CN211557794U

CN211557794U - Heat radiator of Ethernet module

Info

Publication number: CN211557794U
Application number: CN201922083227.8U
Authority: CN
Inventors: 徐平; 周勇
Original assignee: Ningbo Chaosuda Communication Technology Co ltd
Current assignee: SUZHOU HUOHUAYUN COMMUNICATIONS TECHNOLOGY CO.,LTD.
Priority date: 2019-11-28
Filing date: 2019-11-28
Publication date: 2020-09-22
Anticipated expiration: 2029-11-28

Abstract

The utility model discloses a heat abstractor of ethernet module, including box body and semiconductor refrigeration piece, screw and reserve screw hole installation dustproof radiator-grid are passed through at the top in the box body, and just dustproof radiator-grid bottom passes through dead lever and bolt installation semiconductor refrigeration piece, one end both sides are equipped with a spring in the box body, and a fixed plate of spring one end welding, other end both sides are equipped with No. two springs in the box body, and No. two fixed plates of spring one end welding, corner is equipped with the supporting leg in the box body, and supporting leg bottom veneer connects shock pad, the box body surface is equipped with flame retardant coating, and the box body internal surface coats and has graphite alkene heat dissipation layer. The utility model relates to a heat abstractor of ethernet module utilizes the semiconductor refrigeration piece directly to dispel the heat to the ethernet module, simple structure, and convenient to use is fit for being extensively promoted and used.

Description

Heat radiator of Ethernet module

Technical Field

The utility model relates to a heat abstractor technical field of ethernet module, in particular to heat abstractor of ethernet module.

Background

The ethernet module is one of ethernet components, and generates heat during its operation, requiring an external device to dissipate the heat.

Patent numbers: CN201120065786.7 discloses a heat dissipation device for an SFP electrical port module of ethernet, which can conduct heat of a first heat source unit through a first metal shell and the first heat conducting insulator to form a heat conducting channel, so as to ensure that the SFP electrical port module operates normally in a high temperature environment.

The heat dissipation device has the following defects: 1. the heat dissipation is only carried out through the heat conduction insulator, and the effect is poor, and can not cool down rapidly 2, because the external structure of module itself is irregular rectangle, heat abstractor can not be fine with it fixed 3, when oppressing the module in the external world, can not alleviate the effort that the module received.

SUMMERY OF THE UTILITY MODEL

The main object of the present invention is to provide a heat dissipation device for ethernet module, which can effectively solve the problems in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a heat abstractor of ethernet module, includes box body and semiconductor refrigeration piece, the dustproof radiator-grid of screw hole installation is passed through at the top in the box body and is reserved to the screw, and just dustproof radiator-grid bottom is through dead lever and bolt installation semiconductor refrigeration piece, one end both sides are equipped with a spring in the box body, and a fixed plate of spring one end welding No. one, other end both sides are equipped with No. two springs in the box body, and No. two fixed plates of spring one end welding No. two, corner is equipped with the supporting leg in the box body, and supporting leg bottom veneer connection shock pad, the box body surface is equipped with fire-retardant coating, and the box body internal surface coats and has graphene.

Furthermore, elastic rubber pads are glued and connected to one sides of the first fixing plate and the second fixing plate.

Furthermore, the top of the box body is provided with a heat dissipation hole.

Furthermore, one side of the box body is provided with a data transmission port.

Further, the heating end of the semiconductor refrigeration piece is positioned outside the box body.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. through setting up the semiconductor refrigeration piece, the refrigeration end of semiconductor refrigeration piece contacts with the ethernet module, and the end of heating is located the box body outside, and when the work of semiconductor refrigeration piece, the refrigeration end of semiconductor refrigeration piece can be rapid dispels the heat to the ethernet module, prevents that the ethernet module is overheated, and then can make the long-time work of ethernet module.

2. Through setting up a spring, a fixed plate, No. two springs and No. two fixed plates, the outer surface structure of ethernet module is irregular rectangle, and when personnel placed the ethernet module in this heat abstractor, a spring and No. two springs can be according to the position of a fixed plate of ethernet module surface structure automatic adjustment and No. two fixed plates for this heat abstractor can fix the ethernet module inside it.

3. Through setting up supporting leg and shock attenuation callus on the sole, the supporting leg is located four corners of this heat abstractor, and the height ratio of shock attenuation callus on the sole ethernet module highly hangs down, so when external force is exerted this device surface, can be weakened by the shock attenuation callus on the sole, and then reduces the power that the ethernet module received, prevents to cause too big vibrations to the ethernet module, leads to its work unusual.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a heat dissipation apparatus of an ethernet module according to the present invention.

Fig. 2 is a schematic diagram of an internal structure of a heat dissipation device of an ethernet module according to the present invention.

Fig. 3 is a schematic side sectional view of a heat dissipation device of an ethernet module according to the present invention.

Fig. 4 is a schematic view of a cross-sectional structure of a surface material layer of a box body of a heat dissipation device of an ethernet module according to the present invention.

In the figure: 1. supporting legs; 2. a box body; 3. a first spring; 4. a first fixing plate; 5. a data transfer port; 6. a second fixing plate; 7. a second spring; 8. an elastic rubber pad; 9. a shock-absorbing foot pad; 10. a semiconductor refrigeration sheet; 11. heat dissipation holes; 12. flame retardant coating; 13. a graphene heat dissipation layer; 14. dustproof radiator-grid.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-4, a heat abstractor of ethernet module, including box body 2 and semiconductor refrigeration piece 10, the dustproof radiator-grid 14 of screw hole installation is passed through at the top in the box body 2, and just dustproof radiator-grid 14 bottom is through dead lever and bolt installation semiconductor refrigeration piece 10, one end both sides are equipped with a spring 3 in the box body 2, and fixed plate 4 of 3 one end welding of a spring, other end both sides are equipped with No. two springs 7 in the box body 2, and No. two fixed plate 6 of 7 one end welding of spring, the corner is equipped with supporting leg 1 in the

box body

2, and 1 bottom veneer of supporting leg connects shock attenuation callus on the sole 9, 2 surfaces of box body are equipped with fire-

retardant coating

12, and 2 internal surfaces of box body are scribbled and are scribbled graphite alkene heat dissipation layer 13.

Wherein, No. one fixed plate 4 and No. two fixed plate 6 one side all glue and connect elastic rubber pad 8.

In this embodiment, as shown in fig. 2, the elastic rubber pad 8 has a certain buffering function, so as to prevent the first fixing plate 4 and the second fixing plate 6 from indentation or damage to the surface of the ethernet module.

Wherein, the top of the box body 2 is provided with a heat dissipation hole 11.

2. In this embodiment, as shown in fig. 1, the heat dissipation holes 11 can accelerate the exchange speed between the air flow in the case 2 and the external air flow, so as to enhance the heat dissipation capability, and the dustproof heat dissipation net 14 can prevent the external dust from contacting the cooling end of the semiconductor cooling plate 10 through the heat dissipation holes 11.

Wherein, a data transmission port 5 is arranged on one side of the box body 2.

In this embodiment, as shown in fig. 1, when the ethernet module is installed in the box 2, the data signal line of the ethernet module can be connected to the ethernet module through the data transmission port 5.

The heating end of the semiconductor refrigeration piece 10 is positioned outside the box body 2.

In this embodiment, as shown in fig. 2, when the ethernet module works, a person can manually open the semiconductor cooling plate 10, and the cooling end of the semiconductor cooling plate 10 can rapidly dissipate heat from the ethernet module, so as to prevent the ethernet module from overheating, and further enable the ethernet module to work for a long time.

It should be noted that, the utility model relates to a heat dissipation device for ethernet module, during operation, a person now places one side of the ethernet module in the box body 2, and compresses the length of the first spring 3 with strength, so as to make the first fixing plate 4 tightly cling to the inner surface of the box body 2, then the person places the other side of the ethernet module in the heat dissipation device, and simultaneously makes the second fixing plate 6 contact with the ethernet module, at this time, the person finishes exerting force, because of the elasticity of the first spring 3 and the second spring 7, the positions of the first fixing plate 4 and the second fixing plate 6 can be automatically adjusted, so as to stably install the ethernet module in the box body 2, then the person connects the external line of the semiconductor refrigeration piece 10 (brand is eichip, model is TEC1-12705) with the external power supply, when the ethernet module works, the person can manually open the semiconductor refrigeration piece 10, the refrigeration end of the semiconductor refrigeration piece 10 can rapidly dissipate heat from the ethernet module, prevent the ethernet module overheated, and then can make the long-time work of ethernet module, when this heat abstractor surface is exerted to external power, because the height ratio ethernet module of shock attenuation callus on the sole 9 is highly low, so external power can be weakened by shock attenuation callus on the sole 9, and then reduce the power that the ethernet module received, prevent to cause too big vibrations to the ethernet module, lead to its work unusual, fire-retardant coating 12 (the producer burns new material science and technology limited company for mixing fertilizer) can make this heat abstractor have certain flame retardant efficiency, graphite alkene heat dissipation layer 13 can accelerate box body 2 and external heat transfer, cooperation louvre 11, also have certain heat dissipation function for the during operation at semiconductor refrigeration piece 10.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a heat abstractor of ethernet module, includes box body (2) and semiconductor refrigeration piece (10), its characterized in that: the utility model discloses a box body, including box body (2), top are passed through screw and reserve screw hole installation dustproof radiator-grid (14), and dustproof radiator-grid (14) bottom is through dead lever and bolt installation semiconductor refrigeration piece (10), one end both sides are equipped with spring (3) in box body (2), and fixed plate (4) of spring (3) one end welding No. one, other end both sides are equipped with spring (7) No. two in box body (2), and No. two fixed plate (6) of spring (7) one end welding No. two, the corner is equipped with supporting leg (1) in box body (2), and supporting leg (1) bottom veneer connects shock attenuation callus on the sole (9), box body (2) surface is equipped with fire-retardant coating (12), and box body (2) internal surface is scribbled and is scribbled graphite.

2. The heat dissipation device of an ethernet module according to claim 1, wherein: and one sides of the first fixing plate (4) and the second fixing plate (6) are glued and connected with an elastic rubber pad (8).

3. The heat dissipation device of an ethernet module according to claim 1, wherein: the top of the box body (2) is provided with a heat dissipation hole (11).

4. The heat dissipation device of an ethernet module according to claim 1, wherein: one side of the box body (2) is provided with a data transmission port (5).

5. The heat dissipation device of an ethernet module according to claim 1, wherein: the heating end of the semiconductor refrigeration piece (10) is positioned outside the box body (2).