CN211208422U

CN211208422U - Gilding cover plate with gold-tin welding ring for electronic packaging

Info

Publication number: CN211208422U
Application number: CN202020075495.5U
Authority: CN
Inventors: 荀涌波; 林宗光
Original assignee: Shenzhen Xigu Welding Technology Co ltd
Current assignee: Shenzhen Xigu Welding Technology Co ltd
Priority date: 2020-01-14
Filing date: 2020-01-14
Publication date: 2020-08-07
Anticipated expiration: 2030-01-14

Abstract

The utility model discloses an electronic packaging is with taking gold tin welding ring gilding apron, including the apron body, the top fixedly connected with gold tin welding ring of apron body, the top symmetry of apron body has seted up the groove of dismantling, the preformed groove has been seted up to the side of apron body, the bottom fixedly connected with copper sheet of apron body, the thickness of gold tin welding ring is 0.03-0.05mm, gold tin welding ring and apron body welded fastening, the top of apron body is located the inboard of gold tin welding ring and has evenly seted up the inflation groove, the thickness in inflation groove is 0.05mm, the copper sheet is kept away from one side of gold tin welding ring and has evenly seted up the heat absorption groove, the utility model relates to an electronic packaging field. This electronic packaging is with taking gold tin to weld ring gilding apron has solved current electronic packaging apron and has taken place to damage inconvenient dismantlement when needing the maintenance in inside, and thermal conductivity is not enough simultaneously, and easy bulging deformation influences the problem of leakproofness when high temperature environment or back exogenic action.

Description

Gilding cover plate with gold-tin welding ring for electronic packaging

Technical Field

The utility model relates to an electronic packaging field specifically is an electronic packaging is with taking gold tin to weld ring gilding apron.

Background

Electronic components encapsulation is used for storing electronic components, and electronic packaging metal cover plate wide application is in electronic components's encapsulation, and present electronic components encapsulation is mostly closed shell structure. But current electronic packaging apron takes place inside and damages inconvenient dismantlement when needing the maintenance, and thermal conductivity is not enough simultaneously, and easy bulging deformation influences the leakproofness when high temperature environment or back exogenic action.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides an electronic packaging is with taking gold tin to weld ring gilding apron has solved current electronic packaging apron and has taken place inconvenient dismantlement when damaging needs the maintenance in inside, and thermal conductivity is not enough simultaneously, and easy bulging deformation influences the problem of leakproofness when high temperature environment or back exogenic action.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides an electronic packaging is with taking gold tin to weld ring gilding apron, includes the apron body, the top fixedly connected with gold tin of apron body welds the ring, the top symmetry of apron body has seted up the dismantlement groove, the preformed groove has been seted up to the side of apron body, the bottom fixedly connected with copper sheet of apron body.

Preferably, the thickness of the gold-tin welding ring is 0.03-0.05mm, and the gold-tin welding ring is welded and fixed with the cover plate body.

Preferably, the top of the cover plate body is located on the inner side of the gold-tin welding ring and is evenly provided with expansion grooves, and the thickness of each expansion groove is 0.05 mm.

Preferably, heat absorption grooves are uniformly formed in one side, away from the gold-tin welding ring, of the copper sheet.

Preferably, the ratio of the width of the preformed groove to the thickness of the cover plate body is 1: 5.

Preferably, the number of the expansion grooves is 4-6, and the expansion grooves are symmetrically distributed on two sides of the reserved groove.

(III) advantageous effects

The utility model provides an electronic packaging is with taking gold-tin welding ring gilding apron. The method has the following beneficial effects:

(1) this electronic packaging is with taking gold-tin welding ring gilding apron has seted up the dismantlement groove through the top symmetry of apron body, and use tools inserts the dismantlement inslot portion when electronic components is inside to be damaged, and with the apron from components and parts upwarp, the convenience is dismantled the apron from electronic components and is carried out maintenance work.

(2) This electronic packaging is with taking gold tin to weld ring gilding apron has seted up the reservation groove through the side of apron body, the bottom fixedly connected with copper sheet of apron body, copper have good heat conductivity, can be with the quick transmission of the inside heat of electronic components to the apron on, then by the apron transmission to the components and parts outside, the heat conductivility of electrical components has been increased, to reservation groove and inflation inslot extrusion when apron expansion deformation under high temperature environment or back exogenic action, avoid the outside leakproofness of extrudeing components and parts destruction electronic components of apron inflation, solved current electronic packaging apron easy expansion deformation influence leakproofness when high temperature environment or back exogenic action problem.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the heat dissipation device of the present invention.

In the figure: the heat absorption device comprises a cover plate body 1, a gold-tin welding ring 2, a disassembly groove 3, a reserved groove 4, a copper sheet 5, an expansion groove 6 and a heat absorption groove 7.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: a gilding cover plate with a gold-tin welding ring for electronic packaging comprises a cover plate body 1, the top of the cover plate body 1 is fixedly connected with a gold-tin welding ring 2, the top of the cover plate body 1 is symmetrically provided with dismounting grooves 3, when an electronic component is damaged, a tool is inserted into the dismounting grooves 3 to tilt the cover plate body 1 from the component, so that the cover plate can be conveniently dismounted from the electronic component for maintenance, the side surface of the cover plate body 1 is provided with a reserved groove 4, the bottom of the cover plate body 1 is fixedly connected with a copper sheet 5, the copper sheet 5 has good thermal conductivity, the heat in the electronic component can be rapidly transferred to the cover body 1 and then transferred to the outside of the component by the cover plate body 1, the thermal conductivity of the electrical component is improved, when the cover plate body 1 expands and deforms under the action of high-temperature environment or external force, the cover plate body extrudes into the reserved groove 4, the problem that the sealing performance of the electronic component is affected by the fact that the electronic packaging cover plate is easy to expand and deform in a high-temperature environment or under the action of external force is solved.

The thickness of the gold-tin welding ring 2 is 0.03-0.05mm, and the gold-tin welding ring 2 is fixedly welded with the cover plate body 1.

Expansion grooves 6 are uniformly formed in the inner side, located on the gold-tin welding ring 2, of the top of the cover plate body 1, and the thickness of each expansion groove 6 is 0.05 mm.

And heat absorption grooves 7 are uniformly formed in one side of the copper sheet 5, which is far away from the gold-tin welding ring 2.

The ratio of the width of the reserve groove 4 to the thickness of the cover plate body 1 is 1: 5.

The number of the expansion grooves 6 is 4-6, and the expansion grooves 6 are symmetrically distributed on two sides of the reserve groove 4.

During the use, use tool inserts inside the disassembly groove 3 when electronic components is inside to be damaged, with apron body 1 from components and parts perk, under high temperature environment or back exogenic action apron body 1 inflation deformation time to in preformed groove 4 and the expansion tank 6 extrusion can.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an electronic packaging is with taking gold tin welding ring gilding apron, includes apron body (1), the top fixedly connected with gold tin welding ring (2) of apron body (1), its characterized in that: the detachable cover plate is characterized in that the top of the cover plate body (1) is symmetrically provided with dismounting grooves (3), the side face of the cover plate body (1) is provided with a reserved groove (4), and the bottom of the cover plate body (1) is fixedly connected with a copper sheet (5).

2. The cover plate with gold-tin ring for electronic package of claim 1, wherein: the thickness of the gold-tin welding ring (2) is 0.03-0.05mm, and the gold-tin welding ring (2) is fixedly welded with the cover plate body (1).

3. The cover plate with gold-tin ring for electronic package of claim 1, wherein: expansion grooves (6) are uniformly formed in the inner side, located on the gold-tin welding ring (2), of the top of the cover plate body (1), and the thickness of each expansion groove (6) is 0.05 mm.

4. The cover plate with gold-tin ring for electronic package of claim 1, wherein: and heat absorption grooves (7) are uniformly formed in one side of the copper sheet (5) far away from the gold-tin welding ring (2).

5. The cover plate with gold-tin ring for electronic package of claim 1, wherein: the ratio of the width of the preformed groove (4) to the thickness of the cover plate body (1) is 1: 5.

6. The cover plate with gold-tin ring for electronic package of claim 3, wherein: the number of the expansion grooves (6) is 4-6, and the expansion grooves (6) are symmetrically distributed on two sides of the reserved groove (4).