CN218630713U - Multiple heat radiation structure of computer chip - Google Patents
Multiple heat radiation structure of computer chip Download PDFInfo
- Publication number
- CN218630713U CN218630713U CN202222587246.6U CN202222587246U CN218630713U CN 218630713 U CN218630713 U CN 218630713U CN 202222587246 U CN202222587246 U CN 202222587246U CN 218630713 U CN218630713 U CN 218630713U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- chip
- liquid
- side wall
- computer chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present disclosure relates to a multiple heat dissipation structure of a computer chip, comprising: the liquid storage box comprises a heat dissipation box body and a heat dissipation plate arranged on the heat dissipation box body; the chip placing groove is arranged on the heat dissipation plate, and the top end and the bottom end of the chip placing groove are opened; a liquid flow ring groove is formed in the side wall of the chip placing groove, and a first liquid inlet and a first liquid outlet are formed in the liquid flow ring groove; the liquid containing box is arranged on the heat dissipation plate, and a second liquid inlet and a second liquid outlet are formed in the side wall of the liquid containing box; wherein, the first liquid inlet is connected with the second liquid outlet through a heat exhaust conduit; the first liquid outlet is connected with the second liquid inlet through a second conduit; the heat exhaust pipe and the second pipe are respectively provided with a pump; a plurality of first heat dissipation fans are arranged on the heat dissipation plate below the heat dissipation pipe. The multiple heat dissipation structure of the computer chip can prolong the service life of the computer chip.
Description
Technical Field
The present disclosure relates to the field of computer information technology, and more particularly, to a multiple heat dissipation structure for a computer chip.
Background
The computer chip is a microcircuit sheet made of silicon material and has a small volume. In the process of running and calculating the computer under continuous high load, a large amount of heat generated by the chip can be caused, but the heat dissipation effect of most of the existing computer chips is not ideal, and the heat dissipation effect is often dependent on the heat dissipation structure of the mainboard inside the computer, so that the heat dissipation can be carried out on the computer chip only while the mainboard dissipates heat. Under the condition that the computer works for a long time, the heat generated by the computer chip is more and more, and the service life of the computer chip is further reduced. Accordingly, there is a need to address one or more of the problems associated with the related art solutions discussed above to increase the useful life of a computer chip.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
An object of the disclosed embodiment is to provide a multiple heat dissipation structure of a computer chip, which can improve the service life of the computer chip.
The embodiment of the present disclosure provides a multiple heat dissipation structure of a computer chip, including:
the heat dissipation box comprises a heat dissipation box body and a heat dissipation plate arranged on the heat dissipation box body;
the chip placing groove is arranged on the heat dissipation plate, the top end and the bottom end of the chip placing groove are both of an open structure, and the chip placing groove is used for placing a chip; a liquid flow ring groove is formed in the side wall of the chip placing groove, and a first liquid inlet and a first liquid outlet are formed in the liquid flow ring groove;
the liquid containing box is arranged on the heat dissipation plate, and a second liquid inlet and a second liquid outlet are formed in the side wall of the liquid containing box;
wherein the first liquid inlet and the second liquid outlet are connected through a heat exhaust conduit; the first liquid outlet is connected with the second liquid inlet through a second conduit; the heat exhaust pipe and the second pipe are respectively provided with a pump; the heat dissipation plate below the heat dissipation pipe is provided with a plurality of first heat dissipation fans.
In an exemplary embodiment of the present disclosure, the heat exhaust conduit comprises a cold drain pipe and a first conduit, one port of the cold drain pipe is connected with the second liquid outlet, and the other port of the cold drain pipe is connected with one port of the first conduit; the other port of the first conduit is connected with the first liquid inlet; wherein, the cold row of tubes is crooked wave.
In an exemplary embodiment of the present disclosure, a pump is disposed at a connection end of the cold drain pipe and the second liquid outlet; and a pump is arranged at the connecting end of the second conduit and the first liquid outlet.
In an exemplary embodiment of the present disclosure, a plurality of the first heat dissipation fans are disposed on the heat dissipation plate below the cold row pipe; a plurality of control switch setting of first heat dissipation fan is installing cold calandria one side on the lateral wall of heat dissipation box body.
In an exemplary embodiment of the present disclosure, a partition is disposed in the chip placement groove, the partition divides the chip placement groove into an upper accommodation cavity and a lower accommodation cavity, the upper accommodation cavity is used for placing a chip, and a dust screen is disposed at the bottom of the upper accommodation cavity.
In an exemplary embodiment of the present disclosure, the heat dissipation box body includes a heat dissipation box bottom plate, and a heat dissipation box side wall vertically connected to the periphery of the heat dissipation box bottom plate, and the heat dissipation box bottom plate and the heat dissipation box side wall form an accommodating cavity structure with an open upper end; the heat dissipation box is characterized in that a servo motor is arranged on the heat dissipation box bottom plate in the heat dissipation box body, the output end of the servo motor is connected with a pipeline fan, and the pipeline fan is located under the chip placing groove.
In an exemplary embodiment of the present disclosure, the duct fan includes a blade and a housing, and a connecting shaft of the blade is connected to an output end of the servo motor; the shell cladding the blade, the both sides of shell symmetry respectively are provided with first ventilation hole, every first ventilation hole all is connected with the ventilation pipe, the air outlet of ventilation pipe stretches into hold the intracavity down.
In an exemplary embodiment of the disclosure, a plurality of support rods are connected to an inner side wall of the heat dissipation box body, one end of each support rod is connected to the inner side wall of the heat dissipation box body, a second heat dissipation fan is arranged at the other end of each support rod, and each second heat dissipation fan faces to an opening at the bottom end of the chip placement groove; and the control switches of the second heat dissipation fans are arranged on the side wall of the heat dissipation box body.
In an exemplary embodiment of the present disclosure, each side wall of the heat dissipation plate is provided with a second vent hole.
In an exemplary embodiment of the disclosure, a plurality of heat dissipation metal blocks are disposed on an outer side wall of the chip placement groove.
The technical scheme provided by the disclosure can comprise the following beneficial effects:
in the exemplary embodiment of the present disclosure, a multiple heat dissipation structure of a computer chip is provided, in which a liquid flow loop on a side wall of a liquid containing box and a chip placing groove forms a cooling liquid backflow, and a plurality of first heat dissipation fans are arranged on a heat dissipation plate below a heat dissipation conduit, so as to perform a multiple heat dissipation function on the computer chip, thereby prolonging the service life of the computer chip.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is apparent that the drawings in the following description are only some embodiments of the disclosure, and that other drawings may be derived from those drawings by a person of ordinary skill in the art without inventive effort.
Fig. 1 shows a schematic diagram of a multiple heat dissipation structure of a computer chip in an exemplary embodiment of the present disclosure;
FIG. 2 illustrates another schematic diagram of a multiple heat dissipation structure of a computer chip in an exemplary embodiment of the present disclosure;
FIG. 3 is a schematic diagram illustrating a configuration of a liquid flow ring groove in a multiple heat dissipation structure of a computer chip in an exemplary embodiment of the disclosure;
fig. 4 is a schematic diagram illustrating an internal structure of a heat dissipation box in a multiple heat dissipation structure of a computer chip according to an exemplary embodiment of the present disclosure.
In the figure, 100, a heat dissipation box; 101. a heat dissipation plate; 1011. a first heat dissipation fan; 1012. a second vent hole; 102. a heat dissipation box body; 1021. a heat dissipation box bottom plate; 1022. a side wall of the heat dissipation box; 103. a chip placing groove; 1031. a liquid flow ring groove; 10311. a first liquid inlet; 10312. a first liquid outlet; 1032. an upper receiving cavity; 10321. a dust screen; 1033. a lower receiving chamber; 1034. a heat-dissipating metal block; 104. a liquid placing box; 1041. a second liquid inlet; 1042. a second liquid outlet; 105. a heat exhaust conduit; 1051. a cold discharge pipe; 1052. a first conduit; 106. a second conduit; 107. a pump; 108. a servo motor; 109. a pipeline fan; 110. a vent pipe; 111. a support bar; 1111. a second heat radiation fan.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in the form of software, or in one or more hardware modules or integrated circuits, or in different networks and/or processor devices and/or microcontroller devices.
In the present exemplary embodiment, a multiple heat dissipation structure of a computer chip is provided, and as shown in fig. 1, the multiple heat dissipation structure of a computer chip may include: a heat radiation box 100, a chip placing groove 103 and a liquid placing box 104.
The heat dissipation box 100 includes a heat dissipation box body 102, and a heat dissipation plate 101 disposed on the heat dissipation box body 102;
the chip placement groove 103 is arranged on the heat dissipation plate 101, and the top end and the bottom end of the chip placement groove 103 are both of an open structure; the chip placement groove 103 is used for placing chips; a liquid flow ring groove 1031 is arranged on the side wall of the chip placing groove 103, and a first liquid inlet 10311 and a first liquid outlet 10312 are arranged on the liquid flow ring groove 1031;
the liquid containing box 104 is disposed on the heat dissipating plate 101, and a second liquid inlet 1041 and a second liquid outlet 1042 are disposed on a side wall of the liquid containing box 104;
wherein, the first liquid inlet 10311 and the second liquid outlet 1042 are connected by a heat exhaust conduit 105; the first outlet 10312 and the second inlet 1041 are connected by a second conduit 106; a pump 107 is provided on the heat exhaust duct 105 and the second duct 106, respectively; a plurality of first heat radiation fans 1011 are provided on the heat radiation plate 101 below the heat radiation duct 105.
In the present exemplary embodiment, when heat is dissipated from a computer chip, first, the chip is placed in the chip placement groove 103, and the cooling liquid is placed in the liquid placement box 104; then, the pump 107 on the heat exhaust pipe 105 is turned on, the cooling liquid flows into the liquid flow ring groove 1031 through the heat exhaust pipe 105, and meanwhile, the cooling liquid flowing through the heat exhaust pipe 105 is further cooled by the plurality of first cooling fans 1011; then, the pump 107 on the second conduit 106 is turned on, and the cooling liquid flows back to the liquid containing box 104, so that the circulating flow of the cooling liquid is formed, and under the combined action of the first heat dissipation fan 1011, the effect of multiple heat dissipation on the computer chip is realized, and the service life of the computer chip is prolonged.
The multiple heat dissipation structure of the computer chip in the present exemplary embodiment is explained in more detail below:
in an exemplary embodiment of the present disclosure, as shown in fig. 2, the specific configuration of the heat exhaust duct 105 is defined, in this example, the heat exhaust duct 105 includes a cold exhaust pipe 1051 and a first duct 1052, one port of the cold exhaust pipe 1051 is connected to the second liquid outlet 1042, and the other port of the cold exhaust pipe 1051 is connected to one port of the first duct 1052; the other port of the first conduit 1052 is connected to the first inlet port 10311. The shape of the cold row pipe 1051 is preferably a curved wave shape.
Further, a pump 107 is arranged at the connecting end of the cold exhaust pipe 1051 and the second liquid outlet 1042; a pump 107 is also provided at the connection of the second conduit 106 to the first liquid outlet 10312.
This allows the coolant in the pad 104 to flow through the heat removal conduit 105 into the fluid ring groove 1031 and then back to the pad 104 through the second conduit 106. The design enables the cooling liquid to flow circularly, so that the effect of multiple heat dissipation on the computer chip is achieved, and the service life of the computer chip is prolonged.
Further, a plurality of first heat dissipating fans 1011 are disposed on the heat dissipating plate 101 below the cold row pipe 1051, so that the cooling liquid in the cold row pipe 1051 can be further cooled. And a control switch of the first heat dissipation fan 1011 is provided on the side wall of the heat dissipation box body 102 on the side where the cold row pipe 1051 is installed. The control switch is connected to the first heat dissipation fan 1011 through a wire, and the control switch may be disposed on any one of the side walls of the heat dissipation box 100 or the heat dissipation plate 101, so that the wire may be disposed in the side wall of the heat dissipation box 100 or inside the heat dissipation plate 101. However, the length of the circuit can be shortened by being disposed on the side wall of the heat dissipation box body 102 on the side where the cold row pipe 1051 is mounted, and the disassembly and maintenance are convenient.
In an exemplary embodiment of the present disclosure, as shown in fig. 2 and 3, a specific structure of the chip placement slot 103 is designed, the chip placement slot 103 is provided with a partition, the partition divides the chip placement slot 103 into an upper accommodating chamber 1032 and a lower accommodating chamber 1033, a chip to be cooled is placed in the upper accommodating chamber 1032, and a dust screen 10321 may be provided at the bottom of the upper accommodating chamber 1032 for preventing dust.
Next, in an exemplary embodiment of the present disclosure, the structure of the heat dissipation box body 102 is designed, as shown in fig. 4, the heat dissipation box body 102 includes a heat dissipation box bottom plate 1021, and a heat dissipation box side wall 1022 vertically connected to the periphery of the heat dissipation box bottom plate 1021. Thus, the heat dissipation case base plate 1021 and the heat dissipation case side wall 1022 form an accommodating chamber structure with an open upper end; a servo motor 108 is arranged on a heat dissipation box bottom plate 1021 in the heat dissipation box body 102, an output end of the servo motor 108 is connected with a pipeline fan 109, and the pipeline fan 109 is arranged right below the chip placement groove 103.
Further, the structure of the pipeline fan 109 is limited, the pipeline fan 109 comprises a blade and a shell, the shell wraps the blade, and a connecting shaft of the blade is connected with the output end of the servo motor 108; the both sides of shell symmetry respectively set up first ventilation hole, and every first ventilation hole all is connected with ventilation pipe 110 to set up the air outlet of ventilation pipe 110 into stretching into in the lower chamber 1033 that holds of chip standing groove 103. The duct fan 109 is driven to rotate by the servo motor 108, and cold air is blown into the lower accommodating chamber 1033 of the chip placement groove 103 through the vent pipe 110, so that the heat dissipation effect on the computer chip is further achieved.
Furthermore, a plurality of support rods 111 are connected to the inner side wall of the heat dissipation box body 102, one end of each support rod 111 is connected to the inner side wall of the heat dissipation box body 102, a second heat dissipation fan 1111 is arranged at the other end of each support rod 111, and each second heat dissipation fan 1111 faces to an opening at the bottom end of the chip placement groove 103; the plurality of support bars 111 play a supporting role, and the second heat dissipation fan 1111 and the controller are connected by a wire provided inside the support bars 111.
The control switch of the second heat dissipation fan 1111 is connected to the second heat dissipation fan 1111 through a wire, and the control switch may be disposed on any sidewall of the heat dissipation case 100 or the heat dissipation plate 101, so that the wire may be disposed inside the sidewall of the heat dissipation case 100 or inside the heat dissipation plate 101.
Here, the control switch is integrally provided on the side wall of the heat radiation box main body 102 on the side where the cold discharge pipe 1051 is installed, and the control switch can control the first heat radiation fan 1011, the second heat radiation fan 1111, and the servo motor 108.
In an exemplary embodiment of the present disclosure, a second vent 1012 is provided on each side wall of the heat dissipation plate 101, which serves to further cool the accommodation chamber formed by the heat dissipation box body 102.
In an exemplary embodiment of the present disclosure, a plurality of heat-dissipating metal blocks 1034 are disposed on the outer side wall of the chip placement groove 103, and the heat-dissipating metal blocks 1034 are preferably copper blocks. Thus, the computer chip is further cooled.
In summary, in the exemplary embodiment of the present disclosure, after a computer chip runs for a long time, a large amount of heat is generated, the computer chip is placed in the upper receiving cavity 1032 of the chip placement slot 103, the liquid containing box 104 is filled with the cooling liquid, the cooling liquid in the liquid containing box 104 flows into the liquid flow ring groove 1031 through the cold discharge pipe 1051 and the first conduit 1052, and then flows back to the liquid containing box 104 through the second conduit 106, so as to form a circulating flow of the cooling liquid, thereby cooling the computer chip; meanwhile, the first heat dissipation fan 1011 and the second heat dissipation fan 1111 further cool the computer chip; and the heat of the computer chip can be further absorbed by the plurality of heat-dissipating metal blocks 1034 arranged on the outer side wall of the chip placement groove 103, and the whole design is cooled until the computer chip is cooled.
It should be noted that in the description of the exemplary embodiments of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of describing the exemplary embodiments of the present disclosure and simplifying the description, but do not indicate or imply that the referred devices or elements must have specific orientations, be configured and operated in specific orientations, and thus, should not be construed as limiting the exemplary embodiments of the present disclosure; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the exemplary embodiments of the present disclosure can be understood in specific cases by those of ordinary skill in the art.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice in the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (10)
1. A multiple heat dissipation structure of a computer chip, comprising:
the heat dissipation box comprises a heat dissipation box body and a heat dissipation plate arranged on the heat dissipation box body;
the chip placing groove is arranged on the heat dissipation plate, the top end and the bottom end of the chip placing groove are both of an open structure, and the chip placing groove is used for placing a chip; a liquid flow ring groove is formed in the side wall of the chip placing groove, and a first liquid inlet and a first liquid outlet are formed in the liquid flow ring groove;
the liquid containing box is arranged on the heat dissipation plate, and a second liquid inlet and a second liquid outlet are formed in the side wall of the liquid containing box;
wherein the first liquid inlet and the second liquid outlet are connected through a heat exhaust conduit; the first liquid outlet is connected with the second liquid inlet through a second conduit; the heat exhaust pipe and the second pipe are respectively provided with a pump; the heat dissipation plate below the heat dissipation pipe is provided with a plurality of first heat dissipation fans.
2. The multiple heat dissipation structure of a computer chip according to claim 1, wherein the heat removal conduit comprises a cold drain pipe and a first conduit, one port of the cold drain pipe is connected to the second liquid outlet, and the other port of the cold drain pipe is connected to one port of the first conduit; the other port of the first conduit is connected with the first liquid inlet; wherein, the cold discharge pipe is in a bent wave shape.
3. The multiple heat dissipation structure of computer chip according to claim 2, wherein a pump is disposed at a connection end of the cold drain pipe and the second liquid outlet; and a pump is arranged at the connecting end of the second conduit and the first liquid outlet.
4. The multiple heat dissipation structure of computer chip according to claim 2, wherein a plurality of the first heat dissipation fans are disposed on the heat dissipation plate below the cold row pipe; a plurality of control switch setting of first heat dissipation fan is installing cold calandria one side on the lateral wall of heat dissipation box body.
5. The multiple heat dissipation structure of computer chip according to claim 1, wherein a partition is disposed in the chip placement groove, the partition divides the chip placement groove into an upper accommodating chamber and a lower accommodating chamber, the upper accommodating chamber is used for accommodating a chip, and a dust screen is disposed at the bottom of the upper accommodating chamber.
6. The multiple heat dissipation structure of computer chip according to claim 5, wherein the heat dissipation box body comprises a heat dissipation box bottom plate and a heat dissipation box side wall vertically connected with the periphery of the heat dissipation box bottom plate, and the heat dissipation box bottom plate and the heat dissipation box side wall form an accommodating cavity structure with an upper end opened; the heat dissipation box is characterized in that a servo motor is arranged on the heat dissipation box bottom plate in the heat dissipation box body, the output end of the servo motor is connected with a pipeline fan, and the pipeline fan is located under the chip placing groove.
7. The multiple heat dissipation structure of a computer chip according to claim 6, wherein the duct fan comprises a blade and a housing, and a connecting shaft of the blade is connected with an output end of the servo motor; the shell cladding the blade, the both sides of shell symmetry respectively are provided with first ventilation hole, every first ventilation hole all is connected with the ventilation pipe, the air outlet of ventilation pipe stretches into hold the intracavity down.
8. The multiple heat dissipation structure of a computer chip according to claim 7, wherein a plurality of support rods are connected to an inner side wall of the heat dissipation box body, one end of each support rod is connected to the inner side wall of the heat dissipation box body, a second heat dissipation fan is arranged at the other end of each support rod, and each second heat dissipation fan faces to an opening at the bottom end of the chip placement groove; and the control switches of the second heat dissipation fans are arranged on the side wall of the heat dissipation box body.
9. The multiple heat dissipation structure of computer chip as claimed in any one of claims 1 to 8, wherein each side wall of the heat dissipation plate is provided with a second vent hole.
10. The multiple heat dissipation structure of computer chip according to claim 9, wherein a plurality of heat dissipation metal blocks are disposed on an outer side wall of the chip placement groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222587246.6U CN218630713U (en) | 2022-09-28 | 2022-09-28 | Multiple heat radiation structure of computer chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222587246.6U CN218630713U (en) | 2022-09-28 | 2022-09-28 | Multiple heat radiation structure of computer chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218630713U true CN218630713U (en) | 2023-03-14 |
Family
ID=85468356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222587246.6U Active CN218630713U (en) | 2022-09-28 | 2022-09-28 | Multiple heat radiation structure of computer chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218630713U (en) |
-
2022
- 2022-09-28 CN CN202222587246.6U patent/CN218630713U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3594900B2 (en) | Display integrated computer | |
| US7222661B2 (en) | Cooling module | |
| JP2006207881A (en) | Cooling device and electronic apparatus comprising the same | |
| CN112393626A (en) | Liquid cooling radiating water discharge of water inlet multi-runner multi-water collecting box water adding pump | |
| WO2021077802A1 (en) | Integrated air source heat pump | |
| CN218630713U (en) | Multiple heat radiation structure of computer chip | |
| CN217389307U (en) | Storage type air cooling and immersion liquid cooling two-phase heat exchange data center | |
| CN211267490U (en) | Integral type air source heat pump | |
| JP2003004359A (en) | Refrigerator | |
| CN213690504U (en) | Heat dissipation protection device for desktop computer main body | |
| CN214751739U (en) | Liquid cooling heat radiation structure with stirring function | |
| CN112432250B (en) | Automatically controlled box and air condensing units | |
| CN209946787U (en) | Sheet-metal case with efficient heat dissipation function | |
| CN209842505U (en) | Big data server with good heat dissipation performance | |
| CN211267491U (en) | Integral type air source heat pump | |
| KR101413931B1 (en) | Outdoor unit of a airconditioning system, cooling method for the outdoor unit, and cooling apparatus for a box receiving elertric parts | |
| CN219225476U (en) | Industrial computer with quick heat dissipation structure | |
| CN111857270A (en) | Device beneficial to heat dissipation of computer | |
| CN112333975B (en) | Heat exchanger and heat exchange structure of internal device of outdoor equipment | |
| CN218497442U (en) | Case with dustproof cooling function and industrial personal computer | |
| CN215872539U (en) | Heat dissipation module and electronic product with same | |
| CN216958195U (en) | Balanced heat dissipation equipment of battery module | |
| CN213093708U (en) | Distribution box overheat protection structure | |
| CN218974863U (en) | Immersed liquid cooling all-in-one machine | |
| CN217085649U (en) | Water-cooled casing for computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |