TWI458891B - Fan module - Google Patents

Description

Fan module

The invention relates to a fan module, in particular to a fan module with a muffling device.

In the field of heat dissipation of electronic components, fans have become a device often used in the field of heat dissipation because of the low threshold of fan manufacturing technology and the advantages of low cost, high reliability, and high durability. The fan uses its blades to rotate to apply pressure to the air to cause air to flow, and to reduce the temperature around the fan by forced convection by flowing air to achieve heat dissipation. However, when the fan leaves disturb the air, the fan blades rub against the air, which produces a wind-cut sound at the edge of the blade. In addition, when the air flows through the air inlet or outlet of the fan, it will be at the air outlet or air inlet of the fan. Rubbing against the frame creates airflow noise.

Although the faster the fan blade speed or the larger the fan blade area, more and stronger air volume can be produced, but the volume of the above-mentioned wind-cutting sound and airflow noise is increased. A fan that is generally suitable for dissipating heat from electronic components has a sound intensity of 10 to 20 decibels (dB), which may be unbearable noise for the user. In addition, when the airflow circulates in the fan frame, the airflow will partially impinge on the fan blades, causing the blades to vibrate, which in turn causes the fan frame to resonate and generate additional vibration noise.

In order to reduce the volume of these noises, it can be achieved by reducing the rotational speed of the blades or reducing the area of the blades, but it is not possible to achieve the ideal air volume when the fan is operating. However, in order to reduce the noise while maintaining the ideal air volume, an external noise reduction device is required. To eliminate noise sound. At present, the sound absorbing device applied to the fan covers the entire fan by a casing cover larger than the fan, and two openings are formed in the casing, so that the fan can suck and discharge the airflow through the two openings. This kind of silencing method mainly restricts the noise generated by the fan to the inside of the casing by the casing, so as to prevent the fan noise from being transmitted to the external environment, thereby achieving the effect of silencing. However, such a muffling method must provide a casing larger than the fan volume, and therefore tends to be limited in space by use, and is difficult to apply to general electronic components, such as a graphics processing chip, a heat dissipation system, or an electronic device. The interior occupies too much space and seriously affects the composition of other electronic components.

In addition, another method of noise reduction applied to the fan is to provide a porous structure in the fan frame corresponding to the inner wall surface of the fan blade, so that when the fan is in operation, the wind cut sound generated by the blade is transmitted outward. It can be absorbed by the porous structure to reduce the fan noise. However, the internal space of the fan frame is equivalent to the volume of the fan impeller. Therefore, the distance between the fan blade and the air outlet of the frame and the air inlet is too short, so that the porous structure of the inner wall surface of the frame cannot be The friction noise generated by the airflow is absorbed at the air outlet and the air inlet of the frame. Furthermore, since the sound absorbing range of the porous structure is related to the area of the inner wall surface of the frame, and the area of the inner wall surface of the frame is related to the volume of the fan impeller, the air outlet and the inlet of the blade and the frame still exist. The problem of too short a distance between the tuyères, which limits the sound absorption range of the porous structure, and results in a limited sound absorption effect of the frame on the fan noise.

In view of the above problems, the present invention provides a fan module, which solves the problem that the conventional fan module is prone to noise during operation, for example, cannot be reduced or eliminated. In addition to the wind-cutting sound generated by the friction of the air at the edge of the blade, the noise generated by the friction between the airflow at the air outlet and the air inlet of the fan and the fan vibration caused by the airflow impinging on the fan blade.

The invention discloses a fan module, which comprises a fan and a muffling device. The fan is formed with a tuyere, the muffling device comprises a first muffling component, and the first muffling component is attached to one side of the fan forming the tuyere, and the first A first air flow passage is formed on the sound absorbing member, and the first air flow passage corresponds to a tuyere of the fan.

The utility model has the advantages that the first sound absorbing component is attached to the air outlet side of the fan, and when the fan is operated, the wind noise generated by the blade friction air and the noise generated by the airflow friction fan air outlet can be The air outlet of the fan is transferred into the first air flow passage of the first sound absorbing member and is absorbed by the porous structure in the first air flow passage. In addition, by the manner in which the first silencing element is attached to the fan, the amount of vibration generated by the fan is absorbed by the first silencing element, and the vibration noise generated when the fan module operates can be further eliminated.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

Referring to FIG. 1A to FIG. 1C , the fan module 10 of the first embodiment of the present invention includes a muffling device 100 and a fan 200. The muffling device 100 includes a first silencing component 120 and a first silencing component 120. The first silencing element 120 may be formed of a porous structure by a porous material or other sound absorbing material having a sound absorbing function. In the present embodiment, the material of the first silencing element 120 is made of foam as an example, but is not limited thereto. First silencing element 120 A first air flow passage 122 penetrating through the first sound absorbing member 120 is formed therein, and a wall surface of the first sound absorbing member 120 located in the first air flow passage 122 is formed with a recessed wall surface and communicates with one of the first air flow passages 122 The buffer space 124 is used to increase the surface area of the first silencing element 120 within the first air flow passage 122.

In assembly, the first silencing element 120 can be, but is not limited to, adhered to the fan 200 with an adhesive medium (such as silicone or double-sided tape, etc.), so that the first silencing element 120 is closely attached to the surface of the fan 200. The fan 200 has a frame 220 and an impeller 240 disposed in the frame 220, and a plurality of blades 242 are looped on the impeller 240. The frame 220 has a wind outlet side and an air inlet side. The air outlet side of the frame 220 is formed with an air outlet 222, and an air inlet 224 is formed on the air inlet side. The air outlet 222 is connected to the air inlet 224, and the air outlet 222 is provided. And the air inlets 224 respectively penetrate the opposite sides of the frame 220. The first sound absorbing member 120 is attached to the air outlet side surface of the frame 220, and the first air flow passage 122 corresponds to the air outlet 222 of the frame 220, wherein the inner diameter of the first air flow passage 122 matches the air outlet 222 of the frame 220. The inner diameter, that is, the inner diameter of the first air flow passage 122 is slightly smaller than, equal to, or slightly larger than the inner diameter of the air outlet 222 of the frame 220.

As shown in FIG. 1A to FIG. 1D, the fan module 10 can be applied to an electronic device to provide heat dissipation to electronic components disposed on the electronic device, for example, to a graphics card or a host computer. On the board, a micro processing chip set such as a graphics processing unit (GPU) or a central processing unit (CPU) is provided for heat dissipation. In the embodiment, the fan module 10 is applied to the display card 30 as an example, but is not limited thereto. The display card 30 is provided with at least one micro processing chip set 320 and a plurality of electronic components. 340, and a heat sink 360 is disposed on the microchip wafer set 320, wherein the heat sink 360 is composed of a base and a plurality of heat sink fins. The fan module 10 is disposed on one side of the display card 30 adjacent to the heat sink 360.

When the fan 200 starts to operate, the impeller 240 of the fan 200 drives the fan blade 242 to rotate to generate an air flow, which enters the frame 220 via the air inlet 224 and flows from the air outlet 222 to the first sound absorbing member 120. Thereafter, the airflow is further blown to the heat dissipation fins of the heat sink 360 via the first air flow passage 122 of the first sound absorbing member 120, so that the airflow is heat exchanged on the surface of the heat sink 360 in a heat convection manner. During this process, the wind-cutting sound generated by the fan blades 242 of the fan 200 rubbing the air in the frame 220 will be transmitted to the first airflow passage 122 of the first sound absorbing member 120 and the buffer space 124 as the airflow is driven, thereby being The first silencing element 120 is absorbed by the porous structure in the first air flow passage 122 and the buffer space 124, so that the wind cut sound is eliminated or isolated in the first sound deadening element 120, thereby reducing or eliminating The noise generated by the fan 200 during operation. Meanwhile, since the first silencing element 120 is attached to the air outlet side surface of the frame 220, when the airflow generates friction at the inner edge of the air outlet 222 of the frame 220, the friction sound will be directly applied to the first silencing element 120. The first air flow passage 122 absorbs to achieve the purpose of eliminating frictional sound or reducing the amount of friction sound.

In addition, since the first silencing element 120 is disposed on the surface of the frame 220 of the fan 200 in a close fitting manner, when the impeller 240 of the fan 200 rotates within the frame 220 and a part of the air current impinges on the vibration generated by the blade 242, Slowed or eliminated by absorption by the porous structure of the first silencing element 120, in addition to reducing or eliminating noise generated by the fan 200 via the resonance effect, and preventing the fan 200 from being The frame 220 strikes the display card 30 to avoid knocking noise between the two.

Referring to FIG. 2A and FIG. 2B , in the fan module 10 disclosed in the second embodiment of the present invention, the muffling device 100 includes a plurality of first silencing elements 120 and a second silencing element 140 . The first silencing element 120 is formed with a first air flow passage 122 and a buffer space 124 connected to each other, and the first air flow passage 122 penetrates the first sound absorbing member 120. A second air flow passage 142 and a buffer space 144 are formed on the second sound absorbing member 140, and the second air flow passage 142 extends through the second sound absorbing member 140. The first silencing element 120 and the second silencing element 140 are respectively composed of a porous material, or are composed of other sound absorbing materials having a sound absorbing function, so that the first silencing element 120 and the second silencing element 140 are respectively formed porous. Sexual structure. In the present embodiment, the materials of the first silencing element 120 and the second silencing element 140 are made of foam as an example, but are not limited thereto.

The plurality of first silencing elements 120 and the second silencing elements 140 are respectively adhered to the surface of the fan 200 by an adhesive medium such as silicone or double-sided tape, so that the first silencing element 120 and the second silencing element 140 are closely attached to the fan. 200 on. The fan 200 has a frame 220 and an impeller 240 disposed in the frame 220, and a plurality of blades 242 are looped on the impeller 240. The frame 220 has a wind outlet side and an air inlet side. The air outlet side of the frame 220 is formed with an air outlet 222, and an air inlet 224 is formed on the air inlet side. The air outlet 222 and the air inlet 224 are connected, and respectively penetrate through. The opposite sides of the frame 220.

The plurality of first silencing elements 120 are sequentially attached to the air outlet side of the frame 220 in a serial manner in which the first air flow passages 122 correspond to each other, and the air outlets 222 of the frame 220 are aligned with the first air flow passages 122. The second silencing element 140 is attached to the frame 220 The air inlet side is aligned with the second air flow passage 142 to align the air inlet of the frame, so that the fan 200 is clamped and fixed between the first sound absorbing member 120 and the second sound absorbing member 140. The inner diameter of the first air flow passage 122 matches the inner diameter of the air outlet 222 of the frame 220, that is, the inner diameter of the first air flow passage 122 is slightly smaller than, equal to, or slightly larger than the inner diameter of the air outlet 222 of the frame 220. The inner diameter of the second air flow passage 142 is matched to the inner diameter of the air inlet 224 of the frame 220, that is, the inner diameter of the second air flow passage 142 is slightly smaller than, equal to, or slightly larger than the inner diameter of the air inlet 224 of the frame 220.

As shown in FIG. 2A to FIG. 2C , the fan module 10 composed of the muffling device 100 and the fan 200 is applied to an electronic device to provide heat dissipation to the electronic components disposed on the electronic device, for example, A display card 30 is used to dissipate heat from the microchip stack 320 on the display card 30. The display card 30 is provided with a plurality of micro-processor chipsets 320 and a plurality of electronic components 340. The plurality of micro-processor chipsets 320 are spaced apart from the display card 30, and a heat sink is disposed on each of the micro-processor chipsets 320. 360, the heat sink 360 is composed of a base and a plurality of heat sink fins. The fan module 10 is disposed on one side of the display card 30 adjacent to the heat sink 360.

Moreover, when a plurality of fan modules 10 are disposed on the display card 30, the plurality of fan modules 10 are disposed side by side between the adjacent two heat sinks 30, and the frame 220 of the fan 200 is respectively configured as an air outlet 224. And the air inlet 222 corresponds to the adjacent two heat sinks 30. Therefore, when the fan 200 starts to operate, the impeller 240 of the fan 200 drives the fan blade 242 to rotate to generate air airflow, and the air on one of the heat sinks 360 is driven by the airflow to enter the second airflow passage of the second muffler 140. Within 142. Then, the airflow enters the frame 220 through the air inlet 224, and the air is discharged from the air. The port 222 flows to the first silencing element 120. Then, the airflow is sequentially blown to the next heat sink 360 through the first air flow passage 122 of each first sound absorbing component 120, so that the air airflow is disturbed between the adjacent two heat sinks 360 and the two heat sinks 360, Heat exchange is performed on the surface of the heat sink 360 by air convection.

During this process, the airflow at the air inlet 224 of the frame 220, due to the frictional sound generated by the edges of the friction frame 220, will be absorbed by the porous structure of the second sound absorbing element 140 located in the second air flow passage 142. At the same time, the wind-cutting sound generated by the fan blades 242 of the fan 200 rubbing the air in the frame 220 will be transmitted to the first airflow passage 122 of each of the first sound-damping components 120 as the airflow is driven, and is driven by the first airflow passage 122. The porous structure inside absorbs. Therefore, the wind cut sound generated by the fan 200 during operation and the friction sound generated between the air flow and the frame 220 are eliminated in the first sound absorbing member 120 and the second sound absorbing member 140, or are limited to the first sound absorbing member. 120 and the second silencing element 140, thereby reducing or eliminating the noise generated by the fan 200 during operation.

Similarly, since the first silencing element 120 and the second silencing element 140 are disposed on the air outlet side and the air inlet side of the frame 220 in a close fitting manner, when the impeller 240 of the fan 200 rotates within the frame 220 and partially flows The vibration generated by the impact on the blade 242 will be absorbed or mitigated by the porous structure of the first silencing element 120 and the second silencing element 140, thereby reducing the noise generated by the fan 200 due to the resonance effect, or causing resonance. Noise is eliminated. Moreover, by increasing the number of the first silencing element 120 and the second silencing element 140, the noise cancellation or isolation performance of the silencer device 100 on the fan 200 can be further improved.

Therefore, in the fan module disclosed in the present invention, the first silencing component and the The number of the two muffler components can be adaptively changed according to the actual use state, but is not limited to the number of settings of the embodiment disclosed in the present invention.

Referring to FIGS. 3A and 3B, the third embodiment of the present invention is substantially identical in structure to the second embodiment, and only the differences between the two will be described below. In the fan module 10 of the third embodiment of the present invention, the muffling device 100 further includes a mask 160 in addition to the plurality of first silencing elements 120 and the second silencing element 140. The mask 160 has a flat plate 162 and two side plates 164. The two side plates 164 are respectively erected on opposite sides of the flat plate 162, and form a receiving space 166 with the flat plate 162. The mask 160 is made of a porous material. For example, it is composed of foam, and a porous structure is formed on the wall surface of the mask 160 in the accommodation space 166.

In the application, the muffling device 100 is attached to the air outlet side surface of the fan 200 by the first silencing element 120, and is attached to the air inlet side surface of the fan 200 by the second muffling element 140, so that the first muffling element 120, The second silencing element 140 and the fan 200 are combined in advance into a layered structure. Next, one or more layered structures are mounted on an electronic device such as the display card 30 or the motherboard, so that a plurality of layered structures are assembled side by side between the adjacent two heat sinks 360. Then, the mask 160 is covered on the display card 30, and is in contact with the fan 200, the first silencing element 120 and the second silencing element 140, so that the fan 200, the first silencing element 120, the second silencing element 140, and the heat dissipation The seat 360 is wrapped in the receiving space 166 of the mask 160.

Therefore, when the fan 200 is in operation, the airflow generated by the fan 200 will flow from the air inlet side of the fan 200 toward the air outlet side, from the heat sink 360 adjacent to the second sound absorbing element 140 to the second sound absorbing component 140. In the second air flow passage 142, The frame 220 is then accessed via the air inlet 224 and flows from the air outlet 222 to the first sound deadening element 120. Then, the airflow is further blown to the heat sink 360 adjacent to the first sound absorbing component 120 via the first airflow passage 122 of the first sound absorbing component 120 connected in series, so that the airflow is disturbed between the heat radiating fins of the heat sink 360. The heat exchange is performed on the surface of the heat sink 360 by means of air convection.

Since the mask 160 covers the first silencing element 120, the second silencing element 140, the fan 200, and the heat sink 360 at the same time, the airflow generated by the fan 200 is restricted to flow in the housing space 166 of the mask 160. Moreover, since the mask 160 is in contact with the fan 200, the first silencing element 120, and the second silencing element 140, the mask 160 can be further used as a flow path of the airflow to guide the flow direction of the airflow, thereby concentrating the airflow. Flowing between the fins of the heat sink 360 and guiding the airflow to the outside of the mask 160, in addition to increasing the heat exchange efficiency of the airflow on the surface of the heat sink 360, the fan 200 can be absorbed and eliminated by the mask 160. The wind-cutting sound and the friction sound generated during operation can slow or prevent the fan 200 from vibrating during operation. In addition, the mask 160 can block thermal energy in the housing space 166 to prevent thermal energy from being transmitted through the mask 160 to the housing on which the electronic device is mounted.

The fan module of the present invention is attached to the air outlet side surface of the fan by the first sound absorbing component, or is attached to the air inlet side surface of the fan by the second sound absorbing component at the same time, so that the fan blade is rubbed against the air. The resulting wind-cutting sound and the frictional sound between the frame of the fan and the airflow must first pass through the first muffling element and the airflow path of the second muffling element. Therefore, the wind-cutting sound and the friction sound generated when the fan operates can be absorbed by the porous structure of the first silencing element and the second silencing element, thereby reducing the amount of noise transmitted outward or completely eliminated. In addition, The muffler is attached to the fan surface to make the muffler device in close contact with the fan, and can absorb and suppress the vibration generated when the fan is operated, thereby further reducing or eliminating the vibration noise of the fan.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

10‧‧‧Fan module

100‧‧‧Damping device

120‧‧‧First silencing element

122‧‧‧First airflow channel

124‧‧‧ buffer space

140‧‧‧Second silencer element

142‧‧‧Second airflow channel

144‧‧‧ buffer space

160‧‧‧ mask

162‧‧‧ tablet

164‧‧‧ side panels

166‧‧‧ Included space

200‧‧‧fan

220‧‧‧Frame

222‧‧‧air outlet

224‧‧‧ inlet

240‧‧‧ Impeller

242‧‧‧ fan leaves

30‧‧‧ display card

320‧‧‧Microprocessor chipset

340‧‧‧Electronic components

360‧‧‧ Heat sink

Fig. 1A is an exploded perspective view showing the first embodiment of the present invention.

Fig. 1B is an exploded perspective view showing another perspective of the first embodiment of the present invention.

Fig. 1C is a schematic view showing the combination of the first embodiment of the present invention.

Fig. 1D is a schematic view showing the state of use of the first embodiment of the present invention.

Fig. 2A is an exploded perspective view showing a second embodiment of the present invention.

2B is an exploded perspective view showing another perspective of the second embodiment of the present invention.

2C is a schematic view showing the state of use of the second embodiment of the present invention.

Fig. 3A is an exploded perspective view showing a third embodiment of the present invention.

Fig. 3B is a schematic view showing the state of use of the third embodiment of the present invention.

10‧‧‧Fan module

100‧‧‧Damping device

120‧‧‧First silencing element

122‧‧‧First airflow channel

124‧‧‧ buffer space

200‧‧‧fan

220‧‧‧Frame

222‧‧‧air outlet

240‧‧‧ Impeller

242‧‧‧ fan leaves

Claims (9)

A fan module includes: a fan having a tuyere formed thereon; and a muffling device including a first silencing component and a second silencing component respectively attached to an air outlet side of the fan and an inlet a first air flow passage is formed on the first sound absorbing member, the first air flow passage corresponding to one of the air outlets of the fan, and the second air damper member is formed with a second air flow passage, the second air flow passage Corresponds to one of the air inlets of the fan. The fan module of claim 1, wherein the first silencing element and the second silencing element are made of a porous material. The fan module of claim 1, wherein the sound absorbing device further comprises a mask, the mask is made of a porous material, and the mask is formed with a receiving space, and the mask covers and contacts the mask. The fan and the first sound absorbing component are disposed such that the fan and the first sound absorbing component are located in the accommodating space. The fan module of claim 1, wherein an inner diameter of the first air flow passage of the first sound absorbing member matches an inner diameter of the air outlet of the fan. The fan module of claim 1, wherein a buffer space is formed in the first silencing element, and the buffer space is connected to the first air flow channel. The fan module of claim 1, wherein the muffling device further comprises a mask, and a space is formed in the mask, the cover covers and contacts the fan, the first silencing element, and the first And a second sound absorbing component, wherein the fan, the first sound absorbing component and the second second sound absorbing component are located in the accommodating space. The fan module of claim 6, wherein the first silencing element and the second eliminating The sound element and the material of the mask are porous materials. The fan module of claim 1, wherein an inner diameter of the second airflow passage of the second sound absorbing member matches an inner diameter of the air inlet of the fan. The fan module of claim 1, wherein a buffer space is formed in the second silencing element, and the buffer space is connected to the second air flow channel.