CN218554808U

CN218554808U - Efficient IC packaging test system

Info

Publication number: CN218554808U
Application number: CN202222381087.4U
Authority: CN
Inventors: 梁大明
Original assignee: Chart Automation System Co ltd
Current assignee: Chart Automation System Co ltd
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2023-03-03
Anticipated expiration: 2032-09-08

Abstract

The utility model provides a pair of efficient IC encapsulation test system, including feeding case, first electronic guide rail, the electronic guide rail of second, the electronic guide rail of third, removal passageway, location dolly, testing arrangement and play workbin, the feeding case is located one side of first electronic guide rail, and removal passageway is located the opposite side of first electronic guide rail, the feeding case is provided with feeding dish robotic arm with first electronic guide rail vertically one side, the location dolly is located the removal passageway and removes, the electronic guide rail of second is located one side of removal passageway, testing arrangement is located one side of the electronic guide rail of second, the last two test area KIT boards that are provided with of testing arrangement, testing arrangement one side is provided with the electronic guide rail of third, the both sides of the electronic guide rail of third are provided with waste material capsule, play workbin and manual dish, it is provided with out dish robotic arm with third electronic guide rail vertically one side to go out the workbin.

Description

Efficient IC encapsulation test system

Technical Field

The utility model belongs to the technical field of integrated circuit IC finished product test, concretely relates to efficient IC encapsulation test system.

Background

Along with the rapid development of the semiconductor industry, the requirement on the test efficiency of an IC test sorting machine is higher and higher, the conventional IC test system generally adopts a PNP suction nozzle manipulator module to firstly grab and feed an integrated circuit IC, and the integrated circuit IC is then picked and fed by the same PNP suction nozzle manipulator after the test is finished.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem existing in the background art, the utility model provides an efficient IC packaging test system.

The utility model provides a pair of efficient IC encapsulates test system, including feeding case, first electronic guide rail, the electronic guide rail of second, the electronic guide rail of third, moving walkways, location dolly, testing arrangement and play workbin, its characterized in that: the feeding box comprises an empty feeding disc and a full feeding disc, the feeding box is located on one side of a first electric guide rail, a moving channel is located on the other side of the first electric guide rail, a feeding disc mechanical arm is arranged on one side, perpendicular to the first electric guide rail, of the feeding box, a first PNP suction nozzle mechanical arm module is connected to the first electric guide rail in a sliding mode, a positioning trolley is located in the moving channel and moves inside the moving channel, a first positioning point and a second positioning point are arranged inside the moving channel, the second electric guide rail is located on one side, close to the second positioning point, of the moving channel, a second PNP suction nozzle mechanical arm module is connected to the second electric guide rail in a sliding mode, the testing device is located on one side of the second electric guide rail, two testing area KIT plates are arranged on the testing device, a third electric guide rail is arranged on one side of the testing device, a third PNP suction nozzle mechanical arm module is connected to the third electric guide rail in a sliding mode, small waste material boxes, discharging boxes and manual discharging discs are arranged on two sides of the third electric guide rail, the discharging boxes are formed by the empty discharging disc box, defective product boxes and discharging boxes are arranged on one side of the empty discharging disc boxes.

As an improvement, the first PNP suction nozzle manipulator module, the second PNP suction nozzle manipulator module, and the third PNP suction nozzle manipulator module are all composed of two rows of suction nozzles, and each row has 4 suction nozzles.

As an improvement, 8 KIT pits are formed in the positioning trolley, and the 8 KIT pits correspond to the positions of the suction nozzles in the first PNP suction nozzle manipulator module, the second PNP suction nozzle manipulator module and the third PNP suction nozzle manipulator module.

As an improvement, 8 KIT pits are arranged on the two test area KIT plates, and the 8 KIT pits correspond to the positions of the suction nozzles on the first PNP suction nozzle manipulator module, the second PNP suction nozzle manipulator module and the third PNP suction nozzle manipulator module.

As an improvement, the positioning trolley moves between a first positioning point and a second positioning point in the moving channel, the moving position of the positioning trolley is limited, and the transported IC to be tested can be determined to move to the specified position.

As an improvement, the first electric guide rail, the moving channel and the second electric guide rail are arranged vertically, the moving channel and the testing device are positioned on the same side of the second electric guide rail, and the third electric guide rail and the second electric guide rail are arranged vertically, so that the occupied space is reduced.

As an improvement, the small waste box and the manual disc are positioned on one side, close to the testing device, of the third electric guide rail, and the discharging box is positioned on one side, far away from the testing device, of the third guide rail, so that the waste box and the manual disc can be conveniently classified.

The utility model has the advantages that:

this system goes up the unloading to the IC that awaits measuring respectively through mutually independent first electronic guide rail, electronic guide rail of second and the electronic guide rail of third to through the mode of two test area KIT board cross tests, greatly increased the efficiency of snatching the IC chip of test, accelerated the speed of going up unloading, and then accelerated the efficiency of test, reduced the cost of test.

Drawings

Fig. 1 is a schematic structural diagram of an efficient IC package testing system of the present invention.

Fig. 2 is a schematic system flow diagram of an efficient IC package testing system according to the present invention.

( 1. A feed tray robotic arm; 2. a feeding box; 3. a first motorized rail; 4. a moving channel; 5. positioning a trolley; 6. a second motorized rail; 7. a testing device; 8. a test area KIT plate; 9. a waste bin; 10. a discharging box; 11. a manual disc; 12. a third motorized track; 13. a discharge pan robotic arm; 14. a first location site; 15. a second positioning point; 16. a first PNP suction nozzle manipulator module; 17. a second PNP suction nozzle manipulator module; 18. third PNP suction nozzle manipulator module )

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Please refer to fig. 1-2, the utility model provides a pair of efficient IC encapsulation test system, including feeding case 2, first electronic guide rail 3, second electronic guide rail 6, third electronic guide rail 12, moving channel 4, location dolly 5, testing arrangement 7 and ejection of compact case 10, feeding case 2 comprises the empty charging tray of feeding and the full charging tray of feeding, feeding case 2 is located one side of first electronic guide rail 3, and moving channel 4 is located the opposite side of first electronic guide rail 3, feeding case 2 is provided with feeding disc robotic arm 1 with first electronic guide rail 3 vertically one side, sliding connection has first PNP suction nozzle manipulator module 16 on first electronic guide rail 3, location dolly 5 is located moving channel 4 and removes, be provided with first setpoint 14 and second setpoint 15 in moving channel 4, second electronic guide rail 6 is located moving channel 4 and is close to one side of second setpoint 15, sliding connection has second PNP suction nozzle manipulator module 17 on second electronic guide rail 6, testing arrangement 7 is located one side of second electronic guide rail 6, testing arrangement 7 is provided with two KI guide rail 8 on the moving channel 4 and is provided with the vertical discharge tray of third electronic guide rail 12, the empty charging tray 12 is provided with the discharge box 12, the discharge box 12 is provided with the vertical discharge tray of discharging tray of third electronic guide rail 12, the empty charging tray is provided with the empty charging tray 18, the discharge box 12 discharge tray is provided with the discharge tray and the vertical discharge box 12, the discharge tray is provided with the third electronic suction nozzle and the discharge tray 12 discharge box 12, the discharge box 12 discharge tray is provided with the vertical discharge tray is provided with the empty charging tray discharge device.

Example 1:

through first PNP suction nozzle manipulator module 16 on first electronic guide rail 3, the IC that awaits measuring that places in the full charging tray of feeding is carried to the little vehicle 5 of the location of first fixed point 14 department in the transfer passage 4 on, the full charging tray of feeding of getting the material becomes the empty charging tray of feeding to by feeding tray robotic arm 1 will get the empty charging tray of feeding of IC and move to feeding case 2 in, later take out the full charging tray of feeding in feeding case 2, place the position department of getting of first PNP suction nozzle manipulator module 16.

Example 2:

8 KIT pits on the positioning trolley 5 are used for storing ICs sucked by a first PNP suction nozzle manipulator module 16, the ICs are conveyed to a second positioning point 15 from a first positioning point 14 through the moving channel 4, the ICs to-be-tested ICs on the positioning trolley 5 at the second positioning point 15 are sucked by a second PNP suction nozzle manipulator module 17 on the second electric guide rail 6, the ICs are moved to two test area KIT plates 8 on the testing device 7 to be placed and tested, when one test area KIT plate 8 is in a testing state, the other test area KIT plate 8 is fed or discharged, and the two test area KIT plates 8 are tested in a circulating mode.

Example 3:

through third PNP suction nozzle manipulator module 18 on third electric guide rail 12, the IC that test completion on KIT board 8 in test area absorbs, and place corresponding ejection of compact non-defective products case with IC according to the result of test, ejection of compact non-defective products case, inside manual dish 11 and waste material capsule 9, and when ejection of compact non-defective products case or ejection of compact non-defective products case are full, ejection of compact dish robotic arm 13 removes to the top of ejection of compact non-defective products case or ejection of compact non-defective products case, place the particular position after taking out it, later ejection of compact dish robotic arm 13 removes to a plurality of ejection of compact empty charging trays top in ejection of compact case 10 and picks up the empty charging tray and removes to ejection of compact non-defective products case or ejection of compact non-defective products case position and puts down, carry out the getting the blowing of the IC of new round.

The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and what is shown in the detailed description is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.

Claims

1. The utility model provides an efficient IC encapsulation test system, includes feeding box (2), first electronic guide rail (3), electronic guide rail of second (6), electronic guide rail of third (12), moving channel (4), location dolly (5), testing arrangement (7) and play workbin (10), its characterized in that: a plurality of feeding empty trays and a plurality of feeding full trays are placed in the feeding box (2), the feeding box (2) is positioned on one side of a first electric guide rail (3), a moving channel (4) is positioned on the other side of the first electric guide rail (3), one side of the feeding box (2) perpendicular to the first electric guide rail (3) is provided with a feeding disc mechanical arm (1), the first electric guide rail (3) is connected with a first PNP suction nozzle mechanical arm module (16) in a sliding manner, the positioning trolley (5) is positioned in the moving channel (4) to move, a first positioning point (14) and a second positioning point (15) are arranged in the moving channel (4), the second electric guide rail (6) is positioned on one side of the moving channel (4) close to the second positioning point (15), a second PNP suction nozzle mechanical arm module (17) is connected on the second electric guide rail (6) in a sliding manner, the testing device (7) is positioned on one side of the second electric guide rail (6), two testing areas KIT plates (8) are arranged on the testing device (7), a third electric guide rail (12) is arranged on one side of the testing device (7), and a third electric guide rail (12) and a third discharging box (12) and a third electric guide rail (11) and a third discharging box (12) are arranged on two sides of the PNP suction nozzle mechanical arm (11), go out workbin (10) and constitute by the empty charging tray case of ejection of compact, ejection of compact non-defective unit case, ejection of compact defective unit case, wherein the empty charging tray incasement of ejection of compact is provided with the empty charging tray of a plurality of ejection of compact, one side of going out workbin (10) and third electronic guide rail (12) vertically is provided with out a set robotic arm (13).

2. An efficient IC package testing system as recited in claim 1, wherein: the first PNP suction nozzle manipulator module (16), the second PNP suction nozzle manipulator module (17) and the third PNP suction nozzle manipulator module (18) are all composed of two rows of suction nozzles, and each row has 4 suction nozzles.

3. An efficient IC package testing system as recited in claim 2, wherein: the positioning trolley (5) is provided with 8 KIT pits, and the positions of the 8 KIT pits correspond to the positions of the suction nozzles on the first PNP suction nozzle manipulator module (16), the second PNP suction nozzle manipulator module (17) and the third PNP suction nozzle manipulator module (18).

4. A high efficiency IC package testing system as recited in claim 2, wherein: all be provided with 8 KIT pits on two test zone KIT board (8), and 8 KIT pits and first PNP suction nozzle manipulator module (16), second PNP suction nozzle manipulator module (17) and third PNP suction nozzle manipulator module (18) go up the position of suction nozzle corresponding.

5. An efficient IC package testing system as recited in claim 1, wherein: the positioning trolley (5) moves between a first positioning point (14) and a second positioning point (15) in the moving channel (4).

6. An efficient IC package testing system as recited in claim 1, wherein: the first electric guide rail (3) and the moving channel (4) are perpendicular to the second electric guide rail (6), the moving channel (4) and the testing device (7) are located on the same side of the second electric guide rail (6), and the third electric guide rail (12) is perpendicular to the second electric guide rail (6).

7. A high efficiency IC package testing system as recited in claim 1, wherein: the small waste box (9) and the manual disc (11) are positioned on one side, close to the testing device (7), of the third electric guide rail (12), and the discharging box (10) is positioned on one side, far away from the testing device (7), of the third guide rail.