CN218568801U

CN218568801U - Wafer gluing carrier

Info

Publication number: CN218568801U
Application number: CN202222461373.1U
Authority: CN
Inventors: 何正鸿; 张超; 李利; 陈泽
Original assignee: Yongsi Semiconductor Ningbo Co ltd
Current assignee: Yongsi Semiconductor Ningbo Co ltd
Priority date: 2022-09-16
Filing date: 2022-09-16
Publication date: 2023-03-03
Anticipated expiration: 2032-09-16

Abstract

The utility model discloses a wafer rubber coating carrier, wade wafer rubber coating carrier technical field, including place the platform, place the platform the centre has been seted up first vacuum hole, the second vacuum hole of annular array form is seted up to the periphery in first vacuum hole, place the platform's surface has been seted up fixed screw hole, place the platform's one end bilateral symmetry is provided with first locating piece and second locating piece, place the platform's the other end is provided with third locating piece and fourth locating piece, through designing first locating piece, the second locating piece, third locating piece and fourth locating piece splice with place the platform, thereby realize that wafer coating carrier satisfies the breach wafer or the operation of no breach wafer of different models, thereby promote the commonality of coating carrier, through designing a plurality of fixed screw holes, first screw hole 31 and second screw hole 41 positions, thereby realize adjusting different wafer sizes, satisfy the operation of different wafer size models, thereby promote the commonality of coating carrier.

Description

Wafer gluing carrier

Technical Field

The utility model belongs to the technical field of the wafer rubber coating carrier technique and specifically relates to a wafer rubber coating carrier is related to.

Background

With the development trend of very large scale integrated circuits, fan-out or fan-in wafer level packaging is adopted, and the packaging structure is widely applied to the semiconductor industry. At present, when a photoresist coating process is carried out on a wafer, a photoresist layer is formed on the surface of the wafer in a rotary spraying mode of a machine table, and after a pattern layer is formed on the photoresist layer through subsequent exposure and development, a circuit layer is formed on the pattern layer through an electroplating process.

Because wafers in the prior art are classified into two types (N/P type structures), the wafer gap is often used as the N type structure, and the wafer gap without the gap is used as the P type structure, however, the prior jig can not simultaneously satisfy two types of wafer operations, the operation of different operation jig platforms needs to be changed, and the prior wafer size is divided into multiple sizes (6 inches/8 inches/12 inches, etc.), so that the prior jig can not satisfy the simultaneous operation of multiple sizes.

SUMMERY OF THE UTILITY MODEL

In order to improve the above-mentioned problem, the utility model provides a wafer rubber coating carrier.

The utility model provides a wafer rubber coating carrier adopts following technical scheme:

the utility model provides a wafer rubber coating carrier, includes place the platform, place the platform's one end bilateral symmetry is provided with first locating piece and second locating piece, and place the platform's the other end is provided with third locating piece and fourth locating piece, and place the platform upper end and place jagged wafer or unnotched wafer, and the spraying has the photoresist on jagged wafer and the unnotched wafer.

Through adopting above-mentioned technical scheme, place first locating piece, second locating piece, third locating piece and fourth locating piece through fixed screw hole on the place the platform, place the breach wafer of different sizes or no breach wafer on the place the platform again after, when the fixed back of the breach wafer of different sizes or no breach wafer, rotatory place the platform and spout the photoetching glue, form the photoetching glue layer on breach wafer or no breach wafer surface, finally accomplish the spraying of wafer photoetching glue layer.

Optionally, a first vacuum hole is formed in the middle of the placing platform, second vacuum holes in an annular array shape are formed in the periphery of the first vacuum hole, and fixing screw holes are formed in the surface of the placing platform.

By adopting the technical scheme, the first vacuum hole and the second vacuum hole are mainly used for vacuum adsorption of the wafer.

Optionally, the first positioning block and the second positioning block have the same structure and are arranged in a fan-shaped structure.

By adopting the technical scheme, the first positioning block and the second positioning block are of fan-shaped structures, an inner wall arc and an outer wall arc are designed, the inner wall arc is in contact with the wafer, and the outer wall arc is the outer ring of the carrier structure.

Optionally, first screw holes are formed in the surfaces of the second positioning block and the first positioning block, and first sealing rings are arranged on the inner walls of the first screw holes.

Through adopting above-mentioned technical scheme, first screw hole is used for the fixed action, and first seal ring is used for covering sealedly, prevents that bottom vacuum air current gas leakage and glue liquid from getting into, avoids being used for the fixed screw and touches the problem that can't take out with glue liquid.

Optionally, the surfaces of the third positioning block and the fourth positioning block are provided with second screw holes, and the inner walls of the second screw holes are provided with second sealing rings.

Through adopting above-mentioned technical scheme, fixed screw hole, first screw hole and second screw hole all design 3, correspond the wafer that the size is 12 inches, 8 inches, 6 inches respectively, improve the commonality of carrier.

Optionally, the first positioning block, the second positioning block, the third positioning block and the fourth positioning block are all made of memory alloy.

By adopting the technical scheme, the memory alloy can be titanium-nickel alloy, gold-cadmium alloy, copper-zinc alloy and the like, so that edge radian bending deformation is realized, and the curvature of the memory alloy is adjusted to be matched and attached with the wafer radian.

To sum up, the utility model discloses a following at least one beneficial effect:

1. through designing first locating piece, second locating piece, third locating piece and fourth locating piece and placing platform concatenation to realize that wafer coating carrier satisfies the operation of the breach wafer of different models or unnotched wafer, thereby promote the commonality of coating carrier.

2. Through designing a plurality of fixed screw holes, first screw hole 31 and second screw hole 41 positions to the realization is adjusted different wafer sizes, satisfies the operation of different wafer size models, thereby promotes the commonality of coating carrier.

Drawings

Fig. 1 is a schematic structural view of the placing platform of the present invention;

FIG. 2 is a view of the notched wafer mounting structure of the present invention;

fig. 3 is a structural view of the installation of the unnotched wafer of the present invention;

FIG. 4 is a 12-inch wafer mounting structure of the present invention;

fig. 5 is an exploded view of the positioning block of the present invention.

Description of reference numerals:

1. placing a platform; 11. a first vacuum hole; 12. a second vacuum hole; 13. fixing screw holes; 2. a first positioning block; 3. a second positioning block; 31. a first screw hole; 32. a first seal ring; 4. a third positioning block; 41. a second screw hole; 42. a second seal ring; 5. a fourth positioning block; 6. photoresist; 7. a notched wafer; 8. a non-notched wafer.

Detailed Description

The present invention will be described in further detail with reference to fig. 1 to 5.

Referring to fig. 1-5, the present invention provides an embodiment: the utility model provides a wafer rubber coating carrier, including place platform 1, place platform 1's centre has been seted up first vacuum hole 11, annular array form second vacuum hole 12 has been seted up to first vacuum hole 11's periphery, first vacuum hole 11 and second vacuum hole 12 mainly used vacuum adsorption wafer, place platform 1's surface has been seted up fixed screw hole 13, fixed screw hole 13 sets up a plurality of positions, thereby realize different wafer size and adjust, satisfy different wafer size model operations (as size 12/8/6 cun), thereby promote the coating carrier commonality, (figure 2 and figure 3 are that 6 cun wafers are fixed, figure 4 is that 12 cun wafers are fixed).

The one end bilateral symmetry of place platform 1 is provided with first locating piece 2 and second locating piece 3, and first locating piece 2 is the same with 3 structures of second locating piece, and is fan-shaped structure setting, and first screw hole 31 has all been seted up on the surface of second locating piece 3 and first locating piece 2, and the inner wall of first screw hole 31 all is provided with first seal ring 32.

First locating piece 2 and the design of second locating piece 3 have inner wall arc and outer wall arc, its inner wall arc and wafer contact, the outer wall arc is the carrier structure outer lane, its surface design has the first screw hole 31 corresponding with fixed screw hole 13 and the inside first seal ring 32 that sets up of first screw hole 31, its first screw hole 31 is used for the fixed action, first seal ring 32 is used for covering sealedly, prevent bottom vacuum air current gas leakage and glue liquid entering, avoid being used for fixed screw and the problem that the contact of glue liquid can't take out.

The other end of the placing platform 1 is provided with a third positioning block 4 and a fourth positioning block 5, second screw holes 41 are formed in the surfaces of the third positioning block 4 and the fourth positioning block 5, second sealing ring rings 42 are arranged on the inner walls of the second screw holes 41, and the first positioning block 2, the second positioning block 3, the third positioning block 4 and the fourth positioning block 5 are made of memory alloy, such as titanium-nickel alloy, gold-cadmium alloy, copper-zinc alloy and the like, so that edge radian bending deformation is achieved, and the curvature of the edge is adjusted to be matched with the wafer radian in a fitting mode. The upper end of the placing platform 1 is placed with a notch wafer 7 or an unnotched wafer 8, the notch wafer 7 and the unnotched wafer 8 are sprayed with photoresist 6, and the glue liquid is the photoresist 6.

The number of the fixing screw holes 13, the number of the first screw holes 31 and the number of the second screw holes 41 are 3, and the fixing screw holes correspond to 12-inch, 8-inch and 6-inch wafers respectively, so that the universality of the carrier is improved. The third positioning block 4 and the fourth positioning block 5 complete a splicing structure, and the direction of the gap of the third positioning block 4 is consistent with that of the gap wafer 7, so that the gap wafer 7 is positioned, the redundant area of the gap wafer 7 is covered by the third positioning block 4, and the situation that a glue layer enters a gap between a carrier and the wafer when the photoresist 6 is coated is avoided, so that the photoresist 6 on the side wall of the wafer is prevented from being remained as far as possible, and defects are generated in the subsequent electroplating process.

The fourth positioning block 5 is used for placing the third positioning block 4, when the unnotched wafer 8 is worked, the third positioning block 4 can be disassembled (or the third positioning block 4 is not placed), the requirements of the unnotched wafer 8 and the notched wafer 7 are met, and the two wafers are worked by one set of jig.

The working principle is as follows: placing a first positioning block 2, a second positioning block 3, a third positioning block 4 and a fourth positioning block 5 on a placing platform 1 through a fixing screw hole 13, then placing notch wafers 7 or unnotched wafers 8 of different sizes on the placing platform 1 again, starting adsorption vacuum by a machine table at the moment, adsorbing the wafers from a first vacuum hole 11 and a second vacuum hole 12 on the placing platform 1, rotating the placing platform 1 again to spray photoresist 6, forming a photoresist layer on the surfaces of the notch wafers 7 or the unnotched wafers 8, and finally finishing the spraying of the wafer photoresist layer.

Above is the preferred embodiment of the utility model, not limit according to this the utility model discloses a protection scope, the event: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. The utility model provides a wafer rubber coating carrier, includes place the platform (1), its characterized in that: the wafer placing device is characterized in that a first positioning block (2) and a second positioning block (3) are symmetrically arranged on two sides of one end of the placing platform (1), a third positioning block (4) and a fourth positioning block (5) are arranged on the other end of the placing platform (1), a notched wafer (7) or a non-notched wafer (8) is placed on the upper end of the placing platform (1), and photoresist (6) is sprayed on the notched wafer (7) and the non-notched wafer (8).

2. The wafer gluing carrier of claim 1, wherein: first vacuum hole (11) have been seted up in the centre of place the platform (1), and annular array form second vacuum hole (12) have been seted up to the periphery of first vacuum hole (11), and fixed screw hole (13) have been seted up on the surface of place the platform (1).

3. The wafer gluing carrier of claim 1, wherein: the first positioning block (2) and the second positioning block (3) are identical in structure and are arranged in a fan-shaped structure.

4. The wafer gluing carrier of claim 1, wherein: first screw hole (31) have all been seted up on the surface of second locating piece (3) and first locating piece (2), and the inner wall of first screw hole (31) all is provided with first seal ring (32).

5. The wafer gluing carrier of claim 1, wherein: and second screw holes (41) are formed in the surfaces of the third positioning block (4) and the fourth positioning block (5), and second sealing ring rings (42) are arranged on the inner walls of the second screw holes (41).

6. The wafer gluing carrier of claim 1, wherein: the first positioning block (2), the second positioning block (3), the third positioning block (4) and the fourth positioning block (5) are all made of memory alloy.