CN218657302U - Copper-free paste welding die applied to ultrathin soaking plate - Google Patents
Copper-free paste welding die applied to ultrathin soaking plate Download PDFInfo
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- CN218657302U CN218657302U CN202222466651.2U CN202222466651U CN218657302U CN 218657302 U CN218657302 U CN 218657302U CN 202222466651 U CN202222466651 U CN 202222466651U CN 218657302 U CN218657302 U CN 218657302U
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Abstract
The utility model discloses a copper paste-free welding mould applied to an ultrathin soaking plate, which comprises an upper mould and a lower mould, wherein the copper paste-free welding is carried out on the ultrathin soaking plate through the combination of the upper mould and the lower mould; the upper die comprises an upper die main body and a convex plate; the upper die main body is a force application main body; the convex plate is arranged on the upper die main body; the lower die comprises a lower die main body, a cavity and a stress welding edge; the lower die main body is a stressed main body; the cavity is arranged in the lower die main body and is matched with the protruding plate in size; the stress welding edge surrounds the cavity and has a height higher than the plane height of the cavity; when the upper die and the lower die are closed, an expansion reserved gap is arranged between the ultrathin soaking plate and the side edge of the cavity, and a reserved gap is arranged between the upper die and the lower die. The utility model discloses a compound die of last mould and bed die carries out no copper paste welding, has solved the higher problem of ultra-thin soaking plate manufacturing cost among the prior art effectively.
Description
Technical Field
The utility model relates to a soaking plate technical field, in particular to be applied to no copper paste welding mould of ultra-thin soaking plate.
Background
The vapor chamber is a vacuum chamber with a fine structure on the inner wall, and is usually made of copper. When heat is conducted to the evaporation zone from the heat source, the cooling liquid in the cavity starts to generate the gasification phenomenon of the cooling liquid after being heated in the environment with low vacuum degree, at the moment, heat energy is absorbed, the volume rapidly expands, the whole cavity is rapidly filled with gaseous cooling medium, and the condensation phenomenon can be generated when the gaseous working medium contacts a relatively cold zone. The heat accumulated during evaporation is released by the condensation phenomenon, and the condensed cooling liquid returns to the evaporation heat source through the capillary tube of the microstructure, and the operation is repeated in the cavity.
The welding of the upper cover and the lower cover of the ultrathin soaking plate in the prior art adopts two modes: 1. using a dispenser to dispense soldering paste on the edge of the lower cover, combining the upper cover on the dispensing face, putting the upper cover into a graphite mold for locking, and putting the upper cover into a furnace for welding, namely copper paste welding for short; 2. putting the upper cover and the lower cover into a graphite mould, applying pressure on the mould, heating instantly, and welding by using the movement and diffusion of molecules at high temperature, which is hereinafter referred to as 'graphite pressure welding'; the existing copper paste welding process has the following defects: 1. the copper paste welding increases the material cost, and the copper paste has short validity period and is easy to cause waste; 2. the copper paste welding mode increases two (copper paste dispensing and presintering) process costs, which causes protective gas loss; 3. the flux in the copper soldering paste is heated to pollute the capillary structure of the ultrathin soaking plate; the existing 'graphite pressure welding' process has the following defects: 1. the graphite die has large loss, and the cost of welding a single product is high; secondly, welding is unstable, the shutdown treatment is abnormal for a long time, and mass production is not facilitated; therefore, the copper paste-free welding die applied to the ultrathin soaking plate is provided, and the problem that the production cost of the ultrathin soaking plate is high in the prior art is solved.
SUMMERY OF THE UTILITY MODEL
One of the purposes of the utility model is to provide a be applied to no copper paste welding mould of ultra-thin soaking plate to in solving prior art the higher problem of ultra-thin soaking plate manufacturing cost.
The utility model relates to a be applied to no copper paste welding mould of ultra-thin soaking plate can realize through following technical scheme:
the utility model relates to a no copper paste welding mould applied to ultra-thin soaking plate, which comprises an upper mould and a lower mould, wherein the upper mould is arranged above the lower mould, and the soaking upper plate and the soaking lower plate in the ultra-thin soaking plate arranged in the upper mould are welded without copper paste through the closing of the upper mould and the lower mould; the upper die comprises an upper die main body and a convex plate; the upper die main body is a force application main body; the convex plate is arranged on the upper die main body, and the size of the convex plate is matched with that of the ultrathin soaking plate; the lower die comprises a lower die main body, a cavity and a stress welding edge; the lower die main body is a stressed main body; the cavity is arranged in the lower die main body and is matched with the protruding plate in size; the stress welding edge is encircled in the cavity and has a height higher than that of the plane of the cavity; when the upper die and the lower die are closed, an expansion reserved gap is arranged between the ultrathin soaking plate and the side edge of the cavity, and a reserved gap is arranged between the upper die and the lower die.
In one embodiment, the height difference between the force-bearing welded edge and the plane of the cavity is 0.025-0.04mm.
In one embodiment, when the upper die and the lower die are closed, the expansion allowance gap between the ultrathin soaking plate and the side edge of the cavity ranges from 0.15mm to 0.20mm.
In one embodiment, when the upper die and the lower die are closed, the reserved gap between the upper die and the lower die ranges from 0.04mm to 0.08mm.
In one embodiment, the width of the stressed welded edge ranges from 1.5 mm to 2.8mm.
In one embodiment, the upper die further comprises a first groove body and a plurality of first positioning holes, and the first groove body is arranged on the side edge of the convex plate; a plurality of first locating hole sets up respectively go up the side of mould main part and run through go up the mould main part.
In one embodiment, the lower die further comprises a second groove body and a plurality of second positioning holes, the second groove body is arranged on the side edge of the cavity, and the position of the second groove body is matched with that of the first groove body; the second positioning holes are respectively arranged on the side edge of the lower die main body and penetrate through the lower die main body, and are respectively matched with the corresponding positions and sizes of the first positioning holes.
In one embodiment, the welding pressure balance weight of the upper die is not less than 3kg, and the temperature of the welding furnace is maintained at 780-820 ℃.
In one embodiment, the upper mold and the lower mold are made of graphite.
In one embodiment, the thickness of the ultrathin soaking plate is 0.35-0.4mm.
Compared with the prior art, the utility model relates to a be applied to no copper paste welding mould of ultra-thin soaking plate's beneficial effect does:
the utility model relates to a copper paste free welding mould applied to an ultrathin soaking plate, which is characterized in that a stress welding edge is arranged at the side edge of a cavity of a lower template, and a height difference is arranged between the stress welding edge and the cavity, so that the lower pressure of an upper template is completely concentrated on the stress welding edge, and the copper paste free welding is carried out on the upper and lower plates of the ultrathin soaking plate; when the upper die and the lower die are matched, an expansion reserved gap is formed between the ultrathin soaking plate and the side edge of the cavity, so that the ultrathin soaking plate is convenient to take after welding is finished, and the ultrathin soaking plate is not cracked when heated; a reserved gap is formed between the upper die and the lower die, so that overpressure is effectively avoided, and the situation that the convex plate cannot press the stressed welding edge is prevented, so that the copper paste-free welding function of the upper and lower plates of the ultrathin soaking plate is realized, and the problem that the production cost of the ultrathin soaking plate is high in the prior art is effectively solved;
the utility model relates to a copper-free soldering mould applied to an ultrathin soaking plate, which can effectively avoid the pollution of the heating of soldering flux in the copper soldering paste to the capillary structure of the ultrathin soaking plate, and improve the performance yield; the copper soldering paste and the pre-burning gas consumption are saved, and the material cost is saved; meanwhile, the welding is stable, and mass production can be performed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic structural view of a copper paste-free soldering mold applied to an ultra-thin soaking plate according to the present invention;
fig. 2 is a schematic diagram of an explosion structure of a copper paste-free welding mold applied to an ultra-thin vapor chamber of the present invention shown in fig. 1, which includes an upper mold and a lower mold;
FIG. 3 is a schematic structural view of an upper mold of the copper paste free welding mold for an ultra-thin soaking plate of the present invention shown in FIG. 2;
FIG. 4 is a schematic structural view of a lower mold of the copper paste free soldering mold of the present invention shown in FIG. 2;
fig. 5 is a schematic side view of the copper paste-free welding mold applied to the ultra-thin vapor chamber of the present invention shown in fig. 1;
fig. 6 is an enlarged schematic view of fig. 5 at a.
The figures are marked by: 11, an upper die; 111, an upper die body; 112, a convex plate; 113, a first trough body; 114, a first locating hole; 12, a lower die; 121, a lower die body; 122, a cavity; 123, stress welding edges; 124, a second trough body; 125, a second positioning hole; 20, ultrathin soaking plates; 21, soaking the upper plate; 211, a vacuum head; and (22) soaking the lower plate.
Detailed Description
To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the attached drawings in the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are part of the embodiments of the present invention, rather than all embodiments. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships usually placed when the products of the present invention are used, and are only for convenience of description and simplification of the description, but not for indicating or implying that the indicated device or element must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present invention.
Further, in the present disclosure, unless expressly stated or limited otherwise, the first feature may comprise directly contacting the first and second features above or below the second feature, or may comprise contacting the first and second features not directly but through additional features therebetween. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature that underlies, and underlies a second feature includes a first feature that is directly under and obliquely under a second feature, or simply means that the first feature is at a lesser level than the second feature.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are absolutely horizontal or hanging, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, the copper paste-free soldering mold for an ultra-thin soaking plate of the present invention is mainly applied to the production process of an ultra-thin soaking plate 20 for effective heat dissipation inside a notebook computer and a smart phone, wherein the thickness of the ultra-thin soaking plate 20 is 0.35-0.4mm; the utility model relates to a be applied to no copper paste welding mould of ultra-thin soaking plate mainly includes mould 11 and bed die 12, it sets up to go up mould 11 the top of bed die 12, through its compound die between them to setting up in it soaking upper plate 21 and soaking hypoplastron 22 among the ultra-thin soaking plate 20 carry out no copper paste welding.
Referring to fig. 1 to 3, in the present embodiment, the upper mold 11 includes an upper mold main body 111, a convex plate 112, a first groove 113, and a plurality of first positioning holes 114; the upper die main body 111 is a force application main body; the convex plate 112 is arranged on the upper die main body 111, and the size of the convex plate is matched with that of the ultrathin soaking plate 20; the first groove 113 is arranged on the side edge of the convex plate 112, and the position and the size of the first groove are matched with the position and the size of the vacuum head 211 on the ultrathin soaking plate 20; the first positioning holes 114 are respectively disposed at the side of the upper mold main body 111 and penetrate through the upper mold main body 111, and function to position. In the present embodiment, the upper mold body 111 and the convex plate 112 are integrally formed, and the material of the upper mold body and the convex plate is graphite.
Referring to fig. 1, fig. 2 and fig. 4, in the present embodiment, the lower mold 12 includes a lower mold main body 121, a cavity 122, a stress welding edge 123, a second groove 124 and a plurality of second positioning holes 125; the lower die main body 121 is a stressed main body; the cavity 122 is arranged in the lower die body 121 and is matched with the size of the convex plate 112; the stress welding edge 123 surrounds the cavity 122, and the height of the stress welding edge 123 is slightly higher than that of the cavity 122, so that the side edge of the ultrathin soaking plate 20 is arranged on the stress welding edge 123 to be welded under stress; the second slot 124 is arranged at the side of the cavity 122, and the position of the second slot 124 is matched with that of the first slot 113, so that the vacuum head 211 arranged on the first slot 113 and the second slot 124 is not deformed under stress; the second positioning holes 125 are respectively disposed at the side of the lower mold body 121 and penetrate through the lower mold body 121, and the positions and the sizes of the second positioning holes 125 are respectively matched with the positions and the sizes of the corresponding first positioning holes 114. In this embodiment, the lower die body 121, the cavity 122 and the force-receiving welding edge 123 are integrally formed. The three materials are graphite; the width range of the force-bearing welding edge 123 is 1.5-2.8mm, and preferably, the width range of the force-bearing welding edge 123 is 2.3mm.
Referring to fig. 5 and 6, in this embodiment, when the upper mold 11 and the lower mold 12 are closed, an expansion allowance gap W is provided between the ultra-thin soaking plate 20 and the side edge of the cavity 122, and the width W of the expansion allowance gap is in the range of 0.15-0.20mm; preferably, the width W of the expansion allowance gap is 0.15mm, so that when the upper mold 11 presses down the lower mold 12, the soaking upper plate 21 and the soaking lower plate 22 are expanded by heat, and the ultrathin soaking plate 20 after being pressed is difficult to take out of the lower mold 12. In this embodiment, the height H between the force-bearing welding edge 122 and the plane of the cavity 122 ranges from 0.025 to 0.04mm, and preferably, the height H is 0.03mm, so that when the upper mold 11 is pressed down, the downward pressure is mainly concentrated between the force-bearing welding edge 122 and the ultra-thin soaking plate 20, and the non-welding area is prevented from being pressed. In this embodiment, when the upper mold 11 and the lower mold 12 are closed, the value of the clearance h reserved between the upper mold 11 and the lower mold 12 is 0.04-0.08mm, which is used to avoid overpressure and prevent the flange 112 from not pressing against the stressed welding edge 123, and preferably, the clearance h is 0.05 mm.
The utility model relates to a be applied to no copper cream of ultra-thin soaking plate and weld production technology, including following step:
s1, sequentially aligning and placing the soaking lower plate 22 and the soaking upper plate 22 in the lower die 12, wherein the side edges of the soaking lower plate 22 and the soaking upper plate 22 are respectively arranged on the stress welding edge 123, and the expansion reserved gap between the side edges of the soaking lower plate 22 and the soaking upper plate 22 and the side edge of the cavity 122 is 0.15mm;
s2, the upper die 11 presses the lower die 12 downwards, and a reserved gap between the upper die and the lower die is 0.05 mm; in the welding process, the welding pressure balance weight of the upper die 11 is not less than 3kg, and the temperature of the welding furnace is maintained as follows: 780-820 degrees.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The copper paste-free welding mold applied to the ultrathin soaking plate is characterized by comprising an upper mold and a lower mold, wherein the upper mold is arranged above the lower mold, and the soaking upper plate and the soaking lower plate in the ultrathin soaking plate arranged in the upper mold are welded in a copper paste-free mode through the closing of the upper mold and the lower mold; the upper die comprises an upper die main body and a convex plate, the upper die main body is a force application main body, the convex plate is arranged on the upper die main body, and the size of the convex plate is matched with that of the ultrathin soaking plate; the lower die comprises a lower die main body, a cavity and a stress welding edge; the lower die main body is a stressed main body; the cavity is arranged in the lower die main body and is matched with the convex plate in size; the stress welding edge is encircled in the cavity and has a height higher than that of the plane of the cavity; when the upper die and the lower die are closed, an expansion reserved gap is arranged between the ultrathin soaking plate and the side edge of the cavity, and a reserved gap is arranged between the upper die and the lower die.
2. The brazing-free soldering mold for ultrathin soaking plates as claimed in claim 1, wherein the height difference between the stressed welding edge and the cavity plane is 0.025-0.04mm.
3. The brazing paste free mold for an ultrathin soaking plate according to claim 1, wherein when the upper mold and the lower mold are closed, the expansion allowance gap between the ultrathin soaking plate and the side edge of the cavity ranges from 0.15mm to 0.20mm.
4. The brazing paste free mold for an ultrathin soaking plate according to claim 1, wherein when the upper mold and the lower mold are closed, the reserved gap between the upper mold and the lower mold ranges from 0.04mm to 0.08mm.
5. The brazing paste free mold for an ultrathin soaking plate as claimed in claim 1, wherein the width of the stressed welding edge ranges from 1.5 mm to 2.8mm.
6. The brazing paste free mold for an ultrathin soaking plate as claimed in claim 1, wherein the upper mold further comprises a first groove body and a plurality of first positioning holes, the first groove body is arranged on the side edge of the convex plate; a plurality of first locating hole sets up respectively go up the side of mould main part and run through go up the mould main part.
7. The brazing paste free mold for an ultrathin soaking plate as claimed in claim 6, wherein the lower mold further comprises a second groove body and a plurality of second positioning holes, the second groove body is arranged on the side edge of the cavity, and the position of the second groove body is matched with that of the first groove body; the second positioning holes are respectively arranged on the side edge of the lower die main body and penetrate through the lower die main body, and are respectively matched with the corresponding positions and sizes of the first positioning holes.
8. The brazing paste free welding mould applied to the ultrathin soaking plate as claimed in claim 1, wherein the welding pressure balance weight of the upper mould is not less than 3kg, and the temperature of a welding furnace is maintained as follows: 780-820 degrees.
9. The brazing paste free mold for an ultrathin soaking plate according to claim 1, wherein the upper mold and the lower mold are made of graphite.
10. The brazing paste free mold for an ultrathin soaking plate according to any one of claims 1 to 9, wherein the thickness of the ultrathin soaking plate is 0.35 to 0.4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222466651.2U CN218657302U (en) | 2022-09-19 | 2022-09-19 | Copper-free paste welding die applied to ultrathin soaking plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222466651.2U CN218657302U (en) | 2022-09-19 | 2022-09-19 | Copper-free paste welding die applied to ultrathin soaking plate |
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| Publication Number | Publication Date |
|---|---|
| CN218657302U true CN218657302U (en) | 2023-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222466651.2U Active CN218657302U (en) | 2022-09-19 | 2022-09-19 | Copper-free paste welding die applied to ultrathin soaking plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218657302U (en) |
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- 2022-09-19 CN CN202222466651.2U patent/CN218657302U/en active Active
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