CN215488780U

CN215488780U - Computer shock attenuation heat radiation structure

Info

Publication number: CN215488780U
Application number: CN202121871891.XU
Authority: CN
Inventors: 甄民坡
Original assignee: Hebei Feibai Technology Co ltd
Current assignee: Hebei Feibai Technology Co ltd
Priority date: 2021-08-11
Filing date: 2021-08-11
Publication date: 2022-01-11
Anticipated expiration: 2031-08-11

Abstract

The utility model discloses a computer shock-absorbing and heat-dissipating structure which comprises a base, wherein a placing groove is formed in the upper portion of the base, a clip-shaped shock-absorbing pad is arranged on the edge of the bottom of the placing groove, a heat-conducting plate is arranged on the clip-shaped shock-absorbing pad, a plurality of heat-dissipating fins are arranged at the bottom of the heat-conducting plate, a cavity is formed in the base, the top of the cavity is communicated with the bottom of the placing groove, first through holes are formed in the outer walls of four sides of the base, the two first through holes are communicated with the cavity, a first dustproof separation net is arranged in each of the two first through holes, a heat-dissipating mechanism is arranged in each of the two first through holes, second through holes are formed in the outer walls of the inner side and the outer side of the base, and the second through holes are communicated with the cavity. When the cooling radiating device is used, the cooling radiating device can not only carry out efficient cooling and radiating on the computer, but also enable the computer to have good anti-seismic performance in the using process.

Description

Computer shock attenuation heat radiation structure

Technical Field

The utility model relates to the technical field of computers, in particular to a computer shock absorption and heat dissipation structure.

Background

The computer is commonly called as computer, is an electronic computer for high-speed calculation, can perform numerical calculation and logic calculation, has a memory function, and is modern intelligent electronic equipment capable of automatically processing mass data at high speed according to program operation.

For the notebook computer, in the long-time use process, a large amount of heat can be generated at the bottom and two sides of the notebook computer, the use performance of the computer is seriously influenced, meanwhile, the notebook computer can be used in bumpy occasions, and the use and the service life of the computer are also influenced due to large vibration.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a computer damping and heat dissipating structure to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a computer shock attenuation heat radiation structure, includes the base, the standing groove has been seted up on the upper portion of base, the bottom edge of standing groove is provided with back the shape shock pad, it is provided with the heat-conducting plate to return the shape shock pad, the bottom of heat-conducting plate is provided with a plurality of radiating fin, the cavity has been seted up to the inside of base, the top of cavity with the bottom intercommunication of standing groove, first through-hole has all been seted up to four side outer walls of base, two first through-hole all with the cavity intercommunication, two all be provided with first dustproof spacer screen in the first through-hole, two all be provided with heat dissipation mechanism in the first through-hole.

Preferably, the outer walls of the inner side and the outer side of the base are provided with second through holes, the second through holes are communicated with the cavity, and second dustproof separation nets are arranged in the second through holes.

Preferably, heat dissipation mechanism includes fixed frame, universal driving shaft, a plurality of axis of rotation, a plurality of flabellum and driving motor, fixed frame sets up in the first through-hole, the universal driving shaft sets up in the fixed frame, a plurality of the axis of rotation all sets up one side of fixed frame, just the surface of universal driving shaft is provided with the first conical gear of a plurality of, the one end of axis of rotation is provided with the second conical gear, first conical gear with second conical gear intermeshing, a plurality of the flabellum sets up respectively and corresponds the other end of axis of rotation, driving motor sets up one side of fixed frame, driving motor's output shaft with the one end of universal driving shaft is connected.

Preferably, a sound-deadening layer is laid on the inner wall of the first through hole, and the sound-deadening layer is made of sound-deadening cotton.

Preferably, the inner walls of the inner side and the outer side of the right end of the placing groove are provided with communicating holes, and electric fans are arranged in the communicating holes.

Preferably, the inner side surface and the outer side surface of the base are respectively provided with a plurality of wiring ports.

Compared with the prior art, the utility model has the beneficial effects that:

1. the heat-conducting cooling device is provided with the cavity, the heat-conducting plate, the heat-radiating fins, the first through holes, the heat-radiating mechanism, the second through holes, the first dustproof isolating net and the second dustproof isolating net, so that heat at the bottom of a computer in work can be absorbed and cooled quickly and efficiently;

2. the utility model is also provided with the clip-shaped shock pad, so that the computer can be kept stable in the use process, and the internal elements of the computer are prevented from being damaged.

Drawings

FIG. 1 is a schematic sectional front view of the present invention;

FIG. 2 is a schematic top sectional view of the heat dissipation mechanism of the present invention;

fig. 3 is an enlarged schematic view of a portion a in fig. 1.

In the figure: 1. a base; 2. a clip-shaped shock pad; 3. a heat conducting plate; 4. a heat dissipating fin; 5. a first dustproof separation net; 6. a heat dissipation mechanism; 601. a fixed frame; 602. a linkage shaft; 603. a rotating shaft; 604. a fan blade; 605. a drive motor; 7. a second dustproof separation net; 8. a first bevel gear; 9. a second bevel gear; 10. a sound-deadening layer; 11. an electric fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a computer shock absorption and heat dissipation structure comprises a base 1, wherein a placing groove is formed in the upper portion of the base 1, a square-shaped shock absorption pad 2 is installed at the edge of the bottom of the placing groove, a heat conduction plate 3 is installed on the square-shaped shock absorption pad 2, a plurality of heat dissipation fins 4 are installed at the bottom of the heat conduction plate 3, a cavity is formed in the base 1, the top of the cavity is communicated with the bottom of the placing groove, first through holes are formed in the outer walls of four sides of the base 1 and communicated with the cavity, first dustproof partition nets 5 are installed in the two first through holes, and heat dissipation mechanisms 6 are installed in the two first through holes;

the outer walls of the inner side and the outer side of the base 1 are respectively provided with a second through hole, the second through holes are communicated with the cavity, a second dustproof separation net 7 is arranged in each second through hole, the heat dissipation mechanism 6 comprises a fixed frame 601, a linkage shaft 602, a plurality of rotating shafts 603, a plurality of fan blades 604 and a driving motor 605, the fixed frame 601 is arranged in each first through hole, the linkage shaft 602 is arranged in the fixed frame 601, the plurality of rotating shafts 603 are arranged on one side of the fixed frame 601, the surface of the linkage shaft 602 is provided with a plurality of first bevel gears 8, one end of each rotating shaft 603 is provided with a second bevel gear 9, the first bevel gears 8 are mutually meshed with the second bevel gears 9, the plurality of fan blades 604 are respectively arranged at the other end of the corresponding rotating shafts 603, the driving motor 605 is arranged on one side of the fixed frame 601, the output shaft of the driving motor 605 is connected with one end of the linkage shaft 602, a silencing layer 10 is laid on the inner wall of each first through hole, the noise reduction layer 10 is made of noise reduction cotton, communicating holes are formed in the inner walls of the inner side and the outer side of the right end of the placing groove, electric fans 11 are installed in the communicating holes, and a plurality of wiring ports are formed in the surfaces of the inner side and the outer side of the base 1.

The working principle is as follows: when the heat dissipation device is used, a notebook computer can be placed on the heat conduction plate 3 in the placement groove, heat generated in the using process of the computer is transmitted to the surface of the heat dissipation fin 4 through the heat conduction plate 3, then the fan blades 604 are rotated through the driving motor 605, the linkage shaft 602, the first bevel gear 8, the second bevel gear 9 and the rotating shaft 603, so that the heat dissipation fin 4 is dissipated, the heat inside the cavity is discharged through the second through holes on the inner side and the outer side of the base 1, the rectangular shock absorption pad 2 is installed at the bottom of the heat conduction substrate, so that the computer can have a little shock absorption effect in the using process, and internal elements of the surface computer are damaged due to long-time vibration. The utility model discloses a when using, not only can carry out the efficient heat dissipation of cooling to the computer, can make the computer in the use simultaneously, have good anti-seismic performance.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a computer shock attenuation heat radiation structure, includes base (1), its characterized in that: the improved heat dissipation device is characterized in that a placing groove is formed in the upper portion of the base (1), a square shock pad (2) is arranged at the bottom edge of the placing groove, a heat conducting plate (3) is arranged on the square shock pad (2), a plurality of heat dissipation fins (4) are arranged at the bottom of the heat conducting plate (3), a cavity is formed in the base (1), the top of the cavity is communicated with the bottom of the placing groove, first through holes are formed in the outer walls of four sides of the base (1), the first through holes are communicated with the cavity, a first dustproof separation net (5) is arranged in each first through hole, and a heat dissipation mechanism (6) is arranged in each first through hole.

2. The computer shock-absorbing and heat-dissipating structure according to claim 1, wherein: second through holes are formed in the outer walls of the inner side and the outer side of the base (1), the second through holes are communicated with the cavity, and second dustproof separation nets (7) are arranged in the second through holes.

3. The computer shock-absorbing and heat-dissipating structure according to claim 1, wherein: the heat dissipation mechanism (6) comprises a fixed frame (601), a linkage shaft (602), a plurality of rotating shafts (603), a plurality of fan blades (604) and a driving motor (605), the fixed frame (601) is arranged in the first through hole, the linkage shaft (602) is arranged in the fixed frame (601), the plurality of rotating shafts (603) are all arranged on one side of the fixed frame (601), a plurality of first bevel gears (8) are arranged on the surface of the linkage shaft (602), a second bevel gear (9) is arranged at one end of each rotating shaft (603), the first bevel gears (8) are meshed with the second bevel gears (9), the plurality of fan blades (604) are respectively arranged at the other ends of the corresponding rotating shafts (603), and the driving motor (605) is arranged on one side of the fixed frame (601), the output shaft of the driving motor (605) is connected with one end of the linkage shaft (602).

4. The computer shock-absorbing and heat-dissipating structure according to claim 1, wherein: the inner wall of the first through hole is paved with a sound-deadening layer (10), and the sound-deadening layer (10) is made of sound-deadening cotton.

5. The computer shock-absorbing and heat-dissipating structure according to claim 1, wherein: intercommunicating pores are formed in the inner walls of the inner side and the outer side of the right end of the placing groove, and electric fans (11) are arranged in the intercommunicating pores.

6. The computer shock-absorbing and heat-dissipating structure according to claim 1, wherein: a plurality of wiring ports are formed in the surfaces of the inner side and the outer side of the base (1).