CN218630732U - Embedded modularization industry mainboard - Google Patents

Abstract

The utility model relates to an industry mainboard technical field provides an embedded modularization industry mainboard, include: mainboard body, interface terminal module, storage module, processing module, heating panel and dehumidification module, interface terminal module, storage module and processing module set up at mainboard body upside, and interface terminal module, storage module and processing module pass through the electricity to be connected, and the heating panel setting is at mainboard body downside, and the dehumidification module setting is at the edge of heating panel, the heating panel includes: heating panel body, fin and radiator fan, heating panel body fixed mounting is at mainboard body downside, and the fin is provided with the multiunit, and the even array of multiunit fin sets up at heating panel body downside, and radiator fan sets up between the multiunit fin, and heating panel body edge fixed mounting has the dehumidification module, the utility model discloses rational in infrastructure, convenient to use, the dismouting is convenient, and under the prerequisite of reducing the arrangement volume, both played the radiating action, played the dehumidification effect again.

Description

Embedded modularization industry mainboard

Technical Field

The utility model relates to an industry mainboard technical field has especially related to an embedded modularization industry mainboard.

Background

The embedded industrial main board is a computer main board designed based on an X86 architecture according to industrial grade requirements, is a core component of an embedded industrial personal computer, an industrial tablet personal computer and a customized industrial personal computer, and has the functions of high reliability, low power consumption, high electronic integration level, multifunctional extended application interfaces and the like.

As in application No.: CN202023292269.1 discloses an embedded modularization industry mainboard, which comprises a mainboard, locate daughter card extension row needle on the mainboard side, erect at the mainboard top and with daughter card extension row needle grafting complex extension daughter card, locate the POE extension row needle at mainboard middle part, with POE extension row needle grafting complex POE module, locate the CPU that is located POE module side on the mainboard, locate the board-mounted memory granule that is located the CPU side on the mainboard, locate the MiniPCI-E expansion interface at the mainboard back, and locate the memory expansion interface at the mainboard back.

However, the embedded motherboard is designed according to the characteristics of the industrial site, and because the humidity of part of industrial environment sites is too high, such as an automatic welding site, a vehicle body assembly site, a paint spraying site and the like, after the motherboard is installed on the host, the service life of the industrial motherboard can be shortened due to the invasion of water vapor, and the continuous operation of the motherboard can cause temperature rise, even cause element failure, forced production halt and economic loss.

SUMMERY OF THE UTILITY MODEL

In order to solve the design of embedded mainboard according to the characteristics design in industry place, because partial industrial environment place humidity is too big, if automatic welding place, automobile body assembly, the place of spraying paint etc. install the back on the host computer at above-mentioned mainboard, because the invasion of steam can reduce industry mainboard life, and the mainboard continuation work can lead to the temperature to rise, leads to the component to become invalid even, is forced to stop production, causes economic loss's problem, the utility model provides an embedded modularization industry mainboard solves this problem.

In order to achieve the above purpose, the utility model provides a following technical scheme:

an embedded modular industrial motherboard comprising: mainboard body, interface terminal module, storage module, processing module, heating panel and dehumidification module, interface terminal module, storage module and processing module set up at mainboard body upside, and interface terminal module, storage module and processing module pass through the electricity to be connected, and the heating panel setting is at mainboard body downside, and the dehumidification module setting is at the edge of heating panel.

Preferably, the heat dissipation plate includes: heating panel body, fin and radiator fan, heating panel body fixed mounting is at mainboard body downside, and the fin is provided with the multiunit, and the even array of multiunit fin sets up at heating panel body downside, and radiator fan sets up between the multiunit fin, and heating panel body edge fixed mounting has dehumidification module.

Preferably, the dehumidification module comprises: the dehumidification box, the dehumidification box outside is provided with a plurality of bleeder vents.

Preferably, a plurality of ventilation holes are formed at the lower side of the dehumidifying box.

Preferably, the dehumidifying box is filled with calcium chloride and activated carbon particles.

Preferably, the interface terminal module includes: the USB terminal, the LAN terminal, the COM terminal, the VGA terminal, the audio and video input interface terminal, USB terminal, LAN terminal, COM terminal, VGA terminal, audio and video input interface terminal arrange in proper order and set up at mainboard body one side edge, USB terminal, LAN terminal, COM terminal, VGA terminal, audio and video input interface terminal interface outwards set up.

Preferably, the storage module includes: the memory bank is installed on the mainboard body through the memory bank installing seat, and one side of the memory bank is provided with a processing module.

The utility model has the advantages that: the utility model discloses a set up the heating panel bottom mainboard body, can transmit the absorption with the heat of mainboard body through the heating panel, thereby improve the radiating efficiency, can dehumidify around the mainboard body through set up dehumidification module at the heating panel edge, and the dehumidification module is after absorbing water, specific heat capacity increases, can improve heat storage, because dehumidification module and heating panel contact setting, the dehumidification module can absorb more heats at the bottom of the mainboard body, thereby further improve the radiating effect of heating panel to the mainboard body, set up dehumidification module at the heating panel edge and both played the radiating effect, the dehumidification effect has been played again, can also reduce the arrangement cost, the arrangement volume has been reduced simultaneously, both played the radiating effect under the prerequisite of reducing the arrangement volume, the dehumidification effect has been played again.

Drawings

The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation. In the drawings:

fig. 1 is a schematic structural view of the heat dissipating plate of the present invention;

fig. 2 is a schematic structural view of a first angle of the main board body of the present invention;

fig. 3 is a bottom view of the heat dissipating plate body of the present invention;

fig. 4 is a cross-sectional view of the main board body of the present invention at angle two.

Description of reference numerals:

1. a main board body; 2. an interface terminal module; 3. a storage module; 4. a processing module; 5. a heat dissipation plate; 6. a dehumidification module; 51. a heat dissipation plate body; 52. a fin; 53. a heat-dissipating fan; 61. a dehumidification box; 611. air holes are formed; 21. a USB terminal; 22. a LAN terminal; 23. a COM terminal; 24. a VGA terminal; 25. an audio/video input interface terminal; 31. a memory bank; 32. memory bank mount pad.

Detailed Description

It should be noted that, in the case of no conflict, the embodiments and features of the embodiments of the present invention may be combined with each other.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of the indicated technical features. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The first embodiment is described with reference to fig. 1 and 2:

an embedded modular industrial motherboard comprising: mainboard body 1, interface terminal module 2, storage module 3, processing module 4, heating panel 5 and dehumidification module 6, interface terminal module 2, storage module 3 and processing module 4 set up at 1 upside of mainboard body, interface terminal module 2, storage module 3 and processing module 4 are through the electricity connection, heating panel 5 sets up at 1 downside of mainboard body, dehumidification module 6 sets up the edge at heating panel 5, so set up, heating panel 5 plays the radiating effect, dehumidification module 6 plays the dehumidification effect, after dehumidification module 6 dehumidifies and collects moisture, can play supplementary heating panel 5 and carry out radiating effect.

In the second embodiment, the following description is made with reference to fig. 3 on the basis of the first embodiment:

the heat dissipation plate 5 includes: the heat dissipation plate comprises a heat dissipation plate body 51, fins 52 and a heat dissipation fan 53, wherein the heat dissipation plate body 51 is fixedly installed on the lower side of the mainboard body 1 through screws, and the heat dissipation plate is convenient to detach.

The fins 52 are provided with a plurality of groups, the plurality of groups of fins 52 are uniformly arranged on the lower side of the heat dissipation plate body 51 in an array mode, the fins 52 are used for expanding the heat dissipation surface area, and the fins 52 and the heat dissipation plate body 51 are integrally arranged.

Radiator fan 53 sets up between multiunit fin 52, and radiator fan 53 is used for cooling down fin 52, and radiator plate body 51 edge fixed mounting has dehumidification module 6, and dehumidification module 6 is used for absorbing moisture, and increase specific heat capacity improves the ability of heat absorption.

The dehumidification module 6 comprises: dehumidification box 61, the dehumidification box 61 outside is provided with a plurality of bleeder vents 611, so set up, improves the dehumidification effect.

Dehumidification box 61 downside is provided with a plurality of bleeder vents 611, so set up, when dehumidification box 61 is inside to absorb moisture to the upper limit, unnecessary moisture can be followed downside bleeder vent 611 and dripped, can indicate the staff in time to change dehumidification box 61.

Dehumidification box 61 is inside to be filled with calcium chloride, active carbon particle, so set up, improves the dehumidification effect.

In the third embodiment, the following description will be made with reference to fig. 4:

the interface terminal module 2 includes: the USB interface module comprises a USB terminal 21, a LAN terminal 22, a COM terminal 23, a VGA terminal 24 and an audio and video input interface terminal 25, wherein the USB terminal 21, the LAN terminal 22, the COM terminal 23, the VGA terminal 24 and the audio and video input interface terminal 25 are sequentially arranged at one side edge of the mainboard body 1, and the USB terminal 21, the LAN terminal 22, the COM terminal 23, the VGA terminal 24 and the audio and video input interface terminal 25 are arranged in an outward mode.

The storage module 3 includes: memory bank 31 and memory bank mount pad 32, memory bank 31 passes through memory bank mount pad 32 to be installed on mainboard body 1, and memory bank 31 one side is provided with processing module 4.

The utility model discloses a theory of operation: when using, heating panel body 51 absorbs the heat from mainboard body 1, on the fin 52 of heat diffusion on the heating panel body 51, thereby dispel the heat on taking away fin 52 through radiator fan 53, dehumidification box 61 absorbs water through the calcium chloride of inside setting, activated carbon particle, at the in-process that absorbs water, heating panel body 51 gives the moisture of absorption in the dehumidification box 61 with some heat transfer, thereby improves mainboard body 1's radiating effect, the utility model discloses rational in infrastructure, convenient to use, the dismouting is convenient, and under the prerequisite of reducing layout volume, both played the radiating action, played the dehumidification effect again.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The above, only do the preferred embodiment of the present invention, not used to limit the present invention, all the technical matters of the present invention should be included in the protection scope of the present invention for any slight modification, equivalent replacement and improvement of the above embodiments.

Claims (6)

1. An embedded modular industrial motherboard comprising: mainboard body (1), interface terminal module (2), storage module (3) and processing module (4), its characterized in that still includes: the interface terminal module (2), the storage module (3) and the processing module (4) are arranged on the upper side of the mainboard body (1), the interface terminal module (2), the storage module (3) and the processing module (4) are electrically connected, the heat dissipation plate (5) is arranged on the lower side of the mainboard body (1), and the dehumidification module (6) is arranged on the edge of the heat dissipation plate (5).

2. Embedded modular industrial motherboard according to claim 1, characterized in that said heat dissipation plate (5) comprises: heating panel body (51), fin (52) and radiator fan (53), heating panel body (51) fixed mounting is in mainboard body (1) downside, and fin (52) are provided with the multiunit, and the even array of multiunit fin (52) sets up at heating panel body (51) downside, and radiator fan (53) set up between multiunit fin (52), and heating panel body (51) edge fixed mounting has dehumidification module (6).

3. An embedded modular industrial motherboard according to claim 2, characterized in that said dehumidification module (6) comprises: the dehumidifying box (61), the dehumidifying box (61) outside is provided with a plurality of bleeder vents (611).

4. An embedded modular industrial motherboard according to claim 3, characterized in that the dehumidifying box (61) is provided with a plurality of ventilation holes (611) at the lower side.

5. Embedded modular industrial motherboard according to claim 1, characterized in that said interface terminal module (2) comprises: USB terminal (21), LAN terminal (22), COM terminal (23), VGA terminal (24), audio and video input interface terminal (25), USB terminal (21), LAN terminal (22), COM terminal (23), VGA terminal (24), audio and video input interface terminal (25) arrange in proper order and set up at mainboard body (1) one side edge, USB terminal (21), LAN terminal (22), COM terminal (23), VGA terminal (24), audio and video input interface terminal (25) interface sets up outwards.

6. An embedded modular industrial motherboard according to claim 1, characterized in that said memory module (3) comprises: memory bank (31) and memory bank mount pad (32), memory bank (31) are installed on mainboard body (1) through memory bank mount pad (32), and memory bank (31) one side is provided with processing module (4).

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