CN218710956U - Electroplating device using conductive belt for conduction - Google Patents
Electroplating device using conductive belt for conduction Download PDFInfo
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- CN218710956U CN218710956U CN202222407045.3U CN202222407045U CN218710956U CN 218710956 U CN218710956 U CN 218710956U CN 202222407045 U CN202222407045 U CN 202222407045U CN 218710956 U CN218710956 U CN 218710956U
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Abstract
The utility model provides an use electrically conductive belt electrically conductive electroplating device, this electroplating device includes: the device comprises a first plating tank and cathode edge conducting mechanisms, wherein a plurality of electroplating anodes are arranged in the first plating tank, and the cathode edge conducting mechanisms are respectively positioned on the left side and the right side of the electroplating anodes; the cathode edge conducting mechanism includes: the upper conductive belt wraps the outer part of the upper driving assembly, and the lower conductive belt wraps the outer part of the lower driving assembly; the front side wall and the rear side wall of the first plating tank are respectively provided with a first notch for the upper conductive belt and the lower conductive belt to pass through; the upper driving assembly and the lower driving assembly respectively block the first gap; the upper conductive belt and the lower conductive belt clamp the edge of the film to conduct electricity to the film and drive the film to move. The utility model discloses an go up drive assembly and plug up the first breach of first coating bath both sides with lower drive assembly, avoid conductive belt to bring out the plating bath and lead to copper facing on the conductive belt, improve product production quality.
Description
Technical Field
The utility model relates to a film electroplating technology field, concretely relates to use electrically conductive belt electrically conductive electroplating device.
Background
In the conventional electroplating apparatus, for example, patent No. CN114164478A entitled horizontal electroplating apparatus, and patent No. CN114182328A entitled cathode edge conductive mechanism and cathode conductive module of horizontal electroplating apparatus, in these two patents, the upper conductive belt roller and the lower conductive belt roller respectively drive the upper conductive belt and the lower conductive belt roller to move circularly, and the upper conductive belt and the lower conductive belt clamp the film substrate to move forward. The conductive belt part is positioned in the plating solution, two upper conductive belt rollers are positioned in the plating solution, and two upper conductive belt rollers are positioned outside the plating solution. Because the upper conductive belt is rectangular, the conductive belt in the plating solution can bring the plating solution to the upper conductive belt roller outside the plating solution, so that a plating layer is formed on the upper conductive belt roller, and meanwhile, the plating layer can be formed on the conductive belt, so that the conductive belt is not stable in the moving process, the conductive effect of the conductive belt on the film is influenced, and the plating quality is further influenced.
SUMMERY OF THE UTILITY MODEL
In view of this, an object of the embodiments of the present invention is to provide an electroplating apparatus using a conductive belt to solve the technical problem in the prior art that the conductive belt in the plating solution can bring the plating solution to the conductive belt roller located outside the plating solution, and a plating layer is formed on the conductive belt roller and the conductive belt, so that the conductive belt is unstable during the tape feeding process, the conductive effect of the conductive belt on the film is affected, and the quality of the plated film is further affected.
To achieve the above object, an embodiment of the present invention provides an electroplating apparatus using a conductive belt for conduction, the electroplating apparatus including:
the electroplating device comprises a first plating tank and cathode edge conducting mechanisms, wherein a plurality of electroplating anodes are arranged in the first plating tank, and the cathode edge conducting mechanisms are respectively positioned on the left side and the right side of the electroplating anodes;
the cathode edge conduction mechanism includes:
the upper conductive belt is wrapped outside the upper driving assembly, and the upper driving assembly drives the upper conductive belt to rotate;
the lower conductive belt is wrapped outside the lower driving assembly, and the lower driving assembly drives the lower conductive belt to rotate;
the front side wall and the rear side wall of the first plating tank are respectively provided with a first notch for the upper conductive belt and the lower conductive belt to pass through; the upper driving assembly and the lower driving assembly are used for respectively plugging the first gap;
the edges of the upper conductive belt and the lower conductive belt clamping the film conduct electricity to the film and drive the film to move.
In some possible embodiments, the upper driving assembly comprises an upper conductive belt roller and a plurality of upper pressing wheels, the upper conductive belt roller is positioned outside the front and rear side walls of the first plating tank, and the plurality of upper pressing wheels are arranged between the first notches on the front and rear side walls of the first plating tank; the first upper pinch roller and the last upper pinch roller are arranged in the first gap and are respectively used for plugging the first gap to avoid excessive plating solution from flowing out;
the lower driving assembly comprises a lower conductive belt roller and a plurality of lower pressing wheels, the lower conductive belt roller is positioned outside the front side wall and the rear side wall of the first plating bath, and the lower pressing wheels are arranged between first notches on the front side wall and the rear side wall of the first plating bath; the first lower pressing wheel and the last lower pressing wheel are arranged inside the first notch and are respectively used for plugging the first notch, so that excessive plating solution is prevented from flowing out;
the upper pinch roller and the lower pinch roller are in rolling contact.
In some possible embodiments, the plurality of upper press wheels and the plurality of lower press wheels are rotatably mounted on the first plating tank.
In some possible embodiments, the upper conductive belt roller, the lower conductive belt roller, the plurality of upper press wheels, and the plurality of lower press wheels are all driving rollers.
In some possible embodiments, the upper conductive belt roller and the lower conductive belt roller are replaced with two conductive pulleys.
In some possible embodiments, the plating apparatus further includes:
and the second plating tank is sleeved outside the first plating tank, and the height of the second plating tank is higher than that of the first plating tank.
In some possible embodiments, the front and rear side walls of the second plating tank are respectively provided with a second notch at a position corresponding to the first notch, and the lower edge of the second notch is equal to the upper edge of the first notch in height.
In some possible embodiments, the upper conductive belt roller and the lower conductive belt roller are both rotatably mounted on the second plating tank.
In some possible embodiments, the plurality of plating anodes comprises: a plurality of titanium blues which are arranged in parallel.
In some possible embodiments, the electroplating anode is an insoluble anode; the plating solution in the first plating tank is provided by an external copper dissolving system.
The beneficial technical effects of the technical scheme are as follows:
the embodiment of the utility model provides an use electrically conductive belt electrically conductive electroplating device, this electroplating device includes: the device comprises a first plating tank and cathode edge conducting mechanisms, wherein a plurality of electroplating anodes are arranged in the first plating tank, and the cathode edge conducting mechanisms are respectively positioned on the left side and the right side of the electroplating anodes; the cathode edge conducting mechanism includes: the lower driving assembly drives the lower conductive belt to rotate; the front side wall and the rear side wall of the first plating tank are respectively provided with a first notch for the upper conductive belt and the lower conductive belt to pass through; the upper driving assembly and the lower driving assembly respectively block the first gap; the upper conductive belt and the lower conductive belt clamp the edge of the film to conduct electricity to the film and drive the film to move. The utility model discloses a first breach of first coating bath both sides is plugged up with lower drive assembly to the last drive assembly of the electrically conductive mechanism in negative pole edge, avoids conductive belt to bring out the plating bath and leads to copper facing on the conductive belt, improves product production quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of an electroplating apparatus according to an embodiment of the present invention;
FIG. 2 is a left side view of a first plating tank according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an upper driving assembly and a lower driving assembly according to an embodiment of the present invention;
fig. 4 is a schematic view of the overall structure of the cathode edge conductive mechanism according to the embodiment of the present invention;
FIG. 5 is a schematic view of an overall structure of another electroplating apparatus according to an embodiment of the present invention;
FIG. 6 is a left side view of a second plating tank according to an embodiment of the present invention;
FIG. 7 is a left side view of another electroplating apparatus according to an embodiment of the present invention;
fig. 8 is a plan view of another electroplating apparatus according to an embodiment of the present invention.
The reference numbers illustrate:
1. a first plating tank; 11. electroplating an anode; 12. a first notch;
2. a cathode edge conduction mechanism; 21. an upper conductive belt; 22. an upper drive assembly; 22a, an upper conductive belt roller; 22b, an upper pinch roller; 23. a lower conductive belt; 24. a lower drive assembly; 24a, a lower conductive belt roller; 24b, a lower pressing wheel;
3. a second plating tank; 31. a second notch.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by illustrating examples of the invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Fig. 1 is a schematic view of an overall structure of an electroplating apparatus according to an embodiment of the present invention, fig. 2 is a left side view of a first plating tank according to an embodiment of the present invention, fig. 3 is a schematic view of an upper driving assembly and a lower driving assembly according to an embodiment of the present invention, and fig. 4 is a schematic view of an overall structure of a cathode edge conductive mechanism according to an embodiment of the present invention; as shown in fig. 1 to 4, the plating apparatus includes: the device comprises a first plating tank 1 and a cathode edge conducting mechanism 2, wherein a plurality of electroplating anodes 11 are arranged in the first plating tank 1, and the cathode edge conducting mechanism 2 is respectively positioned at the left side and the right side of the electroplating anodes 11; the cathode edge conduction mechanism 2 includes: the device comprises an upper conductive belt 21 and an upper driving assembly 22, wherein the upper conductive belt 21 is wrapped outside the upper driving assembly 22, and the upper driving assembly 22 drives the upper conductive belt 21 to rotate; the lower conductive belt 23 is wrapped outside the lower driving assembly 24, and the lower driving assembly 24 drives the lower conductive belt 23 to rotate; the front side wall and the rear side wall of the first plating bath 1 are respectively provided with a first gap 12 for the upper conductive belt 21 and the lower conductive belt 23 to pass through; the upper driving component 22 and the lower driving component 24 respectively block the first gap 12; the upper conductive belt 21 and the lower conductive belt 23 clamp the edge of the film 4 to conduct electricity to the film 4 and drive the film 4 to move.
The utility model discloses a first breach 12 of 1 both sides of first coating bath is plugged up with lower drive assembly 24 to the last drive assembly 22 of negative pole edge electrically conductive mechanism 2, avoids going up electrically conductive belt 21 and lower electrically conductive belt 23 and leads to conductive belt 21 and lower electrically conductive belt 23 to go up the copper facing with plating bath out, improves product production quality.
As shown in fig. 3, in some embodiments, the upper driving assembly 22 includes an upper conductive belt roller 22a and a plurality of upper pressing wheels 22b, the upper conductive belt roller 22a is located outside the front and rear side walls of the first plating tank 1, and the plurality of upper pressing wheels 22b are disposed between the first notches 12 on the front and rear side walls of the first plating tank 1; the first upper pinch roller 22b and the last upper pinch roller 22b are arranged inside the first gap 12 and are respectively used for plugging the first gap 12 to avoid excessive plating solution from flowing out; the lower driving assembly 24 comprises a lower conductive belt roller 24a and a plurality of lower pressing wheels 24b, the lower conductive belt roller 24a is positioned outside the front and rear side walls of the first plating tank 1, and the plurality of lower pressing wheels 24b are arranged between the first notches 12 on the front and rear side walls of the first plating tank 1; wherein, first two last lower pinch rollers 24b all set up inside first breach 12, are used for the shutoff first breach 12 respectively, avoid too much plating solution to flow out. Wherein, each upper pressure wheel 22b and each lower pressure wheel 24b are in up-and-down rolling contact, and the plurality of upper pressure wheels 22b and the plurality of lower pressure wheels 24b are rotatably arranged on the first plating bath 1.
Specifically, the first and last two upper pinch rollers 22b and the first and last two lower pinch rollers 24b are all arranged in the first gap 12, each upper pinch roller 22b is in rolling contact with each lower pinch roller 24b, and block up the first gap 12, the upper conductive belt 21 and the lower conductive belt 23 respectively pass through a gap between the upper pinch roller 22b and the lower pinch roller 24b, the upper conductive belt 21 and the lower conductive belt 23 are respectively extruded with plating solution by the upper pinch roller 22b and the lower pinch roller 24b, so that the upper conductive belt 21 and the lower conductive belt 23 do not take the plating solution in the first plating tank 1 out, the upper conductive belt 21 and the lower conductive belt 23 outside the first plating tank 1 are avoided, and plating layers are formed on the upper conductive belt roller 22a and the lower conductive belt roller 24a, so that the upper conductive belt 21 and the lower conductive belt 23 are smooth in running, the conductive effect of the upper conductive belt 21 and the lower conductive belt 23 on the thin film 4 is improved, and the plating quality is ensured.
In some embodiments, the upper conductive belt roller 22a and the lower conductive belt roller 24a are drive rollers, and the plurality of upper press wheels 22b and the plurality of lower press wheels 24b are drive wheels.
In some embodiments, the upper conductive belt roller 22a and the lower conductive belt roller 24a may be replaced with two conductive pulleys.
Fig. 5 is a schematic view of an overall structure of another electroplating apparatus according to an embodiment of the present invention, fig. 6 is a left side view of a second plating tank according to an embodiment of the present invention, fig. 7 is a left side view of another electroplating apparatus according to an embodiment of the present invention, and fig. 8 is a top view of another electroplating apparatus according to an embodiment of the present invention. As shown in fig. 5 to 8, the plating apparatus further includes: the second plating bath 3 is sleeved outside the first plating bath 1, and the height of the second plating bath 3 is higher than that of the first plating bath 1.
The embodiment of the utility model provides an in, through setting up second coating bath 3, can be so that the plating bath in the first coating bath 1 overflows to the second coating bath 3 in, avoid overflowing the external pollution environment, also extravagant plating bath simultaneously.
As shown in fig. 6, in some embodiments, in order to allow the upper conductive belt 21 and the lower conductive belt 23 to pass through the front and rear side walls of the second plating tank 3, second notches 31 are respectively disposed on the front and rear side walls of the second plating tank 3 at positions corresponding to the first notches 12, and lower edges of the second notches 31 are equal to upper edges of the first notches 12.
As shown in fig. 7, in some embodiments, in order to improve the space utilization of the plating apparatus, both the upper conductive belt roller 22a and the lower conductive belt roller 24a are rotatably mounted on the second plating tank 3.
In some embodiments, the plurality of plating anodes 11 includes: the titanium blues are arranged in parallel, the length directions of the titanium blues are parallel or vertical to the length direction of the thin film 4, copper balls are respectively arranged in the titanium blues and react with the plating solution, so that copper ions are contained in the plating solution, and the copper ions are deposited on the thin film 4.
In some embodiments, the plating anode 11 is an insoluble anode; the plating solution in the first plating tank 1 is provided by an external copper dissolving system. In this embodiment, the plating anode 11 is an insoluble anode and only functions to pass current, and since the plating solution provided by the copper dissolving system contains copper ions, no additional copper ions are needed.
The beneficial effects of this practical embodiment are as follows:
the utility model discloses a first breach 12 of 1 both sides of first coating bath is plugged up with lower drive assembly 24 to the last drive assembly 22 of negative pole edge electrically conductive mechanism 2, avoids going up electrically conductive belt 21 and lower electrically conductive belt 23 and leads to conductive belt 21 and lower electrically conductive belt 23 to go up the copper facing with plating bath out, improves product production quality.
The embodiment of the utility model provides an in, first two last pinch rollers 22b and first two last pinch rollers 24b down all set up in first breach 12, pinch roller 24b rolling contact under pinch roller 22b and each on each, and plug up first breach 12, go up electrically conductive belt 21 and lower electrically conductive belt 23 respectively from last pinch roller 22b and the gap between the pinch roller 24b passes through down, respectively through last pinch roller 22b and pinch roller 24b down to last electrically conductive belt 21 and electrically conductive belt 23 extrusion plating bath down, make and go up electrically conductive belt 21 and electrically conductive belt 23 down and all not take out the plating bath to the outside in the first coating bath 1, avoid electrically conductive belt 21 and lower electrically conductive belt 23 on the first coating bath 1 outside, and form the cladding material on electrically conductive belt roller 22a and the electrically conductive roller 24a down, make and go up electrically conductive belt 21 and electrically conductive belt 23 ambulation steady down, improve electrically conductive belt 21 and the electrically conductive effect of electrically conductive belt 23 to film 4 down, guarantee the coating film quality.
The embodiment of the utility model provides an in, through setting up second coating bath 3, can be so that the plating bath in the first coating bath 1 overflows to the second coating bath 3 in, avoid overflowing the external pollution environment, also extravagant plating bath simultaneously.
In the description of the embodiments of the present invention, it should be noted that the terms "upper, lower, inner and outer" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms first, second, or third are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the embodiments of the present invention, unless explicitly stated or limited otherwise, the terms "mounted, connected" or "connected" should be interpreted broadly, for example: can be fixedly connected, detachably connected or integrally connected; they may be mechanically, electrically, or directly connected, or indirectly connected through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. The present invention is not limited to the particular embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (10)
1. An electroplating apparatus that conducts electricity using a conductive belt, comprising:
the electroplating device comprises a first plating tank (1) and cathode edge conducting mechanisms (2), wherein a plurality of electroplating anodes (11) are arranged in the first plating tank (1), and the cathode edge conducting mechanisms (2) are respectively positioned on the left side and the right side of the electroplating anodes (11);
the cathode edge conducting mechanism (2) comprises:
the device comprises an upper conductive belt (21) and an upper driving assembly (22), wherein the upper conductive belt (21) is wrapped outside the upper driving assembly (22), and the upper driving assembly (22) drives the upper conductive belt (21) to rotate;
the lower conductive belt (23) and a lower driving assembly (24), the lower conductive belt (23) is wrapped outside the lower driving assembly (24), and the lower driving assembly (24) drives the lower conductive belt (23) to rotate;
the front side wall and the rear side wall of the first plating tank (1) are respectively provided with a first notch (12) for the upper conductive belt (21) and the lower conductive belt (23) to pass through; the upper driving component (22) and the lower driving component (24) respectively block the first gap (12);
the edges of the upper conductive belt (21) and the lower conductive belt (23) clamping the film (4) conduct electricity to the film (4), and the film (4) is driven to move.
2. An electroplating apparatus using a conductive belt for conduction according to claim 1,
the upper driving assembly (22) comprises an upper conductive belt roller (22 a) and a plurality of upper pressing wheels (22 b), the upper conductive belt roller (22 a) is positioned outside the front side wall and the rear side wall of the first plating tank (1), and the plurality of upper pressing wheels (22 b) are arranged between first notches (12) on the front side wall and the rear side wall of the first plating tank (1); the first upper pressing wheel (22 b) and the last upper pressing wheel (22 b) are arranged inside the first notch (12) and are respectively used for plugging the first notch (12) to avoid excessive plating solution from flowing out;
the lower driving assembly (24) comprises a lower conductive belt roller (24 a) and a plurality of lower pressing wheels (24 b), the lower conductive belt roller (24 a) is positioned outside the front side wall and the rear side wall of the first plating tank (1), and the plurality of lower pressing wheels (24 b) are arranged between first notches (12) on the front side wall and the rear side wall of the first plating tank (1); the first lower pressing wheel (24 b) and the last lower pressing wheel (24 b) are arranged inside the first notch (12) and are respectively used for plugging the first notch (12) to avoid excessive plating solution from flowing out;
each of the upper press wheels (22 b) is in rolling contact with each of the lower press wheels (24 b).
3. An electroplating apparatus using a conductive belt for conduction of electricity according to claim 2, wherein the plurality of upper press wheels (22 b) and the plurality of lower press wheels (24 b) are rotatably mounted on the first plating tank (1).
4. An electroplating apparatus using a conductive belt for conduction of electricity according to claim 2, wherein the upper conductive belt roller (22 a) and the lower conductive belt roller (24 a) are driving rollers, and the plurality of upper press wheels (22 b) and the plurality of lower press wheels (24 b) are driving wheels.
5. A plating apparatus using a conductive belt for conduction of electricity according to claim 2, wherein said upper conductive belt roller (22 a) and said lower conductive belt roller (24 a) are replaced with two conductive pulleys.
6. The plating apparatus using a conductive belt for conduction of electricity according to claim 2, further comprising:
the second plating tank (3), the second plating tank (3) cover is established the outside of first plating tank (1), the height of second plating tank (3) is higher than first plating tank (1).
7. The electroplating device using the conductive belt for conduction of claim 6, wherein the front and back side walls of the second plating tank (3) are respectively provided with a second notch (31) at a position corresponding to the first notch (12), and the lower edge of the second notch (31) is as high as the upper edge of the first notch (12).
8. A plating apparatus using a conductive belt for conduction of electricity according to claim 6, wherein both the upper conductive belt roller (22 a) and the lower conductive belt roller (24 a) are rotatably mounted on the second plating tank (3).
9. An electroplating apparatus using a conductive belt for conduction of electricity according to claim 1, wherein said plurality of electroplating anodes (11) comprise: a plurality of titanium blues arranged in parallel.
10. An electroplating apparatus using a conductive belt for conduction of electricity according to claim 1, wherein the electroplating anode (11) is an insoluble anode; the plating solution in the first plating tank (1) is provided by an external copper dissolving system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222407045.3U CN218710956U (en) | 2022-09-09 | 2022-09-09 | Electroplating device using conductive belt for conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222407045.3U CN218710956U (en) | 2022-09-09 | 2022-09-09 | Electroplating device using conductive belt for conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218710956U true CN218710956U (en) | 2023-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222407045.3U Active CN218710956U (en) | 2022-09-09 | 2022-09-09 | Electroplating device using conductive belt for conduction |
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| CN (1) | CN218710956U (en) |
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- 2022-09-09 CN CN202222407045.3U patent/CN218710956U/en active Active
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