CN218849754U - Soft base material printed board for millimeter wave mismatch load - Google Patents
Soft base material printed board for millimeter wave mismatch load Download PDFInfo
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- CN218849754U CN218849754U CN202223280200.6U CN202223280200U CN218849754U CN 218849754 U CN218849754 U CN 218849754U CN 202223280200 U CN202223280200 U CN 202223280200U CN 218849754 U CN218849754 U CN 218849754U
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Abstract
The utility model provides a soft base material printing board that millimeter wave mismatch load was used, it can reduce the structure size of the fixed mismatch load of high-power microwave, reduce the processing cost and the processing degree of difficulty, this printing board includes the medium substrate and sets up in the microstrip transmission line of medium substrate top surface, the microstrip transmission line is including setting up in the input transmission line and the output transmission line at medium substrate both ends, and both ends connect ripple impedance transmission lines such as input transmission line and output transmission line respectively, ripple impedance transmission lines such as chebyshev are the N level transmission line based on central line symmetry, the line width of ripple impedance transmission lines such as chebyshev is greater than the line width of input/output transmission line.
Description
Technical Field
The utility model relates to a millimeter wave mismatch load field particularly, relates to a soft base material printing board that millimeter wave mismatch load was used.
Background
At present, the millimeter wave national standard mismatch load in the domestic market mainly adopts the way that an aluminum nitride thin film resistor is coated on an aluminum oxide ceramic substrate, different resistance values are realized by changing the sheet resistance of the thin film resistor, and then the mismatch load of variable standing waves is realized.
However, the processing technology of the thin film resistor is high, the resistance value is related to the formula and the coating technology of the thin film resistor, and the cost is high.
Based on this, some designs are designed by disposing microstrip lines on the substrate, for example, patent No. CN201922479850.5, a description of high-power coaxial mismatch load: the electrode clamp is clamped at the input end of the load sheet, the grounding clamps are respectively clamped on grounding micro-strip lines at the upper end and the lower end of the load sheet, the load sheet is located in the cavity, the contact head compresses the spring and props against the input end of the load sheet, the heat dissipation plate is arranged on the cavity, the handle is connected with the heat dissipation plate, and therefore the electrode clamp can be used for a series of reeds such as the electrode clamp and the grounding clamp on mismatched loads, the processing and heat treatment costs of the reeds are high, and the micro-strip substrates are clamped through the reeds, so that the structural reliability is low.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a soft base material printed board for millimeter wave mismatch load, which can reduce the structural size of the high-power microwave fixed mismatch load and reduce the processing cost and the processing difficulty; and the processing cost and the processing difficulty of the millimeter wave mismatched load printed board can be reduced.
The embodiment of the utility model is realized like this:
a soft base material printed board for millimeter wave mismatched loads comprises a dielectric substrate and a microstrip transmission line arranged on the top surface of the dielectric substrate, wherein the microstrip transmission line comprises an input transmission line and an output transmission line which are arranged at two end parts of the dielectric substrate, and Chebyshev equal-ripple impedance transmission lines of which the two ends are respectively connected with the input transmission line and the output transmission line, the Chebyshev equal-ripple impedance transmission lines are N-level transmission lines based on midline symmetry, and the line width of the Chebyshev equal-ripple impedance transmission lines is larger than the line width of the input/output transmission lines.
In the preferred embodiment of the present invention, the above-mentioned frequency of the mismatch load of millimeter wave is 26.5-67GHz, and the ripple impedance transmission line such as chebyshev is a five-stage low impedance transformation transmission line.
In the preferred embodiment of the present invention, the five-stage low impedance transformation transmission line has a line width of 0.4137mm, 0.5475mm,0.8125mm, 1.1648mm and 1.4737mm, a length of 1.136mm, 1.125mm, 1.109mm,1.096mm and 1.089mm, respectively, from left to right.
In a preferred embodiment of the present invention, the dielectric substrate is a soft substrate microwave printed board.
In a preferred embodiment of the present invention, the soft substrate microwave printed board includes a rogers 5880.
In a preferred embodiment of the present invention, the thickness of the soft substrate microwave printed board is 0.127mm.
In a preferred embodiment of the present invention, the input transmission line and the output transmission line are 50 ohm transmission lines.
In the preferred embodiment of the present invention, the input transmission line or the output transmission line is 0.3724mm.
The embodiment of the utility model provides a beneficial effect is: the utility model provides a millimeter wave mismatch is printed board for load adopts the ripple impedance transmission line such as chebyshev that coats five grades of quarter wavelength between the 50 ohm transmission lines of input/output, and its progression N more than or equal to 1 selects the progression that needs according to the demand of operating band, standing-wave ratio ripple, and whole microstrip line is based on the central line symmetry, convenient to process; and the width of the ripple impedance transmission line such as Chebyshev is larger than the line width of the input/output transmission line, the realization cost and difficulty can be reduced, and the influence of the processing error on the electrical property of mismatched loads is very small.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 and 2 are schematic structural diagrams of a printed board according to an embodiment of the present invention;
fig. 3 is simulation design data of millimeter wave mismatch load using the printed board according to the embodiment of the present invention;
icon: a dielectric substrate 100, a microstrip transmission line 200, an input transmission line 210, an output transmission line 220, and a ripple impedance transmission line 230 such as chebyshev.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that the products of the present invention are usually placed when used, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element indicated must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.
First embodiment
Referring to fig. 1 and 2, the present embodiment provides a soft substrate printed board for millimeter wave mismatched loads, which includes a dielectric substrate 100 and a microstrip transmission line 200 disposed on the top surface of the dielectric substrate 100, where the microstrip transmission line 200 includes an input transmission line 210 and an output transmission line 220 disposed at two ends of the dielectric substrate 100, and a ripple impedance transmission line 230 such as chebyshev, whose two ends are respectively connected to the input transmission line 210 and the output transmission line 220, the ripple impedance transmission line 230 such as chebyshev is an N-stage transmission line based on centerline symmetry, and a line width of the ripple impedance transmission line 230 such as chebyshev is greater than a line width of the input/output transmission line 220.
For a soft substrate microwave printed board (such as Rogers 5880), the conventional minimum processing line width is 0.1-0.15mm, and if the minimum processing line width is thinner, the precision is difficult to ensure, but the line width of the ripple impedance transmission line 230 such as Chebyshev and the like in the technical scheme is larger than the line width of the input/output transmission line 220, so that the problem that the precision control of the soft substrate is difficult can be overcome.
The whole millimeter wave mismatch load is a simple millimeter wave microstrip printed circuit, wherein the input and output parts of the dielectric substrate are coated with standard 50 ohm transmission lines with certain length and are respectively connected with the inner conductors of the input and output glass insulators. A five-stage quarter-wavelength Chebyshev-like ripple impedance transmission line is coated between input and output 50-ohm transmission lines, the stage number N is more than or equal to 1, and the specific selection is related to the working frequency band and standing wave ratio ripple (fluctuation) of mismatched loads. Generally, the wider the operating band and the smaller the standing wave ratio ripple, the more stages are required.
In this embodiment, the frequency of the millimeter wave mismatched load is 26.5-67GHz, and the ripple impedance transmission line 230 such as chebyshev is a five-stage low impedance transformation transmission line. From left to right, the five-stage low-impedance transformation transmission line has the line widths of 0.4137mm, 0.5475mm,0.8125mm, 1.1648mm and 1.4737mm, and the lengths of 1.136mm, 1.125mm, 1.109mm,1.096mm and 1.089mm.
The dielectric substrate 100 is a soft substrate microwave printed board, preferably, the soft substrate microwave printed board in this embodiment is rogers 5880, and specifically, the thickness of the soft substrate microwave printed board is 0.127mm.
The input transmission line 210 and the output transmission line 220 are 50 ohm transmission lines, the length of the input transmission line 210 or the output transmission line 220 is 0.3724mm, and particularly the length of the input transmission line 210 or the output transmission line 220 is 2mm, so that the length of the input/output transmission line 220 can be lengthened or shortened on the premise of not influencing product performance and assembly.
The line width of the ripple impedance conversion transmission line such as Chebyshev and the like adopting low impedance (capacitive) conversion is far larger than the minimum line width of the conventional microwave millimeter wave printed board processing technology, and the realization cost or difficulty is very small. In addition, the processing error has very small influence on the electrical performance of the mismatched load.
The simulation design data of the millimeter wave mismatched load are respectively shown in fig. 3, and it can be seen that the mismatched standing wave ratio is between 2.9 and 3.16 in the frequency band of 26.5 to 67 GHz.
To sum up, the utility model provides a millimeter wave mismatch is mismatch load that printing plate is applicable to soft base material class is used for the load, reduces the printing plate size by a wide margin, reduces the processing degree of difficulty, adopts traditional little equipment technology, and millimeter wave mismatch load is with low costs, and the equipment is little with the debugging degree of difficulty.
This description describes examples of embodiments of the invention, and is not intended to illustrate and describe all possible forms of the invention. It should be understood that the embodiments described in this specification can be implemented in many alternative forms. The figures are not necessarily to scale; some features may be exaggerated or minimized to show details of particular components. Specific structural and functional details disclosed are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention. It will be appreciated by persons skilled in the art that a plurality of features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to form embodiments which are not explicitly illustrated or described. The described combination of features provides a representative embodiment for a typical application. However, various combinations and modifications of the features consistent with the teachings of the present invention may be used as desired for particular applications or implementations.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A soft substrate printed board for millimeter wave mismatched loads is characterized by comprising a dielectric substrate and a microstrip transmission line arranged on the top surface of the dielectric substrate, wherein the microstrip transmission line comprises an input transmission line and an output transmission line which are arranged at two end parts of the dielectric substrate, and a Chebyshev equal-ripple impedance transmission line of which two ends are respectively connected with the input transmission line and the output transmission line, the Chebyshev equal-ripple impedance transmission line is an N-stage transmission line based on midline symmetry, and the line width of the Chebyshev equal-ripple impedance transmission line is larger than the line width of the input/output transmission line; the medium substrate is a soft substrate microwave printed board.
2. The flexible substrate printed board for millimeter wave mismatched loads according to claim 1, wherein when the frequency of the millimeter wave mismatched load is 26.5-67GHz, the chebyshev-like ripple impedance transmission line is a five-stage low impedance transformation transmission line.
3. The printed board of a soft substrate for millimeter wave mismatched loads according to claim 2, wherein the five-stage low impedance transformation transmission line has line widths of 0.4137mm, 0.5475mm,0.8125mm, 1.1648mm and 1.4737mm, and lengths of 1.136mm, 1.125mm, 1.109mm,1.096mm and 1.089mm, respectively, from left to right.
4. The soft substrate printed board for millimeter wave mismatched loading according to claim 1, wherein the soft substrate microwave printed board comprises Rogers 5880.
5. The soft substrate printed board for millimeter wave mismatched loading according to claim 1 or 4, wherein the thickness of the soft substrate microwave printed board is 0.127mm.
6. The flexible substrate printed board for millimeter wave mismatched loads according to claim 1, wherein said input transmission line and output transmission line are 50 ohm transmission lines.
7. The flexible substrate printed board for millimeter wave mismatched loads according to claim 1, wherein the input transmission line or the output transmission line is 0.3724mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223280200.6U CN218849754U (en) | 2022-12-07 | 2022-12-07 | Soft base material printed board for millimeter wave mismatch load |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223280200.6U CN218849754U (en) | 2022-12-07 | 2022-12-07 | Soft base material printed board for millimeter wave mismatch load |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218849754U true CN218849754U (en) | 2023-04-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223280200.6U Active CN218849754U (en) | 2022-12-07 | 2022-12-07 | Soft base material printed board for millimeter wave mismatch load |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218849754U (en) |
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2022
- 2022-12-07 CN CN202223280200.6U patent/CN218849754U/en active Active
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