by a tapping screw, so that the CPU is fixed, and then the heat sink 2 is installed in the first accommodating chamber 11, that is, the heat dissipation bottom plate 21 on the heat sink 2 is fixed on the accommodating platform 13 by a screw, so that the heat dissipation bottom plate 21 seals the top of the second accommodating chamber 12, and the bottom of the heat dissipation bottom plate 21 can be abutted against the CPU, thereby improving the heat dissipation efficiency of the CPU; when the novel heat dissipation module works, external cold air enters the second accommodating cavity 12 through the air inlet 121, the heat dissipated by the working process of the CPU can be discharged through the heat dissipation holes 23, and simultaneously, the heat dissipated by the working process of the CPU can be conducted to the heat dissipation fins 22 through the heat dissipation bottom plate 21, at this time, when the air flow blown out by the heat dissipation fan at one end of the heat sink 2 passes through the heat dissipation grooves (the heat dissipation grooves are formed between the two heat dissipation fins), the hot air exhausted from the heat dissipation holes 23 and the heat on the heat dissipation fins 22 can be dissipated in a concentrated mode at one time, and then the overall ventilation and heat dissipation effect of the novel heat dissipation module can be greatly improved, and the normal work of the CPU can be guaranteed.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims

1. The utility model provides a novel heat dissipation module which characterized in that includes:

the heat dissipation bottom shell (1), a first accommodating cavity (11) is formed by inwards recessing the surface of the heat dissipation bottom shell (1), a second accommodating cavity (12) is formed by inwards recessing the bottom of the first accommodating cavity (11), an accommodating platform (13) is connected between the side wall of the second accommodating cavity (12) and the side wall of the first accommodating cavity (11), and a CPU is installed in the second accommodating cavity (12);

radiator (2), radiator (2) are in including radiating bottom plate (21) and even equidistance arrangement polylith heat radiation fins (22) on radiating bottom plate (21), radiating bottom plate (21) are installed on holding platform (13), and right the top realization of second holding chamber (12) is sealed.

2. The heat dissipation module as claimed in claim 1, wherein a sidewall of the second receiving cavity (12) has a plurality of air inlets (121) formed therethrough, and the heat dissipation bottom plate (21) has a plurality of heat dissipation holes (23) uniformly formed therethrough between the two heat dissipation fins (22).

3. The novel heat dissipation module as claimed in claim 2, wherein a plurality of support columns (122) are disposed at the bottom of the second receiving cavity (12), and fixing screw holes are disposed at the top of the support columns (122).

4. The novel heat dissipation module as claimed in claim 3, wherein a dust screen is disposed in the air inlet hole (121).

5. The novel heat dissipation module according to claim 4, wherein a sealing ring (3) is disposed between the heat dissipation base plate (21) and the accommodating platform (13).

6. The novel heat dissipation module according to claim 5, wherein the heat dissipation base plate (21) is fixed to the receiving platform (13) by screws.

7. The novel heat dissipation module according to any one of claims 1 to 6, further comprising a heat dissipation fan disposed at one end of the heat sink (2), wherein the direction of the air blown by the heat dissipation fan is parallel to the extending direction of the heat dissipation fins (22).