CN218632400U - Millimeter wave mismatch load assembly - Google Patents
Millimeter wave mismatch load assembly Download PDFInfo
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- CN218632400U CN218632400U CN202223318961.6U CN202223318961U CN218632400U CN 218632400 U CN218632400 U CN 218632400U CN 202223318961 U CN202223318961 U CN 202223318961U CN 218632400 U CN218632400 U CN 218632400U
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Abstract
The utility model provides a millimeter wave mismatch load assembly, its cost, the standardized structure that can reduce millimeter wave mismatch load reduce the equipment and debug the degree of difficulty, and this millimeter wave mismatch load assembly includes: the mismatch load cavity is provided with a first groove in a downward concave mode from the center of the top, the left side and the right side of the mismatch load cavity are provided with a first through hole communicated with the first groove and two first cavity connecting grooves arranged on the two sides of the first through hole; the printed board is arranged in the first groove; the glass insulator is soldered at the first through hole, an inner conductor of the glass insulator is reliably connected with an input/output transmission line on the printed board, the input/output part of the printed board is a 50-ohm transmission line, and ripple impedance transmission lines such as Chebyshev are arranged between the 50-ohm transmission lines.
Description
Technical Field
The utility model relates to a microwave field particularly, relates to a millimeter wave mismatch load assembly.
Background
With the continuous evolution of mobile communication, the working frequency is higher and the bandwidth is wider. To better test the performance index of a transmitter or a power amplifier in a mismatched state, a mismatched load is often required to simulate a specific reflection condition of an antenna or a terminal system. The mismatch load can be divided into an adjustable mismatch load and a fixed mismatch load, and the continuously adjustable mismatch load has higher processing assembly precision and processing technology due to the existence of a mechanical tuning mechanism, so that the cost is very high in a millimeter wave frequency band and the application is very little. The standing wave ratio of the commonly used fixed standing wave ratio mismatch load is 1.2,1.5,2.0,2.5,3.0,5.0 and the like.
The fixed mismatch load on the market today is two of the following:
1. by adopting the scheme that the terminal resistor is connected with the inner conductor, the mismatched loads with different standing wave ratios are realized by selecting resistors with different resistance values.
2. The combination mode of a plurality of metal resonators and matched loads is adopted, the resonant frequency of the metal resonators is changed by changing the volume size and the material characteristics of the resonant cavity, and therefore the integral standing wave is changed, and the mismatched load of the variable standing wave is achieved.
The traditional high-power microwave fixed mismatch load generally has the problems of large structural size, inconvenience in use, high debugging difficulty and the like, and is used more in a microwave frequency band.
At present, the millimeter wave national standard mismatch load in the domestic market mainly adopts the way that an aluminum nitride thin film resistor is coated on an aluminum oxide ceramic substrate, different resistance values are realized by changing the sheet resistance of the thin film resistor, and then the mismatch load of variable standing waves is realized. The highest using frequency is 50GHz, and the following defects exist in the using process:
1) The processing technology of the thin film resistor is high, the resistance value of the thin film resistor is related to the formula of the thin film resistor and the coating technology, and the cost is high;
2) The processing and heat treatment cost of the reed is higher, and the structure reliability is not high by clamping the microstrip substrate through the reed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a millimeter wave mismatch load assembly, its cost, the standardized structure that can reduce millimeter wave mismatch load reduce the equipment and debug the degree of difficulty.
The embodiment of the utility model is realized like this:
a millimeter-wave mismatched load assembly comprising: the mismatch load cavity is provided with a first groove in a downward concave mode from the center of the top, the left side and the right side of the mismatch load cavity are provided with a first through hole communicated with the first groove and two first cavity connecting grooves arranged on the two sides of the first through hole; the printed board is arranged in the first groove; the glass insulator is soldered at the first through hole, and an inner conductor of the glass insulator is reliably connected with the input/output transmission line on the printed board.
In the preferred embodiment of the present invention, the millimeter wave mismatch load assembly further includes a standard connector, a port of the standard connector is connected to the glass insulator, and the standard connector is fastened to the first cavity connecting groove on either side by a connector screw.
In a preferred embodiment of the present invention, the millimeter wave mismatch load assembly further includes a standard matching load, and the standard matching load is screwed into the standard connector on either side.
In the preferred embodiment of the present invention, the mismatch load cavity is a square cavity, and the first groove and the second groove of the mismatch load cavity are respectively disposed on both sides of the first groove.
The utility model discloses a in the preferred embodiment, above-mentioned millimeter wave mismatch load assembly still includes the apron, is provided with two connecting holes on the apron, connects gradually connecting hole, second cavity spread groove through the apron screw, fastens the apron at mismatch load cavity's top.
In a preferred embodiment of the present invention, the printed board is a thin quartz glass printed board or a soft substrate high-frequency microwave printed board.
In the preferred embodiment of the present invention, when the printed board is a thin quartz glass printed board, the ripple impedance transmission line such as chebyshev is a high impedance transformation transmission line, and the line width of the high impedance transformation transmission line is smaller than the line width of the input/output transmission line.
In the preferred embodiment of the present invention, when the printed board is a soft base material high-frequency microwave printed board, the ripple impedance transmission line such as chebyshev is a low impedance transformation transmission line, and the line width of the low impedance transformation transmission line is greater than the line width of the input/output transmission line.
The embodiment of the utility model provides a beneficial effect is: the utility model provides a millimeter wave mismatch load assembly reduces the realization cost and the degree of difficulty, standardizes assembly structure, adopts traditional little equipment technology, reduces the cost of whole millimeter wave mismatch load, and simple structure, makes holistic equipment and debugging degree of difficulty reduce by a wide margin.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is an exploded view of a millimeter wave mismatched load assembly according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a mismatched load cavity according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a structure of a soft base material printed board according to an embodiment of the present invention;
fig. 4 is a diagram of the simulation result of the millimeter wave fixed mismatch load standing-wave ratio in the embodiment of the present invention;
fig. 5 is a schematic diagram of a ripple impedance transmission line printed board of high impedance conversion chebyshev and the like;
FIG. 6 is a schematic diagram of a low impedance transformation Chebyshev equal ripple impedance transmission line printed board;
fig. 7 is a diagram of a simulation result of low-impedance millimeter wave fixed mismatch load standing wave ratio.
An icon: the device comprises a mismatch load cavity 100, a printed board 200, a glass insulator 300, a standard connector 400, a standard match load 500, a cover plate 600, a first groove 101, a first through hole 102, a first cavity connecting groove 103, a second cavity connecting groove 104, a 50 ohm transmission line 201, a ripple impedance transmission line 202 such as Chebyshev, a connector screw 401, a connecting hole 601 and a cover plate screw 602.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.
First embodiment
Referring to fig. 1-3, the present embodiment provides a mis-matched mm-wave load assembly, which includes: mismatched load cavity 100, printed board 200, glass insulator 300, standard connector 400, standard matched load 500 and cover plate 600.
Specifically, the mismatched load cavity 100 is recessed from the top center with a first groove 101 for assembling the printed board 200. The left and right sides of the mismatched load cavity 100 are provided with first through holes 102 penetrating the first grooves 101 for assembling the glass insulator 300. Two first cavity coupling grooves 103 disposed at both sides of the first through-hole 102 for assembling the standard connector 400. The mismatched load cavity 100 in this embodiment is a square cavity, and in other embodiments, the shape of the cavity may be changed according to different situations, and the second cavity connecting grooves 104 are respectively disposed on two sides of the first groove 101 of the mismatched load cavity 100 and are used for connecting the cover plate 600.
Printed board 200 is disposed in first groove 101, and printed board 200 in this embodiment is a thin quartz glass printed board or a high-frequency microwave printed board. The input and output portion of printed board 200 is 50 ohm transmission line 201 connected to glass insulator 300.
A ripple impedance transmission line 202 such as Chebyshev is arranged between the 50 ohm transmission lines 201, and different types of ripple impedance transmission lines such as Chebyshev are selected according to different printed circuit board base materials. The whole millimeter wave mismatch load is a simple millimeter wave microstrip printed circuit, wherein the input and output parts of the dielectric substrate are coated with standard 50 ohm transmission lines with certain length and are respectively connected with the inner conductors of the input and output glass insulators. A five-stage quarter-wavelength Chebyshev-like ripple impedance transmission line is coated between input and output 50-ohm transmission lines, the stage number N is more than or equal to 1, and the specific selection is related to the working frequency band and standing wave ratio ripple (fluctuation) of mismatched loads. Generally, the wider the operating band and the smaller the standing wave ratio ripple, the more stages are required.
If the printed board is a thin quartz glass printed board, referring to fig. 5, the ripple impedance transmission line such as chebyshev is a high-impedance conversion transmission line, and the line width of the high-impedance conversion transmission line is smaller than the line width of the input/output transmission line.
In this embodiment, taking 26.5-67GHz as an example, the specific parameters of the printed board are as follows: the thickness of the board is 0.1mm, the input and output 50 ohm transmission line width is 0.208mm, the length is 2mm, and the board can be lengthened or shortened on the premise of not influencing the product performance and assembly. From left to right, the high-impedance 5-stage transformation lines have line widths of 0.1813mm, 0.12696mm, 0.0645mm,0.02696mm and 0.011mm, and lengths of 0.933mm,0.948mm,0.972mm,0.996mm and 1.014mm, respectively.
For a hard substrate microwave printed board (quartz glass), on the premise of ensuring the processing precision, the minimum processing line width is 1 μm, and the cost of the hard substrate microwave printed board is slightly higher than that of a softer substrate microwave printed board.
If the printed board is a soft base material high-frequency microwave printed board, please refer to fig. 6, the ripple impedance transmission line such as chebyshev is a low-impedance transformation transmission line, and the line width of the low-impedance transformation transmission line is greater than the line width of the input/output transmission line.
For a soft substrate microwave printed board (such as rogers 5880), the conventional minimum processing line width is 0.1-0.15mm, and if the minimum processing line width is thinner, it is difficult to ensure the precision.
Specifically, the embodiment adopts a soft base material microwave printed board (Rogers 5880), the board thickness is 0.127mm, the input and output 50 ohm transmission line width is 0.3724mm, the length is 2mm, and the length of the 50 ohm transmission line can be lengthened or shortened on the premise of not influencing the product performance and assembly. From left to right, the low impedance 5-stage transformation lines had line widths of 0.4137mm,0.5475mm,0.8125mm,1.1648mm and 1.4737mm, and lengths of 1.136mm,1.125mm,1.109mm,1.096mm and 1.089mm, respectively.
The glass insulator 300 is soldered to the first through hole 102, and the inner conductor of the glass insulator 300 is securely connected to the input/output transmission line on the printed board 200. The standard connector 400 is connected at its end to the glass insulator 300, and the standard connector 400 is fastened to the first cavity connecting groove 103 on either side by a connector screw 401. The standard mating load 500 is screwed to the standard connector 400 on either side. The cover plate 600 is provided with two connection holes 601, and the cover plate 600 is fastened to the top of the mismatch load chamber 100 by sequentially connecting the connection holes 601 and the second chamber connection groove 104 through cover plate screws 602.
The millimeter wave mismatched load reassembling and assembling mode is as follows:
firstly, the printed board 200 is welded or adhered to the bottom of the mismatched load cavity 100 by using a tool, then the glass insulator 300 is soldered into a joint hole of the mismatched load cavity 100, and the reliable connection between the inner conductor of the glass insulator 300 and the input/output transmission line on the printed board 200 is ensured. The standard adapter 400 and the cover plate 600 are then fastened to the mismatch load chamber 100 by means of adapter screws 401 and cover plate 600 screws, respectively, and finally the standard matched load 500 is screwed onto the standard adapter 400 at either end (no so-called input/output port since the millimeter wave mismatch load of the present invention is a passive reciprocal device) and tightened. Further simulation design data for millimeter wave mismatched loads with high impedance, low impedance transformation lines are shown in fig. 4 and 7, respectively.
To sum up, the utility model provides a millimeter wave mismatch load assembly, high impedance transformation transmission line printing board 200 is low impedance transformation transmission line printing board 200, can reduce the realization cost and the degree of difficulty, with assembly structure standardization, adopt traditional little equipment technology, reduce the cost of whole millimeter wave mismatch load, and simple structure, make holistic equipment and debugging degree of difficulty reduce by a wide margin.
This description describes examples of embodiments of the invention, and is not intended to illustrate and describe all possible forms of the invention. It should be understood that the embodiments described in this specification can be implemented in many alternative forms. The figures are not necessarily to scale; some features may be exaggerated or minimized to show details of particular components. Specific structural and functional details disclosed are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention. It will be appreciated by those of ordinary skill in the art that a plurality of features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to form embodiments that are not explicitly illustrated or described. The described combination of features provides a representative embodiment for a typical application. However, various combinations and modifications of the features consistent with the teachings of the present invention may be used as desired for particular applications or implementations.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A millimeter-wave mismatched load assembly, comprising: the mismatch load cavity is provided with a first groove in a downward concave mode from the center of the top, and the left side and the right side of the mismatch load cavity are provided with a first through hole communicated with the first groove and two first cavity connecting grooves arranged on the two sides of the first through hole;
the printed board is arranged in the first groove; the input and output parts of the printed board are 50 ohm transmission lines, and ripple impedance transmission lines such as Chebyshev are arranged between the 50 ohm transmission lines;
and the glass insulator is soldered at the first through hole, and an inner conductor of the glass insulator is reliably connected with the input/output transmission line on the printed board.
2. The millimeter wave mismatch load assembly of claim 1, further comprising a standard connector having a port connected to said glass insulator, said standard connector being fastened to said first cavity connection slot on either side by a connector screw.
3. The mmwave mismatched load assembly of claim 2, further comprising a standard matched load screwed onto the standard connectors on either side.
4. The mmwave mismatched load assembly according to claim 1, wherein the mismatched load cavity is a square cavity, and the second cavity connecting grooves are respectively disposed on two sides of the first groove of the mismatched load cavity.
5. The millimeter wave mismatch load assembly according to claim 4, further comprising a cover plate, wherein the cover plate is provided with two connecting holes, and the cover plate is fastened to the top of the mismatch load cavity by sequentially connecting the connecting holes and the second cavity connecting groove through cover plate screws.
6. The millimeter wave mismatch load assembly according to claim 1, wherein said printed board is a thin quartz glass printed board or a soft substrate high frequency microwave printed board.
7. The millimeter wave mismatched load assembly of claim 6, wherein when the printed board is a thin quartz glass printed board, the Chebyshev-like ripple impedance transmission line is a high impedance transformation transmission line having a line width smaller than that of the input/output transmission line.
8. The millimeter wave mismatched load assembly of claim 6, wherein when the printed board is a soft substrate high frequency microwave printed board, said Chebyshev-like ripple impedance transmission line is a low impedance transformation transmission line, and the line width of said low impedance transformation transmission line is greater than the line width of said input/output transmission line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223318961.6U CN218632400U (en) | 2022-12-07 | 2022-12-07 | Millimeter wave mismatch load assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223318961.6U CN218632400U (en) | 2022-12-07 | 2022-12-07 | Millimeter wave mismatch load assembly |
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| Publication Number | Publication Date |
|---|---|
| CN218632400U true CN218632400U (en) | 2023-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202223318961.6U Active CN218632400U (en) | 2022-12-07 | 2022-12-07 | Millimeter wave mismatch load assembly |
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| CN (1) | CN218632400U (en) |
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- 2022-12-07 CN CN202223318961.6U patent/CN218632400U/en active Active
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