CN209842505U - Big data server with good heat dissipation performance - Google Patents
Big data server with good heat dissipation performance Download PDFInfo
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- CN209842505U CN209842505U CN201920876526.4U CN201920876526U CN209842505U CN 209842505 U CN209842505 U CN 209842505U CN 201920876526 U CN201920876526 U CN 201920876526U CN 209842505 U CN209842505 U CN 209842505U
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- heat dissipation
- heat
- water
- server
- big data
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Abstract
The utility model discloses a good heat dissipation's big data server, including the server shell, the fixed a plurality of baffle that is equipped with of inside wall of server shell, and the inside of a plurality of baffle all imbeds and installs the heat conduction post, and a plurality of heat conduction post all extend to the baffle outside and with the lateral wall fixed connection of heat pipe, the one end of heat pipe is linked together with the one end of outlet pipe, the other end of outlet pipe links to each other with the delivery port of water pump. The inside water liquid of water tank is extracted through the inlet tube after the start-up water pump, water liquid flows in the cooling tube through the outlet pipe, the heat that equipment in the server shell produced when the operation passes through the leading-in heat conduction post of baffle simultaneously, lead to the cooling tube in with the heat by the heat conduction post, thereby taken away the heat by flowing water liquid, radiating effect has been reached, utilize heat dissipation fan b simultaneously can discharge the heat fast, realize forced air cooling and the synchronous heat dissipation of water-cooling, very big improvement server operation efficiency and life.
Description
Technical Field
The utility model relates to a server technical field specifically is a good heat dissipation's big data server.
Background
Servers, also known as servers, are devices that provide computing services. Since a server needs to respond to and process a service request, the server generally has a capability of supporting and securing a service, and the server includes a processor, a hard disk, a memory, a system bus, and the like, and is similar to a general computer architecture, but needs to provide a highly reliable service, and thus has high requirements for processing capability, stability, reliability, security, extensibility, manageability, and the like.
However, existing servers have some drawbacks. For example, a large amount of data operation processes are required during operation of the existing server, so that a large amount of heat is easily generated, and once the heat is not dissipated in time, the temperature of the server is increased, and the operation and the service life are affected. Therefore, we propose a large data server with good heat dissipation.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a good heat dissipation's big data server, through the water tank, a water pump, the outlet pipe, the cooperation of cooling tube and heat conduction post is used, extract the inside water liquid of water tank through the inlet tube after the start-up water pump, water liquid flows in the cooling tube through the outlet pipe, the heat that equipment in the server shell produced when the operation passes through the leading-in heat conduction post of baffle simultaneously, lead to the cooling tube in with the heat by the heat conduction post, thereby taken away the heat by mobile water liquid, radiating effect has been reached, utilize heat dissipation fan b can discharge the heat fast simultaneously, realize forced air cooling and water-cooling synchronous heat dissipation, very big improvement server operation efficiency and life, the problem of proposing in the background art has been solved.
In order to achieve the above object, the utility model provides a following technical scheme: a big data server with good heat dissipation performance comprises a server shell, wherein a plurality of partition plates are fixedly arranged on the inner side wall of the server shell, heat conduction columns are embedded into the partitions and extend to the outer sides of the partitions and are fixedly connected with the outer side walls of the heat conduction tubes, one ends of the heat conduction tubes are communicated with one ends of water outlet pipes, the other ends of the water outlet pipes are connected with water outlets of water pumps, water inlets of the water pumps are connected with one ends of water inlet pipes, the other ends of the water inlet pipes are communicated with the inside of a water tank, heat conduction plates are fixedly arranged on the inner side wall of the water tank, two semiconductor refrigeration sheets are fixedly arranged on the lower surfaces of the heat conduction plates, heat dissipation fans a are fixedly arranged on the lower surfaces of the semiconductor refrigeration sheets, the other ends of the heat conduction tubes penetrate through the server shell and are communicated with the inside, and fixed heat dissipation fan b of establishing on the fixed plate, the front of server shell is equipped with four at least ventilation net b, water pump, semiconductor refrigeration piece, heat dissipation fan an and heat dissipation fan b respectively with external power supply electric connection.
As a preferred embodiment of the present invention, the heat conducting pipe is a serpentine shape.
As a preferred embodiment of the present invention, a ventilation net a is embedded in both the front and the back of the bottom of the water tank.
As a preferred embodiment of the present invention, the back surface of the heat dissipation fan b is provided with a protective net.
As a preferred embodiment of the present invention, the server housing is provided with a dust-proof cover at a position corresponding to the ventilation net b.
As a preferred embodiment of the present invention, the model of the water pump is specifically DC40H, the model of the semiconductor cooling plate is specifically TEC2-19008, and the model of the heat dissipation fan a and the heat dissipation fan b is specifically WDF 22060.
Compared with the prior art, the beneficial effects of the utility model are as follows:
through the water tank, a water pump, the outlet pipe, the cooperation of cooling tube and heat conduction post is used, through the inside water liquid of inlet tube extraction water tank behind the start-up water pump, water liquid flows in the cooling tube through the outlet pipe, the heat that equipment in the server shell produced when the operation passes through the leading-in heat conduction post of baffle simultaneously, lead to the cooling tube in with the heat by the heat conduction post, thereby taken away the heat by flowing water liquid, radiating effect has been reached, utilize heat dissipation fan b can be fast with heat discharge simultaneously, realize forced air cooling and water-cooling synchronous heat dissipation, very big improvement server operation efficiency and life.
Through the cooperation use of heat-conducting plate, semiconductor refrigeration piece and heat dissipation fan a, water liquid has certain temperature behind the backward flow to improve the temperature of the inside water liquid of water tank, after circular telegram the semiconductor refrigeration piece this moment, the temperature of the inside water liquid of water tank is derived to the heat-conducting plate, rely on the refrigeration effect of semiconductor refrigeration piece to keep the inside temperature of water tank, be convenient for to the inside water-cooling effect that lasts of server shell, the setting of heat dissipation fan an is convenient for dispel the heat to the semiconductor refrigeration piece.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic diagram of an internal structure of a big data server with good heat dissipation performance according to the present invention;
fig. 2 is a schematic structural diagram of the big data server with good heat dissipation performance after the heat dissipation fan b of the utility model is installed;
fig. 3 is a schematic front view of the big data server with good heat dissipation performance;
fig. 4 is a schematic diagram of the internal structure of the water tank of the big data server with good heat dissipation performance;
FIG. 5 is a schematic diagram of a top view cross-sectional structure of a partition board of a big data server with good heat dissipation performance according to the present invention;
fig. 6 is the utility model discloses good heat dissipation's big data server's heat conduction post and heat pipe connection structure sketch map.
In the figure: the server comprises a server shell 1, a partition plate 2, a heat conduction column 3, a heat conduction pipe 4, a water outlet pipe 5, a water pump 6, a water inlet pipe 7, a water tank 8, a heat conduction plate 9, a semiconductor refrigeration sheet 10, a heat dissipation fan a, a ventilation net a12, a water inlet 13, a fixing plate 14, a protection net 15, a heat dissipation fan b16, a ventilation net b17 and a dust separation cover 18.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1-6, the present invention provides a technical solution: a big data server with good heat dissipation performance comprises a server shell 1, wherein a plurality of partition plates 2 are fixedly arranged on the inner side wall of the server shell 1, heat-conducting columns 3 are embedded in the partition plates 2, the heat-conducting columns 3 extend to the outer sides of the partition plates 2 and are fixedly connected with the outer side wall of a heat-conducting pipe 4, one end of the heat-conducting pipe 4 is communicated with one end of a water outlet pipe 5, the other end of the water outlet pipe 5 is connected with a water outlet of a water pump 6, a water inlet 13 of the water pump 6 is connected with one end of a water inlet pipe 7, the other end of the water inlet pipe 7 is communicated with the inside of a water tank 8, a heat-conducting plate 9 is fixedly arranged on the inner side wall of the water tank 8, two semiconductor refrigeration sheets 10 are fixedly arranged on the lower surface of the heat-conducting plate 9, a heat-dissipating, the inside wall of server shell 1 is fixed and is equipped with horizontal vertical connection's fixed plate 14, and fixed the heat dissipation fan b16 of establishing on the fixed plate 14, and the front of server shell 1 is equipped with four at least ventilation net b17, and water pump 6, semiconductor refrigeration piece 10, heat dissipation fan a11 and heat dissipation fan b16 are respectively with external power supply electric connection.
In this embodiment (please refer to fig. 1), the heat pipe 4 is in a serpentine shape, and the heat pipe 4 is in a serpentine shape, so that the heat pipe 4 connects the plurality of partition plates 2, and the water can flow circularly.
In this embodiment (see fig. 1), the front and the back of the bottom of the water tank 8 are embedded with the ventilation net a12, and the ventilation net a12 is arranged, so that air can enter the bottom of the water tank 8 conveniently, and the heat dissipation effect of the heat dissipation fan a11 is improved.
In this embodiment (see fig. 2), the protective net 15 is installed on the back of the heat dissipation fan b16, and the arrangement of the protective net 15 prevents wires on the devices in the server housing 1 from contacting the heat dissipation fan b16, thereby reducing the occurrence of potential safety hazards.
In this embodiment (please refer to fig. 4), the water inlet 13 is disposed on the upper surface of the water tank 8, and the water inlet 13 is disposed, so that people can heat water in the water tank 8 conveniently, and the water in the water tank 8 is prevented from being evaporated to reduce the water amount.
In this embodiment (please refer to fig. 3), the dust-proof cover 18 is fixedly disposed at a position corresponding to the ventilation net b17 on the front surface of the server casing 1, and the dust is prevented from entering the server casing 1 through the ventilation net b17 by the arrangement of the dust-proof cover 18.
It should be noted that the present invention relates to a big data server with good heat dissipation, which comprises a server housing 1, a partition plate 2, a heat conducting column 3, a heat conducting pipe 4, a water outlet pipe 5, a water pump 6, a water inlet pipe 7, a water tank 8, a heat conducting plate 9, a semiconductor refrigerating sheet 10, a heat dissipating fan 11, a ventilating net 12, a water inlet 13, a fixing plate 14, a protecting net 15, a heat dissipating fan 16, a ventilating net 17, and a dust isolating cover 18, wherein the components are all universal standard components or components known by those skilled in the art, the structure and principle of the components are all known by the technical manual or by the conventional test method, when a big data server with good heat dissipation is used, the water pump 6 is started to extract the water inside the water tank 8 through the water inlet pipe 7, the water flows in the heat dissipating pipe through the water outlet pipe 5, and the heat generated by the equipment in the server housing 1 during operation is guided into the heat conducting, by the heat conduction post 3 with the heat conduction to the cooling tube in, thereby taken away the heat by flowing water liquid, radiating effect has been reached, utilize heat dissipation fan b16 can discharge the heat fast simultaneously, realize forced air cooling and the synchronous heat dissipation of water-cooling, very big improvement server operation efficiency and life, water liquid has certain temperature after the backward flow, thereby improve the temperature of the inside water liquid of water tank 8, after circular telegram semiconductor refrigeration piece 10 this moment, the temperature of the inside water liquid of heat-conducting plate 9 derivation water tank 8, rely on the refrigeration effect of semiconductor refrigeration piece 10 to keep the inside temperature of water tank 8, be convenient for to last water-cooling effect to server shell 1 inside.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A big data server with good heat dissipation performance comprises a server shell (1) and is characterized in that: the server shell comprises a server shell (1), wherein a plurality of clapboards (2) are fixedly arranged on the inner side wall of the server shell (1), heat conducting columns (3) are embedded into the clapboards (2), the heat conducting columns (3) extend to the outer sides of the clapboards (2) and are fixedly connected with the outer side wall of the heat conducting pipes (4), one ends of the heat conducting pipes (4) are communicated with one ends of water outlet pipes (5), the other ends of the water outlet pipes (5) are connected with a water outlet of a water pump (6), a water inlet (13) of the water pump (6) is connected with one end of a water inlet pipe (7), the other end of the water inlet pipe (7) is communicated with the inside of a water tank (8), a heat conducting plate (9) is fixedly arranged on the inner side wall of the water tank (8), two semiconductor refrigerating sheets (10) are fixedly arranged on the lower surface of the heat conducting plate (9), the other end of heat pipe (4) passes server shell (1) and is linked together with water tank (8) inside, the fixed plate (14) of violently indulging the connection that is equipped with of inside wall of server shell (1), and fixed heat dissipation fan b (16) of establishing on fixed plate (14), the front of server shell (1) is equipped with four at least ventilation net b (17), water pump (6), semiconductor refrigeration piece (10), heat dissipation fan a (11) and heat dissipation fan b (16) respectively with external power supply electric connection.
2. The big data server with good heat dissipation performance of claim 1, wherein: the heat conduction pipe (4) is in a snake-shaped bent shape.
3. The big data server with good heat dissipation performance of claim 1, wherein: and ventilation nets a (12) are embedded in the front and the back of the bottom of the water tank (8).
4. The big data server with good heat dissipation performance of claim 1, wherein: and a protective net (15) is arranged on the back surface of the heat dissipation fan b (16).
5. The big data server with good heat dissipation performance of claim 1, wherein: and a water inlet (13) is formed in the upper surface of the water tank (8).
6. The big data server with good heat dissipation performance of claim 1, wherein: and the front surface of the server shell (1) is fixedly provided with a dust separation cover (18) at a position corresponding to the ventilation net b (17).
7. The big data server with good heat dissipation performance of claim 1, wherein: the type of the water pump (6) is DC40H, the type of the semiconductor refrigeration sheet (10) is TEC2-19008, and the types of the heat dissipation fan a (11) and the heat dissipation fan b (16) are WDF 22060.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920876526.4U CN209842505U (en) | 2019-06-12 | 2019-06-12 | Big data server with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920876526.4U CN209842505U (en) | 2019-06-12 | 2019-06-12 | Big data server with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209842505U true CN209842505U (en) | 2019-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920876526.4U Expired - Fee Related CN209842505U (en) | 2019-06-12 | 2019-06-12 | Big data server with good heat dissipation performance |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113328174A (en) * | 2021-08-04 | 2021-08-31 | 南通裕荣电子商务有限公司 | Machine room power supply support system for internet data center |
-
2019
- 2019-06-12 CN CN201920876526.4U patent/CN209842505U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113328174A (en) * | 2021-08-04 | 2021-08-31 | 南通裕荣电子商务有限公司 | Machine room power supply support system for internet data center |
| CN113328174B (en) * | 2021-08-04 | 2021-10-08 | 南通裕荣电子商务有限公司 | Machine room power supply support system for internet data center |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191224 Termination date: 20200612 |