CN218568783U - Semi-etching device for lead frame of integrated circuit - Google Patents
Semi-etching device for lead frame of integrated circuit Download PDFInfo
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- CN218568783U CN218568783U CN202222361287.3U CN202222361287U CN218568783U CN 218568783 U CN218568783 U CN 218568783U CN 202222361287 U CN202222361287 U CN 202222361287U CN 218568783 U CN218568783 U CN 218568783U
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Abstract
The utility model discloses a half etching device of integrated circuit lead frame, concretely relates to semiconductor processing technology field to lead frame when chemical etching, owing to adopt the dry film development mode to carry out the protection of part region, the problem that the off normal or developing excessively or developing is not clean easily appears leads to the bad problem of the outer pin etching of product, now proposes following scheme, and it includes the support frame, the cross-section of support frame is the setting of U type, the top fixed mounting of support frame has a supporting box, there is the hollow tube top horizontal segment bottom of support frame through cylinder fixed mounting, install a plurality of shower nozzles that are array distribution on the hollow tube, set up the drainage subassembly between supporting box and the hollow tube, vertical section one side fixed mounting of support frame has spacing, the cross-section of spacing is the setting of U type. The utility model discloses novel structure has improved chemical etching's efficiency and effect, suitable popularization.
Description
Technical Field
The utility model relates to a semiconductor processing technology field especially relates to a half etching device of integrated circuit lead frame.
Background
The lead frame is a chip carrier of an integrated circuit, and is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical circuit. The production of the lead frame requires selecting a copper base plate, washing the surface for dust removal, coating an oil film or pressing a film on the copper material, transferring the lead frame to be etched on a film to a base material through photopolymerization reaction, etching the copper material by etching liquid for an etching machine after development, protecting the copper material by a photosensitive oil film or a dry film, performing corrosion forming on circuits and graphs of the lead frame, and finally removing ink on the copper material by an ink remover.
When the lead frame is subjected to chemical etching, due to the fact that a dry film developing mode is adopted for carrying out partial region protection, the problems of exposure deviation, excessive development or incomplete development are prone to occurring, and etching failure of outer pins of products is caused. Therefore, in order to solve such problems, we propose an integrated circuit lead frame half-etching apparatus.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pair of half etching device of integrated circuit lead frame has solved the lead frame when chemical etching, owing to adopt the dry film development mode to carry out the protection of part region, easily appears exposing off normal or develop excessive or develop unclean problem, leads to the bad problem of the outer pin etching of product.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a half etching device of integrated circuit lead frame, includes the support frame, the cross-section of support frame is the setting of U type, the top fixed mounting of support frame has a supporting box, there is the hollow tube top horizontal segment bottom of support frame through cylinder fixed mounting, install a plurality of shower nozzles that are array distribution on the hollow tube, set up the drainage subassembly between supporting box and the hollow tube, vertical section one side fixed mounting of support frame has spacing, spacing cross-section is the setting of U type, fixed mounting has two support columns that are the symmetry and set up, two between spacing both sides in opposite directions slide between the support column and cup joint two sliders that are the symmetry and set up, be provided with the drive assembly that the drive slider removed on the spacing, be located the top the one end fixed mounting that spacing was kept away from to the slider has the carrier, is located the below the one end fixed mounting that spacing was kept away from to the slider has the carrier block, the top of carrier block is seted up flutedly, be provided with the buffering subassembly in the recess of carrier block.
The lead frame that will treat the etching prevents in the recess of carrier block, and servo motor passes through the screw rod and drives two sliders motion in opposite directions, and carrier block and bearing frame carry out centering clamping movement, and the etching liquid suction hollow tube in will supporting box of drainage subassembly is sprayed through the shower nozzle after that, etches the lead frame, and the region that the dry film developed has been replaced to the shape of apron.
Preferably, the drainage component comprises a pump body, the pump body is fixedly installed at the top end of the support frame, an input port of the pump body is communicated with the support box through a hose, an output port of the pump body is communicated with the hollow pipe through a hose, and the pump body has a driving effect on liquid.
Preferably, one side fixed surface of supporting box installs the PLC controller, the pump body is electric connection with the PLC controller, has the regulation and control effect.
Preferably, drive assembly includes the screw rod, the screw rod rotates to be installed between spacing both sides in opposite directions, be provided with two sections on the screw rod and revolve to opposite and the same screw thread of pitch, two slider and two sections screw thread phase-matchs, spacing top fixed mounting has servo motor, servo motor's output shaft is fixed connection through shaft coupling and screw rod, servo motor is electric connection with the PLC controller, two spouts that are the symmetry and set up are seted up to spacing vertical section, the body of rod slidable mounting of slider is in the spout, and servo motor has the drive action to the screw rod.
Preferably, the cross-section of bearing the frame is "mouth" style of calligraphy setting, the inner wall fixed mounting who bears the frame has the apron, bear the frame and all be attached to the sealed pad with one side that bears the weight of the piece in opposite directions, the apron has the etching prevention effect, and sealed pad has a sealing function.
Preferably, the buffering subassembly includes a plurality of springs, and is a plurality of spring fixed mounting is in the recess of carrier block, and is a plurality of the spring is the array distribution, slidable mounting has the backup pad in the recess of carrier block, and is a plurality of the spring all is fixed connection with the backup pad, and spring cooperation backup pad has the cushioning effect.
Preferably, the holding tank has been seted up on the bottom horizontal segment top of support frame, the bottom fixed mounting of support frame has the fluid-discharge tube that is the intercommunication setting with the holding tank, and the holding tank has the effect of holding to the etching solution, and the fluid-discharge tube has the drainage effect.
The utility model has the advantages that:
through the installation to support frame and spacing, the lead frame that will treat the etching is placed in the recess of carrier block, and servo motor passes through the screw rod and drives two sliders motion in opposite directions, and carrier block and bearing frame carry out centering clamping movement, and the apron laminates with the lead frame, and the pump body will support the etching liquid suction hollow tube of incasement after that, sprays through the shower nozzle, etches the lead frame, and the region that the dry film developed has been replaced to the shape of apron, has improved chemical etching's efficiency and effect.
To sum up, the utility model provides high chemical etching's efficiency and effect has solved the lead frame when chemical etching, owing to adopt the dry film development mode to carry out the protection of part region, the easy exposure off normal or the developing problem excessively or that develop not clean that appears leads to the bad problem of the outer pin etching of product, suitable popularization.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a side view of the present invention;
FIG. 3 is a view showing the installation structure of the screw rod of the present invention;
FIG. 4 is a view showing an installation structure of the loading frame of the present invention;
fig. 5 is a mounting structure diagram of the bearing block of the present invention.
The reference numbers in the figures: 1. a support frame; 2. a support box; 3. a hollow tube; 4. a spray head; 5. a pump body; 6. a PLC controller; 7. a limiting frame; 8. a support pillar; 9. a slider; 10. a screw; 11. a servo motor; 12. a chute; 13. a carrier; 14. a cover plate; 15. a bearing block; 16. a spring; 17. a support plate; 18. accommodating a tank; 19. and a liquid discharge pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1 and 2, the utility model provides an integrated circuit lead frame half etching device, including support frame 1, the cross-section of support frame 1 is the setting of U type, top fixed mounting at support frame 1 has supporting box 2, it holds the effect to have a support, there is hollow tube 3 at support frame 1's top horizontal segment bottom through cylinder fixed mounting, it holds the effect to have, install a plurality of shower nozzles 4 that are the array distribution on hollow tube 3, the injection effect has, set up the drainage subassembly between supporting box 2 and the hollow tube 3, the drainage subassembly includes the pump body 5, with the top of pump body 5 fixed mounting in support frame 1, the input port of the pump body 5 is the intercommunication setting through hose and supporting box 2, the delivery outlet of the pump body 5 is the intercommunication setting through hose and hollow tube 3, the drive effect to liquid has, one side fixed surface installs PLC controller 6 at supporting box 2, the pump body 5 is electric connection with PLC controller 6, the regulation and control effect has.
Referring to fig. 1-3, a limiting frame 7 is fixedly mounted on one side of a vertical section of a support frame 1, the cross section of the limiting frame 7 is in a U-shaped arrangement and has a supporting effect, two symmetrically arranged support columns 8 are fixedly mounted between two opposite sides of the limiting frame 7 and have a supporting effect, two symmetrically arranged sliders 9 are slidably sleeved between the two support columns 8 and have a supporting effect, a driving assembly for driving the sliders 9 to move is arranged on the limiting frame 7 and comprises a screw 10, the screw 10 is rotatably mounted between the two opposite sides of the limiting frame 7, two threads with opposite rotation directions and the same thread pitch are arranged on the screw 10, the two sliders 9 are matched with the two threads and have a transmission effect, a servo motor 11 is fixedly mounted at the top end of the limiting frame 7, an output shaft of the servo motor 11 is fixedly connected with the screw 10 through a coupler, the servo motor 11 is electrically connected with a PLC controller 6 and has a function of driving the screw 10 to rotate, two symmetrically arranged slide grooves 12 are formed in the vertical section of the limiting frame 7, and a rod body of the sliders 9 is slidably mounted in the slide grooves 12 and has a limiting effect.
Referring to fig. 1-5, a bearing frame 13 is fixedly installed at one end, far away from a limiting frame 7, of a slider 9 located above the bearing frame 13, the cross section of the bearing frame 13 is arranged in a shape like a Chinese character 'kou', the bearing frame has a bearing effect, a cover plate 14 is fixedly installed at the inner wall of the bearing frame 13, the bearing frame has a regional protection effect, a bearing block 15 is fixedly installed at one end, far away from the limiting frame 7, of the slider 9 located below the bearing frame, the bearing block has a limiting effect, a sealing gasket is attached to one side, facing to the bearing block 13 and the bearing block 15, and has a sealing effect, a groove is formed in the top end of the bearing block 15 and has a containing effect, a buffer assembly is arranged in the groove of the bearing block 15 and comprises springs 16, the springs 16 are fixedly installed in the groove of the bearing block 15, the springs 16 are distributed in an array and have an elastic supporting effect, a supporting plate 17 is slidably installed in the groove of the bearing block 15, the springs 16 are fixedly connected with the supporting plate 17 and have a buffer effect, an accommodating groove 18 is formed in the bottom horizontal section of the supporting frame 1 and has a drainage effect.
The working principle is as follows: the utility model discloses when using, at first the lead frame that will treat the etching is placed in the recess of carrier block 15, through PLC controller 6, 11 drive screw 10 of servo motor rotate, drive two sliders 9 relative motion on support column 8, carrier block 15 and carrier block 13 carry out centering clamping movement, apron 14 and lead frame laminating, spring 16 cooperation backup pad 17 has the cushioning effect to the lead frame, the pump body 5 will support etching solution suction hollow tube 3 in the case 2 after that, spray through shower nozzle 4, etch the lead frame, the region that the dry film developed has been replaced to the shape of apron 14, etching solution falls into holding tank 18 and discharges through fluid-discharge tube 19.
The above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A semi-etching device for an integrated circuit lead frame comprises a support frame (1), it is characterized in that the section of the supporting frame (1) is arranged in a U shape, the top end of the supporting frame (1) is fixedly provided with a supporting box (2), the bottom end of the top horizontal section of the supporting frame (1) is fixedly provided with a hollow pipe (3) through a cylinder, a plurality of spray heads (4) distributed in an array are arranged on the hollow pipe (3), a drainage component is arranged between the supporting box (2) and the hollow pipe (3), a limiting frame (7) is fixedly arranged on one side of the vertical section of the supporting frame (1), the cross section of the limiting frame (7) is arranged in a U shape, two symmetrically arranged supporting columns (8) are fixedly arranged between two opposite sides of the limiting frame (7), two symmetrically arranged sliding blocks (9) are sleeved between the two supporting columns (8) in a sliding way, a driving component for driving the sliding block (9) to move is arranged on the limiting frame (7), a bearing frame (13) is fixedly arranged at one end of the sliding block (9) which is positioned above and far away from the limiting frame (7), a cover plate (14) is fixedly arranged on the inner wall of the bearing frame (13), a bearing block (15) is fixedly arranged at one end of the sliding block (9) which is positioned at the lower part and is far away from the limiting frame (7), the top end of the bearing block (15) is provided with a groove, and a buffer component is arranged in the groove of the bearing block (15).
2. The integrated circuit lead frame half-etching device according to claim 1, wherein the drainage assembly comprises a pump body (5), the pump body (5) is fixedly mounted at the top end of the support frame (1), an input port of the pump body (5) is communicated with the support box (2) through a hose, and an output port of the pump body (5) is communicated with the hollow tube (3) through a hose.
3. The integrated circuit lead frame half-etching device according to claim 2, wherein a PLC (programmable logic controller) is fixedly installed on one side surface of the supporting box (2), and the pump body (5) is electrically connected with the PLC (6).
4. The integrated circuit lead frame half-etching device according to claim 3, wherein the driving assembly comprises a screw (10), the screw (10) is rotatably installed between two opposite sides of the limiting frame (7), two threads with opposite rotation directions and the same thread pitch are arranged on the screw (10), two sliders (9) are matched with the two threads, a servo motor (11) is fixedly installed at the top end of the limiting frame (7), an output shaft of the servo motor (11) is fixedly connected with the screw (10) through a coupler, the servo motor (11) is electrically connected with the PLC (6), two symmetrically-arranged sliding grooves (12) are formed in a vertical section of the limiting frame (7), and a rod body of each slider (9) is slidably installed in the corresponding sliding groove (12).
5. The apparatus for half-etching of lead frames for integrated circuits according to claim 1, wherein the cross-section of the carrier (13) is square, and a sealing pad is attached to the side of the carrier (13) opposite to the side of the carrier block (15).
6. The integrated circuit lead frame half-etching device according to claim 1, wherein the buffer assembly comprises a plurality of springs (16), the plurality of springs (16) are fixedly arranged in a groove of a bearing block (15), the plurality of springs (16) are distributed in an array, a support plate (17) is slidably arranged in the groove of the bearing block (15), and the plurality of springs (16) are fixedly connected with the support plate (17).
7. The integrated circuit lead frame half-etching device as claimed in claim 1, wherein the supporting frame (1) has a holding groove (18) at the top of the bottom horizontal section, and a drain pipe (19) communicated with the holding groove (18) is fixedly installed at the bottom of the supporting frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222361287.3U CN218568783U (en) | 2022-09-05 | 2022-09-05 | Semi-etching device for lead frame of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222361287.3U CN218568783U (en) | 2022-09-05 | 2022-09-05 | Semi-etching device for lead frame of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218568783U true CN218568783U (en) | 2023-03-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222361287.3U Active CN218568783U (en) | 2022-09-05 | 2022-09-05 | Semi-etching device for lead frame of integrated circuit |
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| CN (1) | CN218568783U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117747437A (en) * | 2023-11-20 | 2024-03-22 | 天水华洋电子科技股份有限公司 | Coarsening treatment process for integrated circuit stamping lead frame |
| CN117747437B (en) * | 2023-11-20 | 2024-06-07 | 天水华洋电子科技股份有限公司 | Coarsening treatment process for integrated circuit stamping lead frame |
-
2022
- 2022-09-05 CN CN202222361287.3U patent/CN218568783U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117747437A (en) * | 2023-11-20 | 2024-03-22 | 天水华洋电子科技股份有限公司 | Coarsening treatment process for integrated circuit stamping lead frame |
| CN117747437B (en) * | 2023-11-20 | 2024-06-07 | 天水华洋电子科技股份有限公司 | Coarsening treatment process for integrated circuit stamping lead frame |
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