CN218550482U - Circuit board with composite structure - Google Patents
Circuit board with composite structure Download PDFInfo
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- CN218550482U CN218550482U CN202222179322.XU CN202222179322U CN218550482U CN 218550482 U CN218550482 U CN 218550482U CN 202222179322 U CN202222179322 U CN 202222179322U CN 218550482 U CN218550482 U CN 218550482U
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- heat
- circuit board
- plate
- heat dissipation
- dissipation plate
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Abstract
The utility model relates to a circuit board technical field, concretely relates to composite construction's circuit board, include: the heat dissipation plate comprises a circuit board main body, an embedded seat, heat conduction columns, a heat dissipation plate and a heat dissipation plate clamping structure, wherein the embedded seat is installed on the circuit board main body at equal intervals, the heat conduction columns are fixedly installed on the surface of the heat dissipation plate, the heat conduction columns are embedded in the embedded seat in a sliding mode in the horizontal direction, the circuit board main body is smaller than the heat dissipation plate in the length direction, and the heat dissipation plate clamping structure is arranged at two end portions of the heat dissipation plate. Through the mode of establishing the heating panel additional between the circuit board, thereby utilize the block structure between the heating panel to establish the circuit board clamp and compound fixed connection each other, structurally play the effect that does not destroy the circuit board. Meanwhile, the heat-conducting columns on the heat-radiating plate are embedded on the circuit board at equal intervals, heat on the circuit board is guided to the heat-radiating plate, and the heat is radiated through the heat-radiating plate, so that the problems that the circuit board with a composite structure is difficult to disassemble and the heat-radiating efficiency is low are solved.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to composite construction's circuit board.
Background
With the continuous progress of electronic design and manufacturing process, the circuit board gradually moves to the trend development of high functionality, high density and high transmission rate, the circuit board continuously progresses to multilayering and diversification, but the circuit board of the existing multilayer composite structure has poor heat dissipation performance, the service life of the circuit board is influenced, the existing multilayer composite circuit board is integrated, once the multilayer composite circuit board is damaged, an operator cannot maintain the circuit board, and the waste of circuit board resources of the multilayer composite structure is caused.
The existing composite structure circuit board has the following problems: first, the conventional multilayer composite circuit board has poor heat dissipation performance, so that the multilayer composite circuit board usually generates high temperature when in operation, and when the circuit board of the multilayer composite structure continuously operates at high temperature, the circuit board of the composite structure is easily damaged, and the service life of the circuit board of the composite structure is influenced. Second, current composite construction circuit board is integrated, in case certain one deck of composite construction's circuit board breaks down or damages, whole circuit board will suffer to be eliminated, and operating personnel also can't maintain it, influences composite construction's circuit board reuse rate, has caused the wasting of resources of composite construction's circuit board.
In view of the above, it is highly desirable to design a circuit board with a composite structure, in which the circuit boards are sandwiched by the heat dissipation plates in a manner of adding the heat dissipation plates between the circuit boards, so as to be fixedly connected to each other in a composite manner, thereby structurally not damaging the circuit boards. Meanwhile, the heat-conducting columns on the heat-radiating plate are embedded on the circuit board at equal intervals, heat on the circuit board is guided to the heat-radiating plate, and the heat is radiated through the heat-radiating plate, so that the problems that the circuit board with a composite structure is difficult to disassemble and the heat-radiating efficiency is low are solved.
SUMMERY OF THE UTILITY MODEL
In order to solve the deficiencies of the prior art, the utility model aims to provide a composite construction's circuit board through adding the mode of establishing the heating panel between the circuit board, thereby utilizes the block structure between the heating panel to press from both sides the circuit board and establish mutual compound fixed connection, structurally plays the effect that does not destroy the circuit board. Meanwhile, the heat-conducting columns on the heat-radiating plate are embedded on the circuit board at equal intervals, so that heat on the circuit board is guided to the heat-radiating plate, and is radiated through the heat-radiating plate, and the problems that the circuit board with a composite structure is difficult to disassemble and the heat-radiating efficiency is low are solved.
In order to realize the above object, the technical scheme of the utility model is that: a circuit board of composite construction comprising: the heat dissipation plate comprises a circuit board main body, an embedded seat, heat conduction columns, a heat dissipation plate and heat dissipation plate clamping structures, wherein the embedded seat is installed on the circuit board main body at equal intervals, the heat conduction columns are fixedly installed on the top surface and the bottom surface of the heat dissipation plate at equal intervals, the heat conduction columns are embedded in the embedded seat in a sliding mode along the horizontal direction, the circuit board main body is smaller than the heat dissipation plate in the length direction, and the heat dissipation plate clamping structures are arranged at two end portions of the heat dissipation plate.
Further, the fitting seat includes: baffle portion, spacing head and fixed beam, the fixed beam sets up perpendicularly and equidistant circuit board main part top surface and bottom surface, baffle portion with the fixed beam is perpendicular to be connected and integrated into one piece, baffle portion tip fixedly connected with the spacing head.
Further, the heat conductive pillar includes: the heat-conducting circuit board comprises a contact heat-conducting part, a hook clamping head and extension heat-conducting columns, wherein the contact heat-conducting part is parallel to the circuit board main body, the hook clamping head is fixedly installed on the top surface of the contact heat-conducting part, the extension heat-conducting columns are arranged at the tail ends of the contact heat-conducting part, and the extension heat-conducting columns are fixedly installed on the top surface and the bottom surface of the heat-radiating plate at equal intervals.
Furthermore, the contact heat conducting part is matched with the baffle plate part, and the limiting head and the hook clamping head are same in specification.
Further, the heat dissipation plate includes: the metal radiating core plate comprises a metal radiating core plate, a ceramic heat insulation layer and a resin buffer layer, wherein the ceramic heat insulation layer is arranged on the top surface and the bottom surface of the metal radiating core plate, and the resin buffer layer is arranged on the outer diameter surface of the ceramic heat insulation layer.
Further, the heat sink engaging structure includes: the bolt holes are formed in two end portions of the heat dissipation plate, and the bolts penetrate through the bolt holes to be detachably connected with the nuts.
Has the advantages that:
the utility model provides a pair of composite construction's circuit board through adding the mode of establishing the heating panel between the circuit board, thereby utilizes the block structure between the heating panel to press from both sides the circuit board and establishes mutual compound fixed connection, structurally plays the effect that does not destroy the circuit board. Meanwhile, the heat-conducting columns on the heat-radiating plate are embedded on the circuit board at equal intervals, so that heat on the circuit board is guided to the heat-radiating plate, and is radiated through the heat-radiating plate, and the problems that the circuit board with a composite structure is difficult to disassemble and the heat-radiating efficiency is low are solved.
Drawings
Fig. 1 is a schematic diagram of a circuit board structure of the composite structure of the present invention.
In the figure: 1-circuit board main body, 2-embedded seat, 3-heat conducting column, 4-heat dissipation plate, 5-heat dissipation plate clamping structure, 21-baffle part, 22-limiting head, 23-fixing beam, 31-contact heat conducting part, 32-hook clamping head, 33-extension heat conducting column, 41-metal heat dissipation core plate, 42-ceramic heat insulation layer, 43-resin buffer layer, 51-bolt hole, 52-bolt and 53-nut.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art all belong to the protection scope of the present invention.
As shown in fig. 1, the utility model discloses a composite structure's circuit board, include: the heat dissipation structure comprises a circuit board main body 1, an embedded seat 2, heat conduction columns 3, a heat dissipation plate 4 and heat dissipation plate clamping structures 5, wherein the embedded seat 2 is installed on the circuit board main body 1 at equal intervals, the heat conduction columns 3 are fixedly installed on the top surface and the bottom surface of the heat dissipation plate 4 at equal intervals, the heat conduction columns 3 are embedded in the embedded seat 2 in a sliding mode along the horizontal direction, the circuit board main body 1 is smaller than the heat dissipation plate 4 in the length direction, and the heat dissipation plate clamping structures 5 are arranged at two end portions of the heat dissipation plate 4.
In this embodiment, the fitting seat 2 includes: baffle portion 21, spacing head 22 and fixed beam 23, fixed beam 23 vertically and equidistantly set up in circuit board main part 1 top surface and bottom surface, baffle portion 21 with fixed beam 23 is perpendicular to be connected and integrated into one piece, the terminal fixedly connected with of baffle portion 21 spacing head 22.
In this embodiment, the heat-conducting pillar 3 includes: a contact heat conduction part 31, a hook head 32 and an extension heat conduction column 33, wherein the contact heat conduction part 31 is parallel to the circuit board main body 1, the hook head 32 is fixedly installed on the top surface of the contact heat conduction part 31, the extension heat conduction column 33 is arranged at the tail end of the contact heat conduction part 31, and the extension heat conduction column 33 is fixedly and equidistantly installed on the top surface and the bottom surface of the heat dissipation plate 4.
In this embodiment, the contact heat-conducting portion 31 is fitted to the baffle portion 21, and the stopper 22 and the hook head 32 have the same specification.
In this embodiment, the heat dissipation plate 4 includes: the heat radiating core plate comprises a metal heat radiating core plate 41, a ceramic heat insulating layer 42 and a resin buffer layer 43, wherein the ceramic heat insulating layer 42 is arranged on the top surface and the bottom surface of the metal heat radiating core plate 41, and the resin buffer layer 43 is arranged on the outer diameter surface of the ceramic heat insulating layer 42.
In this embodiment, the heat sink engagement structure 5 includes: bolt holes 51, bolts 52 and nuts 53, wherein the bolt holes 51 are opened at both ends of the heat dissipation plate 4, and the bolts 52 are detachably connected with the nuts 53 through the bolt holes 51.
The working principle is as follows:
since the fitting seats 2 are arranged on the top surface and the bottom surface of the circuit board main body 1 at equal intervals, the fitting seats 2 are fixedly connected with the baffle plate part 21 through the fixing beams 23, the limiting head 22 is fixedly arranged at the tail end of the baffle plate part 21, and the limiting head 22, the baffle plate part 21 and the fixing beams 23 form a hook-shaped clamping seat. The structure of corresponding heat conduction post 3 is just opposite with gomphosis seat 2, the contact heat conduction portion 31 and the baffle 21 of heat conduction post 3 just in time cooperate, and contact heat conduction portion 31 end is provided with hook chuck 32, hook chuck 32 is the same with spacing head 22's specification, when heat conduction post 3 along horizontal direction sliding connection in gomphosis seat 2, it is spacing each other between hook chuck 32 and the spacing head 22, when not receiving external force to drag along the horizontal direction, spacing heating panel 4 and the displacement of circuit board main part 1 in vertical direction and horizontal direction.
The heat dissipation plate 4 is connected to the top and bottom surfaces of the circuit board main body 1 in a sliding manner in the horizontal direction by the engaging seat 2 and the heat conductive post 3 being in a mutually restricted connection, and the circuit board main body 1 and the heat dissipation plate 4 are fixed to each other. And the heat conduction columns 3 are fixedly connected to the top and bottom surfaces of the heat dissipation plate 4 at equal intervals. The contact heat conduction portion 31 of the heat conduction post 3 guides heat on the circuit board main body 1 to the extended heat conduction post 33, and the extended heat conduction post 33 guides heat to the metal heat dissipation core of the heat dissipation plate 4, and dissipates heat through the metal heat dissipation core.
The heat dissipation plate 4 is provided with the metal heat dissipation core, the top surface and the bottom surface of the metal heat dissipation core are compounded with the ceramic heat insulation layer 42, and the ceramic heat insulation layer 42 isolates heat generated between the circuit board main body 1 and the circuit board main body 1 from each other so as to prevent the metal heat dissipation core from transmitting the heat to each other. The outer diameter surface of the ceramic heat insulating layer 42 is compounded with a resin buffer layer 43, and when the whole structure is impacted by external force, the resin buffer layer 43 is used for preventing the circuit board main body 1 from being damaged by pressure.
The heat sink 4 is larger than the circuit board main bodies 1 in the longitudinal direction, and the heat sink engaging structures 5 are provided at both ends of the heat sink 4, and the plurality of circuit board main bodies 1 are combined with each other by forming bolt holes 51 and fixing and connecting the heat sink 4 to each other by bolts 52 and nuts 53 through the bolt holes 51.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and all modifications, equivalents, improvements and the like that fall within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A circuit board of composite construction comprising: the circuit board comprises a circuit board main body (1), an embedded seat (2), heat-conducting columns (3), a heat-radiating plate (4) and a heat-radiating plate clamping structure (5), and is characterized in that the embedded seat (2) is installed on the circuit board main body (1) at equal intervals, the heat-conducting columns (3) are fixedly installed on the top surface and the bottom surface of the heat-radiating plate (4) at equal intervals, the heat-conducting columns (3) are embedded in the embedded seat (2) in a sliding mode along the horizontal direction, the circuit board main body (1) is smaller than the heat-radiating plate (4) in the length direction, and the heat-radiating plate clamping structure (5) is arranged at two end portions of the heat-radiating plate (4).
2. A composite-structured circuit board according to claim 1, wherein said fitting seat (2) comprises: baffle portion (21), spacing head (22) and fixed beam (23), fixed beam (23) set up perpendicularly and equidistant ground in circuit board main part (1) top surface and bottom surface, baffle portion (21) with fixed beam (23) are perpendicular to be connected and integrated into one piece, baffle portion (21) end fixedly connected with spacing head (22).
3. A composite-structured circuit board according to claim 2, characterized in that said heat-conducting stud (3) comprises: contact heat conduction portion (31), hook dop (32) and extension heat conduction post (33), contact heat conduction portion (31) with circuit board main part (1) is parallel, hook dop (32) fixed mounting in contact heat conduction portion (31) top surface, the end of contact heat conduction portion (31) is provided with extension heat conduction post (33), extension heat conduction post (33) are fixed and install equidistantly heat dissipation plate (4) top surface and bottom surface.
4. A composite-structured circuit board according to claim 3, wherein said contact heat-conducting portion (31) is fitted to said baffle portion (21), and said stopper head (22) is of the same size as said hook head (32).
5. A composite-structured circuit board according to claim 4, wherein the heat-dissipating plate (4) comprises: the heat radiating core plate comprises a metal heat radiating core plate (41), a ceramic heat insulating layer (42) and a resin buffer layer (43), wherein the ceramic heat insulating layer (42) is arranged on the top surface and the bottom surface of the metal heat radiating core plate (41), and the resin buffer layer (43) is arranged on the outer diameter surface of the ceramic heat insulating layer (42).
6. A composite structural circuit board according to claim 5, wherein said heat radiating plate engaging structure (5) comprises: the heat dissipation plate comprises bolt holes (51), bolts (52) and nuts (53), the bolt holes (51) are formed in two end portions of the heat dissipation plate (4), and the bolts (52) penetrate through the bolt holes (51) and are detachably connected with the nuts (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222179322.XU CN218550482U (en) | 2022-08-18 | 2022-08-18 | Circuit board with composite structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222179322.XU CN218550482U (en) | 2022-08-18 | 2022-08-18 | Circuit board with composite structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218550482U true CN218550482U (en) | 2023-02-28 |
Family
ID=85270906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222179322.XU Active CN218550482U (en) | 2022-08-18 | 2022-08-18 | Circuit board with composite structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218550482U (en) |
-
2022
- 2022-08-18 CN CN202222179322.XU patent/CN218550482U/en active Active
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