CN219658092U - Computer device and CPU heat dissipation device thereof - Google Patents
Computer device and CPU heat dissipation device thereof Download PDFInfo
- Publication number
- CN219658092U CN219658092U CN202320773912.7U CN202320773912U CN219658092U CN 219658092 U CN219658092 U CN 219658092U CN 202320773912 U CN202320773912 U CN 202320773912U CN 219658092 U CN219658092 U CN 219658092U
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- Prior art keywords
- noise reduction
- cpu
- heat dissipation
- reduction shell
- shell
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 230000009467 reduction Effects 0.000 claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 33
- 229920000742 Cotton Polymers 0.000 claims abstract description 10
- 238000009413 insulation Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 abstract description 11
- 238000001816 cooling Methods 0.000 abstract description 10
- 239000000428 dust Substances 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 230000035807 sensation Effects 0.000 abstract description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 5
- 235000017491 Bambusa tulda Nutrition 0.000 description 5
- 241001330002 Bambuseae Species 0.000 description 5
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 5
- 239000011425 bamboo Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer device and a CPU heat dissipation device thereof, and relates to the technical field of CPU heat dissipation, and the computer device comprises a CPU body, a noise reduction mechanism and a heat dissipation mechanism, wherein the noise reduction mechanism comprises a noise reduction shell, the CPU body is positioned in the noise reduction shell, soundproof cotton is arranged in the noise reduction shell, rectangular grooves are formed in the noise reduction shell and the soundproof cotton, the heat dissipation mechanism comprises two heat dissipation fans, the two heat dissipation fans are positioned in the noise reduction shell, and the two heat dissipation fans are positioned above the CPU body. It utilizes the cooperation between the mechanism of making an uproar with falling the mechanism of falling through the cooling mechanism, utilizes the cooling mechanism to dispel the heat to can prevent the CPU body damage because of overheated, and then can effectively improve the life of CPU body, utilize the mechanism of falling can reduce the produced noise of radiator fan working process, thereby can avoid the noise to influence user's use sensation, through setting up the filter screen, can prevent that the dust from being infected with on the CPU body to the radiating in-process of CPU body.
Description
Technical Field
The utility model relates to the technical field of CPU heat dissipation, in particular to a computer device and a CPU heat dissipation device thereof.
Background
The electronic computer is a modern electronic computing machine for high-speed computing, can perform numerical computation and logic computation, has a memory function, can run according to a program, and can automatically process mass data at high speed. The CPU is an indispensable part of the computer, and generates a large amount of heat when the CPU is used, and a heat sink is required to dissipate the generated heat.
According to the chinese patent of application No. 202020377708.X, a computer CPU heat abstractor is disclosed, including the heat dissipation machine case, the front of heat dissipation machine case is provided with the louvre, the inside wall fixedly connected with fixed plate of heat dissipation machine case, the inside of fixed plate is provided with the coolant liquid bin, the inside of coolant liquid bin is provided with the condensing sheet, the upper surface fixedly connected with honeycomb duct of coolant liquid bin, the side fixedly connected with mount of fixed plate, the inner wall of mount is provided with small-size water pump, the side fixedly connected with heating panel of cooling plate, the inner wall of heat dissipation machine case is provided with radiator fan.
By adopting the scheme, the heat energy emitted from the heat radiating plate is blown to the outside of the heat radiating machine case through the heat radiating holes by arranging the heat radiating fan, so that the air cooling and heat radiating effects are achieved, but the heat radiating fan in the scheme can generate noise in the working process, so that the use feeling of a user can be influenced; to this end, we provide a computer device and a CPU heat sink thereof to solve the above problems.
Disclosure of Invention
The utility model aims to make up the defects of the prior art and provides a computer device and a CPU heat dissipation device thereof.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a CPU heat abstractor, includes CPU body, mechanism of making an uproar and heat dissipation mechanism, its the mechanism of making an uproar falls including the shell of making an uproar falls, the CPU body is located the inside of the shell of making an uproar falls, the internally mounted of the shell of making an uproar falls has the cotton that gives an uproar, the rectangular channel has all been seted up to the inside of the shell of making an uproar falls and the inside of the cotton that gives an uproar falls, heat dissipation mechanism includes two radiator fan, two radiator fan all is located the inside of the shell of making an uproar falls, two radiator fan all is located the top of CPU body.
Further, two I-shaped connecting plates are all installed on the upper surface of radiator fan, two radiator fan's top all is provided with the rectangular plate, two the bottom surface of rectangular plate respectively with two I-shaped connecting plates keep away from two radiator fan's one side fixed connection, two the rectangular plate is all installed at the upper surface of the shell of making an uproar falls.
Further, the noise reduction mechanism further comprises two sound insulation air guide pipes, positioning holes are formed in the two rectangular plates, and the bottoms of the two sound insulation air guide pipes are respectively inserted into the two positioning holes.
Further, the outer surfaces of the two sound-insulation air guide pipes are fixedly connected with mounting rings, and the two mounting rings are respectively arranged on the upper surfaces of the two rectangular plates.
Further, two the equal threaded connection of surface of sound insulation air duct has a screw thread section of thick bamboo, two the filter screen is all installed to the inside of screw thread section of thick bamboo.
A computer device comprises a circuit board, wherein a CPU body and a noise reduction shell are arranged on the upper surface of the circuit board.
Compared with the prior art, the computer device and the CPU heat dissipation device thereof have the following beneficial effects:
1. according to the utility model, through the cooperation between the heat radiation mechanism and the noise reduction mechanism, the heat radiation mechanism can be used for radiating the CPU body, so that the CPU body can be prevented from being damaged due to overheat, the service life of the CPU body can be effectively prolonged, and the noise generated in the working process of the heat radiation fan can be reduced by the noise reduction mechanism, so that the noise can be prevented from affecting the use feeling of a user.
2. According to the utility model, the filter screen is arranged, so that dust can be prevented from being stained on the CPU body in the process of radiating the CPU body, and the filter screen can be conveniently taken down from the sound-insulation air duct by arranging the thread cylinder, so that dust attached to the filter screen can be conveniently cleaned.
Drawings
FIG. 1 is a schematic perspective elevation view of the present utility model;
FIG. 2 is a schematic diagram of a circuit board and a CPU body in a three-dimensional structure according to the present utility model;
FIG. 3 is a schematic perspective view of a noise reduction housing and an acoustic insulator of the present utility model;
FIG. 4 is a schematic diagram showing the connection of a cooling fan and an I-shaped connection board according to the present utility model;
fig. 5 is a schematic illustration of the connection of the sound-deadening airway of the present utility model to the mounting ring.
In the figure: 1. a circuit board; 2. a CPU body; 3. a noise reduction mechanism; 301. a noise reduction shell; 302. soundproof cotton; 303. positioning holes; 304. a sound-insulating air duct; 305. a mounting ring; 306. a thread cylinder; 307. a filter screen; 4. a heat dissipation mechanism; 401. a heat radiation fan; 402. an I-shaped connecting plate; 403. and a rectangular plate.
Detailed Description
The principles and features of the present utility model are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the utility model and are not to be construed as limiting the scope of the utility model.
The present embodiment provides a computer device and a CPU heat dissipating device thereof, which are used for heat dissipating processing to a CPU, and by the noise reduction mechanism 3, noise generated during the operation of the heat dissipating fan 401 can be reduced, so that the noise can be prevented from affecting the use feeling of a user.
Referring to fig. 1 to 5, a CPU heat dissipation device includes a CPU body 2, a noise reduction mechanism 3 and a heat dissipation mechanism 4, the noise reduction mechanism 3 includes a noise reduction shell 301, the CPU body 2 is located inside the noise reduction shell 301, an soundproof cotton 302 is installed inside the noise reduction shell 301, rectangular grooves are formed in the noise reduction shell 301 and inside the soundproof cotton 302, the heat dissipation mechanism 4 includes two heat dissipation fans 401, the two heat dissipation fans 401 are located inside the noise reduction shell 301, and the two heat dissipation fans 401 are located above the CPU body 2.
Through setting up rectangular channel, can be convenient for place radiator fan 401, through the cooperation between radiator unit 4 and the mechanism of making an uproar 3 that falls, utilize radiator unit 4 can dispel the heat to CPU body 2 to can prevent CPU body 2 damage because of overheated, and then can effectively improve CPU body 2's life, utilize the noise that mechanism of making an uproar 3 can reduce radiator fan 401 in-process produced, thereby can avoid the noise to influence user's use sensation.
I-shaped connecting plates 402 are all installed on the upper surfaces of two radiator fans 401, rectangular plates 403 are arranged above the two radiator fans 401, the bottom surfaces of the two rectangular plates 403 are fixedly connected with one surfaces of the two I-shaped connecting plates 402, which are far away from the two radiator fans 401, the two rectangular plates 403 are all installed on the upper surface of the noise reduction shell 301, a first round hole is formed in the inner portion of each I-shaped connecting plate 402, a first threaded hole is formed in the inner portion of each radiator fan 401, the first threaded hole is matched with the first round hole, a second round hole is formed in the inner portion of each rectangular plate 403, a second threaded hole is formed in the inner portion of the noise reduction shell 301, and the second threaded hole is matched with the second round hole.
The noise reduction mechanism 3 further comprises two sound insulation air guide pipes 304, positioning holes 303 are formed in the two rectangular plates 403, the bottom ends of the two sound insulation air guide pipes 304 are respectively inserted into the two positioning holes 303, the two sound insulation air guide pipes 304 are respectively located right above the two cooling fans 401, and the sound insulation air guide pipes 304 are made of sound insulation materials.
The equal fixedly connected with collar 305 of surface of two sound insulation air duct 304, the upper surface at two rectangular plates 403 is installed respectively to two collar 305, the third round hole has been seted up to the inside of sound insulation air duct 304, the third screw hole has been seted up to the inside of rectangular plate 403, and third screw hole and third round hole looks adaptation, the equal threaded connection of surface of two sound insulation air duct 304 has a screw thread section of thick bamboo 306, filter screen 307 is all installed to the inside of two screw thread section of thick bamboo 306, through setting up filter screen 307, can prevent that the dust from being infected with CPU body 2 at the radiating in-process of CPU body 2, through setting up screw thread section of thick bamboo 306, can be convenient for take off filter screen 307 from sound insulation air duct 304, thereby can be convenient for clear up the dust that adheres to on the filter screen 307.
A computer device comprises a circuit board 1, a CPU body 2 and a noise reduction shell 301 are arranged on the upper surface of the circuit board 1, a fourth round hole is formed in the noise reduction shell 301, a fourth threaded hole is formed in the circuit board 1, the fourth threaded hole is matched with the fourth round hole, the noise reduction shell 301 is firstly arranged on the upper surface of the circuit board 1, then a cooling fan 401 is arranged in the noise reduction shell 301, a rectangular plate 403 is arranged on the upper surface of the noise reduction shell 301 to fix the cooling fan 401 and the like, the bottom end of a sound insulation air duct 304 is inserted into the inside of a positioning hole 303, a mounting ring 305 is arranged on the upper surface of the rectangular plate 403 to fix the sound insulation air duct 304 and the like, finally a threaded cylinder 306 is arranged on the outer surface of the sound insulation air duct 304, the whole device is assembled, at the moment, the cooling fan 401 is started to cool the CPU body 2, the outside dust can be filtered by a filter screen 307 in the process of cooling the CPU body 2, the service life of the CPU body 2 is prevented from being affected, and the noise of the CPU body 2 is prevented from being polluted by dust, and the noise of the noise reduction shell 301, the sound insulation air duct 302 and the noise air duct 401 can be prevented from being polluted by the outside the user.
Working principle: when the noise-reducing fan assembly device is used, firstly, the noise-reducing shell 301 is arranged on the upper surface of the circuit board 1, then the heat-radiating fan 401 is arranged in the noise-reducing shell 301, the rectangular plate 403 is arranged on the upper surface of the noise-reducing shell 301 to fix the heat-radiating fan 401 and the like, then the bottom end of the sound-insulating air duct 304 is inserted into the positioning hole 303, the mounting ring 305 is arranged on the upper surface of the rectangular plate 403 to fix the sound-insulating air duct 304 and the like, finally, the screw thread cylinder 306 is arranged on the outer surface of the sound-insulating air duct 304 to complete the assembly of the whole device, at the moment, the heat-radiating fan 401 is started to radiate the CPU body 2, and the filter screen 307 can filter external dust in the process of radiating the CPU body 2, so that dust is prevented from being stained on the CPU body 2, the noise generated in the working process of the heat-radiating fan 401 is reduced by the shell 301, the sound-insulating cotton 302 and the sound-insulating air duct 304, and the use feeling of a user can be avoided.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (6)
1. The utility model provides a CPU heat abstractor, includes CPU body (2), noise reduction mechanism (3) and heat dissipation mechanism (4), its characterized in that: the noise reduction mechanism (3) comprises a noise reduction shell (301), the CPU body (2) is located inside the noise reduction shell (301), sound insulation cotton (302) is installed inside the noise reduction shell (301), rectangular grooves are formed in the noise reduction shell (301) and the sound insulation cotton (302), the heat dissipation mechanism (4) comprises two heat dissipation fans (401), the two heat dissipation fans (401) are located inside the noise reduction shell (301), and the two heat dissipation fans (401) are located above the CPU body (2).
2. The CPU heat sink as claimed in claim 1, wherein: i-shaped connecting plates (402) are arranged on the upper surfaces of the two radiating fans (401), rectangular plates (403) are arranged above the two radiating fans (401), the bottom surfaces of the two rectangular plates (403) are fixedly connected with one surfaces, far away from the two radiating fans (401), of the two I-shaped connecting plates (402), and the two rectangular plates (403) are arranged on the upper surface of the noise reduction shell (301).
3. A CPU heat sink as claimed in claim 2, wherein: the noise reduction mechanism (3) further comprises two sound insulation air guide pipes (304), positioning holes (303) are formed in the two rectangular plates (403), and the bottom ends of the two sound insulation air guide pipes (304) are respectively inserted into the two positioning holes (303).
4. A CPU heat sink as claimed in claim 3, wherein: the outer surfaces of the two sound insulation air guide pipes (304) are fixedly connected with mounting rings (305), and the two mounting rings (305) are respectively arranged on the upper surfaces of the two rectangular plates (403).
5. A CPU heat sink as claimed in claim 3, wherein: the outer surfaces of the two sound-insulation air guide pipes (304) are connected with threaded barrels (306) in a threaded mode, and filter screens (307) are installed inside the threaded barrels (306).
6. A computer device comprising a circuit board (1), characterized in that: the CPU body (2) and the noise reduction shell (301) are both arranged on the upper surface of the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320773912.7U CN219658092U (en) | 2023-04-10 | 2023-04-10 | Computer device and CPU heat dissipation device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320773912.7U CN219658092U (en) | 2023-04-10 | 2023-04-10 | Computer device and CPU heat dissipation device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219658092U true CN219658092U (en) | 2023-09-08 |
Family
ID=87879359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320773912.7U Active CN219658092U (en) | 2023-04-10 | 2023-04-10 | Computer device and CPU heat dissipation device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219658092U (en) |
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2023
- 2023-04-10 CN CN202320773912.7U patent/CN219658092U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |