CN218447869U

CN218447869U - Semiconductor packaging structure

Info

Publication number: CN218447869U
Application number: CN202222436184.9U
Authority: CN
Inventors: 蔡江
Original assignee: Baowu Group Echeng Iron and Steel Co Ltd
Current assignee: Baowu Group Echeng Iron and Steel Co Ltd
Priority date: 2022-09-15
Filing date: 2022-09-15
Publication date: 2023-02-03
Anticipated expiration: 2032-09-15

Abstract

The utility model relates to a semiconductor packaging structure, which comprises a substrate, the top center fixedly connected with chip module of base plate, the both sides of chip module are provided with signal sending module and signal receiving module respectively, all be provided with first angle bead on the top left and right sides turning of chip module, the top left and right sides corner of signal sending module all is provided with the second angle bead, the top left and right sides corner of signal receiving module all is provided with the third angle bead, the outside of chip module, signal receiving module and signal sending module is provided with the protecting crust, the rear side middle part fixedly connected with first pad of protecting crust, the left side of first pad is provided with the second pad, the right side of first pad is provided with the third pad, the left and right sides of protecting crust all is provided with a plurality of ventilation holes, the top of protecting crust is provided with sealed lid; the utility model discloses avoided chip module, signal sending module and signal receiving module to cause the problem of damage because of external force, improved life.

Description

Semiconductor packaging structure

Technical Field

The utility model belongs to the technical field of semiconductor production equipment technique and specifically relates to a semiconductor packaging structure is related to.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion, etc., for example, a diode is a device manufactured by using a semiconductor, for example, in a communication device, a chip module and an antenna need to be packaged together to form a semiconductor packaging structure, wherein the antenna is a device for receiving and transmitting electromagnetic wave signals and is used as a carrier for signal transmission between different chip modules, and along with the research and improvement on the use and performance of the semiconductor, the application requirements of the semiconductor packaging structure are more and more strict.

At present, the existing semiconductor packaging structure comprises a chip module and an antenna module, but the existing semiconductor packaging structure has certain defects, and the semiconductor packaging structure is lack of a protection module and a heat dissipation module, so that the hidden danger of damage to the chip module and the antenna module inside is caused, and the chip module and the antenna module inside are not convenient to maintain, so that the semiconductor packaging structure needs to be improved.

Disclosure of Invention

The present invention is directed to provide a semiconductor package structure.

The utility model has the following concrete scheme: the utility model provides a semiconductor packaging structure, includes the base plate, the top center fixedly connected with chip module of department of base plate, the both sides of chip module are provided with signal sending module and signal receiving module respectively, all be provided with first angle bead on the top left and right sides corner of chip module, the top left and right sides corner of signal sending module all is provided with the second angle bead, the top left and right sides corner of signal receiving module all is provided with the third angle bead, the outside of chip module, signal receiving module and signal sending module is provided with the protecting crust, the first pad of rear side middle part fixedly connected with of protecting crust, the left side of first pad is provided with the second pad, and the right side of first pad is provided with the third pad, the left and right sides of protecting crust all is provided with a plurality of ventilation holes, the top of protecting crust is provided with sealed lid, the equal fixedly connected with connecting plate in the left and right sides of sealed lid, the equal threaded connection in both ends has the locking screw around the connecting plate, threaded connection has the fixed column on the bottom external diameter of locking screw.

Further, in the utility model discloses four in the bottom of fixed column respectively fixed connection in the top four corners department of base plate, the bottom fixed connection of protecting crust is on the top surface of base plate.

Further, in the utility model discloses in signal transmission module front side is provided with the signal transmission antenna, the front side of chip module is provided with the chip interface, the front side of signal reception module is provided with the signal reception antenna, and signal transmission antenna, chip interface, signal reception antenna all set up in the protective housing.

Further, in the present invention, the bottom of the signal sending module and the bottom of the signal receiving module are both fixedly connected to the top surface of the substrate.

Further, in the present invention, a periphery of the outside of the bottom of the sealing cover is fixedly connected with a sealing pad.

Further, in the utility model discloses in the inside screw hole that is provided with in top of fixed column, the size of screw hole and locking screw's size phase-match.

Further, in the utility model discloses in position department corresponding with chip interface, signal transmission antenna, signal reception antenna is provided with first opening, second opening and third opening respectively on the preceding lateral wall of protecting crust.

Further, the utility model discloses in the one end of first pad links to each other with the wiring end of chip module, the one end of second pad links to each other with the wiring end of signalling module, the one end of third pad links to each other with the wiring end of signal reception module.

The utility model discloses following beneficial effect has:

1. in the utility model, the chip module, the signal sending module and the signal receiving module are firstly installed and fixed in the protective shell, the sealing effect on the protective shell can be realized through the matching of the sealing cover and the sealing gasket, and the hidden danger that the chip module, the signal sending module and the signal receiving module are damaged by external dust debris is avoided; the locking screw is matched with the threaded hole formed in the fixing column, the sealing cover can be fixed, the locking screw can be rotated reversely during disassembly, the mounting and the disassembly are very convenient, the chip module, the signal sending module and the signal receiving module can be protected through the first angle bead, the second angle bead and the third angle bead which are arranged, the problem that the chip module, the signal sending module and the signal receiving module are damaged due to external force is avoided, and the service life is prolonged.

2. The utility model discloses in, can send signal and received signal independently through the signal transmission module and the signal transmission antenna, signal reception module and the signal reception antenna that set up to realized the function of independent control, be favorable to promoting the accurate nature of control, through the ventilation hole that sets up in the protecting crust left and right sides, thereby can form a ventilation channel, be favorable to promoting the radiating effect.

Drawings

Fig. 1 is a schematic perspective view of a semiconductor package structure according to the present invention;

fig. 2 is a schematic front sectional view of a semiconductor package structure according to the present invention;

fig. 3 is a schematic diagram of a rear side of the semiconductor package structure according to the present invention.

In the figure: 1. a substrate; 2. a protective shell; 3. fixing the column; 4. a sealing cover; 5. a gasket; 6. a connecting plate; 7. locking screws; 8. a chip module; 9. a chip interface; 10. a signal emitting module; 11. a signal emitting antenna; 12. a signal receiving module; 13. a signal receiving antenna; 14. a first corner protector; 15. a second corner protector; 16. a third corner protector; 17. a threaded hole; 18. a first opening; 19. a second opening; 20. a third opening; 21. a first bonding pad; 22. a second bonding pad; 23. a third pad; 24. a vent hole.

Detailed Description

The technical solutions of the present invention will be described in detail and fully hereinafter with reference to the accompanying drawings of the present invention, and it is to be understood that the described embodiments are only some, but not all embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the utility model is used, and are only for convenience of describing the present invention or simplifying the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed or operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Referring to fig. 1 to 3, the present invention provides an embodiment: a semiconductor packaging structure comprises a substrate 1, a chip module 8 is fixedly connected to the center of the top of the substrate 1, a signal sending module 10 is arranged on the left side of the chip module 8, a signal receiving module 12 is arranged on the right side of the chip module 8, signals can be sent and received independently through the signal sending module 10, the signal sending antenna 11, the signal receiving module 12 and the signal receiving antenna 13, independent control functions are achieved, improvement of control accuracy is facilitated, a ventilation channel can be formed through ventilation holes 24 formed in the left side and the right side of a protective shell 2, improvement of heat dissipation effects is facilitated, first protective corners 14 are arranged on the left side and the right side of the top of the chip module 8, second protective corners 15 are arranged on the left side and the right side of the top of the signal sending module 10, third protective corners 16 are arranged on the left side and the right side of the top of the signal receiving module 12, the outer sides of the chip module 8, the chip interface 9 and the signal sending module 10 are provided with a protective shell 2, the middle part of the rear side of the protective shell 2 is fixedly connected with a first bonding pad 21, the left side of the first bonding pad 21 is provided with a second bonding pad 22, the right side of the first bonding pad 21 is provided with a third bonding pad 23, the left side and the right side of the protective shell 2 are both provided with a plurality of ventilation holes 24, the top of the protective shell 2 is provided with a sealing cover 4, the left side and the right side of the sealing cover 4 are both fixedly connected with a connecting plate 6, the front side and the rear side of the inside of the connecting plate 6 are both in threaded connection with locking screws 7, the outer diameter of the bottom of the locking screws 7 is in threaded connection with fixing columns 3, the chip module 8, the signal sending module 10 and the signal receiving module 12 are installed and fixed inside the protective shell 2, and the sealing effect on the protective shell 2 can be realized through the matching of the sealing cover 4 and the sealing gasket 5, avoid outside dust piece to chip module 8, signal emitting module 10 and signal receiving module 12 cause the hidden danger of damage, cooperate through the inside screw hole 17 that sets up of locking screw 7 and fixed column 3, can realize the fixed to sealed lid 4, reverse rotation locking screw 7 can during the dismantlement, it is very convenient to install and dismantle, first angle bead 14 through setting up, second angle bead 15 and third angle bead 16 can be respectively to chip module 8, signal emitting module 10 and signal receiving module 12 protect, avoid chip module 8, signal emitting module 10 and signal receiving module 12 cause the problem of damage because of external force, service life is prolonged.

The bottom end of the fixed column 3 is respectively fixedly connected to four corners of the top of the substrate 1, the bottom of the protective shell 2 is fixedly connected to the top of the substrate 1, the fixed column 3, the height and thickness of the protective shell 2 can be produced according to the sizes of the chip module 8, the signal sending module 10 and the signal receiving module 12, the front side of the signal sending module 10 is provided with the signal sending antenna 11 for sending signals, the front side of the chip module 8 is provided with the chip interface 9, the front side of the signal receiving module 12 is provided with the signal receiving antenna 13 for receiving signals, the bottoms of the signal sending module 10 and the signal receiving module 12 are both fixedly connected to the top of the substrate 1, a sealing gasket 5 is fixedly connected to the periphery of the outer side of the bottom of the sealing gasket 4, the sealing performance of the semiconductor packaging structure is improved, a threaded hole 17 is formed inside the top end of the fixed column 3, the size of the threaded hole 17 is matched with the size of the locking screw 7 for fixing the signal sending module 4, the front side of the protective shell 2 is respectively provided with the chip interface 9, the positions corresponding to which the signal receiving antenna 11 are provided with the first opening pad 18, the second opening pad 19 and the third opening pad 20, one end of the sealing gasket is connected to the signal receiving module 22, the signal sending module 22, which is connected to the third signal receiving module 23, which is connected to the signal receiving module 22, and the signal receiving module 23, which is connected to the third opening terminal 23.

The utility model discloses a theory of operation: with chip module 8, signal sending module 10 and signal receiving module 12 installation are fixed in the inside of protecting crust 2, can realize the sealed effect to protecting crust 2 through the cooperation of sealed lid 4 and sealed pad 5, avoid outside dust piece to chip module 8, signal sending module 10 and signal receiving module 12 to cause the hidden danger of damage, cooperate with the inside screw hole 17 that sets up of fixed column 3 through locking screw 7, can realize the fixed to sealed lid 4, reverse rotation locking screw 7 during the dismantlement can, signal sending module 10 and signal sending antenna 11 and signal receiving module 12 and signal receiving antenna 13 through setting up can be signals and received signal independently, thereby the function of independent control has been realized, be favorable to promoting the accurate nature of control, through the ventilation hole 24 that sets up in the protecting crust 2 left and right sides, the air of being convenient for flows and dispels the heat.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. A semiconductor packaging structure comprises a substrate, and is characterized in that: the chip module is fixedly connected with the top center of the substrate, a signal sending module and a signal receiving module are arranged on two sides of the chip module respectively, first corner protectors are arranged on corners of the left side and the right side of the top of the chip module respectively, second corner protectors are arranged on corners of the left side and the right side of the top of the signal sending module respectively, third corner protectors are arranged on corners of the left side and the right side of the top of the signal receiving module respectively, a protective shell is arranged on the outer sides of the chip module, the signal receiving module and the signal sending module, a first welding disc is fixedly connected with the middle of the rear side of the protective shell, a second welding disc is arranged on the left side of the first welding disc, a third welding disc is arranged on the right side of the first welding disc, a plurality of ventilation holes are arranged on the left side and the right side of the protective shell respectively, a sealing cover is arranged on the top of the protective shell, a connecting plate is fixedly connected with the left side and the right side of the sealing cover respectively, locking screws are in threaded connection with the front end and the rear end of the connecting plate, and the locking screws are connected with fixing columns in threaded connection with the outer diameters of the bottom of the locking screws.

2. The semiconductor package structure of claim 1, wherein: the bottom ends of the four fixing columns are respectively fixedly connected to four corners of the top of the substrate, and the bottom of the protective shell is fixedly connected to the top surface of the substrate.

3. The semiconductor package structure of claim 1, wherein: the front side of the signal sending module is provided with a signal sending antenna, the front side of the chip module is provided with a chip interface, the front side of the signal receiving module is provided with a signal receiving antenna, and the signal sending antenna, the chip interface and the signal receiving antenna are all arranged in the protective shell.

4. The semiconductor package structure of claim 1, wherein: the bottoms of the signal sending module and the signal receiving module are fixedly connected to the top surface of the substrate.

5. The semiconductor package structure of claim 1, wherein: and a sealing gasket is fixedly connected to the periphery of the outer side of the bottom of the sealing cover.

6. The semiconductor package structure of claim 1, wherein: the top of the fixing column is internally provided with a threaded hole, and the size of the threaded hole is matched with that of the locking screw.

7. The semiconductor package structure of claim 3, wherein: and the positions of the front side wall of the protective shell, which correspond to the chip interface, the signal sending antenna and the signal receiving antenna, are respectively provided with a first opening, a second opening and a third opening.

8. The semiconductor package structure of claim 1, wherein: one end of the first bonding pad is connected with a wiring terminal of the chip module, one end of the second bonding pad is connected with a wiring terminal of the signal sending module, and one end of the third bonding pad is connected with a wiring terminal of the signal receiving module.