CN213716877U

CN213716877U - Electrode structure beneficial to packaging of diode photovoltaic module

Info

Publication number: CN213716877U
Application number: CN202022701228.7U
Authority: CN
Inventors: 朱猛; 王培祥; 祁伟; 季群; 张斌; 姜明春; 郑磊; 王树升; 加春雷
Original assignee: JINAN JINGHENG ELECTRONICS CO Ltd
Current assignee: JINAN JINGHENG ELECTRONICS CO Ltd
Priority date: 2020-11-20
Filing date: 2020-11-20
Publication date: 2021-07-16
Anticipated expiration: 2030-11-20

Abstract

The utility model provides a do benefit to electrode structure of diode photovoltaic module encapsulation mainly includes left electrode, right electrode and plastic-sealed body. The left electrode comprises a left end part, a middle part and a right end part, a left slotted hole is formed in the joint of the right end part and the middle part, the upper side and the lower side of the right end part are wavy, a slotted hole and a semi-enclosed groove are sequentially formed in the right side of the left slotted hole, and chips are arranged on the upper side and the lower side of the slotted hole of the right end part of the left electrode. The right electrode comprises a left end part and a right end part, a right slotted hole is formed in the joint of the left end part and the right end part of the right electrode, a double-side wavy bump is arranged on the left side of the left end part of the right electrode, and connecting strips are arranged on the upper side and the lower side of the double-side wavy bump of the left end part of the right electrode. The plastic package body wraps the right end part of the left electrode and the left end part of the right electrode through the right slotted hole of the right end part of the left electrode and the left slotted hole of the right electrode. The wave-shaped clamping structure can effectively increase the adhesion force and the adhesive strength of the plastic package body on the electrode, thereby solving the layering and separation phenomena of the electrode and the plastic package body.

Description

Electrode structure beneficial to packaging of diode photovoltaic module

Technical Field

The utility model relates to a semiconductor package technical field especially relates to an electrode structure who does benefit to diode module encapsulation.

Background

The solar photovoltaic junction box is a main device for solar power generation conversion, the internal structure of the junction box which is popular in the current market is generally completed by welding and assembling electrodes and discrete diode devices, the structure is simple, the heat dissipation performance is poor, and labor and time are wasted during assembly. In the prior art, a diode photovoltaic module better than the structure adopts an electrode and a diode chip to be integrated and packaged, and comprises a left electrode, a right electrode, a chip, a thick aluminum wire and a plastic package body. One electrode surface of the chip is welded at the right end part of the left electrode, the opposite electrode surface of the chip is connected with the left end part of the right electrode through a thick aluminum wire, and the diode which is in a connection state is insulated and hermetically wrapped by the plastic package body.

In the prior art, the electrodes are divided into a riveting plane type and a resistance welding plane type, the two types are used for connecting a power supply lead, the right end part of the left electrode and the left end part of the right electrode are parallel and smooth, the two types are used for better radiating and reducing labor in assembly, the two types of electrodes are mature through a welding process of a thick aluminum wire and a chip, however, after the plastic package body is molded by using resin, the parameter characteristic change and the sealing bonding strength of the diode module caused by the heat dissipation problem depend on the parallel and smooth relative position of the electrodes and the packaging process of the plastic package body, the delamination or separation of the electrode and the plastic package body caused by weak sealing strength of the plastic package body can occur in the packaging process, and because the chip is welded with the electrode, therefore, the occurrence of delamination or separation of the plastic package body can cause the parameter characteristics of the diode module to have floating change, thereby causing the parameter of the diode module to exceed the standard and be poor. Therefore, a need exists in the art for a more optimal electrode structure for use in conjunction with a plastic package.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a do benefit to electrode structure of diode photovoltaic module encapsulation, the wave screens structure of its adoption can increase adhesive force and the adhesive strength of plastic-sealed body on the electrode effectively to solve the layering and the separation phenomenon of electrode and plastic-sealed body.

For solving the above technical problem, the utility model provides a technical scheme does:

an electrode structure beneficial to packaging of a diode photovoltaic module comprises a left electrode, a right electrode and a plastic package body, and is characterized in that the left electrode sequentially comprises a left end part, a middle part and a right end part from left to right; the left end part of the left electrode is provided with a wiring terminal, the joint of the right end part and the middle part of the left electrode is provided with a left slotted hole, the upper side and the lower side of the right end part of the left electrode are wavy edges, the right side of the left slotted hole is provided with a slotted hole for reinforcing the connection of the left electrode and a plastic package body, the right side of the slotted hole is provided with a semi-surrounding groove for reinforcing the combination of the plastic package body, and the upper side and the lower side of the slotted hole of the right end part of the left;

the right electrode comprises a left end part and a right end part from left to right, a right slotted hole is formed at the joint of the left end part and the right end part of the right electrode, a double-side wavy bump which is matched with the semi-surrounding groove and can reinforce the plastic package body is arranged on the left side of the left end part of the right electrode, and connecting strips for bonding and connecting the chip and the right electrode are arranged on the upper side and the lower side of the double-side wavy bump at the left end part of the right electrode;

the plastic package body completely and hermetically wraps the right end part of the left electrode and the left end part of the right electrode through the left slotted hole of the right end part of the left electrode and the right slotted hole of the right electrode.

Preferably, the upper side and the lower side of the left slotted hole are respectively provided with a left electrode fixing groove for fixing the plastic package body, the upper side and the lower side of the right slotted hole are respectively provided with a right electrode fixing groove for reinforcing the plastic package body, and the left electrode fixing groove and the right electrode fixing groove are of dovetail groove structures.

Preferably, the left slotted hole and the right slotted hole are T-shaped slotted holes, and the protruding positions of the left slotted hole and the right slotted hole are positioned in the plastic package body.

Preferably, the slotted hole for reinforcing the connection of the left electrode and the plastic fixation packaging body is a circular hole.

Preferably, the upper side and the lower side of the left end part of the right electrode are wavy edges.

The utility model has the advantages that: compared with the prior art, the utility model discloses a clamping structure that left electrode slotted hole bulge position and left electrode right-hand member face's slotted hole, semi-surrounding recess, both sides wave edge, left electrode fixed slot and right electrode left end face's two side wave lugs, right electrode fixed slot, right electrode slotted hole bulge position form, the effectual combination of having consolidated the plastic-sealed body has reduced the interval between the two electrodes, make the resin before forming the plastic-sealed body shaping adhesion force when the plastic envelope, the joint degree has obtained greatly promoting. Because the utility model discloses a screens structure has also reduced layering, the separation phenomenon that prior art leads to with the adhesion weak with the heat dissipation that the parallel relative position too big caused.

Drawings

Fig. 1 is an electrode structure for facilitating the encapsulation of a diode photovoltaic module according to the present invention;

in the figure, 1, a left electrode, 1-1, a wiring terminal, 1-2, a left slotted hole, 1-3, a slotted hole, 1-4, a semi-surrounding groove, 1-5, a wavy edge, 1-6, a left electrode fixing groove, 2, a right electrode, 2-1, a right slotted hole, 2-2, a double-side wavy bump, 2-3, a right electrode fixing groove, 3, a chip, 4, a connecting strip, 5 and a plastic package body.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention.

In the description of the present invention, it should be understood that the terms "unequal width", "equal width", "left", "right ahead", "axis", "up", "down", "parallel plane", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and do not indicate specific orientations or configurations, and therefore, should not be construed as limiting the present invention.

In the present disclosure, unless expressly stated or limited otherwise, the first feature is "on" or "under" the second feature, and may comprise direct contact between the first and second features, or may comprise contact between the first and second features through another feature not in direct contact. Moreover, the first feature "left end", "right end" and "convex" and "concave" in the second feature includes the first feature being at the left end, right end, convex, concave in the second feature.

Referring to fig. 1, the present application provides an electrode structure for facilitating the encapsulation of a diode photovoltaic module, which includes a left electrode 1, a right electrode 2 and a plastic package body 5.

The unequal width position of the left electrode 1 is the right end part, the plastic package body 5 can seal and wrap the right end part of the left electrode 1, the equal width position of the left electrode 1 is the left end part, the left end part is parallelly provided with a wiring terminal 1-1 which can be welded or riveted, the adjacent position of the right end part of the left electrode 1 is provided with a left slotted hole 1-2 through which a laminated bus bar can pass, and the protruding position of the left slotted hole 1-2 can reinforce the combination of the plastic package body 5.

The axial line position right in front of the protruding position of the left slotted hole 1-2 is also provided with a slotted hole 1-3 which can be combined with the reinforced plastic package body 5.

And the right end part of the left electrode 1 is also provided with a semi-surrounding groove 1-4 combined with a reinforced plastic package body 5 at the axial line position right in front of the slotted hole 1-3, and two sides of the groove are provided with bulges which protrude out of the right end part of the left electrode 1.

The upper and lower sides of the right end part of the left electrode 1 are provided with wave-shaped edges 1-5 for reinforcing the combination of the plastic package body 5; furthermore, left electrode fixing grooves 1-6 for reinforcing the plastic package body are arranged at the corresponding positions of the upper part and the lower part of the left side of the wavy edges 1-5 at the two sides, and the chip 3 can be placed at the positions of the wavy edges 1-5 at the two sides, the upper part and the lower part of the slotted hole 1-3 and the outer part.

In one embodiment of the application, the non-uniform width position of the right electrode 2 is a left end part, the plastic package body 5 can seal and wrap the left end part of the right electrode 2, the left end part of the right electrode 2 is adjacent to a right slotted hole 2-1 through which a laminated bus bar can pass, right electrode fixing grooves 2-3 for reinforcing the adhesion of the plastic package body 5 are respectively arranged above and below the right slotted hole 2-1, a double-side wavy bump 2-2 capable of reinforcing the combination of the plastic package body is arranged in the middle of the left end part of the right electrode 2, and the root of the wavy bump 2-2 is concave to the left end part of the right electrode; the upper and lower parallel surfaces of the wavy bump 2-2 at the left end part of the right electrode 2 can be used for bonding and connecting the connecting strip 4 with the chip 3.

In a preferred embodiment of the present application, the left electrode 1 and the right electrode 2 are in the same plane, the right end of the left electrode 1 is on the same axis with respect to the left end of the right electrode 2, and the semi-enclosed groove 1-4 at the right end of the left electrode 1 contains the wavy bump 2-2 at the left end of the right electrode 2.

In one embodiment of the present application, the plastic package body 5 completely and hermetically wraps the right end portion of the left electrode 1 and the left end portion of the right electrode 2 through the protruding position of the left slot 1-2 adjacent to the right end portion of the left electrode 1 and the protruding position of the right slot 2-1 adjacent to the left end portion of the right electrode 2.

Compared with the prior art, the electrode structure beneficial to the encapsulation of the diode photovoltaic module is provided by the utility model; the clamping structure formed by the protruding positions of the left slotted hole 1-2, the slotted hole 1-3 on the right end surface of the left electrode 1, the semi-surrounding groove 1-4, the left electrode fixing groove 1-5 on the two sides, the left electrode fixing groove 1-6, the double-side wavy bump 2-2 on the left end surface of the right electrode 2, the right electrode fixing groove 2-3 and the protruding position of the right slotted hole 2-1 effectively strengthens the combination of the plastic package body, reduces the distance between the two electrodes and greatly improves the adhesive force and the combination degree of resin before forming the plastic package body during plastic package. Because the utility model discloses a screens structure has also reduced layering, the separation phenomenon that prior art leads to with the adhesion weak with the heat dissipation that the parallel relative position too big caused.

The utility model discloses locating hole size, plastic envelope shape and process and device that are not described in detail are prior art, no longer give unnecessary details.

The principles and embodiments of the present invention have been explained herein using specific embodiments, which are presented to aid in understanding the methods and core concepts of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. An electrode structure beneficial to packaging of a diode photovoltaic module comprises a left electrode (1), a right electrode (2) and a plastic package body (5), and is characterized in that the left electrode (1) sequentially comprises a left end part, a middle part and a right end part from left to right; a wiring terminal (1-1) is arranged at the left end part of the left electrode (1), a left slotted hole (1-2) is formed at the joint of the right end part and the middle part of the left electrode (1), the upper side and the lower side of the right end part of the left electrode (1) are wavy edges (1-5), a slotted hole (1-3) for reinforcing the connection of the left electrode (1) and a plastic package body (5) is formed in the right side of the left slotted hole (1-2), a semi-surrounding groove (1-4) for reinforcing the combination of the plastic package body (5) is formed in the right side of the slotted hole (1-3), and chips (3) are arranged on the upper side and the lower side of the slotted hole (1-3) of the right end part;

the right electrode (2) comprises a left end part and a right end part from left to right, a right slotted hole (2-1) is formed in the joint of the left end part and the right end part of the right electrode (2), a double-side wavy bump (2-2) which is matched with a semi-surrounding groove (1-4) and can reinforce a plastic package body (5) is arranged on the left side of the left end part of the right electrode (2), and connecting strips (4) which can be used for bonding and connecting a chip (3) and the right electrode (2) are arranged on the upper side and the lower side of the double-side wavy bump (2-2) at the left end part of the right electrode (2);

the plastic package body (5) completely seals and wraps the right end part of the left electrode (1) and the left end part of the right electrode (2) through the left slotted hole (1-2) at the right end part of the left electrode (1) and the right slotted hole (2-1) of the right electrode (2).

2. The electrode structure facilitating the encapsulation of the diode photovoltaic module according to claim 1, wherein the left slot hole (1-2) is provided with left electrode fixing slots (1-6) for fixing the plastic package body (5) on the upper and lower sides respectively, the right slot hole (2-1) is provided with right electrode fixing slots (2-3) for reinforcing the plastic package body (5) on the upper and lower sides respectively, and the left electrode fixing slots (1-6) and the right electrode fixing slots (2-3) are of a dovetail groove structure.

3. The electrode structure facilitating the encapsulation of the diode photovoltaic module according to claim 1, wherein the left slot (1-2) and the right slot (2-1) are T-shaped slots, and the protruding positions of the left slot (1-2) and the right slot (2-1) are located inside the plastic package body (5).

4. The electrode structure facilitating the encapsulation of the diode photovoltaic module according to claim 1, wherein the slotted hole (1-3) for reinforcing the connection of the left electrode (1) and the plastic-fixation package body (5) is a circular hole.

5. The electrode structure for facilitating the encapsulation of a diode photovoltaic module according to claim 1, wherein the upper and lower sides of the left end of the right electrode (2) are wavy edges.