CN218675965U

CN218675965U - Air-cooled radiator for host computer

Info

Publication number: CN218675965U
Application number: CN202223030155.9U
Authority: CN
Inventors: 曾光华; 龙根炳
Original assignee: Tongren Polytechnic College
Current assignee: Tongren Polytechnic College
Priority date: 2022-11-14
Filing date: 2022-11-14
Publication date: 2023-03-21
Anticipated expiration: 2032-11-14

Abstract

The utility model discloses an air-cooled radiator for host computer, including the heat dissipation box. The utility model discloses in-process using, the fixed heat-conducting plate that runs through of lateral wall of heat dissipation box, the heat-conducting plate is embedded setting with the heat dissipation box, a plurality of structures are the same and are the radiating groove that linear array distributes all to two corresponding lateral walls of heat dissipation box, the inner wall of heat dissipation box and heat-conducting plate are located and are equipped with first heat dissipation mechanism between one side in the heat dissipation box, one side that the heat-conducting plate was kept away from to the heat dissipation box is equipped with second heat dissipation mechanism, the opposite side of heat dissipation box is equipped with fixed establishment. Can realize carrying out dual heat dissipation to the host computer, improve the radiating effect, and then can avoid the host computer as far as possible because of the too high trouble that produces of temperature, lead to the phenomenon of host computer data loss to take place.

Description

Air-cooled radiator for host computer

Technical Field

The utility model relates to a host computer heat dissipation technical field especially relates to an air-cooled radiator for host computer.

Background

The host computer is the main organism part except that the input/output equipment is detached to the computer, current processing host computer is box formula structure mostly, its processing rate and throughput promote higher, its energy consumption simultaneously with generate heat all also corresponding promotion, host computer self heat dissipation dispels the heat through the louvre mostly, the radiating effect is not good, thereby can't satisfy the radiating effect of host computer, lead to the host computer to produce the trouble because of the high temperature easily, thereby make the data loss in the host computer easily, cause a large amount of losses for the user. Therefore, an air-cooled radiator for the host is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing an air-cooled radiator for a host.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

an air-cooled radiator for a host comprises a radiating box, wherein a heat-conducting plate is fixedly arranged on the side wall of the radiating box in a penetrating manner, the heat-conducting plate and the radiating box are arranged in an embedded manner, a plurality of radiating grooves which have the same structure and are distributed in a linear array manner are formed in two corresponding side walls of the radiating box, a first radiating mechanism is arranged on one side of the radiating box away from the heat-conducting plate, a second radiating mechanism is arranged between the inner wall of the radiating box and one side of the heat-conducting plate in the radiating box, and a fixing mechanism is arranged on the other side of the radiating box;

first heat dissipation mechanism is including the heat dissipation fan, the heat dissipation fan that the heat-conducting plate was kept away from to the heat dissipation box one side is fixed to run through and is provided with four structures the same and be the heat dissipation fan that rectangular array distributes and set up, heat dissipation fan, heat dissipation box and radiating groove are the setting of intercommunication each other, the heat dissipation fan is located the outer equal fixed filter screen that is provided with the structure the same of one side of heat dissipation box with the radiating groove.

Preferably, fixed establishment includes fixed plate, slide bar, connecting rod and installation piece, the fixed plate that is provided with two structures the same and is corresponding distribution setting of lateral wall that the heat dissipation fan was kept away from to the heat dissipation box, the fixed plate is located the both sides of heat-conducting plate respectively, equal sliding match is provided with two structures the same and is the slide bar that relative distribution set up on the fixed plate, the slide bar all is "concave" style of calligraphy setting, is located two of heat-conducting plate both sides the fixed connecting rod that is provided with between the slide bar, the top and the bottom of connecting rod are all fixed the installation piece that is provided with the same structure, the installation piece all is "L" style of calligraphy setting.

Preferably, the sliding chutes with the same structure are formed in two corresponding side walls of the fixing plate, the sliding blocks with the same structure are fixedly arranged on two corresponding inner walls of the sliding rod, and the sliding blocks are arranged in a sliding matching mode with the adjacent sliding chutes.

Preferably, the second heat dissipation mechanism includes water tank, heat-conducting box, outlet pipe, inlet tube, first water pump and second water pump, the fixed water tank that is provided with of inner wall of heat dissipation box, the fixed heat-conducting box that is provided with in one side that the heat-conducting plate is located the heat dissipation box, the top of heat-conducting box and the top of water tank are mutual intercommunication setting through the inlet tube, the bottom of heat-conducting box and the bottom of water tank are mutual intercommunication setting through the outlet pipe, the fixed first water pump and the second water pump that are provided with of inner wall of water tank, first water pump is mutual intercommunication setting with the one end that the inlet tube is located the water tank, the second water pump is mutual intercommunication setting with the one end that the outlet pipe is located the water tank.

Preferably, a plurality of guide plates with the same structure are fixedly arranged on the inner wall of the heat conduction box, and the guide plates are distributed in an S-shaped loop in the heat conduction box.

The utility model provides a pair of air-cooled radiator for host computer, beneficial effect lies in:

1. through fixed establishment, the linkage setting of slider and spout, to two connecting rods of both sides pulling respectively, it moves on the fixed block to drive the slide bar, according to the size of host computer, after removing two connecting rods to suitable position, four installation piece joint are in four edges of host computer this moment, utilize clamping screw to fix in the host computer outside, thereby can fix the device in the outside of host computer, under the interact through slider and spout, can carry on spacingly at the in-process that the slide bar removed, avoid the slide bar to take place the derail phenomenon.

2. Through first heat dissipation mechanism, the linkage setting of heat dissipation box and radiating groove, when the device is fixed with the host computer, the heat-conducting plate can be with the heat conduction of host computer to the heat dissipation box inside, start four heat dissipation fans, through a plurality of radiating grooves, four heat dissipation fans can let the air in the heat dissipation box circulate, and then can discharge the heat that the heat-conducting plate conducted, thereby the radiating effect to the host computer has been improved, through set up the filter screen on heat dissipation fan and radiating groove, dust in can avoiding the air as far as possible gets into the inside phenomenon of heat dissipation box and takes place, and then improve the holistic life of the device.

3. Through the linkage setting of second heat dissipation mechanism and guide plate, the heat conduction case can be with the leading-in inside of the heat conduction of heat-conducting plate, start first water pump, the cooling water of first water pump in with the water tank passes through the inlet tube and gets into the heat conduction incasement, heat to the heat conduction incasement cools off, through setting up the guide plate, can let the cooling water more abundant dispel the heat to the heat conduction incasement, the cooling water flows into out in the water pipe through the guide plate, start the second water pump, the cooling water suction to the water tank in the second water pump will go out the water pipe, and then realize the cyclic utilization of cooling water, resources are saved.

Drawings

Fig. 1 is a schematic structural view of an air-cooled radiator for a host according to the present invention;

fig. 2 is a schematic side view of an air-cooled heat sink for a mainframe according to the present invention;

fig. 3 is a structural installation of a slide bar and a slide block of the air-cooled radiator for the host machine provided by the utility model;

fig. 4 is a schematic side sectional view of a heat dissipating box of an air-cooled heat sink for a host machine according to the present invention;

fig. 5 is a schematic mechanism installation diagram of a second heat dissipation mechanism of the air-cooled radiator for the host machine according to the present invention.

In the figure: 1. a heat dissipation box; 2. a heat conducting plate; 3. a fixing plate; 4. a chute; 5. a slide bar; 6. a heat sink; 7. a connecting rod; 8. mounting blocks; 9. a heat dissipation fan; 10. a slider; 11. a heat conducting box; 12. a water tank; 13. a water inlet pipe; 14. a water outlet pipe; 15. a first water pump; 16. a second water pump; 17. a deflector.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-3, an air-cooled radiator for a host comprises a heat-dissipating box 1, a heat-conducting plate 2 is arranged through the side wall of the heat-dissipating box 1, and the heat-conducting plate 2 and the heat-dissipating box 1 are arranged in an embedded manner, when the device is fixed on the host, the heat-conducting plate 2 can guide the heat generated by the host into the heat-dissipating box 1, two fixing plates 3 with the same structure and corresponding distribution are fixedly arranged on the side wall of the heat-dissipating box 1 away from a heat-dissipating fan 9, the fixing plates 3 are respectively positioned at both sides of the heat-conducting plate 2, two sliding rods 5 with the same structure and corresponding distribution are arranged on the fixing plates 3 in a sliding and matching manner, the sliding rods 5 are arranged in a concave shape, a connecting rod 7 is fixedly arranged between the two sliding rods 5 positioned at both sides of the heat-conducting plate 2, and mounting blocks 8 with the same structure are fixedly arranged at the top and the bottom of the connecting rod 7, and installation piece 8 all is "L" style of calligraphy setting, stimulate two connecting rods 7 respectively to both sides, drive slide bar 5 and remove on fixed plate 3, according to the size of host computer, remove two connecting rods 7 to suitable position after, four installation pieces 8 joints are in four edges and corners of host computer this moment, utilize clamping screw to fix in the host computer outside, thereby can fix the device in the outside of host computer, the same spout 4 of structure is all seted up to two corresponding lateral walls of fixed plate 3, through two corresponding inner walls all fixed being provided with the same slider 10 of structure with slide bar 5, and slider 10 is the slip matching setting with close spout 4, under the interact of slider 10 and spout 4, can carry on spacingly at the in-process that slide bar 5 removed, avoid slide bar 5 to take place the derail phenomenon.

Referring to fig. 1-2, a plurality of heat dissipation grooves 6 having the same structure and distributed in a linear array are formed in two corresponding side walls of a heat dissipation box 1, one side of the heat dissipation box 1, which is far away from a heat conduction plate 2, is fixedly provided with four heat dissipation fans 9 having the same structure and distributed in a rectangular array, the heat dissipation box 1 and the heat dissipation grooves 6 are communicated with each other, and filter screens having the same structure are fixedly arranged on one sides of the heat dissipation fans 9 and the heat dissipation grooves 6, which are located outside the heat dissipation box 1, when the device is fixed with a host, the heat conduction plate 2 can conduct heat of the host to the inside of the heat dissipation box 1, the four heat dissipation fans 9 are started, through the plurality of heat dissipation grooves 6, the four heat dissipation fans 9 can circulate air in the heat dissipation box 1, and further can discharge the heat conducted by the heat conduction plate 2, so that the heat dissipation effect on the host is improved, by arranging the filter screens on the heat dissipation fans 9 and the heat dissipation grooves 6, dust in the air can be prevented from entering the inside of the heat dissipation box 1 as much as possible, and the service life of the device is prolonged.

Referring to fig. 1 to 5, a water tank 12 is fixedly disposed on an inner wall of a heat dissipation box 1, a heat conduction box 11 is fixedly disposed on one side of the heat conduction plate 2 located in the heat dissipation box 1, the top of the heat conduction box 11 and the top of the water tank 12 are communicated with each other through a water inlet pipe 13, the bottom of the heat conduction box 11 and the bottom of the water tank 12 are communicated with each other through a water outlet pipe 14, a first water pump 15 and a second water pump 16 are fixedly disposed on the inner wall of the water tank 12, the first water pump 15 and one end of the water inlet pipe 13 located in the water tank 12 are communicated with each other, the second water pump 16 and one end of the water outlet pipe 14 located in the water tank 12 are communicated with each other, a plurality of guide plates 17 having the same structure are fixedly disposed on the inner wall of the heat conduction box 11, the guide plates 17 are distributed in an S-shaped loop in the heat conduction box 11, the heat conduction box 11 can guide heat conducted by the heat conduction plate 2 into the interior thereof, the first water pump 15 is started, the cooling water pump 15 feeds cooling water in the water tank 12 into the heat conduction box 11 through the water inlet pipe 13, and the second water pump 16 is started to circulate in the water cooling water guide plates 16, thereby saving the water cooling tank, and the water cooling tank 14.

The use principle and the advantages are as follows: two connecting rods 7 are pulled to two sides respectively, the sliding rod 5 is driven to move on the fixing plate 3, according to the size of the host machine, the two connecting rods 7 are moved to proper positions, at the moment, four installation blocks 8 are clamped at four corners of the host machine, the fixing screw rod is fixed on the outer side of the host machine, the device is fixed on the outer side of the host machine, when the device is fixed with the host machine, the heat conducting plate 2 can conduct the heat of the host machine to the inside of the heat radiating box 1, the four heat radiating fans 9 are started, the four heat radiating fans 9 can enable the air in the heat radiating box 1 to circulate through the plurality of heat radiating grooves 6, and further the heat conducted by the heat conducting plate 2 can be discharged, so that the heat radiating effect of the host machine is improved, the heat conducting box 11 can conduct the heat conducted by the heat conducting plate 2 into the heat conducting box, the first water pump 15 is started, the cooling water in the water tank 12 enters the heat conducting box 11 through the water inlet pipe 13 by the first water pump 15, the heat conducting box 11 is cooled, through the arrangement of the guide plate 17, the second water pump 16 is started, and the water pump is pumped into the water outlet pipe 16, and the cooling water is recycled into the water tank 12, and the water outlet pipe 16, and the water can be used for saving resource saving.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The air-cooled radiator for the host comprises a heat dissipation box (1) and is characterized in that a heat conduction plate (2) is fixedly arranged on the side wall of the heat dissipation box (1) in a penetrating mode, the heat conduction plate (2) and the heat dissipation box (1) are arranged in an embedded mode, a plurality of heat dissipation grooves (6) which are identical in structure and distributed in a linear array mode are formed in two corresponding side walls of the heat dissipation box (1), a first heat dissipation mechanism is arranged on one side, away from the heat conduction plate (2), of the heat dissipation box (1), a second heat dissipation mechanism is arranged between the inner wall of the heat dissipation box (1) and one side, located in the heat dissipation box (1), of the heat conduction plate (2), and a fixing mechanism is arranged on the other side of the heat dissipation box (1);

first heat dissipation mechanism is including heat dissipation fan (9), the fixed heat dissipation fan (9) that run through and be provided with four structures the same and be the setting of rectangular array distribution in one side that heat-conducting plate (2) was kept away from in heat dissipation box (1), heat dissipation fan (9), heat dissipation box (1) and radiating groove (6) are the setting of intercommunication each other, the heat dissipation fan (9) all fixes the filter screen that is provided with the structure the same with one side that radiating groove (6) are located heat dissipation box (1) outside.

2. The air-cooled radiator for the host computer according to claim 1, characterized in that, the fixed establishment includes fixed plate (3), slide bar (5), connecting rod (7) and installation piece (8), the lateral wall that heat dissipation box (1) kept away from heat dissipation fan (9) is fixed to be provided with two fixed plates (3) that the structure is the same and be the corresponding setting that distributes, fixed plate (3) are located the both sides of heat-conducting plate (2) respectively, equal sliding fit is provided with two slide bars (5) that the structure is the same and be the relative setting that distributes on fixed plate (3), slide bar (5) all are "concave" style of calligraphy setting, are located two of heat-conducting plate (2) both sides two fixed connecting rod (7) that are provided with between slide bar (5), the top and the bottom of connecting rod (7) all are fixed to be provided with installation piece (8) that the structure is the same, installation piece (8) all are "L" style of calligraphy setting.

3. The air-cooled radiator for the host machine according to claim 2, wherein the two corresponding side walls of the fixed plate (3) are both provided with sliding grooves (4) with the same structure, the two corresponding inner walls of the sliding rod (5) are both fixedly provided with sliding blocks (10) with the same structure, and the sliding blocks (10) are in sliding matching with the adjacent sliding grooves (4).

4. The air-cooled radiator for the host computer according to claim 1, characterized in that, the second heat dissipation mechanism includes a water tank (12), a heat conduction box (11), a water outlet pipe (14), a water inlet pipe (13), a first water pump (15) and a second water pump (16), the inner wall of the heat dissipation box (1) is fixedly provided with the water tank (12), one side of the heat conduction plate (2) in the heat dissipation box (1) is fixedly provided with the heat conduction box (11), the top of the heat conduction box (11) and the top of the water tank (12) are mutually communicated through the water inlet pipe (13), the bottom of the heat conduction box (11) and the bottom of the water tank (12) are mutually communicated through the water outlet pipe (14), the inner wall of the water tank (12) is fixedly provided with the first water pump (15) and the second water pump (16), the first water pump (15) and the end of the water inlet pipe (13) in the water tank (12) are mutually communicated, and the second water pump (16) and the end of the water outlet pipe (14) in the water tank (12) are mutually communicated.

5. The air-cooled radiator for the host machine according to claim 4, wherein a plurality of guide plates (17) with the same structure are fixedly arranged on the inner wall of the heat conduction box (11), and the guide plates (17) are distributed in an S-shaped loop in the heat conduction box (11).