CN213991502U - Vehicle-mounted information entertainment system host computer heat radiation structure and host computer thereof - Google Patents
Vehicle-mounted information entertainment system host computer heat radiation structure and host computer thereof Download PDFInfo
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- CN213991502U CN213991502U CN202023139313.5U CN202023139313U CN213991502U CN 213991502 U CN213991502 U CN 213991502U CN 202023139313 U CN202023139313 U CN 202023139313U CN 213991502 U CN213991502 U CN 213991502U
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Abstract
The utility model discloses an on-vehicle information entertainment system host computer heat radiation structure, including the center body, circuit board components and bottom, still include radiator unit, radiator unit includes radiator fan, support and radiator, the support is concave type cavity structures, its concave type cavity bottom surface inboard is equipped with the fan boss that the bottom surface upwards extrudees and forms, the central authorities of fan boss are equipped with the ventilation hole, radiator fan installs on the fan boss, the radiator is fixed in the concave type cavity bottom surface outside of support, radiator unit installs on the inboard top surface of center body, radiator fan is surrounded to the concave type cavity of center body top surface and support, and center body top surface corresponds the region with the radiator fan position and sets up a plurality of louvres, radiator unit and the circuit board components below are located center body and bottom and enclose synthetic space. The utility model discloses can still have superstrong heat-sinking capability, simple structure under the condition that does not change host computer space size. The utility model also discloses a vehicle-mounted information entertainment system host computer.
Description
Technical Field
The utility model belongs to the technical field of the host computer heat radiation structure technique and specifically relates to an on-vehicle information entertainment system host computer heat radiation structure and host computer with high heat-sinking capability.
Background
The solution of the automobile information entertainment system is not to leave SoC (System on a chip), which is a system-level chip, an automobile core element and a main processor, and the continuous development and progress of SoC bring the automobile information entertainment and the automobile networking function with rich characteristics for the automobile. With the increasing functions of the vehicle-mounted infotainment system host, the heat productivity of the SoC also increases, so that the SoC needs to be radiated by a proper radiating structure to ensure that the vehicle-mounted host does not exceed the maximum junction temperature of the SoC at high temperature, usually about 80 ℃, so that the host can work normally. Besides SoC, the main PCB board of the host of the vehicle-mounted infotainment system also has the following key electronic components, such as DDR (Double Data Rate synchronous dynamic random access memory), EMMC (Embedded Multi Media Card Embedded multimedia controller), PMU (Power Management Unit) and the like, which also need to dissipate heat. However, if the heat generated during the operation of the SoC cannot be timely dissipated, the heat can be accumulated inside the host, and then the key electronic components on the mainboard are adversely affected. Therefore, the heat generated by the SoC is quickly transferred from the inside of the host to the outside of the host, the temperature rise in the host is reduced, the performance of the host can be exerted to the maximum extent, meanwhile, when the temperature rise is reduced, the key devices can be electronic elements with relatively low temperature resistance and relatively low temperature resistance, and the cost is relatively low.
Fig. 1 shows a prior art heat dissipation structure of a vehicle-mounted host, which dissipates heat of a power amplifier IC 6 'through a power amplifier heat dissipation plate 6, and dissipates heat of an SoC 7' through an SoC heat dissipation plate 7, wherein the heat dissipation plate is made of a stamped aluminum plate, the power amplifier heat dissipation plate 6 and the SoC heat dissipation plate 7 are embedded in a middle frame body 9, and other electronic components on a PCB circuit board assembly 8 naturally dissipate heat through air circulation. The heat dissipation structure is characterized in that the power amplifier heat dissipation sheet 6 and the SoC heat dissipation sheet 7 are attached to the middle frame body 9, the heat dissipation sheets are small, the heat dissipation capacity is limited, and the heat dissipation structure is suitable for occasions (within 5W) with small heat productivity of SoC.
When the SoC becomes powerful and the heat generation amount is larger, the heat dissipation structure in the above scheme cannot effectively dissipate heat of the SoC, and at this time, the heat dissipation fins are usually enlarged to increase the heat dissipation amount of the SoC, as shown in fig. 2, another heat dissipation structure scheme in the prior art is provided, in the scheme, the whole middle frame body 9 'is made of aluminum profile, die-cast aluminum or other aluminum materials, and the aluminum middle frame performs whole heat dissipation on heat sources (power amplifier IC, SoC chip) on the PCB circuit board assembly 8'. The structural scheme is characterized in that the body of the host is made of a heat dissipation material, so that the heat dissipation capacity of the SoC is improved, if the host is not limited by the volume, theoretically, as the heat productivity of the SoC is increased, the aluminum middle frame body 9' is correspondingly increased, so that the heat dissipation problem of the SoC can be solved, but the internal space of the automobile is limited, the volume of the vehicle-mounted host is about the size of a single DIN (DIN), namely 178 x 153 x 50mm, so that the scheme is suitable for the heat productivity of the SoC of 5-15W, the heat dissipation capacity is limited by the size of the space of the host, and the heat dissipation capacity is limited.
In summary, the heat dissipation structure of the host of the vehicle-mounted infotainment system in the prior art has a limited heat dissipation capability, and cannot solve the problem that the SoC has higher and higher heat productivity due to stronger and stronger functions, and when heat dissipation is required to be performed on a plurality of heating elements, the number of parts is large, and the heat dissipation capability is affected by the space size of the host, so that it is urgently needed to design a heat dissipation structure of the host of the vehicle-mounted infotainment system, which has a super-strong heat dissipation capability and a simple structure, without changing the space size of the host.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem, the utility model provides a vehicle-mounted information entertainment system host computer heat radiation structure is provided, can effectively solve current vehicle-mounted information entertainment system host computer heat radiation structure heat-sinking capability limited, can not solve the SoC because of the more and more high difficult problem of calorific capacity that the function faced, dispel the heat to a plurality of heating element and can lead to part quantity a great deal, and the heat-sinking capability receives the problem of host computer space size influence, effectively ensure still to make it have superstrong heat-sinking capability and simple structure under the condition that does not change host computer space size.
In order to solve the technical problem, the utility model provides a heat dissipation structure of a host of a vehicle-mounted information entertainment system, which comprises a middle frame body, a circuit board assembly and a bottom cover, and is characterized by also comprising a heat dissipation assembly,
the heat dissipation assembly comprises a heat dissipation fan, a bracket and a heat radiator;
the support is of a concave cavity structure, the cooling fan is mounted on the inner side of the bottom surface of the concave cavity of the support, the positions of the bottom surface of the concave cavity and the cooling fan are provided with vent holes, and the radiator is mounted on the outer side of the bottom surface of the concave cavity;
the heat dissipation assembly is arranged on the top surface of the inner side of the middle frame body, the top surface of the middle frame body and the concave cavity of the support surround the heat dissipation fan, and a plurality of heat dissipation holes are formed in the area, corresponding to the position of the heat dissipation fan, of the top surface of the middle frame body;
the heat dissipation assembly and the circuit board assembly below the heat dissipation assembly are located in a space enclosed by the middle frame body and the bottom cover.
As an improvement of the above scheme, a fan boss with a bottom surface protruding upward is arranged on the inner side of the bottom surface of the concave cavity, the vent hole is arranged in the center of the fan boss, and the heat dissipation fan is mounted on the fan boss.
In the technical scheme, the fan boss separates the heat radiation fan from the radiator by a proper distance, so that hot air in the host machine is guided and discharged to cold air outside the host machine;
in the technical scheme, a plurality of limiting parts are further arranged at the edges of the ventilation holes and are used for positioning the shape of the cooling fan and preventing the cooling fan from rotating when the cooling fan is installed;
the top of the peripheral side surface of the concave cavity of the bracket is provided with an outward-turned folded edge, the folded edge is attached to the top surface of the inner side of the middle frame body and can be fixedly connected through a screw penetrating through the folded edge and the top surface of the inner side of the middle frame body, so that the heat dissipation assembly is arranged on the top surface of the inner side of the middle frame body;
the heat dissipation assembly can also be mounted on the top surface of the inner side of the middle frame body in other modes, and is not limited to the above mode;
the radiator can be an aluminum extruded radiator, a die-casting aluminum/magnesium radiator or a hot column module;
and each side surface of the middle frame body is provided with a flanged circuit board supporting surface for supporting the circuit board assembly.
As a refinement of the above, the heat sink is located above the primary heat source element on top of the circuit board assembly.
As an improvement of the scheme, the top of the heat source element is covered with a heat conducting medium, and the radiator is attached to the top surface of the heat conducting medium.
The circuit board assembly is a carrier for realizing the functions of an information entertainment system, SoC and AMP in electronic elements mounted on the existing circuit board assembly have the largest heat productivity, and need to be radiated by an additional radiator, and other electronic elements except an external socket have the heating power of about 1W, so the additional radiator is not generally needed, but the additional radiator is needed to radiate the other electronic elements with large heating power or low temperature resistance;
the heat radiator is positioned on a main heat source element at the top of the circuit board assembly, namely, the heat generated during operation is large, a heat source element such as an SoC (system on chip) of the heat radiator needs to be additionally arranged, the top of the heat source element is covered with a heat-conducting medium, and the heat radiator is attached to the top surface of the heat-conducting medium;
in the technical scheme, the radiator comprises a radiator positioned in the middle of the radiator and radiating fins attached to the side face of the radiator and extending to the periphery, the radiator is of a solid structure, the radiator is square, circular or other shapes, the position of the radiator on the support corresponds to the central area of the radiating fan, and the size of the radiator corresponds to the size of the heat source element and does not extend to the blade area of the radiating fan;
the bottom surface of the heat radiation body is attached to the top surface of the heat conducting medium;
the heat generated by the main heat source element such as an SoC during working is conducted to the radiator as a heat transfer medium to be radiated, and meanwhile, the heat radiating fan generates forced convection through air draft or blowing of the vent holes to transfer hot air inside the host to the outside of the host, so that the host has super heat radiating capacity through the combination of the radiator and the heat radiating fan under the condition of not changing the space size of the host, the heat radiating problem of the high-heating-power element is solved, and the heat radiating structure is simple in design, easy to realize standardization, easy to assemble and disassemble and high in reliability.
As a modification of the above, the bottom cover is made of a heat dissipating material.
The heat dissipation material is a stamped aluminum plate, a section aluminum alloy or a die-casting aluminum/magnesium alloy.
As an improvement of the above scheme, a heat conducting medium is covered on the top of the main heat source element at the bottom of the circuit board assembly, and the inner side surface of the bottom cover is attached to the top surface of the heat conducting medium.
In the technical scheme, the heat-conducting medium covers the top of a main heat source element at the bottom of the circuit board assembly, such as AMP, and the inner side surface of the bottom cover is attached to the top surface of the heat-conducting medium, so that the AMP conducts heat generated during working to the bottom cover through the heat-conducting medium as a heat-conducting medium, and the bottom cover and the outside of a host machine radiate heat in a natural convection and radiation mode;
when the bottom cover has surplus heat dissipation on the AMP, the eMMC and the DDR can conduct heat generated by operation to the bottom cover through the heat conducting medium serving as a heat transfer medium, so that the ambient temperature around the eMMC and the DDR can be reduced when the host works, and the type of an element with slightly low temperature resistance can be selected;
the bottom cover is made of a heat dissipation material, so that the dual functions of the heat dissipation sheet and the bottom cover are achieved, the heat dissipation capacity of the host is further enhanced, the component with lower heating power can be selected from the component types with lower temperature resistance under the condition of improving the heat dissipation capacity of the host, and the component with lower temperature resistance is low in cost, so that the cost of the host can be integrally reduced.
Other electronic elements with large heating power or low temperature resistance on the circuit board assembly can also be attached to the inner side surface of the bottom cover or the bottom surface of the heat radiator through the heat conducting medium to dissipate heat.
The heat-conducting medium is a heat-conducting silica gel gasket, heat-conducting silicone grease or a phase-change material and other thermal interface materials.
In the above technical solution, the main heat source component such as AMP at the bottom of the circuit board assembly may also be disposed at the top of the circuit board assembly, and the heat is dissipated by combining the heat dissipation fan and the heat sink.
As an improvement of the scheme, four sides of the concave cavity are closed.
In the technical scheme, when the heat dissipation structure of the vehicle-mounted information entertainment system host works, when the heat dissipation fan dissipates heat by extracting hot air in the host from the ventilation holes of the support, because the four side surfaces of the support are closed, the hot air can only be discharged from the heat dissipation holes on the top surface of the middle frame body and cannot flow back to the inside of the host, the heat dissipation efficiency is high, if the four side surfaces of the support are not closed, namely open, part of the hot air can flow back to the inside of the host, and the heat dissipation efficiency is reduced.
As an improvement of the scheme, the heat dissipation holes are in a hexagonal hole type, the side length is 1.5-2.5 mm, the interval between two adjacent hexagons is 0.8-1.2 mm, and the aperture ratio is more than 50%. The open porosity was calculated as: the area of the opening is divided by the area of the fan profile within the size range of the fan profile.
As an improvement of the scheme, the side surface of the middle frame body is also provided with a plurality of heat dissipation holes.
In the technical scheme, the heat dissipation structure of the vehicle-mounted information entertainment system host computer has two heat dissipation working modes during working:
the first heat dissipation working mode is as follows: cold air outside the host enters the host from the heat dissipation holes in the side face of the middle frame body, and after being mixed with hot air inside the host, the heat dissipation fan extracts the mixed hot air from the ventilation holes and transfers the mixed hot air to the heat dissipation holes in the top face of the middle frame body corresponding to the position of the heat dissipation fan to be discharged, so that the cold air and the hot air are circularly transferred, and finally, the state of dynamic balance of the temperature difference inside and outside the host is achieved;
the second heat dissipation working mode is as follows: the cooling fan sucks the cold air outside the host from the heat dissipation holes at the position corresponding to the top surface of the middle frame body and the position of the cooling fan, blows the cold air to the inside of the host through the air vents, and blows the mixed hot air to the side surfaces of the middle frame body to discharge the heat dissipation holes after the cold air is mixed with the hot air inside the host, so that the cold air and the hot air are circularly transferred, and finally the state of dynamic balance of the temperature difference inside and outside the host is achieved.
The utility model also provides a vehicle-mounted information entertainment system host computer, vehicle-mounted information entertainment system host computer include as above an arbitrary vehicle-mounted information entertainment system host computer heat radiation structure.
To sum up, compare in prior art, the utility model provides a vehicle-mounted information entertainment system host computer heat radiation structure combines the heat that produces heat source element to effectively dispel the heat through radiator fan among the radiator unit and radiator, still through inciting somebody to action the bottom is made by heat sink material, makes it have the dual function of fin and bottom simultaneously concurrently to make the host computer have superstrong heat-sinking capability under the condition that does not change host computer space size, solved high heating power and many heat source element's heat dissipation problem, just the utility model discloses a heat radiation structure design is simple, easily realizes standardizedly, easily assembles and dismantles, and is with low costs and the reliability is high.
Drawings
FIG. 1 is a prior art solution of a heat dissipation structure of a vehicle-mounted host;
FIG. 2 is another prior art solution for a heat dissipation structure of a vehicle-mounted host;
FIG. 3 is a structural composition diagram of a heat dissipation structure of a host of a vehicle-mounted infotainment system of the present invention;
FIG. 4 is a structural assembly diagram of the heat dissipating assembly of the heat dissipating structure of the host of the vehicle-mounted infotainment system of the present invention;
FIG. 5 is a schematic view of the support structure of the heat dissipation structure of the host of the vehicle-mounted infotainment system of the present invention;
FIG. 6 is a schematic structural view of the middle frame body of the heat dissipation structure of the host of the vehicle-mounted infotainment system of the present invention;
FIG. 7 is a schematic view of the heat sink structure of the host heat dissipation structure of the vehicle-mounted infotainment system of the present invention;
FIG. 8 is a comparison diagram of two viewing angles of the schematic sectional structure diagram obtained by sectioning the heat dissipation structure of the vehicle-mounted infotainment system host along the A-A sectioning line after being assembled.
Description of reference numerals:
1-a middle frame body, 2-a circuit board assembly, 3-a bottom cover, 4-a heat dissipation assembly and 5-a heat conducting medium;
11-circuit board support surface, 12-heat dissipation hole, 21-heat source element;
41-a radiating fan, 42-a bracket, 43-a radiator, 421-a concave cavity, 422-a fan boss, 423-a vent hole, 424-a limiting part, 425-a folded edge, 431-a radiator and 432-a radiating fin;
6-power amplifier radiating fins, 6 '-power amplifier IC, 7-SoC radiating fins, 7' -SoC, 8-PCB circuit board components and 9-middle frame bodies;
8'-PCB circuit board subassembly, 9' -center body.
Detailed Description
In order to make the objects, solutions and advantages of the present invention clearer, embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention. In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely used for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.
FIG. 1 ~ 8 will be combined together below to the utility model discloses it is right to make further detailed description, wherein FIG. 1 is a vehicle-mounted host computer heat radiation structure scheme among the prior art, FIG. 2 is another kind of vehicle-mounted host computer heat radiation structure scheme among the prior art, FIG. 3 is the utility model relates to a vehicle-mounted infotainment system host computer heat radiation structure's structure group becomes the picture, FIG. 4 is the utility model relates to a vehicle-mounted infotainment system host computer heat radiation structure the radiator unit structure group becomes the picture, FIG. 5 is the utility model relates to a vehicle-mounted infotainment system host computer heat radiation structure the supporting structure schematic diagram, FIG. 6 is the utility model relates to a vehicle-mounted infotainment system host computer heat radiation structure center body structure schematic diagram, FIG. 7 is the utility model relates to a vehicle-mounted infotainment system host computer heat radiation structure radiator structure schematic diagram, FIG. 8 is the utility model relates to a vehicle-mounted infotainment system host computer heat radiation structure assembles the back and cuts open the line and cuts open along A-A tangent line and cut open And comparing the two visual angles of the sectional structure schematic diagram obtained after cutting.
The invention is explained in further detail below with specific examples:
in order to solve the problems that the heat dissipation capability of the existing vehicle-mounted information entertainment system host is limited and the SoC is not capable of solving the problem that the SoC is higher and higher in heat productivity due to more and more powerful functions, when heat dissipation is required to be performed on a plurality of heating elements, the number of parts is large, and the heat dissipation capability is influenced by the space size of the host, the host is effectively ensured to have super-strong heat dissipation capability and a simple structure under the condition that the space size of the host is not changed, the utility model provides a vehicle-mounted information entertainment system host heat dissipation structure, as shown in fig. 3 and 4, which comprises a middle frame body 1, a circuit board assembly 2 and a bottom cover 3, and further comprises a heat dissipation assembly 4, wherein the heat dissipation assembly 4 comprises a heat dissipation fan 41, a support 42 and a heat dissipation device 43;
as shown in fig. 4 and 5, the support 42 has a concave cavity structure, the heat dissipation fan 41 is installed inside a bottom surface of the concave cavity 421 of the support, a ventilation hole 423 is formed at a position corresponding to the position of the heat dissipation fan 41 on the bottom surface of the concave cavity 421, and the heat sink 43 is installed outside the bottom surface of the concave cavity 421;
as shown in fig. 8, the heat dissipation assembly 4 is installed on the top surface of the inner side of the middle frame body 1, the top surface of the middle frame body 1 and the concave cavity 421 of the bracket 42 surround the heat dissipation fan 41, and as shown in fig. 6, a plurality of heat dissipation holes 12 are formed in the corresponding area of the top surface of the middle frame body 1 and the position of the heat dissipation fan 41;
the heat dissipation assembly 4 and the circuit board assembly 2 below the heat dissipation assembly are located in a space enclosed by the middle frame body 1 and the bottom cover 3.
In the above technical solution, a fan boss 422 having a bottom surface protruding upward may be disposed on the inner side of the bottom surface of the concave cavity 421, the vent hole 423 is disposed in the center of the fan boss 422, and the heat dissipation fan 41 is mounted on the fan boss 422.
The fan boss 422 separates the heat dissipation fan 41 from the heat sink 43 by a proper distance, which is beneficial to guiding and discharging hot air inside the host machine to cold air outside the host machine;
in the above technical solution, the edge of the ventilation hole 423 is provided with a plurality of limiting parts 424 for positioning the shape of the cooling fan 41 and preventing the cooling fan 41 from rotating when the cooling fan 41 is installed;
in the above technical solution, the top of the peripheral side surface of the concave cavity 421 of the bracket 42 is provided with an outward-turned folded edge 425, and the folded edge 425 is attached to the top surface of the inner side of the middle frame body 1 and can be fixedly connected by a screw penetrating through the two folded edges, so that the heat dissipation assembly 4 is installed on the top surface of the inner side of the middle frame body 1;
the heat dissipation assembly 4 can also be mounted on the top surface of the inner side of the middle frame body 1 by other methods, which is not limited to the above method;
the radiator 43 can be an aluminum extruded radiator, a die-casting aluminum/magnesium radiator or a heat column module;
and each side surface of the middle frame body 1 is provided with a flanged circuit board supporting surface 11 for supporting the circuit board assembly 2.
The heat sink 43 is located above the primary heat source element 21 on top of the circuit board assembly 2 in the above-described solution.
The top of the heat source element 21 is covered with a heat conducting medium 5, and the heat radiator 43 is attached to the top surface of the heat conducting medium 5.
The circuit board assembly 2 is a carrier for realizing the functions of the information entertainment system, SoC and AMP in electronic components mounted on the existing circuit board assembly generate the largest heat, and an external radiator is needed to radiate the heat, and the heating power of other electronic components except an external socket is about 1W, so the external radiator is not needed generally, but the external radiator is needed to radiate the heat for other electronic components with large heating power or low temperature resistance.
The heat generated during operation of the heat sink 43, which is the main heat source element located at the top of the circuit board assembly 2, is relatively large, the heat source element 21 such as SoC which needs to be additionally provided with a heat sink is arranged above the heat source element 21, the heat conducting medium 5 is covered on the top of the heat source element 21, and the heat sink 43 is attached to the top surface of the heat conducting medium 5.
As shown in fig. 7, the heat sink 43 includes a heat sink 431 located in a middle portion thereof and heat dissipation fins 432 attached to side surfaces of the heat sink 431 and extending circumferentially, the heat sink 431 has a solid structure, the heat sink 431 has a square, circular or other shape, the position of the heat sink 431 corresponds to a central area of the heat dissipation fan 41, and the size of the heat sink 431 corresponds to the size of the heat source element 21 and does not extend to a blade area of the heat dissipation fan 41;
the top surface of the heat radiator 431 is attached to the top surface of the heat conducting medium 5;
the heat generated by the main heat source element 21, such as SoC, during operation is conducted to the heat sink 43 through the heat conducting medium 5 as a heat transfer medium to dissipate heat, and the heat dissipation fan 41 draws air or blows air through the ventilation hole 423 to generate forced convection to transfer the hot air inside the host to the outside of the host. Above technical scheme can make the host computer have superstrong heat-sinking capability through the combination of radiator 43 with radiator fan 41 under the condition that does not change host computer space size, solves high heating power component's heat dissipation problem, and heat radiation structure is simple, easily realizes standardizing, easily assembles and dismantles, and the reliability is high.
The bottom cover 3 is made of a heat dissipation material, and the heat dissipation material is a stamped aluminum plate, a profile aluminum alloy or a die-casting aluminum/magnesium alloy.
The main heat source element 21 such as AMP at the bottom of the circuit board assembly 2 is covered with a heat conducting medium 5 at the top, and the inner side of the bottom cover 3 is attached to the top surface of the heat conducting medium 5. The heat generated by the AMP is conducted to the bottom cover 3 through the heat conducting medium 5 as a heat transfer medium, and the bottom cover 3 and the outside of the host computer are radiated by natural convection and radiation.
When the bottom cover 3 has surplus heat dissipation on the AMP, the eMMC and the DDR can conduct heat generated by operation to the bottom cover 3 through the heat conducting medium 5 serving as a heat conducting medium, so that the ambient temperature around the eMMC and the DDR can be reduced when the host works, and the type of an element with slightly low temperature resistance can be selected;
in the technical scheme, the bottom cover 3 is made of the heat dissipation material, so that the dual functions of the heat dissipation sheet and the bottom cover are achieved, the heat dissipation capacity of the host is further enhanced, the element with lower heating power can be selected from the element with lower temperature resistance under the condition of improving the heat dissipation capacity of the host, the cost of the element with lower temperature resistance is low, and the cost of the host can be integrally reduced.
Other electronic components on the circuit board assembly 2 with large heating power or low temperature resistance can also be attached to the inner side surface of the bottom cover 3 or the bottom surface of the heat radiator 431 through the heat conducting medium 5 for heat radiation.
The heat-conducting medium 5 is a heat-conducting silica gel gasket, heat-conducting silicone grease or a phase-change material and other thermal interface materials.
In the above solution, the main heat source component 21, such as AMP, at the bottom of the circuit board assembly 2 can also be disposed at the top of the circuit board assembly 2, and the heat is dissipated by the combination of the heat dissipation fan 41 and the heat sink 43.
The concave cavity 421 is closed on four sides. When the heat dissipation fan 41 dissipates heat by extracting hot air in the host from the ventilation holes 423 of the bracket 42, the four sides of the bracket 42 are closed, so that the hot air can be discharged only from the heat dissipation holes 12 on the top surface of the middle frame body 1 without flowing back to the inside of the host, the heat dissipation efficiency is high, and if the four sides of the bracket 42 are not closed, that is, open, part of the hot air flows back to the inside of the host, and the heat dissipation efficiency is reduced.
The heat dissipation holes 12 can be in a hexagonal hole type, the side length is 1.5-2.5 mm, and the interval between two adjacent hexagons is 0.8-1.2 mm; the heat dissipation holes 12 can also be in a circular hole type, and the aperture phi is 2-phi 5. When the heat dissipation holes 12 are in a hexagonal hole type or a circular hole type, the arrangement mode is staggered;
the heat dissipation holes 12 may also be elongated holes, fan-shaped holes or blade-shaped holes;
the aperture ratio of the heat dissipation hole 12 is more than 50%. The higher the opening ratio, the better, more preferably 70% or more. The open porosity was calculated as: the area of the opening is divided by the area of the fan profile within the size range of the fan profile.
A plurality of heat dissipation holes 12 are also formed in the side surface of the middle frame body 1.
In the technical scheme, the heat dissipation structure of the vehicle-mounted information entertainment system host computer has two heat dissipation working modes during working:
the first heat dissipation working mode is as follows: cold air outside the host enters the inside of the host from the heat dissipation holes 12 on the side surface of the middle frame body 1, and after being mixed with hot air inside the host, the heat dissipation fan 41 extracts the mixed hot air from the ventilation holes 423 and transfers the mixed hot air to the heat dissipation holes 12 on the top surface of the middle frame body 1 corresponding to the position of the heat dissipation fan 41 to be discharged, so that the cold and hot air is circularly transferred, and finally the state of dynamic balance of the temperature difference inside and outside the host is achieved;
the second heat dissipation working mode is as follows: the heat dissipation fan 41 sucks cold air outside the host from the heat dissipation holes 12 at the position corresponding to the top surface of the middle frame body 1 and the position of the heat dissipation fan 41, blows the cold air to the inside of the host through the ventilation holes 423, and after the cold air is mixed with hot air inside the host, the heat dissipation fan 41 blows the mixed hot air to the heat dissipation holes 12 on the side surface of the middle frame body 1 to discharge, so that the cold and hot air is circularly transferred, and finally the state of dynamic balance of the temperature difference between the inside and the outside of the host is achieved.
The utility model also provides a vehicle-mounted information entertainment system host computer, vehicle-mounted information entertainment system host computer include as above an arbitrary vehicle-mounted information entertainment system host computer heat radiation structure.
To sum up, compare in prior art, the utility model provides a vehicle-mounted information entertainment system host computer heat radiation structure combines the heat that produces heat source element 21 to effectively dispel the heat through radiator fan 41 and radiator 43 among the radiator unit 4, still through inciting somebody to action bottom 3 is made by heat sink material, makes it have the dual function of fin and bottom simultaneously concurrently to make the host computer have superstrong heat-sinking capability under the condition that does not change host computer space size, solved high heating power and many heat source element's heat dissipation problem, just the utility model discloses a heat radiation structure design is simple, easily realizes the standardization, easily assembles and dismantles, and is with low costs and the reliability is high.
The above is the preferred embodiment of the present invention, it should be noted that although the present invention only provides the above embodiments, but also provides many possible variations which do not need to be obtained through creative work, although still unable to be exhaustive, after reading the present specification, a person of ordinary skill in the art should be able to associate with more specific embodiments, such specific embodiments do not go beyond the spirit of the claims of the present invention, and any form of equivalent replacement or several modifications and embellishments should be regarded as included in the embodiments of the present invention, and belong to the protection scope of the present invention.
Claims (10)
1. A heat dissipation structure of a host machine of a vehicle-mounted information entertainment system comprises a middle frame body, a circuit board assembly and a bottom cover, and is characterized by also comprising a heat dissipation assembly,
the heat dissipation assembly comprises a heat dissipation fan, a bracket and a heat radiator;
the support is of a concave cavity structure, the cooling fan is mounted on the inner side of the bottom surface of the concave cavity of the support, the positions of the bottom surface of the concave cavity and the cooling fan are provided with vent holes, and the radiator is mounted on the outer side of the bottom surface of the concave cavity;
the heat dissipation assembly is arranged on the top surface of the inner side of the middle frame body, the top surface of the middle frame body and the concave cavity of the support surround the heat dissipation fan, and a plurality of heat dissipation holes are formed in the area, corresponding to the position of the heat dissipation fan, of the top surface of the middle frame body;
the heat dissipation assembly and the circuit board assembly below the heat dissipation assembly are located in a space enclosed by the middle frame body and the bottom cover.
2. The vehicle infotainment system host heat dissipation structure of claim 1, wherein a fan boss having a bottom surface that protrudes upward is provided inside the bottom surface of the concave cavity, the vent hole is provided at the center of the fan boss, and the heat dissipation fan is mounted on the fan boss.
3. The in-vehicle infotainment system host heat dissipation structure of claim 1, wherein the heat sink is located above a primary heat source element on top of the circuit board assembly.
4. The in-vehicle infotainment system host heat dissipation structure of claim 3, wherein a heat conducting medium is coated on top of the heat source element, and the heat sink is attached to a top surface of the heat conducting medium.
5. The in-vehicle infotainment system host heat dissipation structure of claim 1, wherein the bottom cover is made of a heat dissipation material.
6. The vehicle infotainment system host heat dissipation structure of claim 5, wherein the top of the primary heat source element at the bottom of the circuit board assembly is covered with a heat conducting medium, and the inside of the bottom cover is attached to the top of the heat conducting medium.
7. The vehicle infotainment system host heat dissipation structure of claim 1, wherein four sides of the concave cavity are closed.
8. The vehicle-mounted infotainment system host heat dissipation structure of claim 1, wherein the heat dissipation holes are hexagonal holes, the side length is 1.5-2.5 mm, two adjacent hexagons are spaced by 0.8-1.2 mm, and the aperture ratio is more than 50%.
9. The vehicle-mounted infotainment system host heat dissipation structure of claim 1, wherein a plurality of heat dissipation holes are also formed in a side surface of the center body.
10. An in-vehicle infotainment system host comprising the in-vehicle infotainment system host heat dissipation structure of any one of claims 1 to 9.
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| CN202023139313.5U CN213991502U (en) | 2020-12-23 | 2020-12-23 | Vehicle-mounted information entertainment system host computer heat radiation structure and host computer thereof |
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| CN202023139313.5U CN213991502U (en) | 2020-12-23 | 2020-12-23 | Vehicle-mounted information entertainment system host computer heat radiation structure and host computer thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114302586A (en) * | 2021-11-24 | 2022-04-08 | 深圳半岛医疗有限公司 | Multi-channel radio frequency power supply |
| CN114326967A (en) * | 2021-12-24 | 2022-04-12 | 惠州市德赛西威汽车电子股份有限公司 | Novel vehicle-mounted intelligent system host box structure |
| CN116033730A (en) * | 2023-03-27 | 2023-04-28 | 之江实验室 | Cabinet and flight device |
| CN114326967B (en) * | 2021-12-24 | 2024-08-02 | 惠州市德赛西威汽车电子股份有限公司 | Novel on-vehicle intelligent system mainframe box structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114302586A (en) * | 2021-11-24 | 2022-04-08 | 深圳半岛医疗有限公司 | Multi-channel radio frequency power supply |
| CN114302586B (en) * | 2021-11-24 | 2024-06-25 | 深圳半岛医疗集团股份有限公司 | Multipath radio frequency power supply |
| CN114326967A (en) * | 2021-12-24 | 2022-04-12 | 惠州市德赛西威汽车电子股份有限公司 | Novel vehicle-mounted intelligent system host box structure |
| CN114326967B (en) * | 2021-12-24 | 2024-08-02 | 惠州市德赛西威汽车电子股份有限公司 | Novel on-vehicle intelligent system mainframe box structure |
| CN116033730A (en) * | 2023-03-27 | 2023-04-28 | 之江实验室 | Cabinet and flight device |
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