CN219107847U - Multilayer circuit board etching device - Google Patents
Multilayer circuit board etching device Download PDFInfo
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- CN219107847U CN219107847U CN202223516432.7U CN202223516432U CN219107847U CN 219107847 U CN219107847 U CN 219107847U CN 202223516432 U CN202223516432 U CN 202223516432U CN 219107847 U CN219107847 U CN 219107847U
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- circuit board
- etching
- multilayer circuit
- cleaning
- plate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a multilayer circuit board etching device which comprises a mounting bracket, wherein an electric roller is arranged in the mounting bracket, a protective shell is fixedly arranged at the top of the mounting bracket, a lifting assembly is arranged on the surface of the protective shell, an etching nozzle is fixedly arranged in the protective shell through the lifting assembly, and a moving assembly is arranged on the surface of the protective shell. The cleaning component is pushed by the moving component and the bottom plate to contact with the multilayer circuit board, the surface of the multilayer circuit board is cleaned, and after the cleaning is finished, the cleaning component is conveyed out through the electric roller, so that the aim of cleaning the surface of the multilayer circuit board after the etching of the multilayer circuit board is fulfilled, the condition that the residual medicament causes further side etching to the circuit board due to unified cleaning after the etching of the circuit board is avoided, and the condition that the side etching is reduced only in a spraying mode and cannot cause the side etching of the circuit board is avoided fundamentally.
Description
Technical Field
The utility model relates to the technical field of multilayer circuit board production, in particular to a multilayer circuit board etching device.
Background
Etching is a technique in which material is removed using a chemical reaction or physical impact. Etching techniques can be divided into two types, wet etching and dry etching; in the printed multilayer circuit board manufacturing process, the etching process occupies a very heavy place. Along with the development of miniaturization and multiple functions of electronic products, the design density of the printed multilayer circuit board is higher, the lead wires are thinner, the aperture is smaller, and the processing difficulty is continuously increased. In the prior art, in the etching process, the multi-layer circuit board is often subjected to etching treatment, and then is subjected to cleaning treatment after the etching is finished, and in the etching process, the side etching condition of the medicament is often reduced by a spraying mode.
When the side etching condition of the circuit board is generated, the side etching condition is usually related to the etching time of the medicament, the medicament is uniformly cleaned after the circuit board is etched, so that the residual medicament is easy to cause further side etching to the circuit board, the side etching is reduced only by a spraying mode, and the side etching condition of the circuit board cannot be fundamentally solved
Disclosure of Invention
In view of the shortcomings of the prior art, the present utility model provides a multi-layer circuit board etching device for solving the problems set forth in the background art.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a multilayer circuit board etching device, includes the installing support, the inside electronic roller that is provided with of installing support, the fixed protective housing that is provided with in installing support top, the protective housing surface is provided with lifting unit, the inside etching nozzle that is provided with through lifting unit of protective housing, the protective housing surface is provided with movable subassembly, the inside bottom plate that is provided with through movable subassembly of protective housing, the bottom plate bottom is provided with the cleaning module that is convenient for carry out abluent after multilayer circuit board etching, the protective housing surface is provided with conveying subassembly, the protective housing is inside to be provided with cleaning nozzle through conveying unit is fixed.
Preferably, the lifting assembly comprises a left electric push rod arranged at the top of the protective casing, the output end of the left electric push rod penetrates through the protective casing and is fixedly provided with a mounting plate, the bottom of the mounting plate is fixedly provided with a moving plate, and the moving plate is fixedly connected with the etching nozzle.
Preferably, the moving assembly comprises a right electric push rod arranged at the top of the protective shell, the output end of the right electric push rod penetrates through the protective shell and is fixedly provided with a connecting plate, and the connecting plate is fixedly connected with the bottom plate.
Preferably, the cleaning assembly comprises a fixed plate arranged at the bottom of the bottom plate, a driving motor is fixedly arranged at the front side of the fixed plate, and an output end of the driving motor penetrates through the fixed plate to extend to the rear side of the fixed plate and is fixedly provided with a rolling brush.
Preferably, the conveying assembly comprises a conveying pump arranged at the top of the protective casing, a liquid inlet pipe is fixedly arranged at the liquid inlet end of the conveying pump and connected with an external conveying pipeline, a liquid outlet pipe is fixedly arranged at the liquid outlet end of the conveying pump, a corrugated pipe is fixedly arranged at the liquid outlet end of the liquid outlet pipe, a shunt pipe is fixedly arranged at the liquid outlet end of the corrugated pipe and is fixedly connected with a cleaning nozzle, a supporting plate is fixedly arranged on the surface of the shunt pipe, and the supporting plate is fixedly connected with a bottom plate.
Preferably, the number of the etching nozzles is multiple, the etching nozzles are distributed in a linear array, and the liquid inlet ends of the etching nozzles are connected with an external conveying hose.
Compared with the prior art, the utility model has the beneficial effects that: the multilayer circuit board etching device comprises a protective shell, a lifting assembly, an etching nozzle, an external conveying hose, a cleaning nozzle, a cleaning assembly, a motor-driven roller, a lifting assembly, a cleaning assembly and a cleaning assembly, wherein the multilayer circuit board is conveyed into the protective shell through the motor-driven roller, the lifting assembly drives the etching nozzle to move to a proper position, etching solution is conveyed to the etching nozzle through the external conveying hose and sprayed out to etch the multilayer circuit board, after etching is finished, the multilayer circuit board is conveyed to the right side of the protective shell through the motor-driven roller, cleaning solution is conveyed to the cleaning nozzle through the conveying assembly and sprayed to the surface of the multilayer circuit board, the cleaning assembly is pushed to be in contact with the multilayer circuit board through the lifting assembly and the bottom plate, the surface of the multilayer circuit board is cleaned, and after cleaning is finished, the multilayer circuit board is conveyed out through the motor-driven roller; the method has the advantages that the aim of facilitating cleaning of the surfaces of the multilayer circuit boards after the etching of the multilayer circuit boards is achieved, the condition that the residual medicament causes further side etching to the circuit boards due to unified cleaning after the etching of the circuit boards is avoided, and the condition that the side etching is reduced only in a spraying mode and cannot cause the side etching of the circuit boards is avoided.
Drawings
FIG. 1 is an isometric view of a structure of the present utility model;
FIG. 2 is a schematic view of the internal structure of the structural protective housing of the present utility model;
FIG. 3 is a schematic view of an etching nozzle and a lifting assembly according to the present utility model;
FIG. 4 is a schematic view of a partial structure of the present utility model;
FIG. 5 is a schematic view of a part of the structure of the cleaning nozzle and the conveying assembly according to the present utility model;
fig. 6 is an enlarged view of the structure at a in fig. 1.
In the figure: 1 installing support, 2 electric roller, 3 protecting sheathing, 4 left electric putter, 5 mounting panel, 6 movable plates, 7 etching nozzle, 8 right electric putter, 9 connecting plates, 10 bottom plate, 11 fixed plate, 12 driving motor, 13 delivery pump, 14 feed liquor pipe, 15 drain pipe, 16 bellows, 17 shunt tubes, 18 backup pad, 19 cleaning nozzle, 20 round brush.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-6, a multilayer circuit board etching device, including installing support 1, installing support 1 is inside to be provided with electric roller 2, installing support 1 top is fixed to be provided with protecting sheathing 3, protecting sheathing 3 surface is provided with lifting assembly, lifting assembly is including setting up in the left electric putter 4 at protecting sheathing 3 top, the output of left electric putter 4 runs through protecting sheathing 3 and fixedly provided with mounting panel 5, mounting panel 5 bottom is fixed to be provided with movable plate 6, and movable plate 6 and etching nozzle 7 fixed connection setting, left electric putter 4 promotes movable plate 6 through mounting panel 5 and drives etching nozzle 7 and remove suitable position, be convenient for adjust etching nozzle 7's height, be convenient for etching nozzle 7 can use the multilayer circuit board of different specifications, protecting sheathing 3 is inside to be fixedly provided with etching nozzle 7 through lifting assembly, etching nozzle 7's quantity is a plurality of, and a plurality of etching nozzle 7 are linear array type and distribute, and etching nozzle 7's feed liquor end is connected with outside conveying hose, be convenient for make multilayer circuit board surface's medicament more even, prevent that multilayer circuit board surface from appearing does not spray, protecting sheathing 3 surface sets up the moving assembly and is provided with etching nozzle 7 and is provided with electric putter 3, be convenient for be connected with the bottom plate 9 through the fixed connection plate 9 of electric putter 3 and bottom plate 9 through the fixed connection of bottom plate 9, the bottom plate 20 is set up through the right side of electric putter 3 and bottom plate 9, be convenient for contact with the fixed connection plate 9 of electric putter, the bottom plate 20 is connected with the multilayer brush is provided with etching nozzle is washed, and is convenient for the bottom plate, and is connected with the bottom plate 20, the bottom plate 10 is fixedly arranged in the protective shell 3 through a moving component, a cleaning component which is convenient for cleaning after the multi-layer circuit board is etched is arranged at the bottom of the bottom plate 10, the cleaning component comprises a fixed plate 11 arranged at the bottom of the bottom plate 10, a driving motor 12 is fixedly arranged at the front side of the fixed plate 11, the output end of the driving motor 12 penetrates through the fixed plate 11 to extend to the rear side of the fixed plate 11 and is fixedly provided with a rolling brush 20, the driving motor 12 drives the output end to rotate to drive the rolling brush 20 to clean the surface of the multi-layer circuit board, the cleaning component is convenient for cleaning the surface of the multi-layer circuit board, a conveying component is arranged on the surface of the protective shell 3, the conveying component comprises a conveying pump 13 arranged at the top of the protective shell 3, a liquid inlet pipe 14 is fixedly arranged at the liquid inlet end of the conveying pump 13, the liquid inlet pipe 14 is connected with an external conveying pipeline, a liquid outlet pipe 15 is fixedly arranged at the liquid outlet end of the conveying pump 13, the liquid outlet end of the liquid outlet pipe 15 is fixedly provided with a corrugated pipe 16, the liquid outlet end of the corrugated pipe 16 is fixedly provided with a shunt pipe 17, the shunt pipe 17 is fixedly connected with a cleaning nozzle 19, a supporting plate 18 is fixedly arranged on the surface of the shunt pipe 17, the supporting plate 18 is fixedly connected with the bottom plate 10, a conveying pump 13 arranged in a conveying assembly is started, the conveying pump 13 pumps cleaning liquid into the liquid outlet pipe 15 through a liquid inlet pipe 14, the cleaning liquid enters the shunt pipe 17 through the corrugated pipe 16 and is sprayed onto the surface of a multi-layer circuit board through the cleaning nozzle 19 connected with the shunt pipe 17, the cleaning liquid is conveniently conveyed to the cleaning nozzle 19, the residual medicament on the multi-layer circuit board is conveniently cleaned, the cleaning nozzle 19 is fixedly arranged in the protective housing 3 through the conveying assembly, the multi-layer circuit board etching device conveys the multi-layer circuit board into the protective housing 3 through the electric roller 2, the lifting component drives the etching nozzle 7 to move to a proper position, an etching solution is conveyed to the etching nozzle 7 through an external conveying hose and sprayed out to etch the multilayer circuit board, after etching is finished, the multilayer circuit board is conveyed to the right side of the protective shell 3 through the electric roller 2, cleaning solution is conveyed to the cleaning nozzle 19 through the conveying component and sprayed to the surface of the multilayer circuit board, the cleaning component is pushed to contact with the multilayer circuit board through the moving component and the bottom plate 10, the surface of the multilayer circuit board is cleaned, after cleaning is finished, the electric roller 2 is conveyed out, the aim of cleaning the surface of the multilayer circuit board after etching of the multilayer circuit board is conveniently achieved, the condition that residual medicament causes further side etching to the circuit board due to unified cleaning after etching of the circuit board is avoided, and the condition that side etching is reduced only through a spraying mode and no method causes side etching of the circuit board is fundamentally solved is avoided.
The multi-layer circuit board etching device is connected with 220V commercial power, and the master controller can be a conventional known device for controlling a computer and the like.
When in use: the multi-layer circuit board to be etched is placed on the electric roller 2, the multi-layer circuit board is conveyed into the protective shell 3 through the electric roller 2, the output end is driven to move through the left electric push rod 4, the left electric push rod 4 drives the movable plate 6 to move through the mounting plate 5, the etching nozzle 7 is driven to move through the movable plate 6, when the etching nozzle 7 moves to a proper position, etching solution is conveyed to the etching nozzle 7 through an external conveying hose, the multi-layer circuit board is etched through the spraying of the etching nozzle 7, after etching is finished, the multi-layer circuit board is conveyed to the right side of the protective shell 3 through the electric roller 2, the conveying pump 13 arranged in the conveying assembly is started, the cleaning liquid is pumped into the liquid outlet pipe 15 through the liquid inlet pipe 14, the cleaning liquid enters the shunt pipe 17 through the corrugated pipe 16, and is sprayed to the surface of the multi-layer circuit board through the cleaning nozzle 19 connected with the shunt pipe 17, the right electric push rod 8 arranged in the moving assembly stretches, the connecting plate 9 is enabled to push the multi-layer circuit board to contact through the rolling brush 20 arranged in the bottom plate 10, the rolling brush 20 arranged in the cleaning assembly, the multi-layer circuit board after the multi-layer circuit board is driven to rotate through the driving motor 12, the rolling brush 20 is driven to drive the output end to rotate, and the multi-layer circuit board can be cleaned through the cleaning roller.
In summary, this multilayer circuit board etching device, carry multilayer circuit board to the protective housing 3 through electronic roller 2, drive etching nozzle 7 through lifting unit and remove to suitable position, carry etching solution to etching nozzle 7 through outside conveying hose and spout and carry out the etching to the multilayer circuit board, after the etching is accomplished, carry multilayer circuit board to the protective housing 3 right side through electronic roller 2, carry cleaning solution to cleaning nozzle 19 through conveying unit and spout to multilayer circuit board surface, pass through moving unit and bottom plate 10 promotion cleaning unit and multilayer circuit board contact, and wash multilayer circuit board surface, after the washing is accomplished, carry out through electronic roller 2 and can, the purpose of being convenient for carry out the washing to multilayer circuit board surface after the multilayer circuit board is etched is realized, the medicament has been avoided carrying out unified cleaning again after the circuit board is etched and has been led to the condition that the residual medicament causes further side etching to the circuit board, the condition of side etching can not lead to the solution circuit board is reduced through the spray mode alone, the problem that is used for solving the fundamentally in the above-mentioned background technology.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and for simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, as well as a specific orientation configuration and operation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.
Claims (6)
1. The utility model provides a multilayer circuit board etching device, includes the installing support, its characterized in that, the inside electronic roller that is provided with of installing support, the fixed protecting sheathing that is provided with in installing support top, protecting sheathing surface is provided with lifting unit, the inside etching nozzle that is provided with through lifting unit of protecting sheathing, protecting sheathing surface is provided with movable assembly, the inside bottom plate that is provided with through movable assembly of protecting sheathing, the bottom plate bottom is provided with the cleaning module that is convenient for carry out abluent after multilayer circuit board etching, protecting sheathing surface is provided with conveying assembly, the inside cleaning nozzle that is provided with through conveying assembly of protecting sheathing.
2. The etching device for the multilayer circuit board according to claim 1, wherein the lifting assembly comprises a left electric push rod arranged at the top of the protective shell, an output end of the left electric push rod penetrates through the protective shell and is fixedly provided with a mounting plate, a moving plate is fixedly arranged at the bottom of the mounting plate, and the moving plate is fixedly connected with the etching nozzle.
3. The etching device for the multi-layer circuit board according to claim 1, wherein the moving assembly comprises a right electric push rod arranged at the top of the protective shell, an output end of the right electric push rod penetrates through the protective shell and is fixedly provided with a connecting plate, and the connecting plate is fixedly connected with the bottom plate.
4. The etching device for the multi-layer circuit board according to claim 1, wherein the cleaning assembly comprises a fixing plate arranged at the bottom of the bottom plate, a driving motor is fixedly arranged on the front side of the fixing plate, and an output end of the driving motor penetrates through the fixing plate to extend to the rear side of the fixing plate and is fixedly provided with a rolling brush.
5. The multilayer circuit board etching device according to claim 1, wherein the conveying assembly comprises a conveying pump arranged at the top of the protective casing, a liquid inlet pipe is fixedly arranged at the liquid inlet end of the conveying pump and connected with an external conveying pipeline, a liquid outlet pipe is fixedly arranged at the liquid outlet end of the conveying pump, a corrugated pipe is fixedly arranged at the liquid outlet end of the liquid outlet pipe, a shunt pipe is fixedly arranged at the liquid outlet end of the corrugated pipe and fixedly connected with the cleaning nozzle, a supporting plate is fixedly arranged on the surface of the shunt pipe, and the supporting plate is fixedly connected with the bottom plate.
6. The etching device for the multi-layer circuit board according to claim 1, wherein the number of the etching nozzles is plural, the etching nozzles are distributed in a linear array, and the liquid inlet ends of the etching nozzles are connected with an external conveying hose.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223516432.7U CN219107847U (en) | 2022-12-28 | 2022-12-28 | Multilayer circuit board etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223516432.7U CN219107847U (en) | 2022-12-28 | 2022-12-28 | Multilayer circuit board etching device |
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| Publication Number | Publication Date |
|---|---|
| CN219107847U true CN219107847U (en) | 2023-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223516432.7U Active CN219107847U (en) | 2022-12-28 | 2022-12-28 | Multilayer circuit board etching device |
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| CN (1) | CN219107847U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117448820A (en) * | 2023-12-25 | 2024-01-26 | 山东方霖铝业科技有限公司 | Etching device for aluminum material for all-aluminum furniture |
-
2022
- 2022-12-28 CN CN202223516432.7U patent/CN219107847U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117448820A (en) * | 2023-12-25 | 2024-01-26 | 山东方霖铝业科技有限公司 | Etching device for aluminum material for all-aluminum furniture |
| CN117448820B (en) * | 2023-12-25 | 2024-03-05 | 山东方霖铝业科技有限公司 | Etching device for aluminum material for all-aluminum furniture |
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