CN218384733U - Laminated chip inductor with high heat dissipation performance - Google Patents
Laminated chip inductor with high heat dissipation performance Download PDFInfo
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- CN218384733U CN218384733U CN202222027783.5U CN202222027783U CN218384733U CN 218384733 U CN218384733 U CN 218384733U CN 202222027783 U CN202222027783 U CN 202222027783U CN 218384733 U CN218384733 U CN 218384733U
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Abstract
The utility model belongs to the technical field of the chip inductor, and a stromatolite chip inductor that thermal diffusivity is high is disclosed, include: an inductor body for converting electrical energy to magnetic energy for storage; the top of the containing assembly is provided with a cavity for placing the inductor main body, and the containing assembly is filled with insulating heat-conducting liquid for submerging the inductor main body; the detachable cover plate assembly is arranged at the top of the containing assembly and is used for shielding a cavity at the top of the containing assembly; the both sides of accomodating the subassembly symmetry are the equal fixedly connected with heat-conducting component. The utility model discloses an inductor main part is placed in the stock solution chamber to it has insulating heat conduction liquid to fill between inductor main part and the stock solution chamber, dispels the heat through heat conduction assembly and the supplementary inductor main part of radiator unit, lets the radiating efficiency of device improve, avoids the long-pending hot damage of device during operation, has prolonged device life.
Description
Technical Field
The utility model belongs to the technical field of the chip inductor, concretely relates to stromatolite chip inductor that thermal diffusivity is high.
Background
The chip inductor is a kind of inductor, which is also called surface mount inductor, and like other chip components (SMC and SMD), it is a new generation of leadless or short-lead micro electronic component suitable for Surface Mount Technology (SMT). The welding surfaces of the leading-out ends are on the same plane.
The existing chip inductor is low in heat dissipation efficiency, easy in accumulated heat damage during working of the device and shortened in service life, the existing device is connected with a cable in a welding mode, the cable is not easily reconnected with the device after loosening, the connection difficulty of the device and the cable is increased, and the connection efficiency of the device and the cable is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a stromatolite formula chip inductor that thermal diffusivity is high to the problem of being difficult for and the device reconnection after the radiating efficiency who proposes is lower and the cable is not hard up in solving above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a stacked chip inductor with high heat dissipation performance includes: an inductor body for converting electrical energy to magnetic energy for storage; the top of the containing assembly is provided with a cavity for placing the inductor main body, and the containing assembly is filled with insulating heat-conducting liquid for submerging the inductor main body; the detachable cover plate assembly is arranged at the top of the containing assembly and is used for shielding a cavity at the top of the containing assembly; the two symmetrical sides of the containing assembly are fixedly connected with heat conducting assemblies, and the containing assembly is fixedly connected with an air blowing assembly above the heat conducting assemblies; the insulating heat-conducting liquid is used for conducting heat emitted by the inductor main body to the accommodating assembly; the heat conducting assembly is used for volatilizing heat in the accommodating assembly into air; the air blowing assembly is used for generating air flow to blow the heat conducting assembly.
Preferably, the receiving assembly comprises a heat dissipation box; the bottom of the heat dissipation box is fixedly connected with a bottom foot, and a liquid storage cavity is formed in the top of the bottom foot.
Preferably, the cover plate assembly comprises a top cover; the top cover is arranged above the heat dissipation box, the top of the top cover is symmetrically and fixedly connected with two connecting pipes, and a through hole for the cable to pass through is formed in the top cover; connecting grooves are formed in the two connecting pipes, and one sides of the two connecting pipes are connected with screws in a screwing mode; one end of the screw rod extending into the connecting groove is fixedly connected with a pressing plate; one side of the pressure plate, back to the screw rod, is fixedly connected with a raised head.
Preferably, the inductor body comprises a pedestal; the top of the base frame is fixedly connected with non-magnetic ceramic; electrodes are symmetrically and fixedly connected to the top of the non-magnetic ceramic, and a winding is wound on the non-magnetic ceramic; one end of the winding is fixedly connected with one electrode, and the other end of the winding is fixedly connected with the other electrode.
Preferably, the heat conductive assembly includes a heat dissipation plate; the heat dissipation plates are fixedly connected to the two symmetrical sides of the heat dissipation box, and the heat dissipation holes penetrating through the heat dissipation plates are formed in the heat dissipation plates.
Preferably, the air-blowing assembly includes a side frame; the side frames are fixedly connected to the two symmetrical sides of the heat dissipation box and close to the upper part of the heat dissipation plate, and installation cavities are formed in the side frames; and a heat dissipation fan is arranged in the mounting cavity.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) The utility model discloses an inductor main part is placed in the stock solution chamber to it has insulating heat conduction liquid to fill between inductor main part and the stock solution chamber, dispels the heat through heat-conducting component and the supplementary inductor main part of radiator unit, lets the radiating efficiency of device improve, avoids the long-pending hot damage of device during operation, has prolonged device life.
(2) The utility model discloses an inside the spread groove inserts the cable to the connecting pipe, make the cable pass the top cap and be connected with the inductor main part, rotate the screw rod, make the screw rod remove in that the connecting pipe is inside, drive the clamp plate through the screw rod and remove, make the clamp plate support the inside cable of spread groove, let the cable be difficult for droing after being connected with the device, reduced the device with the cable be connected the degree of difficulty, improved the connection efficiency of device with the cable.
Drawings
FIG. 1 is an external view of the present invention;
FIG. 2 is an internal structure diagram of the present invention;
FIG. 3 is a top view of the side frame of the present invention;
fig. 4 is a plan view of the heat dissipating plate of the present invention;
FIG. 5 is an enlarged view of portion A of FIG. 2;
fig. 6 is a front view of the inductor body of the present invention;
in the figure: 1. footing; 2. a connecting pipe; 3. a side frame; 4. a heat dissipation plate; 5. a screw; 6. a top cover; 7. a heat dissipation box; 8. a liquid storage cavity; 9. an inductor body; 10. connecting grooves; 11. a heat dissipation fan; 12. a mounting cavity; 13. heat dissipation holes; 14. a raised head; 15. pressing a plate; 91. a base frame; 92. a non-magnetic ceramic; 93. winding; 94. and an electrode.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides the following technical solutions:
a laminated chip inductor with high heat dissipation performance comprises:
an inductor main body 9, the inductor main body 9 being configured to convert electric energy into magnetic energy and store the magnetic energy;
the top of the containing component is provided with a cavity for placing the inductor main body 9, and the containing component is filled with insulating heat-conducting liquid submerging the inductor main body 9;
the detachable cover plate assembly is arranged at the top of the storage assembly and is used for shielding a cavity at the top of the storage assembly;
the two symmetrical sides of the containing assembly are fixedly connected with heat conducting assemblies, and the containing assembly is fixedly connected with a blowing assembly above the heat conducting assemblies;
the insulating heat-conducting liquid is used for conducting heat emitted by the inductor main body 9 to the accommodating component;
the heat conducting assembly is used for volatilizing heat in the accommodating assembly into air;
the air blowing assembly is used for generating air flow to blow the heat conducting assembly.
Through the technical scheme, place inductor main part 9 in the cavity at storage assembly top, inductor main part 9 is placed the back, pour insulating heat-conducting liquid into to the cavity at storage assembly top, make insulating heat-conducting liquid flood the inside inductor main part 9 of storage assembly, place the apron subassembly in the storage assembly top again, shelter from the cavity at storage assembly top through the apron subassembly, when inductor main part 9 work generates heat, absorb the heat that inductor main part 9 during operation produced through insulating heat-conducting liquid, make heat conduction to storage assembly on, guide the heat of storage assembly to external through the heat-conducting subassembly, produce the air current through the subassembly of blowing, thereby blow the heat-conducting subassembly, accelerate the radiating efficiency of heat-conducting subassembly.
Specifically, in one embodiment, with respect to the housing assembly:
as shown in fig. 1 and 2, the housing assembly includes a heat dissipation case 7;
the bottom fixedly connected with footing 1 of heat dissipation box 7, and the top of footing 1 has seted up stock solution chamber 8.
Through above-mentioned technical scheme, place inductor main part 9 in the stock solution chamber 8 at heat dissipation box 7 top, pour insulating heat conduction liquid into stock solution chamber 8, support heat dissipation box 7 through footing 1, make heat dissipation box 7 place the back more firm.
Specifically, in one embodiment, with respect to the cover plate assembly:
as shown in fig. 1, 2 and 5, the cover plate assembly includes a top cover 6;
the top cover 6 is arranged above the heat dissipation box 7, the top of the top cover 6 is symmetrically and fixedly connected with the two connecting pipes 2, and the top cover 6 is provided with a through hole for a cable to pass through;
connecting grooves 10 are formed in the two connecting pipes 2, and one sides of the two connecting pipes 2 are connected with screw rods 5 in a screwing mode;
one end of the screw rod 5 extending into the connecting groove 10 is fixedly connected with a pressing plate 15;
a raised head 14 is fixedly connected to one side of the pressure plate 15 opposite to the screw 5.
Through the technical scheme, inductor main part 9 is placed in the stock solution chamber 8 at heat dissipation box 7 top after, pour insulating heat conduction liquid into stock solution chamber 8 after, place top cap 6 in heat dissipation box 7 top, make top cap 6 be fixed in the top of heat dissipation box 7, the cable that will connect inserts to connecting pipe 2 inside spread groove 10, until the cable passes top cap 6 and inductor main part 9 contact, rotate screw rod 5, make screw rod 5 remove in connecting pipe 2, drive clamp plate 15 through screw rod 5 and remove, through the cable in clamp plate 15 base spread groove 10, through the cooperation of plush copper 14, make the cable be connected the back with inductor main part 9 and fasten more.
Specifically, in one embodiment, with respect to the inductor main body 9:
as shown in fig. 2 and 6, the inductor main body 9 includes a pedestal 91;
the top of the base frame 91 is fixedly connected with non-magnetic ceramic 92;
one end of the wire 93 is fixedly connected to one of the electrodes 94, and the other end is fixedly connected to the other electrode 94.
Through the technical scheme, after the cable is connected with the two electrodes 94, the cable is matched with the base frame 91, the nonmagnetic ceramic 92, the winding 93 and the electrodes 94, so that electric energy is converted into magnetic energy to be stored.
Specifically, in one embodiment, with respect to the heat conductive assembly:
as shown in fig. 1 and 4, the heat conductive assembly includes a heat dissipation plate 4;
the heat dissipation plate 4 is fixedly connected to two symmetrical sides of the heat dissipation box 7, and the heat dissipation holes 13 are formed in the heat dissipation plate 4 in a penetrating manner.
Through above-mentioned technical scheme, heating panel 4 work makes heating panel 4 guide the heat of heat dissipation box 7 volatilize, and through the cooperation of louvre 13, it is convenient for dispel the heat to let heating panel 4.
Specifically, in one embodiment, with respect to the air blowing assembly:
as shown in fig. 1 and 3, the air blowing assembly includes a side frame 3;
the side frame 3 is fixedly connected to two symmetrical sides of the heat dissipation box 7 and close to the upper part of the heat dissipation plate 4, and an installation cavity 12 is formed in the side frame 3;
a heat radiation fan 11 is installed inside the installation cavity 12.
Through above-mentioned technical scheme, support heat dissipation fan 11 through installation cavity 12, heat dissipation fan 11 work to produce the air current, blow heating panel 4 through the air current, make heating panel 4 can be faster dispel the heat.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A laminated chip inductor with high heat dissipation performance is characterized in that: the method comprises the following steps:
an inductor body (9), the inductor body (9) for converting electrical energy to magnetic energy for storage;
the top of the containing assembly is provided with a cavity for placing the inductor main body (9), and the containing assembly is filled with insulating heat-conducting liquid for submerging the inductor main body (9);
the detachable cover plate assembly is arranged at the top of the containing assembly and is used for shielding a cavity at the top of the containing assembly;
the two symmetrical sides of the containing assembly are fixedly connected with heat conducting assemblies, and the containing assembly is fixedly connected with a blowing assembly above the heat conducting assemblies;
the insulating heat-conducting liquid is used for conducting heat emitted by the inductor main body (9) to the accommodating assembly;
the heat conducting assembly is used for volatilizing heat in the accommodating assembly into air;
the air blowing assembly is used for generating air flow to blow the heat conducting assembly.
2. The laminated chip inductor with high heat dissipation performance as claimed in claim 1, wherein: the receiving assembly comprises a heat dissipation box (7);
the bottom of the heat dissipation box (7) is fixedly connected with a bottom foot (1), and a liquid storage cavity (8) is formed in the top of the bottom foot (1).
3. The laminated chip inductor with high heat dissipation performance as claimed in claim 2, wherein: the cover plate assembly comprises a top cover (6);
the top cover (6) is arranged above the heat dissipation box (7), the top of the top cover (6) is symmetrically and fixedly connected with the two connecting pipes (2), and the top cover (6) is provided with a through hole for a cable to pass through conveniently;
connecting grooves (10) are formed in the two connecting pipes (2), and one sides of the two connecting pipes (2) are connected with screw rods (5) in a screwing mode;
one end of the screw rod (5) extending into the connecting groove (10) is fixedly connected with a pressing plate (15);
one side of the pressure plate (15), which is back to the screw rod (5), is fixedly connected with a raised head (14).
4. The laminated chip inductor with high heat dissipation performance as claimed in claim 1, 2 or 3, wherein: the inductor body (9) comprises a pedestal (91);
the top of the base frame (91) is fixedly connected with non-magnetic ceramic (92);
electrodes (94) are symmetrically and fixedly connected to the top of the non-magnetic ceramic (92), and a winding (93) is wound on the non-magnetic ceramic (92);
one end of the winding (93) is fixedly connected with one electrode (94), and the other end of the winding is fixedly connected with the other electrode (94).
5. The laminated chip inductor with high heat dissipation performance as claimed in claim 2 or 3, wherein: the heat conducting assembly comprises a heat dissipation plate (4);
the heat dissipation plate (4) is fixedly connected to two symmetrical sides of the heat dissipation box (7), and the heat dissipation plate (4) is provided with penetrating heat dissipation holes (13).
6. The stacked chip inductor with high heat dissipation performance as claimed in claim 5, wherein: the air blowing assembly comprises a side frame (3);
the side frame (3) is fixedly connected to the two symmetrical sides of the heat dissipation box (7) and is close to the upper part of the heat dissipation plate (4), and the side frame (3) is provided with an installation cavity (12);
and a heat dissipation fan (11) is arranged in the mounting cavity (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222027783.5U CN218384733U (en) | 2022-08-03 | 2022-08-03 | Laminated chip inductor with high heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222027783.5U CN218384733U (en) | 2022-08-03 | 2022-08-03 | Laminated chip inductor with high heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218384733U true CN218384733U (en) | 2023-01-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222027783.5U Active CN218384733U (en) | 2022-08-03 | 2022-08-03 | Laminated chip inductor with high heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218384733U (en) |
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- 2022-08-03 CN CN202222027783.5U patent/CN218384733U/en active Active
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