CN218348429U

CN218348429U - Chemical tank

Info

Publication number: CN218348429U
Application number: CN202222012368.2U
Authority: CN
Inventors: 梁堰风; 张丝柳; 苏界; 王家成
Original assignee: Yangtze Memory Technologies Co Ltd
Current assignee: Yangtze Memory Technologies Co Ltd
Priority date: 2022-08-02
Filing date: 2022-08-02
Publication date: 2023-01-20
Anticipated expiration: 2032-08-02

Abstract

Disclosed is a chemical tank comprising: a first tank body; a gas input assembly; and a gas assist input assembly; the gas input assembly includes: the air outlet pipe is positioned at the bottom of the first groove body and extends along the first direction, and an air outlet hole is formed in one side, away from the bottom surface of the first groove body, of the air outlet pipe; the air inlet pipe is positioned on the side wall of one side of the first groove body and is parallel to the side wall of the first groove body, and the air inlet pipe is communicated with the air outlet pipe at the first end of the air outlet pipe; the gas auxiliary input assembly at least comprises an auxiliary gas outlet pipe, the auxiliary gas outlet pipe is positioned at the bottom of the first groove body and extends along the second direction, and one side of the auxiliary gas outlet pipe, which is far away from the bottom surface of the groove, is provided with a gas outlet hole; wherein, the first direction and the second direction are intercrossed, and the first section and the second end of the air outlet pipe are opposite. The utility model discloses a chemical bath sets up gaseous supplementary input subassembly to the pressure of giving vent to anger to the outlet duct both ends compensates, solves at the both ends of outlet duct, the difference problem of the sculpture speed of wafer.

Description

Chemical tank

Technical Field

The utility model relates to the technical field of semiconductors, in particular to chemical tank.

Background

The chemical tank is used for etching or cleaning wafers placed in the chemical tank, and for enabling chemical solution to meet preset conditions, a circulation assembly is usually needed to realize circulation of the chemical solution and treatment outside the chemical tank.

However, the gas outlet pressure of the gas input assembly is higher at the end close to the gas source, and is lower at the end far away from the gas source, so that the corrosion rates of the wafers placed at different positions are obviously different.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a chemical tank, which is provided with a gas auxiliary input assembly to compensate the gas outlet pressure of one end of the gas source away from the gas input assembly.

The utility model provides a chemical tank, include:

a first tank body;

a gas input assembly located within the first cell body; and

a gas assist input assembly located within the first cell body;

the gas input assembly includes:

the air outlet pipe is positioned at the bottom of the first groove body and extends along a first direction, and an air outlet hole is formed in one side, away from the bottom surface of the first groove body, of the air outlet pipe; and

the air inlet pipe is close to the side wall of one side of the first groove body and is parallel to the side wall of the first groove body, and the air inlet pipe is communicated with the air outlet pipe at the first end of the air outlet pipe;

the gas auxiliary input assembly at least comprises an auxiliary gas outlet pipe, and the auxiliary gas outlet pipe is positioned at the bottom of the first groove body and extends along the second direction; the auxiliary air outlet pipe is adjacent to the second end of the air outlet pipe, and an air outlet hole is formed in one side, far away from the bottom surface of the tank, of the auxiliary air outlet pipe; the first direction and the second direction are mutually crossed, and the first end and the second end of the air outlet pipe are opposite.

In some embodiments, the air outlet holes on the auxiliary air outlet pipe are uniformly arranged on the auxiliary air outlet pipe.

In some embodiments, the gas input assembly comprises a plurality of gas outlet pipes, the gas outlet pipes are arranged in parallel at the bottom of the first groove body, and the distance between every two adjacent gas outlet pipes is equal.

In some embodiments, the gas inlet assembly comprises a plurality of gas inlet tubes, each of which communicates with one of the outlet tubes at a first end of the outlet tube.

In some embodiments, the gas input assembly comprises at least one connecting tube connecting any two outlet tubes at the second end of the outlet tubes.

In some embodiments, the gas-assisted input assembly further comprises an auxiliary gas inlet pipe, the auxiliary gas inlet pipe is located at the side wall of one side of the first groove body and is parallel to the side wall of the first groove body, and the auxiliary gas inlet pipe is communicated with the auxiliary gas outlet pipe.

In some embodiments, a second channel is further included, the second channel surrounding the first channel.

In some embodiments, the liquid distributor further comprises a circulation assembly, the circulation assembly comprises a liquid outlet pipe located inside the first trough body and an external circulation pipeline located outside the first trough body and the second trough body, one end of the external circulation pipeline is communicated with the second trough body, and the other end of the external circulation pipeline is communicated with the liquid outlet pipe.

In some embodiments, the external circulation pipeline is connected with a water pump, a heating unit and a filter in sequence.

The utility model provides a chemical bath sets up the outlet duct is kept away from the one end of intake pipe sets up gaseous supplementary input subassembly, gaseous supplementary input subassembly is kept away from gaseous input subassembly the pressure of giving vent to anger of the one end of air supply compensates, solves the first end and the second end of outlet duct, via the different problem of pressure of the venthole combustion gas on the outlet duct is further solved the first end and the second end of outlet duct, the difference problem of the sculpture Rate (Etch Rate, ER) of wafer.

In a preferred embodiment, the gas auxiliary input assembly is an auxiliary gas inlet pipe, the auxiliary gas inlet pipe is additionally arranged at the second end of the gas outlet pipe, so that the gas inlet amount of the gas inlet pipe is the same, the gas outlet pressure of the second end of the gas outlet pipe far away from the gas source is compensated, and the gas input assembly and the gas auxiliary input assembly are integrally communicated, so that the gas input assembly and the gas auxiliary input assembly are simpler in structure.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

fig. 1 shows a schematic view of a chemical tank according to a first embodiment of the present invention;

fig. 2 shows a schematic view of a wafer placed in the chemical bath in a first embodiment of the present invention;

fig. 3 shows a schematic structural view of a gas input assembly according to a first embodiment of the present invention;

fig. 4 shows a schematic structural diagram of a set of gas input assemblies according to a first embodiment of the present invention;

fig. 5 shows a schematic structural view of a gas-assisted input assembly according to a first embodiment of the present invention;

fig. 6 shows a schematic structural diagram of a gas input assembly and a gas auxiliary input assembly according to a second embodiment of the present invention.

Detailed Description

The invention will be described in more detail below with reference to the accompanying drawings. Like elements are denoted by like reference numerals throughout the various figures. For purposes of clarity, the various features in the drawings are not drawn to scale. In addition, certain well known components may not be shown.

The present invention may be presented in a variety of forms, some of which are described below.

Fig. 1 shows a schematic view of a chemical tank according to a first embodiment of the present invention; fig. 2 is a schematic view showing a wafer placed in the chemical bath according to the first embodiment of the present invention; fig. 3 shows a schematic structural view of a gas input assembly of a first embodiment of the present invention; fig. 4 shows a schematic structural view of a set of connection pipes according to a first embodiment of the present invention; the chemical tank of the present embodiment is generally used to etch, clean, etc. a wafer and any other object to be etched, and the following embodiment will take the wafer as an example, but the present embodiment is not limited thereto. As shown in fig. 1 to 4, the chemical tank 100 includes a tank body 110, a circulation assembly 120, a gas input assembly 130, and a gas auxiliary input assembly 150.

As shown in fig. 1 and 2, the tank 110 includes a first tank 111 and a second tank 112 surrounding the first tank 111. The first tank 111 is used for containing a chemical solution and a wafer 900 to be etched/cleaned, specifically, when the chemical solution is contained in the first tank 111, the wafer 900 is placed in the first tank 111, and the chemical solution in the first tank 111 etches or cleans the surface of the wafer 900.

The first tank 111 has a rectangular shape, and includes a tank bottom 1111 and a sidewall 1112 surrounding the tank bottom 1111, and the tank bottom 1111 and the sidewall 1112 define a space for receiving the chemical solution and the wafer 900. It is understood that in other embodiments, the shape of the first groove 111 may also be a cylinder, and a person skilled in the art may specifically select the shape of the first groove 111 according to needs, and the embodiment is not limited thereto.

The second tank 112 is used for adding a chemical solution to the first tank 111. The side wall of the second tank body 112 is higher than the side wall of the first tank body 111, and when the liquid level of the chemical solution in the second tank body 112 is higher than the side wall of the first tank body 111, the chemical solution in the second tank body 112 is injected into the first tank body 111 from the top of the first tank body 111.

The chemical solution in the second tank 112 is also added into the first tank 111 through the circulation component 120. Specifically, the circulation assembly 120 includes an external circulation pipeline 121 located outside the tank body 110 and an outlet pipeline 122 located inside the tank body 110. A liquid inlet of the external circulation pipeline 121 is communicated with the second tank 112, a liquid outlet of the external circulation pipeline 121 is communicated with the liquid outlet pipeline 122, and the liquid outlet pipeline 122 is arranged in the first tank 111.

The external circulation pipeline 121 is sequentially connected with a water pump 1211, a heating unit 1212 and a filter 1213, the chemical solution in the second tank 112 is injected into the heating unit 1212 through the water pump 1211 for heating, the heated chemical solution is filtered by the filter 1213 and then enters the liquid outlet pipeline 122, and the heated chemical solution enters the first tank 121 through the liquid outlet pipeline 122, so that the chemical solution in the second tank 112 is added to the first tank 111.

As shown in fig. 3 and 4, the gas input assembly 130 includes an outlet pipe 131 and an inlet pipe 132 communicating with the outlet pipe 131. The gas inlet assembly 130 includes a plurality of gas outlet pipes 131, the plurality of gas outlet pipes 131 are located on the tank bottom 1111 of the first tank body 111 and extend along a first direction (for example, the Z direction), and a gas outlet hole 131a is provided at a side away from the tank bottom 1111 to deliver gas into the first tank body 111 through the gas outlet hole 131 a.

In this embodiment, the number of the air inlet pipes 132 is equal to the number of the air outlet pipes 131, and each air inlet pipe 132 is communicated with a group of air outlet pipes 131 at a first end of the air outlet pipe 132. The gas inlet pipe 132 is used for conveying gas to the gas outlet pipe 132, the gas entering the gas outlet pipe 131 enters the first tank body through the gas outlet hole 131a in the gas outlet pipe 131 to disturb the chemical solution in the first tank body 111, so that the chemical solution is fully contacted with the wafer to be etched/cleaned, and the gas is preferably inert gas such as nitrogen, argon, helium and the like which does not react with the chemical solution and the wafer.

The surface of the wafer 900 is perpendicular to the extending direction of the gas outlet pipe 131, so that each gas outlet pipe 131 can deliver gas to the surface of each wafer. In a specific embodiment, the outlet tube 131 extends along the Z direction, and when wafers are placed in the first slot 111, the wafers are stacked and arranged in the Z direction, and a plane on which a surface of the wafer is located is, for example, an XOY plane, that is, a plane on which a surface of the wafer 900 is located is perpendicular to the extending direction of the outlet tube 131.

The gas input assembly 130 further comprises a plurality of connecting pipes 133, and each connecting pipe 133 connects any two sets of gas outlet pipes 131 at the second ends of the gas outlet pipes (the first ends and the second ends of the gas outlet pipes are opposite) so as to ensure that no opening exists at both ends of each gas outlet pipe 131. Specifically, the first end of each air outlet pipe 131 is communicated with the air inlet pipe 132, and the second end of each air outlet pipe 131 is communicated with the other air outlet pipes 131 through the connecting pipe 133, so that the air outlet pipes 131 only convey air into the first groove body 111 through the air outlet holes 131a on the air outlet pipes 131, and when one ends of the air outlet pipes 131 in the first groove body 111 are opened, the air flow caused by conveying the air into the first groove body 111 through the open ends of the air outlet pipes 131 is prevented from being concentrated, and further, the difference of the etching efficiency of the excessively concentrated air flow to different wafers is prevented from being too large.

Further, a plurality of outlet pipes 131 are arranged in parallel on the tank bottom 1111, and the distances between adjacent outlet pipes 132 are the same. The gas outlet pipe 132 of the gas input assembly 130 is uniformly arranged on the bottom 1111 of the first tank body 111, so that the gas input assembly 130 can uniformly deliver gas to the first tank body 111. In addition, the plurality of groups of gas input assemblies 130 simultaneously transmit gas to the surface of the wafer 900, so that the chemical solution in the first tank 111 can be fully contacted with the wafer 900 placed in the first tank 111, and the large difference of Etching Rates (ER) of wafers at different positions is prevented.

Further, the plurality of air inlet pipes 132 are located on the same side wall of the first tank body 111, so that the plurality of air inlet pipes 132 are more convenient to connect with the same air source.

In this embodiment, since the first end of the outlet pipe 131 is close to the inlet pipe 132, the pressure of the gas discharged from the gas outlet hole 131a at the first end of the outlet pipe 131 is relatively high, and the pressure of the gas discharged from the gas outlet hole 131a of the outlet pipe 131 is relatively low when the first end of the outlet pipe 131 is far away from the inlet pipe 132, which causes the pressure of the gas discharged from the gas outlet hole 131a of the outlet pipe 131 to be different at the first end and the second end of the outlet pipe 131, and further causes the etching Rate (Etch Rate, ER) of the wafer to be relatively high at the first end and the second end of the outlet pipe 131.

In view of this, the present embodiment also provides a gas assist input assembly 150. Fig. 5 shows a schematic structural view of a gas-assisted input assembly according to a first embodiment of the present invention; as shown in fig. 5, each set of the gas auxiliary input assembly 150 includes an auxiliary gas inlet pipe 151 and an auxiliary gas outlet pipe 152 communicated with the auxiliary gas inlet pipe 151.

The auxiliary outlet pipe 152 is located on the tank bottom 1111 of the first tank 111 and extends along a second direction, the first direction and the second direction are mutually crossed, wherein the mutual crossing of the first direction and the second direction includes that the first direction and the second direction are mutually perpendicular, the first direction and the second direction are taken as an example for explanation, an outlet hole 152a is opened on one side of the auxiliary outlet pipe 152 away from the tank bottom 1111, and the outlet holes 152a are uniformly arranged on the auxiliary outlet pipe 152. In this embodiment, the auxiliary air outlet pipe 152 is adjacent to the second end of the air outlet pipe 131, and the auxiliary air outlet pipe 152 is vertically arranged at the second end of the air outlet pipe 131 and is not in contact with the air outlet pipe 131. One end of the auxiliary air outlet pipe 152 is communicated with the auxiliary air inlet pipe 151, and air enters the auxiliary air outlet pipe 152 from an air inlet of the auxiliary air inlet pipe 151 and enters the first groove body 111 through an air outlet hole 152a in the auxiliary air outlet pipe 152. The auxiliary outlet pipe 152 is located at the second end of the outlet pipe 131 to compensate for the outlet pressure of the second end of the outlet pipe 131 far away from the gas source, so as to solve the problem that the pressures of the gas discharged from the outlet holes 131a of the outlet pipe 131 at the first end and the second end of the outlet pipe 131 are different, and further solve the problem of the difference in the etching rates (Etch Rate, ER) of the wafers at the first end and the second end of the outlet pipe 131.

In this embodiment, the gas auxiliary input assembly 150 includes two sets of the gas auxiliary input assemblies 150, which have the same structure and are symmetrically disposed, so as to increase the uniformity of the gas entering the gas auxiliary input assembly 150. In other embodiments, the number of gas assist input assemblies 150 may be arbitrarily set.

A second embodiment of the present invention provides a chemical tank, which comprises a tank body, a circulation component, a gas input component 230, and a gas auxiliary input component 250. The structure of the trough body and the circulating assembly is the same as that in the first embodiment, and the specific structure is shown in fig. 1 and fig. 2. Unlike the first embodiment, the gas input assembly 230 and the gas assist input assembly 250 are integrally provided.

Fig. 6 shows a schematic structural view of a gas input assembly and a gas auxiliary input assembly of a second embodiment of the present invention; as shown in fig. 6, the gas input assembly 230 includes an outlet pipe 231 and an inlet pipe 232 communicated with the outlet pipe 231. The gas input assembly 230 comprises a plurality of gas outlet pipes 231, the gas outlet pipes 231 are located on the bottom 2111 of the first tank body 211, and a gas outlet hole 231a is formed in one side away from the bottom 2111 of the first tank body, so that gas is conveyed into the first tank body 111 through the gas outlet hole 231 a.

Unlike the first embodiment, in this embodiment, the gas input assembly 230 includes a set of gas inlet pipes 232, and the first ends of the plurality of gas outlet pipes 232 are communicated with the set of gas inlet pipes 232 through the first connecting pipe 2331.

The gas auxiliary input assembly 250 includes a set of auxiliary gas inlet pipes 251, and the second ends of the plurality of gas outlet pipes 232 are communicated with the auxiliary gas inlet pipes 251 through second connecting pipes 2332, that is, the gas inlet pipe 231 and the auxiliary gas inlet pipes 251 are respectively communicated with the gas outlet pipes 232 at the two ends of the gas outlet pipes 232. In this embodiment, the air inlet pipe 231 and the auxiliary air inlet pipe 251 are communicated at one end away from the air outlet pipe 232 and are connected to an air supply source together.

In this embodiment, the auxiliary gas inlet pipe 251 is additionally arranged at the second end of the gas outlet pipe 231, so that the gas inlet amount of the gas inlet pipe 251 is the same, the gas outlet pressure of the second end of the gas outlet pipe 231 far away from the gas source is compensated, and the gas input assembly 230 and the gas auxiliary input assembly 250 are integrally communicated, so that the structures of the gas input assembly 230 and the gas auxiliary input assembly 250 are simpler.

The utility model provides a chemical bath sets up the outlet duct is kept away from the one end of intake pipe sets up gaseous supplementary input subassembly, gaseous supplementary input subassembly is to keeping away from the pressure of giving vent to anger of the one end of air supply compensates, solves the first end and the second end of outlet duct, via the different problem of pressure of the venthole combustion gas on the outlet duct is further solved the first end and the second end of outlet duct, the difference problem of the sculpture Rate (Etch Rate, ER) of wafer.

In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A chemical tank, comprising:

a first tank body;

a gas input assembly located within the first cell body; and

a gas-assisted input assembly located within the first cell body;

the gas input assembly includes:

the air outlet pipe is positioned at the bottom of the first tank body and extends along a first direction, and an air outlet hole is formed in one side, away from the bottom surface of the first tank body, of the air outlet pipe; and

the gas auxiliary input assembly at least comprises an auxiliary gas outlet pipe, and the auxiliary gas outlet pipe is positioned at the bottom of the first groove body and extends along the second direction; the auxiliary air outlet pipe is adjacent to the second end of the air outlet pipe, and an air outlet hole is formed in one side, far away from the bottom surface of the groove, of the auxiliary air outlet pipe; the first direction and the second direction are mutually crossed, and the first end and the second end of the air outlet pipe are opposite.

2. The chemical tank of claim 1, wherein the air outlet holes of the auxiliary air outlet pipe are uniformly arranged on the auxiliary air outlet pipe.

3. The chemical tank of claim 1, wherein the gas input assembly comprises a plurality of gas outlet pipes, the gas outlet pipes are arranged at the bottom of the first tank body in parallel, and the distance between every two adjacent gas outlet pipes is equal.

4. A chemical tank as claimed in claim 1 or 3, wherein the gas input assembly comprises a plurality of gas inlet pipes, each of which communicates with one of the gas outlet pipes at a first end thereof.

5. A chemical tank as claimed in claim 4, wherein the gas inlet assembly comprises at least one connecting tube connecting any two outlet tubes at the second end of the outlet tubes.

6. The chemical tank of claim 1, wherein the gas auxiliary input assembly further comprises an auxiliary gas inlet pipe, the auxiliary gas inlet pipe is located at one side wall of the first tank body and is parallel to the side wall of the first tank body, and the auxiliary gas inlet pipe is communicated with the auxiliary gas outlet pipe.

7. A chemical tank as claimed in claim 1, further comprising a second tank body surrounding the first tank body.

8. The chemical tank of claim 7, further comprising a circulation assembly, wherein the circulation assembly comprises a liquid outlet pipe located inside the first tank body and an external circulation pipeline located outside the first tank body and the second tank body, one end of the external circulation pipeline is communicated with the second tank body, and the other end of the external circulation pipeline is communicated with the liquid outlet pipe.

9. The chemical tank of claim 8, wherein the external circulation line is connected with a water pump, a heating unit and a filter in sequence.