CN218632399U - Millimeter wave mismatch load printed board with high-impedance transformation line - Google Patents
Millimeter wave mismatch load printed board with high-impedance transformation line Download PDFInfo
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- CN218632399U CN218632399U CN202223279730.9U CN202223279730U CN218632399U CN 218632399 U CN218632399 U CN 218632399U CN 202223279730 U CN202223279730 U CN 202223279730U CN 218632399 U CN218632399 U CN 218632399U
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Abstract
The utility model provides a millimeter wave mismatch load printing board with high resistance change line, it can reduce the structure size of the fixed mismatch load of high-power microwave, reduce the processing cost and the processing degree of difficulty, this millimeter wave mismatch load printing board includes the medium substrate and sets up in the microstrip transmission line on medium substrate top surface, the microstrip transmission line is including setting up in the input transmission line and the output transmission line at medium substrate both ends, and the high resistance change line of input transmission line and output transmission line is connected respectively at both ends, the high resistance change line is ripple impedance transmission line such as chebyshev, ripple impedance transmission line such as chebyshev is the N level transmission line based on central line symmetry, the line width of ripple impedance transmission line such as chebyshev is less than the line width of input/output transmission line.
Description
Technical Field
The utility model relates to a mismatch load printing board field particularly, relates to a millimeter wave mismatch load printing board with high impedance transformation line.
Background
At present, the millimeter wave national standard mismatching load in the domestic market mainly adopts the way that an aluminum nitride film resistor is coated on an aluminum oxide ceramic substrate, different resistance values are realized by changing the sheet resistance of the film resistor, and then the mismatching load of variable standing waves is realized.
However, the processing technology of the thin film resistor is high, the resistance value is related to the formula and the coating technology of the thin film resistor, and the cost is high.
Based on this, some designs have also adopted a mode of disposing a microstrip line on a substrate, such as patent No. CN201922479850.5, a description in a high-power coaxial mismatch load: the electrode clamp is clamped at the input end of the load sheet, the grounding clamps are respectively clamped on grounding micro-strip lines at the upper end and the lower end of the load sheet, the load sheet is located in the cavity, the contact head compresses the spring and props against the input end of the load sheet, the heat dissipation plate is arranged on the cavity, the handle is connected with the heat dissipation plate, and therefore the electrode clamp can be used for a series of reeds such as the electrode clamp and the grounding clamp on mismatched loads, the processing and heat treatment costs of the reeds are high, and the micro-strip substrates are clamped through the reeds, so that the structural reliability is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a millimeter wave mismatch load printing board with high impedance transformation line, its structural dimension that can reduce the fixed mismatch load of high-power microwave reduces the processing cost and the processing degree of difficulty.
The embodiment of the utility model is realized like this:
the millimeter wave mismatched load printed board comprises a dielectric substrate and a microstrip transmission line arranged on the top surface of the dielectric substrate, wherein the microstrip transmission line comprises an input transmission line and an output transmission line which are arranged at two end parts of the dielectric substrate, and a high-impedance conversion line of which two ends are respectively connected with the input transmission line and the output transmission line, the high-impedance conversion line is a ripple impedance transmission line such as Chebyshev, the ripple impedance transmission line such as Chebyshev is an N-stage transmission line based on central line symmetry, and the line width of the ripple impedance transmission line such as Chebyshev is smaller than the line width of the input/output transmission line.
In the preferred embodiment of the present invention, the above-mentioned frequency of the millimeter wave mismatch load is 26.5-67GHz, and the ripple impedance transmission line such as chebyshev is a five-stage high impedance conversion line.
In the preferred embodiment of the present invention, the line widths of the five-stage high impedance transformation lines from left to right are respectively 0.1813mm, 0.126mm, 0.0645mm, 0.02696mm and 0.011mm, and the lengths thereof are respectively 0.933mm, 0.948mm,0.972mm, 0.996mm and 1.014mm.
In a preferred embodiment of the present invention, the dielectric substrate is a hard substrate microwave printed board.
In a preferred embodiment of the present invention, the hard substrate microwave printed board includes quartz glass.
In a preferred embodiment of the present invention, the dielectric substrate has a thickness of 0.1mm.
In a preferred embodiment of the present invention, the input transmission line and the output transmission line are 50 ohm transmission lines.
In a preferred embodiment of the present invention, the line width of the input transmission line or the output transmission line is 0.208mm.
The embodiment of the utility model provides a beneficial effect is: the millimeter wave mismatched load printed board in the utility model adopts the mode of the medium substrate and the microstrip transmission line, reduces the use of the film resistor, can reduce the use of reed clamping pieces and the like, and reduces the integral processing difficulty and precision of mismatched loads; the microstrip transmission line is an N-level step-shaped transmission line based on midline symmetry arranged between the input transmission line and the output transmission line, and the line width of the microstrip transmission line is smaller than that of the input transmission line and the output transmission line, so that a simple millimeter wave microstrip printed circuit is formed, the whole volume of a millimeter wave mismatch load can be reduced, and the processing difficulty of a printed board is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic diagram of a printed wiring structure according to an embodiment of the present invention;
fig. 2 simulation design data (high impedance) of millimeter wave mismatch load using the printed board according to the embodiment of the present invention;
an icon: a dielectric substrate 100, a microstrip transmission line 200, an input transmission line 210, an output transmission line 220, and a high impedance transformation line 230.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "suspended" and the like do not imply that the components are absolutely horizontal or suspended, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
First embodiment
Referring to fig. 1, the present embodiment provides a millimeter wave mismatched load printed board with a high impedance transformation line, which includes a dielectric substrate 100 and a microstrip transmission line 200 disposed on the top surface of the dielectric substrate 100.
The microstrip transmission line 200 includes an input transmission line 210 and an output transmission line 220 disposed at two ends of the dielectric substrate 100, and a high-impedance transformation line 230 having two ends respectively connected to the input transmission line 210 and the output transmission line 220, the high-impedance transformation line 230 is a ripple impedance transmission line such as chebyshev, the ripple impedance transmission line such as chebyshev is an N-stage transmission line based on central line symmetry, and a line width of the ripple impedance transmission line such as chebyshev is smaller than a line width of the input/output transmission line 220.
The microstrip transmission line 200 in this embodiment includes a standard 50 ohm transmission line coated with a certain length on the input and output portions of the dielectric substrate 100, and connected to the inner conductors of the glass insulators of the mismatched load input and output, respectively. A ripple impedance transmission line such as five-stage Chebyshev with quarter wavelength is coated between input and output 50 ohm transmission lines, the number of stages N is more than or equal to 1, and how to select the number of stages is related to the working frequency band and standing wave ratio ripple (fluctuation) of mismatched loads. Generally, the wider the operating band and the smaller the standing wave ratio ripple, the more stages are required.
Taking the frequency of the millimeter wave mismatched load at 26.5-67GHz as an example, the ripple impedance transmission line such as chebyshev in the present embodiment is a five-stage high impedance conversion line 230. Specifically, the line widths of the five-stage high-impedance transformation line 230 from left to right are 0.1813mm, 0.126mm, 0.0645mm, 0.02696mm and 0.011mm, and the lengths are 0.933mm, 0.948mm,0.972mm, 0.996mm and 1.014mm, respectively.
The dielectric substrate 100 is a hard substrate microwave printed board, quartz glass is selected in the embodiment, and the thickness of the dielectric substrate 100 is 0.1mm.
The input transmission line 210 and the output transmission line 220 are 50 ohm transmission lines. The line width of the input transmission line 210 or the output transmission line 220 is 0.208mm, and the length of 2mm can be lengthened or shortened on the premise of not influencing the product performance and assembly.
For the quartz glass hard substrate microwave printed board, on the premise of ensuring the processing precision, the minimum processing line width is 1 μm, the cost of the microwave printed board is slightly higher than that of the substrate microwave printed board with a softer material, but the millimeter wave mismatch load and the printed board cost in the prior art can be reduced.
In summary, the millimeter wave mismatched load printed board in the utility model adopts the mode of the dielectric substrate 100 and the microstrip transmission line 200, reduces the use of the thin film resistor, can reduce the use of reed clamping pieces and the like, reduces the processing difficulty and precision, and reduces the whole volume of the millimeter wave mismatched load; the microstrip transmission line 200 is an N-stage step-shaped transmission line based on centerline symmetry arranged between the input and output transmission lines 220, and the line width of the N-stage step-shaped transmission line is smaller than that of the input/output transmission line 220, so that a simple millimeter wave microstrip printed circuit is formed, the overall volume of a millimeter wave mismatched load can be reduced, and the processing difficulty of a printed board is reduced.
This description describes examples of embodiments of the invention, and is not intended to illustrate and describe all possible forms of the invention. It should be understood that the embodiments described in this specification can be implemented in many alternative forms. The figures are not necessarily to scale; some features may be exaggerated or minimized to show details of particular components. Specific structural and functional details disclosed are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention. It will be appreciated by those of ordinary skill in the art that a plurality of features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to form embodiments that are not explicitly illustrated or described. The described combination of features provides a representative embodiment for a typical application. However, various combinations and modifications of the features consistent with the teachings of the present invention may be used as desired for particular applications or implementations.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The millimeter wave mismatched load printed board is characterized by comprising a dielectric substrate and a microstrip transmission line arranged on the top surface of the dielectric substrate, wherein the microstrip transmission line comprises an input transmission line and an output transmission line which are arranged at two end parts of the dielectric substrate, and high-impedance conversion lines of which two ends are respectively connected with the input transmission line and the output transmission line, the high-impedance conversion lines are ripple impedance transmission lines such as Chebyshev, the ripple impedance transmission lines such as Chebyshev are N-stage transmission lines based on central line symmetry, and the line width of the ripple impedance transmission lines such as Chebyshev is smaller than the line width of the input/output transmission lines.
2. The millimeter wave mismatched load printed board with the high impedance transformation line according to claim 1, wherein when the frequency of the millimeter wave mismatched load is 26.5-67GHz, the chebyshev-like ripple impedance transmission line is a five-stage high impedance transformation line.
3. The millimeter wave mismatch load printed board with high impedance transformation line according to claim 2, wherein the line widths of the five-stage high impedance transformation line from left to right are 0.1813mm, 0.126mm, 0.0645mm, 0.02696mm and 0.011mm, and the lengths are 0.933mm, 0.948mm,0.972mm, 0.996mm and 1.014mm, respectively.
4. The millimeter wave mismatched load printed board with high impedance transformation line according to claim 1, wherein the dielectric substrate is a hard substrate microwave printed board.
5. The millimeter wave mismatch load printed board with high impedance transformation line according to claim 4, wherein the hard substrate microwave printed board comprises quartz glass.
6. The millimeter wave mismatched load printed board with the high-impedance transformation line according to claim 4 or 5, wherein the dielectric substrate has a thickness of 0.1mm.
7. The millimeter wave mismatched load printed board with high impedance transformation line according to claim 1, wherein the input transmission line and the output transmission line are 50 ohm transmission lines.
8. The millimeter wave mismatched load printed board with the high impedance transformation line according to claim 7, wherein the line width of the input transmission line or the output transmission line is 0.208mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223279730.9U CN218632399U (en) | 2022-12-07 | 2022-12-07 | Millimeter wave mismatch load printed board with high-impedance transformation line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223279730.9U CN218632399U (en) | 2022-12-07 | 2022-12-07 | Millimeter wave mismatch load printed board with high-impedance transformation line |
Publications (1)
| Publication Number | Publication Date |
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| CN218632399U true CN218632399U (en) | 2023-03-14 |
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| CN202223279730.9U Active CN218632399U (en) | 2022-12-07 | 2022-12-07 | Millimeter wave mismatch load printed board with high-impedance transformation line |
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| CN (1) | CN218632399U (en) |
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- 2022-12-07 CN CN202223279730.9U patent/CN218632399U/en active Active
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