CN218649154U

CN218649154U - High-heat-conductivity aluminum substrate capable of being installed quickly

Info

Publication number: CN218649154U
Application number: CN202222843161.XU
Authority: CN
Inventors: 侯晓明; 侯燕芬; 徐建华; 张素安; 俞宜
Original assignee: Changzhou Wujin 3d Electronics Co ltd
Current assignee: Changzhou Wujin 3d Electronics Co ltd
Priority date: 2022-10-25
Filing date: 2022-10-25
Publication date: 2023-03-17
Anticipated expiration: 2032-10-25

Abstract

The utility model discloses a high heat conduction aluminium base board that can install fast, which comprises a mainboard, the first inner plating of mainboard top inner wall fixedly connected with, the first inlayer of first inner plating bottom fixedly connected with, first inlayer bottom fixedly connected with cooling plate, cooling plate bottom fixedly connected with heat-conducting plate, heat-conducting plate bottom fixedly connected with second inlayer, second inlayer bottom fixedly connected with second inlayer, second inner plating bottom fixedly connected with absorber plate, both ends fixedly connected with evenly distributed's heat pipe around the absorber plate, absorber plate bottom fixedly connected with shock attenuation board, both ends fixedly connected with base around the mainboard left and right sides bottom, base top intermediate position all is provided with the screw hole, both sides four corners department fixedly connected with miniature machine case about the mainboard. The utility model discloses in, effectively promote the shock attenuation effect and the effect of falling the heat of aluminium base board, improved the life of aluminium base board.

Description

High-heat-conductivity aluminum substrate capable of being installed quickly

Technical Field

The utility model relates to an aluminium base board application technology field especially relates to an aluminium base board of high heat conduction that can install fast.

Background

The LED aluminum substrate is just a PCB and is also a printed circuit board, the material of the circuit board is aluminum alloy, the material of the circuit board is glass fiber, but the LED generates heat greatly, so the circuit board for the LED lamp is generally an aluminum substrate, and the heat conduction is fast.

After the aluminum substrate is installed, the connected equipment generates vibration during operation, the vibration may be transmitted to the aluminum substrate, and even the service life of the aluminum substrate may be affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that exists among the prior art, and the aluminium base board of high heat conduction that can install fast that proposes.

In order to realize the purpose, the utility model adopts the following technical scheme: the utility model provides a high heat conduction aluminium base board that can install fast, includes the mainboard, the first inner plate of mainboard top inner wall fixedly connected with, the first inner plate of first inner plate bottom fixedly connected with inlayer, the first inner plate bottom fixedly connected with heat reduction board, heat reduction board bottom fixedly connected with heat-conducting plate, heat-conducting plate bottom fixedly connected with second inlayer, second inner plate bottom fixedly connected with absorber plate, both ends fixedly connected with evenly distributed's heat pipe around the absorber plate, absorber plate bottom fixedly connected with damper plate, both ends fixedly connected with base around the mainboard left and right sides bottom, base top intermediate position all is provided with the screw hole, mainboard left and right sides four corners fixedly connected with miniature machine case.

As a further description of the above technical solution:

the shape of the heat conduction pipe is C-shaped.

As a further description of the above technical solution:

a micro fan is arranged in the microcomputer box.

As a further description of the above technical solution:

the bottom of the base is fixedly connected with a damping rubber pad.

As a further description of the above technical solution:

and damping springs which are uniformly distributed are arranged in the damping plate.

As a further description of the above technical solution:

the top end of the heat conduction pipe is respectively and fixedly connected to the outer walls of the front side and the rear side of the heat conduction plate.

As a further description of the above technical solution:

radiating holes are formed in four corners of the main board.

The utility model discloses following beneficial effect has:

1. the utility model discloses in, at first put the mainboard on appointed place, then squeeze into the screw hole on the base on mainboard both sides with the screw, the screw runs through the base and fixes through the screw hole, process convenient and fast to at base bottom fixedly connected with shock pad, shock pad can the certain degree reduce the vibrations effect that transmits to the mainboard, still be provided with the shock attenuation board bottom the mainboard simultaneously, be provided with a plurality of evenly distributed's damping spring in shock attenuation inboard portion, further reduce vibrations, improve the life of mainboard.

2. The utility model discloses in, mainboard bottom fixedly connected with absorber plate, the absorber plate can absorb the produced heat of mainboard operation in-process, and at the inside intermediate position of mainboard still fixedly connected with heat-conducting plate, through heat-conducting plate and absorber plate combined action down with heat transfer to the heat pipe in, carry by the heat pipe outwards, the micro fan in mainboard both sides four corners department fixed connection's microcomputer case begins the function simultaneously and bloies, carry out the heat dissipation work to the heat pipe, top at the heat-conducting plate still is equipped with the cooling board, keep apart the heat that partly does not handle, and it is convenient with the heat effluvium still to be provided with the louvre in mainboard four corners department, further improve the cooling effect of mainboard, effectual promotion has been carried out to the heat dissipation function of aluminium base board, make aluminium base board possess better radiating effect, effluvium the heat in the aluminium base board.

Drawings

Fig. 1 is a perspective view of a high thermal conductivity aluminum substrate that can be quickly mounted according to the present invention;

FIG. 2 is an enlarged view of FIG. 1 at A;

fig. 3 is a top view of the high thermal conductivity aluminum substrate that can be quickly installed according to the present invention.

Illustration of the drawings:

1. a main board; 2. a micro-cabinet; 3. a base; 4. a threaded hole; 5. a first inner-layer board; 6. a first inner layer; 7. a heat-reducing plate; 8. a heat conduction pipe; 9. a heat conducting plate; 10. a second inner layer; 11. a heat absorbing plate; 12. a damper plate; 13. a micro fan; 14. a shock-absorbing rubber pad; 15. a second inner-layer board; 16. a damping spring; 17. and (4) radiating holes.

Detailed Description

Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a high heat conduction aluminium base board that can install fast, including mainboard 1, the first inner plate 5 of 1 top inner wall fixedly connected with of mainboard, the first inner plate 5 bottom fixedly connected with first inlayer 6 of first inlayer, 6 bottom fixedly connected with heat reduction board 7 of first inlayer keep apart the heat, 7 bottom fixedly connected with heat-conducting plate 9 of heat reduction board derives the heat, heat-conducting plate 9 bottom fixedly connected with second inlayer 10, second inlayer 10 bottom fixedly connected with second

inner plate

15, 15 bottom fixedly connected with absorber plate 11 of second inlayer can absorb the heat that the top produced, both ends fixedly connected with evenly distributed's heat pipe 8 around the absorber plate 11, make things convenient for the absorbed heat to derive in the heat-conducting plate 11 of heat pipe 8, 11 bottom fixedly connected with shock attenuation boards 12 of absorber plate improve mainboard 1's shock attenuation effect, both ends fixedly connected with base 3 around the mainboard 1 left and right sides bottom, 3 top intermediate position all is provided with screw hole 4 makes things convenient for the screw to squeeze into fixedly, mainboard 1 left and right sides four corners fixedly connected with miniature machine case 2.

The shape of heat pipe 8 is the C style of calligraphy, be provided with miniature fan 13 in the miniature machine case 2, miniature fan 13 can carry out the radiating work to the heat of derivation, 3 bottom fixedly connected with shock-absorbing rubber pads 14 of base reduce vibrations, the inside damping spring 16 that is provided with evenly distributed of shock attenuation board 12 reduces vibrations, improve mainboard 1's life, 8 tops of heat pipe are fixed connection respectively makes things convenient for the inside heat dissipation of mainboard 1 on the heat-conducting plate 9 front and back both sides outer wall, mainboard 1 four corners department is provided with louvre 17.

The working principle is as follows: firstly, the mainboard 1 is placed on a designated place, then screws are driven into threaded holes 4 on bases 3 at two sides of the mainboard 1, the screws penetrate through the bases 3 through the threaded holes 4 and are fixed, the process is convenient and rapid, a shock-absorbing rubber pad 14 is fixedly connected at the bottom of the base 3, the shock-absorbing rubber pad 14 can reduce the shock effect transmitted to the mainboard 1 to a certain degree, meanwhile, a shock-absorbing plate 12 is also arranged at the bottom of the mainboard 1, a plurality of shock-absorbing springs 16 which are uniformly distributed are arranged in the shock-absorbing plate 12, the shock is further reduced, the service life of the mainboard 1 is prolonged, meanwhile, the mainboard 1 after the installation is continuously heated in the running process, a heat-absorbing plate 11 is fixedly connected at the bottom of the mainboard 1, the absorber plate 11 can absorb the heat that mainboard 1 operation in-process produced, and at mainboard 1 inside intermediate position fixedly connected with heat-conducting plate 9 still, through heat-conducting plate 9 and absorber plate 11 under the combined action with heat transfer to heat pipe 8 in, carry by heat pipe 8 outside, the micro fan 13 in mainboard 1 both sides four corners department fixedly connected's miniature machine case 2 begins the function simultaneously and bloies, carry out the heat dissipation work to heat pipe 8, still be equipped with heat reduction board 7 at the top of heat-conducting plate 9, keep apart the heat that partly does not dispose, and still be provided with louvre 17 in mainboard 1 four corners department and conveniently spill the heat, further improve mainboard 1's heat reduction effect.

Claims

1. The utility model provides a high heat conduction aluminum substrate that can install fast, includes mainboard (1), its characterized in that: the heat-insulation and heat-insulation combined type heat-insulation combined board is characterized in that a first inner layer board (5) is fixedly connected to the inner wall of the top of the main board (1), a first inner layer board (6) is fixedly connected to the bottom of the first inner layer board (5), a heat-reducing board (7) is fixedly connected to the bottom of the first inner layer board (6), a heat-conducting board (9) is fixedly connected to the bottom of the heat-reducing board (7), a second inner layer board (10) is fixedly connected to the bottom of the second inner layer board (10), a heat-absorbing board (11) is fixedly connected to the bottom of the second inner layer board (15), heat-conducting pipes (8) which are uniformly distributed are fixedly connected to the front end and the rear end of the heat-absorbing board (11), a shock-absorbing board (12) is fixedly connected to the bottom of the heat-absorbing board (11), a base (3) is fixedly connected to the front end and the rear end of the bottom of the left side and the main board (1), threaded holes are formed in the middle position of the top of the base (3), and the micro case (2) is fixedly connected to the four corners of the left side and the main board (1).

2. The aluminum substrate with high thermal conductivity capable of being rapidly mounted as claimed in claim 1, wherein: the shape of the heat conduction pipe (8) is C-shaped.

3. The aluminum substrate with high thermal conductivity capable of being rapidly mounted as claimed in claim 1, wherein: a micro fan (13) is arranged in the micro case (2).

4. The aluminum substrate with high thermal conductivity capable of being rapidly mounted as claimed in claim 1, wherein: the bottom of the base (3) is fixedly connected with a shock-absorbing rubber pad (14).

5. The aluminum substrate with high thermal conductivity capable of being rapidly mounted as claimed in claim 1, wherein: and damping springs (16) which are uniformly distributed are arranged in the damping plate (12).

6. The aluminum substrate with high thermal conductivity capable of being rapidly mounted as claimed in claim 1, wherein: the top ends of the heat conduction pipes (8) are respectively and fixedly connected to the outer walls of the front side and the rear side of the heat conduction plate (9).

7. The aluminum substrate with high thermal conductivity capable of being rapidly mounted as claimed in claim 1, wherein: radiating holes (17) are formed in four corners of the main board (1).