CN218345565U - Corrosion-resistant electroplating bath of integrated circuit lead frame equipment - Google Patents
Corrosion-resistant electroplating bath of integrated circuit lead frame equipment Download PDFInfo
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- CN218345565U CN218345565U CN202222188261.3U CN202222188261U CN218345565U CN 218345565 U CN218345565 U CN 218345565U CN 202222188261 U CN202222188261 U CN 202222188261U CN 218345565 U CN218345565 U CN 218345565U
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Abstract
The utility model relates to the technical field of plating baths, in particular to a corrosion-resistant plating bath of integrated circuit lead frame equipment, which comprises a bath body, wherein a conductive structure is arranged in the bath body, the conductive structure comprises an upper conductive plate and a lower conductive plate, the upper conductive plate and the lower conductive plate are both titanium metal plates, and platinum-gold plating layers are formed on the surfaces of the upper metal plate and the lower metal plate; a liquid spraying pipe is arranged in the groove body along the length direction, and a plurality of liquid spraying holes transversely aligned to the lead frame are formed in the liquid spraying pipe; when in electroplating, the upper conductive plate and the lower conductive plate with the electroplated platinum layer and the lead frame form a conductive electric field simultaneously, and the titanium metal plate has better corrosion resistance due to the extremely high stability of platinum, so that the corrosion of liquid in the tank body to the titanium metal plate can be reduced, the wave crests of the upper conductive plate and the lower conductive plate are not easy to passivate, the better conductive effect can be kept, and the electroplating quality is better; through the liquid sprayed from the liquid spraying holes, cations in the groove can be dissociated to the object to be measured quickly to form a coating.
Description
Technical Field
The utility model relates to a plating bath technical field especially relates to the corrosion-resistant plating bath of integrated circuit lead frame equipment.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a strip-shaped plate body, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.
The metal titanium plating processing is a general coating processing technology, after the surface coating of the lead frame of the integrated circuit is plated with titanium, the stability is very good, the friction is greatly reduced, and in addition, the very attractive golden surface and high wear resistance are generally used in the decoration industry; it is widely used in medical and food industries due to its high thermal stability and chemical inertness. The electroplating device is mainly used for electroplating a metal workpiece, and workers are required to place the metal workpiece inside the electroplating device and then perform electroplating treatment.
When the lead frame of the integrated circuit is electroplated, the titanium metal plate is used as an anode conductive end to be installed in an electroplating bath, an electric field arc is formed between a wave crest on the surface of the titanium metal plate and the lead frame to be electroplated, the electrolyte in the electroplating bath is strong corrosive liquid, the liquid level of the electrolyte is higher than that of the titanium metal plate, the titanium metal plate is soaked in the electroplating bath for a long time and reacts with the electrolyte, the wave crest of the titanium metal plate is easily corroded to generate a passivation phenomenon, the passivated wave crest is uneven with an electric field formed by the lead frame, and the electroplating effect is general.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a corrosion-resistant plating bath of integrated circuit lead frame equipment to the not enough of prior art.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the corrosion-resistant electroplating bath of the integrated circuit lead frame equipment comprises a bath body, wherein a conductive structure and a material passing channel for a lead frame material belt to pass through are arranged in the bath body, the conductive structure comprises an upper conductive plate positioned above the material passing channel and a lower conductive plate positioned below the material passing channel, the upper conductive plate and the lower conductive plate are both titanium metal plates, and electroplating platinum layers are formed on the surfaces of the upper conductive plate and the lower conductive plate; the liquid spray pipe is arranged in the groove body along the moving direction of the lead frame material belt, and the liquid spray pipe is formed to be provided with a plurality of liquid spray holes transversely aligned to the lead frame material belt.
Further: the cell body is internally provided with a top support piece for installing the upper current conducting plate and a bottom support piece for installing the lower current conducting plate.
Further: the top support piece includes that the last backup pad of just installing at the cell body top of arranging along cell body width direction goes up the backup pad and installs the last pressfitting piece that supports to going up the current conducting plate bottom surface.
Further: the bottom support piece comprises a plurality of bottom support seats arranged at the bottom of the tank body at intervals, and the bottom support seats are provided with lower pressing pieces for preventing the lower conductive plates from tilting upwards.
Further: still be provided with the transport structure who is located between last current conducting plate and the current conducting plate down in the cell body, transport structure includes the delivery board of arranging along cell body length direction, and the lead frame can advance along the delivery board and carry.
Further: the distance between the upper conductive plate and the conveying plate is equal to the distance between the lower conductive plate and the conveying plate.
Further: the conveying plate is respectively located the direction of advance both sides of lead frame, and the spray tube transversely is located the conveying plate outside, and the conveying plate shaping has the passageway that passes through that supplies spray tube spun liquid direction, and the through passage is transversely aligned with the hydrojet hole.
Further: liquid supply holes are formed in the groove walls at the two ends of the groove body respectively, the outer ends of the liquid supply holes are connected with connectors, and the two ends of the liquid spraying pipe are inserted into the liquid supply holes respectively.
Further: the cell body still is provided with the board support piece of carrying out the installation to the delivery board, and board support piece includes that the bottom fits in the end supporting shoe of cell body diapire, and end supporting shoe top is connected bottom the delivery board.
Further: the plate support piece further comprises an adjusting plate located at the top of the conveying plate, two ends of the adjusting plate are embedded into the groove wall of the groove body, the top of the conveying plate is provided with a pull rod, and the adjusting plate is provided with an adjusting groove used for slidably mounting the pull rod.
The utility model has the advantages that: when in electroplating, the upper conductive plate and the lower conductive plate with the electroplated platinum layer and the lead frame form a conductive electric field simultaneously, and the titanium metal plate has better corrosion resistance due to the extremely high stability of platinum, so that the corrosion of liquid in the tank body to the titanium metal plate can be reduced, the wave crests of the upper conductive plate and the lower conductive plate are not easy to passivate, the better conductive effect can be kept, and the electroplating quality is better; through the liquid sprayed out from the liquid spraying holes, cations in the tank can be quickly dissociated to the object to be measured to form a coating.
Drawings
FIG. 1 is a schematic view of the structure of the plating bath.
FIG. 2 is a schematic view of the connection between the electroplating tank and the anode conductive structure.
FIG. 3 is a schematic view of the connection between the electroplating tank and the conveying structure.
The reference numerals include:
1-a tank body,
11-anode conductive structure, 12-upper conductive plate, 13-upper supporting plate, 14-upper knob rod,
15-upper pressing block, 16-lower conducting plate, 17-bottom supporting seat, 18-lower knob rod, 19-lower pressing block,
2-a liquid spraying tube,
21-liquid spray hole, 22-liquid supply hole, 23-joint,
3-a conveying structure,
31-conveying plate, 32-passing channel, 33-bottom supporting block, 34-adjusting plate, 35-adjusting groove,
36-pull rod, 37-fastening nut.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1-3, the corrosion-resistant electroplating bath of the integrated circuit lead frame device includes a bath body 1 filled with an electrolyte, a lead frame to be electroplated enters the bath body 1, an anode conductive structure 11 is arranged in the bath body 1, the anode conductive structure 11 includes an upper conductive plate 12 positioned above the lead frame and a lower conductive plate 16 positioned below the lead frame, the upper conductive plate 12 and the lower conductive plate 16 are both titanium metal plates, and platinum-electroplating layers are formed on the surfaces of the upper metal plate and the lower metal plate in an electroplating manner; during electroplating, the upper conductive plate 12 and the lower conductive plate 16 with the electroplated platinum layer and the lead frame form a conductive electric field simultaneously, and the titanium metal plate has better corrosion resistance due to the extremely high stability of platinum, so that the corrosion of liquid in the tank body 1 to the titanium metal plate can be reduced; the wave crests of the upper conductive plate 12 and the lower conductive plate 16 are not easily passivated, a good conductive effect can be kept, and the electroplating quality is good.
Be provided with the top support piece to last current conducting plate 12 installation in the cell body 1, top support piece includes that the direction of arrangement of 1 width direction along the cell body just installs the last backup pad 13 at 1 top of cell body, it is perpendicular with the direction of advance of lead frame to go up the direction of arrangement of backup pad 13, it installs the last pressfitting spare that carries out the support to last current conducting plate 12 bottom surface to go up backup pad 13, it includes can install knob pole 14 in last backup pad 13 with turning round to go up the pressfitting spare, briquetting 15 is installed to knob pole 14 bottom, there is the clearance between last briquetting 15 and the last backup pad 13, this clearance is used for the location to install current conducting plate 12, can install the current conducting plate through rotating knob pole 14.
Be provided with the bottom support piece that carries out the installation to lower current conducting plate 16 in the cell body 1, bottom support piece includes that a plurality of intervals are installed at the bottom sprag seat 17 of 1 bottom of cell body, 16 bottom facings of lower current conducting plate are laminated at bottom sprag seat 17 top, the laminating piece is installed the laminating piece at bottom sprag seat 17, but the laminating piece is including installing the lower knob pole 18 at bottom sprag seat 17 with turning round, lower knob pole 18 nestification has briquetting 19 down, lower current conducting plate 16 is arranged in between briquetting 19 and the bottom sprag seat 17 down, through rotating lower knob pole 18, can prevent the perk that makes progress of lower current conducting plate 16, the realization is to current conducting plate 16 stable erection down.
Still be provided with transport structure 3 that is located between last current conducting plate 12 and the current conducting plate 16 in the cell body 1, this transport structure 3 is for supplying the punchthrough of lead frame to pass through, transport structure 3 includes transport plate 31 of arranging along 1 length direction of cell body, transport plate 31 embeds there is negative pole conductive structure, electrically conducts with the lead frame negative pole when carrying, and the lead frame can advance along transport plate 31 and carry, and transport plate 31 is located the direction of advance both sides of lead frame respectively, and the interval between two transport plates 31 can supply the lead frame to pass through just. Cell body 1 still is provided with the board support piece who carries out the installation to conveying board 31, board support piece includes bottom supporting shoe 33 of bottom laminating in cell body 1 diapire, bottom supporting shoe 33 top is connected bottom conveying board 31, board support piece is still including the adjusting plate 34 that is located conveying board 31 top, the gomphosis of adjusting plate 34 both ends in the cell wall of cell body 1, pull rod 36 is installed at conveying board 31 top, adjusting plate 34 shaping has the adjustment tank 35 that is used for slidable mounting pull rod 36, pull rod 36 nestification has fastening nut 37, elasticity through fastening nut 37, adjustable pull rod 36 is in the position of adjustment tank 35, thereby adjust the interval between two conveying boards 31, lead frame with the different width of confession passes through.
In addition, the distance between the upper conductive plate 12 and the conveying plate 31 is equal to the distance between the lower conductive plate 16 and the conveying plate 31, and the upper conductive plate 12 and the lower conductive plate 16 are parallel to each other horizontally, during electroplating, the electric fields formed between the upper conductive plate 12 and the lead frame, the lower conductive plate 16 and the lead frame are relatively uniform, the formed electric arcs are approximately straight lines parallel to each other, metal ions can be guided to dissociate on the lead frame relatively uniformly according to the directions of the electric fields and the electric arcs, the formed electroplating layer is relatively uniform, and the electroplating effect is better.
The conveying plate 31 is positioned on the inner side of the liquid spraying pipe 2, the liquid spraying pipe 2 is parallel to the conveying plate 31, the conveying plate 31 is formed with a passage 32 for guiding and passing liquid sprayed from the liquid spraying pipe 2, the passage 32 is transversely aligned with the liquid spraying hole 21, electrolyte sprayed from the liquid spraying pipe 2 can flow onto a lead frame through the passage 32, so that anode metal ions guided in the electrolyte can rapidly dissociate onto the lead frame, and a titanium metal coating is rapidly formed on the lead frame according to a formed electric field and an electric arc.
In conclusion, the present invention has the above-mentioned excellent characteristics, so that it can be used to enhance the effectiveness of the prior art and has practicability, and thus it is a product with practical value.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention, and it is to be understood that the present invention is not limited to the above embodiments, but may be modified within the scope of the present invention.
Claims (10)
1. Corrosion-resistant plating bath of integrated circuit lead frame equipment, including the cell body, its characterized in that: the groove body is internally provided with a conductive structure and a material passing channel for the lead frame material belt to pass through, the conductive structure comprises an upper conductive plate positioned above the material passing channel and a lower conductive plate positioned below the material passing channel, the upper conductive plate and the lower conductive plate are both titanium metal plates, and platinum-electroplating layers are formed on the surfaces of the upper conductive plate and the lower conductive plate; the liquid spray pipe is arranged in the groove body along the moving direction of the lead frame material belt, and the liquid spray pipe is formed to be provided with a plurality of liquid spray holes transversely aligned to the lead frame material belt.
2. The corrosion-resistant plating bath for integrated circuit lead frame devices of claim 1, wherein: and a top support piece for mounting the upper conductive plate and a bottom support piece for mounting the lower conductive plate are arranged in the groove body.
3. The corrosion-resistant plating bath for an integrated circuit lead frame apparatus of claim 2, wherein: the top support piece includes that what arrange and install at the last backup pad at cell body top along cell body width direction, goes up the backup pad and installs the last pressfitting piece that supports last current conducting plate bottom surface.
4. The corrosion-resistant plating bath for integrated circuit lead frame devices of claim 2, wherein: the bottom support piece comprises a plurality of bottom support seats arranged at the bottom of the tank body at intervals, and a lower pressing piece for preventing the lower conductive plate from tilting upwards is arranged on each bottom support seat.
5. The corrosion-resistant plating bath for an integrated circuit lead frame apparatus of claim 1, wherein: still be provided with the transport structure who is located between last current conducting plate and the lower current conducting plate in the cell body, transport structure includes the delivery board of arranging along cell body length direction, and the lead frame can advance along the delivery board and carry.
6. The corrosion-resistant plating bath for an integrated circuit lead frame apparatus of claim 5, wherein: the distance between the upper conductive plate and the conveying plate is equal to the distance between the lower conductive plate and the conveying plate.
7. The corrosion-resistant plating bath for integrated circuit lead frame devices of claim 6, wherein: the conveying plates are respectively positioned on two sides of the advancing direction of the lead frame, the liquid spraying pipe is transversely positioned on the outer side of the conveying plates, and the conveying plates are provided with a passage for guiding and passing liquid sprayed by the liquid spraying pipe, and the passage is transversely aligned with the liquid spraying holes.
8. The corrosion-resistant plating bath for integrated circuit lead frame devices of claim 1, wherein: and liquid supply holes are formed in the groove walls at the two ends of the groove body respectively, the outer ends of the liquid supply holes are connected with connectors, and the two ends of the liquid spraying pipe are inserted into the liquid supply holes respectively.
9. The corrosion-resistant plating bath for an integrated circuit lead frame apparatus of claim 5, wherein: the cell body still is provided with the board support piece of carrying out the installation to the delivery board, and board support piece includes the bottom supporting shoe that the bottom laminating in the cell body diapire, and bottom supporting shoe top is connected with the delivery board bottom.
10. The corrosion-resistant plating bath of an integrated circuit lead frame apparatus of claim 9, wherein: the plate support piece further comprises an adjusting plate positioned at the top of the conveying plate, two ends of the adjusting plate are embedded into the groove wall of the groove body, the top of the conveying plate is provided with a pull rod, and the adjusting plate is provided with an adjusting groove used for slidably installing the pull rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222188261.3U CN218345565U (en) | 2022-08-19 | 2022-08-19 | Corrosion-resistant electroplating bath of integrated circuit lead frame equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222188261.3U CN218345565U (en) | 2022-08-19 | 2022-08-19 | Corrosion-resistant electroplating bath of integrated circuit lead frame equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218345565U true CN218345565U (en) | 2023-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222188261.3U Active CN218345565U (en) | 2022-08-19 | 2022-08-19 | Corrosion-resistant electroplating bath of integrated circuit lead frame equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218345565U (en) |
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2022
- 2022-08-19 CN CN202222188261.3U patent/CN218345565U/en active Active
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