CN211827128U - Computer casing heat abstractor - Google Patents
Computer casing heat abstractor Download PDFInfo
- Publication number
- CN211827128U CN211827128U CN202020756848.8U CN202020756848U CN211827128U CN 211827128 U CN211827128 U CN 211827128U CN 202020756848 U CN202020756848 U CN 202020756848U CN 211827128 U CN211827128 U CN 211827128U
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- Prior art keywords
- heat dissipation
- air
- casing
- computer
- open slot
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Abstract
The utility model is suitable for a heat dissipation equipment technical field provides a computer casing heat abstractor, heat abstractor includes the casing, the bottom of casing is fixed with the footing, open slot has all been seted up on the bottom of casing and the left and right sides lateral wall, and the internally mounted of open slot has forced air cooling heat dissipation mechanism; the outer side of the open slot is provided with an outer ventilating plate, and the inner side of the open slot is provided with an inner ventilating plate; and a water-cooling heat dissipation mechanism is arranged in the shell. The utility model discloses set up two kinds of heat dissipation mechanism help effluvium the inside high temperature air of casing very much, showing and having improved the radiating effect, protect the electronic component in the casing, guarantee the normal operating of computer, simultaneously under the effect of outer ventilating board and interior ventilating board, introduce and discharge after handling external air and inside air again, can not only protect air-cooled heat dissipation mechanism, prevent to collect dirt, can also maintain the all ring edge borders of computer.
Description
Technical Field
The utility model belongs to the technical field of the cooling device, especially, relate to a computer housing heat abstractor.
Background
The computer is a modern electronic computing machine for high-speed computing, is a modern intelligent electronic device capable of automatically and efficiently processing mass data according to program operation, and along with the development of science and technology and the progress of technology, the application of the computer is more and more common, and the computer becomes an indispensable tool in life and work.
CPU, chip, hard disk, power etc. of computer are all heating sources, can produce high temperature after the computer long time runs, and high temperature is the enemy of integrated circuit, not only can make the system operation unstable, the circumstances such as the crash appears, serious still can damage hardware, shorten life, perhaps even make some parts burn out.
In order to improve the heat dissipation capability of the computer, a heat dissipation fan is usually used to accelerate air flow and dissipate heat to the outside of the chassis, but the heat dissipation fan in the prior art is full of dust after being used for a long time, which not only affects the heat dissipation effect, but also affects the components of the computer.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a computer case heat abstractor to can introduce the dust when adopting radiator fan to dispel the heat among the solution prior art, the poor problem of radiating effect.
The embodiment of the utility model provides a so realized, a computer casing heat abstractor, heat abstractor includes the casing, the bottom of casing is fixed with the footing, open slot has all been seted up on the bottom of casing and left and right sides lateral wall, the inside forced air cooling heat dissipation mechanism that installs of open slot;
the outer side of the open slot is provided with an outer ventilating plate, and the inner side of the open slot is provided with an inner ventilating plate;
and a water-cooling heat dissipation mechanism is arranged in the shell.
As a further aspect of the present invention: the air-cooling heat dissipation mechanism comprises a motor box, and the motor box is arranged inside the open slot through a connecting frame;
install drive arrangement in the motor case, drive arrangement's output passes through the shaft coupling and is connected with the pivot drive, the pivot passes the inside that the motor case is located the casing, the top of pivot is fixed with the closing cap, be fixed with radiator fan on the closing cap.
As a further aspect of the present invention: one side of the outer ventilating plate, which is far away from the air-cooled heat dissipation mechanism, is provided with a filter screen, and one side of the outer ventilating plate, which is close to the air-cooled heat dissipation mechanism, is provided with an ash absorption layer.
As a further aspect of the present invention: one side that interior ventilating board kept away from forced air cooling heat dissipation mechanism is equipped with ceramic honeycomb panel, interior ventilating board is close to one side of forced air cooling heat dissipation mechanism is equipped with the adsorbed layer.
As a further aspect of the present invention: the water-cooling heat dissipation mechanism comprises a circulating pipe and an electric water pump, the circulating pipe is installed inside the machine shell, and the electric water pump is installed on the outer wall of the machine shell;
the water inlet of the electric water pump is provided with a water inlet pipe, the water inlet pipe penetrates through the heat exchange cavity and is connected with the lower end of the circulating pipe, the water outlet of the electric water pump is provided with a water outlet pipe, and the water outlet pipe is connected with the upper end of the circulating pipe.
Compared with the prior art, the beneficial effects of the utility model are that: this computer casing heat abstractor, accomodate the electronic component of computer etc. in the inside of casing, and set up two kinds of heat dissipation mechanism very much and spill the inside high-temperature air of casing, it has improved the radiating effect to show, protect the electronic component in the casing, guarantee the normal operating of computer, simultaneously under the effect of outer ventilating board and interior ventilating board, reintroduce and discharge after handling external air and inside air, can not only protect air-cooled heat dissipation mechanism, prevent the collection dirt, can also maintain the all ring edge borders of computer.
Drawings
In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the drawings that are needed in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention.
Fig. 1 is a schematic structural diagram of a heat dissipation device of a computer housing.
Fig. 2 is a schematic structural diagram of an air-cooling heat dissipation mechanism in a heat dissipation device of a computer housing.
Fig. 3 is a sectional view of an external vent plate in a heat dissipation device of a computer case.
Fig. 4 is a cross-sectional view of an inner vent panel in a heat sink of a computer chassis.
Fig. 5 is a schematic structural diagram of a water-cooling heat dissipation mechanism in a heat dissipation device of a computer housing.
In the figure: the heat exchange device comprises a machine shell 1, a machine base 2, a bottom foot 3, an open slot 4, a motor box 5, a connecting frame 6, a rotating shaft 7, a sealing cover 8, a cooling fan 9, an outer ventilating plate 91, a filter screen 92, an ash absorption layer 10, an inner ventilating plate 10, a ceramic honeycomb plate 101, an adsorption layer 102, an electric water pump 11, a water inlet pipe 12, a heat exchange cavity 13, a water outlet pipe 14 and a circulating pipe 15.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following detailed description is provided for the specific embodiments of the present invention.
Example 1
As shown in fig. 1 and 5, an embodiment of the present invention provides a heat dissipation device for a computer casing, the heat dissipation device includes a casing 1, a bottom foot 2 is fixed at the bottom of the casing 1, open slots 3 are respectively formed at the bottom end and the left and right side walls of the casing 1, and an air-cooled heat dissipation mechanism is installed inside the open slots 3; an outer ventilation plate 9 is installed on the outer side of the open slot 3, and an inner ventilation plate 10 is installed on the inner side of the open slot 3; and a water-cooling heat dissipation mechanism is arranged inside the machine shell 1.
This computer casing heat abstractor, accomodate the electronic component etc. of computer in the inside of casing 1, and set up two kinds of heat dissipation mechanism help effluvium casing 1 inside high-temperature air very much, showing and improving the radiating effect, protect the electronic component in the casing 1, guarantee the normal operating of computer, simultaneously under the effect of outer ventilating board 9 and interior ventilating board 10, reintroduce and discharge after handling external air and inside air, can not only protect air-cooled heat dissipation mechanism, prevent the collection dirt, can also maintain the all ring edge borders of computer.
When the heat dissipation structure is used, the bottom of the electronic element of the computer can be guaranteed to be dissipated through the open slot 3 at the bottom of the shell 1 by the aid of the bottom feet 2, when the computer runs, the air-cooled heat dissipation mechanism and the water-cooled heat dissipation mechanism are respectively started, the water-cooled heat dissipation mechanism is tightly attached to the outer wall of the electronic element and can directly absorb heat of the electronic element to achieve the purpose of heat dissipation, the air-cooled heat dissipation mechanism accelerates air circulation inside the shell 1 and outside through the open slot 3, air with dust outside is treated through the outer ventilating plate 9, high-temperature air inside the shell 1 is treated through the inner ventilating plate 10, and a better heat dissipation effect is achieved.
As shown in fig. 2, in the embodiment of the present invention, the air-cooling heat dissipation mechanism includes a motor box 4, and the motor box 4 is installed inside the open slot 3 through a connecting frame 5; install drive arrangement in the motor case 4, drive arrangement's output passes through the shaft coupling and is connected with 6 drives of pivot, pivot 6 passes motor case 4 and is located the inside of casing 1, the top of pivot 6 is fixed with closing cap 7, be fixed with radiator fan 8 on the closing cap 7.
Connecting frame 5 makes air-cooled heat dissipation mechanism fix in the inside of open slot 3, and the drive arrangement of 4 inside of starter motor casees drives pivot 6 through drive arrangement and rotates to drive radiator fan 8 and rotate, accelerate the air flow, accelerated that the inside high temperature air of casing 1 flows with external low temperature air, prevent that high temperature air from gathering in the inside of casing 1, causing computer electronic component's damage.
As shown in fig. 3, in the embodiment of the present invention, the outer ventilation board 9 is kept away from one side of the air-cooling heat dissipation mechanism is provided with a filter screen 91, the outer ventilation board 9 is close to one side of the air-cooling heat dissipation mechanism is provided with an ash absorption layer 92.
Outside air enters the inside of the casing 1 through the open slot 3, if the outside air is not processed, outside dust is introduced into the air-cooled heat dissipation mechanism, the heat dissipation effect is influenced, the outside air can be accumulated in the casing 1 to influence the normal work of electronic components, the filter screen 91 and the dust absorption layer 92 are arranged, when the air-cooled heat dissipation mechanism is started, the outside air firstly passes through the filter screen 91, large-size dust particles are intercepted on the outer surface of the filter screen 91, and small-size dust particles are absorbed by the filter screen 91, so that the dustproof purpose is achieved.
As shown in fig. 4, in the embodiment of the present invention, the inner ventilation board 10 is far away from one side of the air-cooling heat dissipation mechanism is provided with a ceramic honeycomb board 101, and the inner ventilation board 10 is close to one side of the air-cooling heat dissipation mechanism is provided with an adsorption layer 102.
When the air in the casing 1 is discharged from the open slot 3, if the air is not treated, the temperature of the surrounding environment of the casing 1 can be increased, and the air has peculiar smell, the ceramic honeycomb plate 101 and the adsorption layer 102 are arranged, when the air-cooled heat dissipation mechanism is started, the air in the casing is firstly cooled through the ceramic honeycomb plate 101, and then the air can absorb the peculiar smell through the adsorption layer 102 and is finally discharged from the open slot 3.
Example 2
As shown in fig. 5, in another embodiment of the present invention, the water-cooling heat dissipation mechanism includes a circulation pipe 15 and an electric water pump 11, the circulation pipe 15 is installed inside the casing 1, and the electric water pump 11 is installed on an outer wall of the casing 1; the water inlet of the electric water pump 11 is provided with a water inlet pipe 12, the water inlet pipe 12 penetrates through a heat exchange cavity 13 and is connected with the lower end of the circulating pipe 15, the water outlet of the electric water pump 11 is provided with a water outlet pipe 14, and the water outlet pipe 14 is connected with the upper end of the circulating pipe 15.
The electric water pump 11 is utilized to drive liquid in the circulating pipe 15 to circularly flow, the circulating pipe 15 is tightly attached to the outer wall of the electronic element, the electric water pump 11 is started, the electric water pump 11 leads the liquid in the circulating pipe 15 out through the water inlet pipe 12 to pass through the heat exchange cavity 13 to exchange heat with a cooling medium in the heat exchange cavity 13, the purpose of cooling is achieved, then the cooled liquid flows back into the circulating pipe 15 through the water outlet pipe 14, circulation is achieved, and the purpose of circularly cooling and radiating is achieved.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. A heat dissipation device of a computer shell comprises a shell (1), wherein a bottom foot (2) is fixed at the bottom of the shell (1), and is characterized in that open grooves (3) are formed in the bottom end, the left side wall and the right side wall of the shell (1), and an air-cooling heat dissipation mechanism is arranged inside each open groove (3);
an outer ventilation plate (9) is installed on the outer side of the open slot (3), and an inner ventilation plate (10) is installed on the inner side of the open slot (3);
and a water-cooling heat dissipation mechanism is arranged in the shell (1).
2. The heat dissipation device of computer casing according to claim 1, wherein the air-cooled heat dissipation mechanism comprises a motor case (4), the motor case (4) is installed inside the open slot (3) through a connection frame (5);
install drive arrangement in motor case (4), drive arrangement's output passes through the shaft coupling and is connected with pivot (6) drive, pivot (6) pass motor case (4) and are located the inside of casing (1), the top of pivot (6) is fixed with closing cap (7), be fixed with radiator fan (8) on closing cap (7).
3. The heat dissipating device of a computer casing according to claim 2, wherein a filter screen (91) is disposed on a side of the outer ventilation board (9) away from the air-cooled heat dissipating mechanism, and a dust absorbing layer (92) is disposed on a side of the outer ventilation board (9) close to the air-cooled heat dissipating mechanism.
4. The heat dissipating device of a computer casing according to claim 2, wherein a ceramic honeycomb panel (101) is disposed on a side of the inner ventilation panel (10) away from the air-cooled heat dissipating mechanism, and an adsorption layer (102) is disposed on a side of the inner ventilation panel (10) close to the air-cooled heat dissipating mechanism.
5. The computer case heat sink according to claim 1, wherein the water-cooling heat sink mechanism comprises a circulation pipe (15) and an electric water pump (11), the circulation pipe (15) is installed inside the case (1), and the electric water pump (11) is installed on an outer wall of the case (1);
the water inlet of electric water pump (11) is equipped with inlet tube (12), inlet tube (12) pass heat exchange cavity (13) with the lower extreme of circulating pipe (15) links to each other, the delivery port of electric water pump (11) is equipped with outlet pipe (14), outlet pipe (14) with the upper end of circulating pipe (15) links to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020756848.8U CN211827128U (en) | 2020-05-09 | 2020-05-09 | Computer casing heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020756848.8U CN211827128U (en) | 2020-05-09 | 2020-05-09 | Computer casing heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211827128U true CN211827128U (en) | 2020-10-30 |
Family
ID=73021305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020756848.8U Expired - Fee Related CN211827128U (en) | 2020-05-09 | 2020-05-09 | Computer casing heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211827128U (en) |
-
2020
- 2020-05-09 CN CN202020756848.8U patent/CN211827128U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201030 Termination date: 20210509 |