CN218526639U - Heat-conducting silica gel composite material - Google Patents
Heat-conducting silica gel composite material Download PDFInfo
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- CN218526639U CN218526639U CN202222149992.7U CN202222149992U CN218526639U CN 218526639 U CN218526639 U CN 218526639U CN 202222149992 U CN202222149992 U CN 202222149992U CN 218526639 U CN218526639 U CN 218526639U
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Abstract
The utility model discloses a heat conduction silica gel combined material, including a plurality of silica gel pieces, a plurality of silica gel piece arrays are arranged, install the elasticity piece between the outer wall of two adjacent silica gel pieces, and the outer wall of silica gel piece is opened there is the draw-in groove, and the joint clamp in the draw-in groove on the silica gel piece outer wall in the outside, the bottom of silica gel piece is all fixed and is equipped with the viscose layer. Lead to elastic sheet and connect between a plurality of silica gel pieces, and the silica gel piece outside in the outside is through draw-in groove joint clamp, the silica gel piece bonds on electronic component through the viscose layer, thereby dispel the heat to electronic component, and the silica gel piece is heated when expanding, the clamp is guaranteed that the silica gel piece can't expand to the outside, then the silica gel piece can expand extrusion elastic sheet, make elastic sheet compression, after cooling down, the elasticity of elastic sheet makes the silica gel piece keep normally arranging, so, when satisfying the radiating, the whole outside size of device can not expand, avoid extrudeing outside part.
Description
Technical Field
The utility model relates to a heat conduction silica gel technical field specifically is a heat conduction silica gel composite.
Background
Heat conduction silica gel is the heat conduction compound of high-end, and can not solidify, risk such as circuit short circuit can be avoided to the characteristic that can not electrically conduct, because of its good insulation, heat conduction and the extensive heat dissipation treatment who is applied to electronic product of convenient assembling's characteristic, but current heat conduction silica gel piece ubiquitous structural strength is not enough, easy damaged problem, and heat conduction silica gel piece when laminating electronic product dispels the heat, its self can be heated the inflation, and present heat conduction silica gel piece all is a whole, lead to the volume increase after the inflation, extrude all the other electronic component easily, lead to the phenomenon that the pine takes off appears in the electronic component connection, to the above-mentioned problem, the inventor proposes a heat conduction silica gel combined material and is used for solving above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
The problem that the existing heat-conducting silica gel sheet is poor in structural strength and easy to damage is solved, the heat-conducting silica gel sheet can be heated to expand when being attached to an electronic product for heat dissipation, the existing heat-conducting silica gel sheet is an integral body, the volume is increased after expansion, other electronic parts are easily extruded, and the electronic parts are easily loosened when being connected; an object of the utility model is to provide a heat conduction silica gel composite.
In order to solve the technical problem, the utility model adopts the following technical scheme: the utility model provides a heat conduction silica gel composite, includes a plurality of silica gel pieces, and is a plurality of the silica gel piece array is arranged, adjacent two install the elasticity piece between the outer wall of silica gel piece, the outer wall of silica gel piece is opened there is the draw-in groove, and the outside joint clamp in the draw-in groove on the silica gel piece outer wall, the bottom of silica gel piece all is fixed and is equipped with the viscose layer, the elasticity piece includes heat conduction silica gel plate, adjacent two be equipped with two heat conduction silica gel plates, two between the outer wall of silica gel piece the middle part of heat conduction silica gel plate all is equipped with curved crease, form a plurality of glue connection points through glue bonding between the outer wall of heat conduction silica gel plate and silica gel piece, the clamp is including the laminating ring, the laminating ring is nonrust steel sheet, and the laminating ring closely laminates on the silica gel piece outer wall of draw-in groove department, the laminating ring is close to one side of silica gel piece and is fixed and is equipped with a plurality of fixture blocks, fixture block joint draw-in groove, and the cross section of fixture block and draw-in groove are matched with C type structure.
Preferably, the silica gel piece includes the silica gel main part, the silica gel main part internal fixation is equipped with the strengthening layer, the top integrated into one piece of silica gel main part is equipped with a plurality of fins, the outer wall of silica gel main part is equipped with draw-in groove and elasticity piece, the fixed viscose layer that is equipped with in bottom of silica gel main part.
Preferably, silica gel main part and fin are heat conduction silica gel cuboid structure, the strengthening layer is the network structure that the aluminium silk formed, the bottom on viscose layer is attached to have from the type layer.
Preferably, the heat-conducting silica gel plate is bent along the bending mark to form a V-shaped structure, and the opening directions of the two heat-conducting silica gel plates are opposite.
Compared with the prior art, the beneficial effects of the utility model reside in that:
make the heat conduction silica gel board of V type structure to connect through the glue contact between a plurality of silica gel pieces, and the fixture block of draw-in groove joint clamp is passed through in the silica gel piece outside in the outside, make the closely laminating ring laminate the silica gel piece outer wall in the outside, the silica gel piece bonds on electronic component through the viscose layer, thereby dispel the heat to electronic component, and the silica gel piece is heated when expanding, the clamp guarantees that the silica gel piece can't expand to the outside, then the silica gel piece can expand extrusion elastic sheet, make the elastic sheet compression, after the cooling, the elasticity of elastic sheet makes the silica gel piece keep normally arranging, so, when satisfying the radiating, the whole outside size of device can not expand, avoid extruding outside part.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the local cross-section structure of the present invention.
Fig. 3 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.
In the figure: 1. a silica gel sheet; 11. a silica gel body; 12. a strengthening layer; 13. a fin; 2. a card slot; 3. an elastic sheet; 31. a heat conductive silica gel plate; 32. bending a crease; 33. glue joint points; 4. clamping a hoop; 41. fitting a ring; 42. a clamping block; 5. an adhesive layer; 6. and a release layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b): as shown in fig. 1-3, the utility model provides a heat conduction silica gel composite, including a plurality of silica gel pieces 1, a plurality of silica gel pieces 1 array is arranged, install elastic sheet 3 between two adjacent silica gel pieces 1's outer wall, silica gel piece 1's outer wall is opened there is draw-in groove 2, joint hoop 4 in draw-in groove 2 on the silica gel piece 1 outer wall in the outside, silica gel piece 1's bottom is all fixed and is equipped with viscose layer 5, elastic sheet 3 includes heat conduction silica gel plate 31, be equipped with two heat conduction silica gel plates 31 between two adjacent silica gel pieces 1's outer wall, two heat conduction silica gel plate 31's middle part all is equipped with curved crease 32, form a plurality of glue joints 33 through glue bonding between heat conduction silica gel plate 31's outer wall and silica gel piece 1, clamp hoop 4 is including laminating ring 41, laminating ring 41 is the stainless steel sheet, and laminating ring 41 closely laminates on the silica gel piece 1 outer wall of draw-in groove 2 department, laminating ring 41 is close to one side of 1 and is fixed and is equipped with a plurality of fixture block 42 joint draw-in the draw-in groove 2, and the cross section of fixture block 42 and type C structure matched with.
Through the technical scheme, make the heat conduction silica gel plate 31 of V type structure connect through gluing contact 33 between a plurality of silica gel pieces 1, and the 1 outside of silica gel piece in the outside passes through the fixture block 42 of draw-in groove 2 joint clamp 4, make the 1 outer wall of silica gel piece in the laminating ring 41 closely laminating in the outside, silica gel piece 1 bonds on electronic component through viscose layer 5, thereby dispel the heat to electronic component, and when silica gel piece 1 is heated the inflation, clamp 4 guarantees that silica gel piece 1 can't expand to the outside, then silica gel piece 1 can expand extrusion elastic sheet 3, make elastic sheet 3 compression, after the cooling, elastic sheet 1 keeps normally arranging for elastic sheet 3's elasticity, thus, when satisfying the heat dissipation, the whole outside size of device can not expand, avoid extrudeing outside part.
Further, silica gel sheet 1 includes silica gel main part 11, silica gel main part 11 internal fixation is equipped with strengthening layer 12, the top integrated into one piece of silica gel main part 11 is equipped with a plurality of fins 13, the outer wall of silica gel main part 11 is equipped with draw-in groove 2 and elastic sheet 3, the fixed viscose layer 5 that is equipped with in bottom of silica gel main part 11, silica gel main part 11 and fin 13 are heat conduction silica gel cuboid structure, strengthening layer 12 is the network structure that the aluminium silk formed, the bottom of viscose layer 5 is attached with from type layer 6.
Through above-mentioned technical scheme, silica gel main part 11 passes through 5 laminating electronic component on viscose layer to derive the heat, and increase heat radiating area through a plurality of fins 13, improve heat conduction efficiency, the network structure through strengthening layer 12 improves the intensity of silica gel piece 1, reduces the broken probability of silica gel piece.
Further, the heat-conducting silica gel plate 31 is bent along the bending mark 32 to form a V-shaped structure, and the opening directions of the two heat-conducting silica gel plates 31 are opposite.
Through the technical scheme, the heat-conducting silica gel plate 31 with the V-shaped structure can be bent, so that the deformation of the silica gel sheets 1 during thermal expansion is met.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. The utility model provides a heat conduction silica gel combined material, includes a plurality of silica gel pieces (1), its characterized in that: a plurality of silica gel piece (1) array is arranged, adjacent two install elastic sheet (3) between the outer wall of silica gel piece (1), open the outer wall of silica gel piece (1) has draw-in groove (2), the outside draw-in groove (2) interior joint clamp (4) on the outer wall of silica gel piece (1), the bottom of silica gel piece (1) is all fixed and is equipped with viscose layer (5).
2. The heat-conducting silica gel composite material as claimed in claim 1, wherein the silica gel sheet (1) comprises a silica gel main body (11), a reinforcing layer (12) is fixedly arranged in the silica gel main body (11), a plurality of fins (13) are integrally formed on the top of the silica gel main body (11), a clamping groove (2) and an elastic sheet (3) are arranged on the outer wall of the silica gel main body (11), and an adhesive layer (5) is fixedly arranged at the bottom of the silica gel main body (11).
3. The heat-conducting silica gel composite material as claimed in claim 2, wherein the silica gel main body (11) and the fins (13) are of a heat-conducting silica gel cuboid structure, the reinforcing layer (12) is of a mesh structure formed by aluminum wires, and the release layer (6) is attached to the bottom of the adhesive layer (5).
4. A heat-conducting silica gel composite material according to claim 2, wherein the elastic sheet (3) comprises heat-conducting silica gel plates (31), two heat-conducting silica gel plates (31) are arranged between the outer walls of two adjacent silica gel sheets (1), the middle parts of the two heat-conducting silica gel plates (31) are provided with bent creases (32), and the outer walls of the heat-conducting silica gel plates (31) and the silica gel sheets (1) are bonded together by glue to form a plurality of glue joints (33).
5. The composite material according to claim 4, wherein the heat conductive silicone rubber plates (31) are bent along the bending marks (32) to form a V-shaped structure, and the two heat conductive silicone rubber plates (31) have opposite opening directions.
6. The heat-conducting silica gel composite material according to claim 1, wherein the clamp (4) comprises an attaching ring (41), the attaching ring (41) is a stainless steel sheet, the attaching ring (41) is closely attached to the outer wall of the silica gel sheet (1) at the position of the clamping groove (2), a plurality of clamping blocks (42) are fixedly arranged on one side of the attaching ring (41) close to the silica gel sheet (1), the clamping blocks (42) are clamped in the clamping groove (2), and the cross sections of the clamping blocks (42) and the clamping groove (2) are of matched C-shaped structures.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202222149992.7U CN218526639U (en) | 2022-08-16 | 2022-08-16 | Heat-conducting silica gel composite material |
Applications Claiming Priority (1)
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CN202222149992.7U CN218526639U (en) | 2022-08-16 | 2022-08-16 | Heat-conducting silica gel composite material |
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CN218526639U true CN218526639U (en) | 2023-02-24 |
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CN202222149992.7U Active CN218526639U (en) | 2022-08-16 | 2022-08-16 | Heat-conducting silica gel composite material |
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2022
- 2022-08-16 CN CN202222149992.7U patent/CN218526639U/en active Active
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