CN218240840U - Electronic device - Google Patents

Abstract

The application provides an electronic device, and relates to the technical field of electronic devices. The problem that the noise that is used for solving current electronic equipment during operation, fan produced influences user and uses experience. The electronic equipment comprises a shell, a fan and a silencing layer. The housing includes a first wall. The fan is arranged inside the shell. The sound-deadening layer is arranged inside the shell, and at least part of the sound-deadening layer is arranged between the fan and the first wall plate. The utility model provides an electronic equipment can absorb the noise that the fan produced through amortization layer to reduce the noise, thereby be favorable to promoting user experience and feel.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

Notebook computers are electronic devices commonly used in people's daily work and life. The notebook computer is more popular with people due to the convenience of carrying. The existing notebook computer adopts a fan to dissipate heat. However, the fan generates noise during operation, so that the fan becomes a core source of noise in the notebook computer, and the use experience of a user is affected.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides electronic equipment, which is used for solving the problem that a fan in the electronic equipment generates noise and influences the use experience of a user.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

the embodiment of the application provides electronic equipment which comprises a shell, a fan and a sound attenuation layer. The housing includes a first wall. The fan is arranged inside the shell. The sound-deadening layer is arranged inside the shell, and at least part of the sound-deadening layer is arranged between the fan and the first wall plate.

The electronic equipment that this application embodiment provided, owing to be provided with the amortization layer between the first wallboard of fan and casing, consequently, at the fan rotation in-process, the noise that produces when the amortization layer can absorb the fan rotation to at the in-process that the user used electronic equipment, can reduce the noise that the fan produced, in order to promote user experience and feel.

In some embodiments of the present application, the sound-deadening layer covers a surface of the fan facing the first wall panel, and an edge of the sound-deadening layer extends in a direction away from the fan in a direction parallel to the first wall panel. This structure can make the amortization layer cover the fan completely to extend around the fan, thereby can absorb the noise of diffusing to all directions, in order to promote sound absorption effect.

In some embodiments of the present application, the distance between the edge of the sound-deadening layer and the edge of the fan in the direction parallel to the first wall plate is H, where H is 0-20 mm. Within the size range, the noise reduction layer can absorb noise, and can not cover other elements, so that the normal heat dissipation of other elements is not influenced.

In some embodiments of the present application, the sound-absorbing layer is provided with an avoiding hole, and the avoiding hole is opposite to the air inlet of the fan. This structure can make and dodge the hole and dodge the air intake of fan to can not block the fan air inlet, so that the fan can normally work.

In some embodiments of the present application, the shape of the avoiding hole is adapted to the shape of the air inlet of the fan, and along a direction parallel to the first wall plate, a distance between an edge of the avoiding hole and an edge of the air inlet of the fan is L, where L is greater than or equal to 0 and less than or equal to 5mm. In the size range, on one hand, the silencing layer can be prevented from blocking the air inlet of the fan, so that the normal work of the fan cannot be influenced by the silencing layer; on the other hand, the sound attenuation layer can be ensured to cover the outer surface of the fan, so that the noise generated by the fan can be absorbed.

In some embodiments of the present application, the edge of the avoiding hole coincides with a vertical projection of the edge of the air inlet of the fan on the first wall plate. Thus, the amortization layer can cover the surface of fan towards first wallboard, avoids the air intake of fan through dodging the hole simultaneously, in the noise absorption, can not block the fan air inlet to when realizing that the fan normally works, absorb the noise that the fan produced.

In some embodiments of the present application, the area of the avoiding hole is smaller than the area of the air inlet of the fan.

In some embodiments of the present application, the area of the avoiding hole is larger than the area of the air inlet of the fan.

In some embodiments of the present application, the electronic device further includes a heat pipe, the heat pipe including a first portion and a second portion, the first portion being opposite to the outlet of the fan, the sound deadening layer covering the first portion. Under this structure, cover the first portion of heat pipe through the amortization layer to the heat of isolated first portion hinders the thermal convection between heat pipe first portion and the first wallboard, with the effect that weakens the thermal convection, makes the heat of first portion all dispel the heat the cooling through the wind of fan air outlet, thereby can avoid the heat transfer of first portion to first wallboard on, be favorable to reducing the holistic temperature of casing.

In some embodiments of the present application, there are two fans, a sound-absorbing layer is disposed between each fan and the first wall plate, the heat pipe includes two first portions, the second portion is disposed between the two first portions, and the two first portions are disposed in one-to-one correspondence with the air outlets of the two fans. Through setting up two fans, be favorable to promoting the heat dissipation capacity to further promote electronic equipment's radiating effect.

In some embodiments of the present application, the material of the sound damping layer is sound absorbing cotton, sound insulating cotton, glass wool or other porous media.

In some embodiments of the present application, the material of the sound damping layer is sound damping cotton.

In some embodiments of the present application, the electronic device includes a notebook computer, and the first wall panel is a bottom wall of the notebook computer.

Drawings

Fig. 1 is a block diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2 is a structural diagram of an electronic device according to an embodiment of the present disclosure after a display screen is fastened to a housing;

fig. 3 is a structural diagram of a housing of an electronic device according to an embodiment of the present disclosure;

FIG. 4 is a partial block diagram of the interior of a housing provided by an embodiment of the present application;

FIG. 5 is a cross-sectional view of a partial structure of another electronic device according to an embodiment of the present application;

fig. 6 is a structural diagram of a sound damping layer and a fan according to an embodiment of the present disclosure;

FIG. 7 is a block diagram of another embodiment of an acoustical layer and a fan;

FIG. 8 is a schematic diagram of a fan and a sound-deadening layer according to an embodiment of the present disclosure;

fig. 9 is a structural diagram of another sound-deadening layer and a fan according to an embodiment of the present disclosure;

FIG. 10 is a schematic diagram of a fan and a sound-deadening layer according to an embodiment of the present disclosure;

FIG. 11 is a noise test chart of an electronic device without the noise reduction layer provided in the present application;

FIG. 12 is a noise test chart of an electronic device provided with an acoustically damping layer as provided herein;

fig. 13 is a diagram illustrating an internal structure of a housing of an electronic device according to an embodiment of the present disclosure;

fig. 14 is a diagram illustrating an internal structure of a housing of another electronic device according to an embodiment of the present disclosure;

fig. 15 is a diagram illustrating an internal structure of a housing of another electronic device according to an embodiment of the present application;

fig. 16 is a cross-sectional view of a portion of the structure of the electronic device 10 provided in fig. 15.

Reference numerals: 10-an electronic device; 100-a housing; 110-a bottom shell; 120-upper cover; 200-a display screen; 300-a keyboard; 400-a rotating shaft; 500-a fan; 510-an air inlet; 520-an air outlet; 600-a heat pipe; 610-a first portion; 620-second portion; 700-a sound damping layer; 710-avoiding holes.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature.

Further, in the present application, directional terms such as "upper" and "lower" are defined with respect to a schematically-disposed orientation of components in the drawings, and it is to be understood that these directional terms are relative concepts that are used for descriptive and clarity purposes and that will vary accordingly with respect to the orientation in which the components are disposed in the drawings.

In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate.

The application provides an electronic device which can comprise a notebook computer, a tablet personal computer (tablet personal computer), a personal computer, a vehicle-mounted device and other devices needing data storage. The embodiment of the present application does not particularly limit the specific form of the electronic device, and for convenience of description, the electronic device is taken as a notebook computer as an example.

As can be seen from the above description, referring to fig. 1, fig. 1 is a structural diagram of an electronic device 10 according to an embodiment of the present application, where in the embodiment, the electronic device 10 is a notebook computer. The electronic device 10 includes a housing 100, a display 200 and a keyboard 300, wherein the keyboard 300 is disposed on an upper surface of the housing 100, and the display 200 is hinged to the housing 100 through a hinge 400, so that the display 200 can be turned upwards to form an included angle with the upper surface of the housing 100; alternatively, referring to fig. 2, fig. 2 is a structural diagram of the electronic device 10 according to the embodiment of the present disclosure after the display screen 200 is fastened to the housing 100, so that the display screen 200 can be fastened to the housing 100, and when the display screen 200 is fastened to the housing 100, the display screen 200 shown in fig. 1 is opposite to the upper surface of the housing 100.

In addition, referring to fig. 3, fig. 3 is a structural diagram of a housing 100 of the electronic device 10 according to an embodiment of the present disclosure, where the housing 100 includes a bottom shell 110 and an upper cover 120, a keyboard 300 is disposed on the upper cover 120, a containing cavity is formed between the bottom shell 110 and the upper cover 120, and components such as a Central Processing Unit (CPU), a memory, a display card, and a motherboard are disposed in the containing cavity.

As these components generate heat during operation, please refer to fig. 4, fig. 4 is a partial structure diagram of the inside of the housing 100 according to an embodiment of the present application, a fan 500 and a heat pipe 600 are further disposed in the accommodating cavity, the heat pipe 600 includes a first portion 610 and a second portion 620, the first portion 610 is opposite to the air outlet 520 of the fan 500, the second portion 620 is disposed near the components, when the components generate heat, the heat is absorbed by the second portion 620 of the heat pipe 600 and conducted to the first portion 610 of the heat pipe 600, then the first portion 610 is cooled by the air blown by the fan 500, and the hot air formed after the heat on the first portion 610 of the heat pipe 600 is absorbed is exhausted to the outside through the air outlet on the bottom case 110, so as to achieve heat dissipation and cooling of the components.

However, the fan 500 generates noise during operation, and the noise also forms a core source of noise in the electronic device 10, thereby affecting the user experience.

To solve the above problem, please refer to fig. 5, fig. 5 is a partial sectional view of another electronic device 10 according to an embodiment of the present disclosure, in which the electronic device 10 further includes a sound-deadening layer 700, and the sound-deadening layer 700 is at least partially disposed between the fan 500 and the first wall of the housing 100.

Wherein, this application uses electronic device 10 as the notebook computer as an example, and the first wallboard of casing 100 refers to the diapire of drain pan 110 promptly, because there is certain clearance between the diapire of fan 500 and drain pan 110, consequently, sets up noise damping layer 700 in this clearance, absorbs the noise that produces when fan 500 rotates through noise damping layer 700 to realize reducing the noise, thereby at the in-process that the user used electronic device 10, can reduce the interference of noise, be favorable to promoting user experience and feel.

The sound-absorbing layer 700 may be made of sound-absorbing cotton, which has advantages of high sound absorption rate and good sound insulation performance, and thus can absorb noise generated by the fan 500. Alternatively, the sound-absorbing layer 700 may also be made of soundproof cotton, glass wool, or other porous medium materials, which is not limited in this application. The following description will be given by taking the sound absorbing layer 700 as an example of sound absorbing cotton.

Based on this, in order to make the sound-deadening layer 700 completely cover the fan 500, please refer to fig. 6, fig. 6 is a structural diagram of the sound-deadening layer 700 and the fan 500 provided in the embodiment of the present application, an edge of the sound-deadening layer 700 provided in the present application extends in a direction parallel to the bottom wall of the bottom case 110 like a direction away from the fan 500, that is, a vertical projection of the sound-deadening layer 700 on the bottom wall of the bottom case 110 completely covers a vertical projection of the fan 500 on the bottom case 110. Thus, the noise-reducing layer 700 completely covers the surface of the fan 500 facing the bottom wall of the bottom case 110, so that noise generated during the operation of the fan 500 passes through the noise-reducing layer 700 when the noise is transmitted, and can be absorbed by the noise-reducing layer 700 to the maximum extent, thereby reducing noise to the maximum extent and facilitating the improvement of user experience.

In some embodiments, with reference to fig. 6, the distance between the edge of the sound-deadening layer 700 and the edge of the fan 500 along the direction parallel to the bottom wall of the bottom case 110 is H, and H is greater than or equal to 0 and less than or equal to 20mm. For example, the distance H between the edge of the sound-deadening layer 700 shown in fig. 6 and the edge of the fan 500 may be 10mm, that is, the edge of the sound-deadening layer 700 extends 10mm from the edge of the fan 500 in a direction away from the fan 500, so that the sound-deadening layer 700 can completely cover the surface of the fan 500. Further, H may be 2mm, 4mm, 6mm, 8mm, 12mm, 14mm, 16mm, 18mm, or the like, and this is not particularly limited in the present application.

In addition, the sound-absorbing layer 700 extends to the periphery of the fan 500, and can cover the components disposed at the periphery of the fan 500 to block heat convection, for example, the fins disposed at the air outlet 520 of the fan 500 for heat dissipation can prevent heat from being transferred to the bottom wall of the bottom case 110 through the sound-absorbing layer 700, so that the heat on the fins is cooled by heat dissipation of the fan, thereby facilitating to reduce the temperature of the bottom case 110.

It should be noted that, the distance H between the edge of the sound-deadening layer 700 and the edge of the fan 500 may be equal to the distance H at any position along the circumference of the edge of the fan 500 shown in fig. 6, that is, the overall shape of the sound-deadening layer 700 is the same as the shape of the fan 500; alternatively, referring to fig. 7, fig. 7 is a structural diagram of another sound-deadening layer 700 and a fan 500 provided in the embodiment of the present application, where a distance between a partial region between an edge of the sound-deadening layer 700 and an edge of the fan 500 may also be H, that is, a shape of the sound-deadening layer 700 is different from a shape of the fan 500, for example, the sound-deadening layer 700 shown in fig. 7 may be a rectangular structure, which can completely cover the fan 500. Therefore, the present application is not particularly limited thereto.

In addition, while absorbing noise, in order to prevent the sound-deadening layer 700 from affecting the normal operation of the fan 500, please refer to fig. 8, where fig. 8 is a structural diagram of another sound-deadening layer 700 and the fan 500 provided in the embodiment of the present application, an avoiding hole 710 may be formed in the sound-deadening layer 700, and the avoiding hole 710 is opposite to the air inlet 510 of the fan 500. The avoidance holes 710 can ensure that the fan 500 can normally supply air, so as to ensure that the fan 500 can normally work, and prevent the noise reduction layer 700 from blocking the air supply of the fan 500.

In some embodiments, with reference to fig. 8, the shape of the avoiding hole 710 is adapted to the shape of the air inlet 510 of the fan 500, and the distance between the edge of the avoiding hole 710 and the edge of the air inlet 510 of the fan 500 along the direction parallel to the bottom wall of the casing 100 is L, where L is greater than or equal to 0mm and less than or equal to 5mm. The shape of the avoiding hole 710 and the shape of the air inlet 510 of the fan 500 may be circular, regular polygon, ellipse, etc. Moreover, since the distance between the edge of the avoiding hole 710 and the edge of the air inlet 510 of the fan 500 is L, that is, the distances between the two at various positions are equal, the center points of the avoiding hole 710 and the air inlet 510 of the fan 500 coincide with each other.

For example, the shape of the avoiding hole 710 and the shape of the air inlet 510 of the fan 500 are both circular, that is, the center of the avoiding hole 710 coincides with the center of the air inlet 510 of the fan 500. Referring to fig. 9, fig. 9 is a structural diagram of another sound-absorbing layer 700 and a fan 500 according to an embodiment of the present application, when L =0, an aperture of the avoiding hole 710 is equal to a diameter of the air inlet 510 of the fan 500, that is, a vertical projection of an edge of the avoiding hole 710 and an edge of the air inlet 510 of the fan 500 on a bottom wall of the bottom chassis 110 coincide with each other. In this case, the sound deadening layer 700 may not shield the air inlet 510 of the fan 500, but may completely cover the surface of the fan 500 facing the bottom case 110, so that the noise generated by the fan 500 may be absorbed to the maximum extent while the fan 500 is normally operated.

When L =2mm, and the aperture of the avoiding hole 710 is larger than the diameter of the air inlet 510 of the fan 500, that is, the sound deadening layer 700 shown in fig. 8 does not cover the edge of the fan 500 close to the air inlet 510; or L =2mm, and the aperture of the avoiding hole 710 is smaller than the diameter of the air inlet 510 of the fan 500, please refer to fig. 10, where fig. 10 is a structural diagram of another sound-deadening layer 700 and the fan 500 provided in the embodiment of the present application, that is, the sound-deadening layer 700 covers the edge of the air inlet 510 of the fan 500 (the dashed circle in the figure indicates the edge of the air inlet 510). In this case, the avoiding hole 710 of the sound-deadening layer 700 and the vertical projection of the air inlet 510 of the fan 500 on the bottom wall of the bottom case 110 form two concentric circles, which do not completely coincide. The L may be 1mm, 1.8mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.7mm, or the like, and the present application is not limited thereto.

Moreover, since the diameter difference between the two circles (i.e., the edge of the air inlet 510 and the edge of the avoiding hole 710) is small, when the aperture of the avoiding hole 710 is larger than the diameter of the air inlet 510 of the fan 500, the sound absorption effect of the sound absorption layer 700 is not affected; when the aperture of the avoiding hole 710 is smaller than the diameter of the air inlet 510 of the fan 500, the sound-deadening layer 700 does not block the air inlet 510 of the fan 500. Thus, only one size of the sound-deadening layer 700 needs to be manufactured, and the sound-deadening layer 700 can be applied to various fans 500, for example, when the diameter of the avoiding hole 710 on the sound-deadening layer 700 is 20mm, the diameter of the air inlet 510 on the fan 500 can be within the range of 15mm to 25mm, and the sound-deadening layer 700 can be used. Thereby, the universality of the silencing layer 700 is improved, and the production cost is favorably reduced.

For example, noise tests can be performed on devices without the sound-deadening layer 700 and devices with the sound-deadening layer 700, please refer to fig. 11, where fig. 11 is a noise test chart of the electronic device 10 without the sound-deadening layer 700 provided in the present application, and when the sound-deadening layer 700 is not provided between the fan 500 and the bottom case 110, the noise of the whole device reaches 41.27dB; referring to fig. 12, fig. 12 is a noise test chart of the electronic device 10 provided with the noise reduction layer 700 provided in the present application, wherein when the noise reduction layer 700 is disposed between the fan 500 and the bottom case 110, the noise of the whole device reaches 39.8dB. Therefore, the noise reduction layer 700 is arranged between the fan 500 and the bottom shell 110, so that the noise generated by the whole machine in the working process can be reduced, the influence of the noise on a user is reduced, and the user experience is improved.

In addition, referring to fig. 13, fig. 13 is an internal structure diagram of the housing 100 of the electronic device 10 according to the embodiment of the present disclosure, in order to improve the heat dissipation effect of the electronic device 10, the electronic device 10 may include two fans 500, and the heat pipe 600 may include two first portions 610 and one second portion 620, where the second portion 620 is disposed between the two first portions 610, and the two first portions 610 are disposed in one-to-one correspondence with the air outlets 520 of the two fans 500 respectively. In this way, the heat dissipation capacity of the electronic device 10 can be increased by the two fans 500, so as to improve the heat dissipation effect of the electronic device 10.

In addition, referring to fig. 14, fig. 14 is a structure diagram of the inside of the housing of another electronic device 10 according to the embodiment of the present disclosure, and the noise reduction layer 700 is disposed between each fan 500 and the bottom wall of the bottom housing 110, so that noise generated by the two fans 500 can be absorbed, the heat dissipation effect is improved, noise generated by the whole device can be reduced, and the user experience can be further improved.

On the basis, please refer to fig. 15 and fig. 16, fig. 15 is a structural diagram of an inside of a housing 100 of another electronic device 10 according to an embodiment of the present application, and fig. 16 is a partial structural cross-sectional view of the electronic device 10 provided in fig. 15. The sound-absorbing layer 700 may further cover the first portion 610 of the heat pipe 600, and thus, since the material (e.g., sound-absorbing cotton) of the sound-absorbing layer 700 has better heat-insulating property, the sound-absorbing layer 700 covers the first portion 610 of the heat pipe 600, that is, the first portion 610 of the heat pipe 600 is separated from the bottom case 110 by the sound-absorbing layer 700, heat of the first portion 610 can be isolated, thermal convection between the first portion 610 of the heat pipe 600 and the bottom case 110 is blocked, and the effect of thermal convection is weakened, so that the heat of the first portion 610 can be dissipated only through wind from the wind outlet 520 of the fan 500, and thus the heat of the first portion 610 of the heat pipe 600 is prevented from being transferred to the bottom case 110, which is beneficial to reducing the overall temperature of the bottom case 110.

Illustratively, the device provided with the sound-deadening layer 700 and the device not provided with the sound-deadening layer 700 may be tested under the same condition of TDP (Thermal Design Power), for example, 45W in TDP and 25 ℃. It should be noted that the TDP is mainly applied to the CPU, and the TDP value of the CPU refers to heat generated when the maximum load is reached (the utilization rate of the CPU is 100% of the theory), and the heat can be dissipated by a heat dissipation system of the device, so as to ensure that the temperature of the CPU is still within a safety range when the TDP value is maximum.

And, since the distance between the rotating shaft 400 and the heat pipe 600 is short, the F7 key on the keyboard 300 of the electronic device 10 corresponds to the position of the CPU (i.e., the temperature at the F7 key is greatly influenced by the CPU), and therefore, the temperatures at the bottom case 110, the rotating shaft 400 and the F7 key are respectively tested. The test results are shown in the following table:

TDP 45W	is provided with a sound-deadening layer 700	Without the noise damping layer 700
			Bottom case 110	42.80℃	45.00℃
Rotating shaft 400	43.60℃	45.50℃
			F7	42.10℃	43.20℃
Environment(s) of	25.00℃	25.00℃

As can be seen from the above table, the temperatures of several locations on the device near the heat pipe 600 and the CPU were tested, respectively. Specifically, in the apparatus provided with the noise-damping layer 700, the temperature of the bottom case 110 was lowered by 2.2 ℃, the temperature of the rotation shaft 400 was lowered by 1.9 ℃, and the temperature at the F7 key was lowered by 1 ℃ as compared to the apparatus not provided with the noise-damping layer 700. Namely, the whole temperature of the equipment provided with the noise damping layer 700 is low, and meanwhile, the heat dissipation effect of the equipment is favorably improved after the noise damping layer 700 is added.

In summary, since the above devices are tested under the same TDP and the same rotation speed of the fan 500, the test result shows that the heat dissipation effect of the device provided with the sound-deadening layer 700 is better. In this way, when the device provided with the sound-deadening layer 700 and the device not provided with the sound-deadening layer 700 operate under the same condition (for example, when the load reaches 100%), since the device provided with the sound-deadening layer 700 has a better heat dissipation effect, the temperature of the CPU of the device provided with the sound-deadening layer 700 is lower, which is advantageous for improving the performance of the CPU.

Moreover, because the heat dissipation effect of the device provided with the sound-absorbing layer 700 is better, when the temperature of the CPU of the device provided with the sound-absorbing layer 700 is the same as that of the CPU of the device not provided with the sound-absorbing layer 700 during the working process, the CPU of the device provided with the sound-absorbing layer 700 can exert better performance, i.e., the working performance of the CPU is improved.

The particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (13)

1. An electronic device, comprising:

a housing comprising a first wall;

the fan is arranged inside the shell;

the sound attenuation layer is arranged inside the shell, and at least part of the sound attenuation layer is arranged between the fan and the first wall plate.

2. The electronic device of claim 1, wherein the sound-damping layer covers a surface of the fan facing the first wall plate, and edges of the sound-damping layer extend in a direction away from the fan in a direction parallel to the first wall plate.

3. The electronic device of claim 2, wherein a distance between an edge of the sound-deadening layer and an edge of the fan in a direction parallel to the first wall plate is H, and 0 ≦ H ≦ 20mm.

4. The electronic device of claim 2, wherein the sound reduction layer is provided with an avoiding hole, and the avoiding hole is opposite to the air inlet of the fan.

5. The electronic device of claim 4, wherein the shape of the avoiding hole is adapted to the shape of the air inlet of the fan, and the distance between the edge of the avoiding hole and the edge of the air inlet of the fan is L along a direction parallel to the first wall plate, wherein L is greater than or equal to 0 and less than or equal to 5mm.

6. The electronic device of claim 5, wherein a vertical projection of a rim of the avoiding hole and a rim of the air inlet of the fan on the first wall plate coincide.

7. The electronic device of claim 5, wherein the area of the avoiding hole is smaller than the area of the air inlet of the fan.

8. The electronic device of claim 5, wherein an area of the avoiding hole is larger than an area of an air inlet of the fan.

9. The electronic device according to any one of claims 1 to 8, further comprising a heat pipe including a first portion and a second portion, the first portion being opposite to the air outlet of the fan, the sound deadening layer covering the first portion.

10. The electronic device according to claim 9, wherein there are two fans, the sound-deadening layer is disposed between each fan and the first wall plate, the heat pipe includes two first portions, the second portion is disposed between the two first portions, and the two first portions are disposed in one-to-one correspondence with air outlets of the two fans.

11. The electronic device according to any one of claims 1 to 8, wherein the material of the sound-deadening layer is sound-deadening cotton, soundproof cotton, or glass cotton.

12. The electronic device of claim 11, wherein the sound-deadening layer is made of sound-absorbing cotton.

13. The electronic device according to any one of claims 1 to 8, wherein the electronic device comprises a notebook computer, and the first wall panel is a bottom wall of the notebook computer.

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