CN218230278U - Intelligent solder paste storage manager - Google Patents
Intelligent solder paste storage manager Download PDFInfo
- Publication number
- CN218230278U CN218230278U CN202221785735.6U CN202221785735U CN218230278U CN 218230278 U CN218230278 U CN 218230278U CN 202221785735 U CN202221785735 U CN 202221785735U CN 218230278 U CN218230278 U CN 218230278U
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- China
- Prior art keywords
- shell
- feeding
- transfer
- solder paste
- storage manager
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 85
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000003756 stirring Methods 0.000 claims description 19
- 238000004064 recycling Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 8
- 239000006071 cream Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000005496 tempering Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model belongs to the technical field of the technique is stored to the tin cream and specifically relates to manager is stored to intelligence tin cream, which comprises an outer shell, the inboard lower surface mounting of shell has the position of being close to the feed inlet to install the feeding work or material rest, the preceding mechanism of snatching that the inboard lower surface mounting of shell is close to the feeding work or material rest, the inboard lower surface mounting of shell moves the mechanism around carrying, the inboard lower surface mid-mounting of shell has the temperature return rabbling mechanism, the inboard lower surface mounting of shell has cold-stored mechanism, snatchs the mechanism after, one side fixed mounting of temperature return rabbling mechanism has bar code scanning device. The beat time is shortened by half compared with the original time; the structure load is small, the efficiency is high, and the stability is good; the storage quantity is multiplied: the refrigerating mechanism can be designed in a modularized way, and the ground rail on the corresponding rear grabbing mechanism is extended; a feeding rack is added, and each position is provided with a photoelectric sensor for detecting the placement position of the solder paste; the condensing water tank is internally arranged, and no additional placing area is occupied.
Description
Technical Field
The utility model relates to a technical field is stored to the tin cream, especially relates to manager is stored to intelligence tin cream.
Background
Chinese patent CN202020487469.3 discloses a solder paste storage manager with automatic storage, temperature return and stirring functions, which is the first generation of equipment.
The original structure is not suitable for large-capacity storage. Increase tin cream storage quantity, the storage charging tray diameter that corresponds will increase, gets the material X axle and also can increase, and the big board of installation of X axle can increase, can lead to the Z axle load big like this, needs to increase Z axle motor power, and the consumption increase can not remove at a high speed, and is inefficient. And the X-axis movement time also increases, affecting the overall tempo.
Feeding: the bottle feeding can not be carried out by a person, and the person is always beside the equipment during the feeding process.
And (3) condensate water treatment: according to the use frequency of customers, water is poured regularly, and if the water is forgotten to be poured, the water overflows after being full.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art, and providing an intelligent solder paste storage manager.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
design intelligent tin cream and store manager, including the shell, the industrial computer is installed to one side of shell, one side of shell is equipped with feed inlet and discharge gate, the top fixed mounting of shell has the tricolor lamp, first electric cabinet is installed on the inboard upper portion of shell, the inboard under surface mounting of shell has the position that is close to the feed inlet and installs the feeding work or material rest, the inboard under surface mounting of shell snatchs the mechanism before being close to the feeding work or material rest, move around moving the mechanism to move around the inboard under surface mounting of shell, move around moving the mechanism and move around moving the inboard lower part that moves the mechanism around and, the inboard under surface mid-mounting of shell has back temperature rabbling mechanism, the inboard under surface mounting of shell has cold-stored mechanism, snatchs the mechanism after, the internally mounted of shell has refrigerating mechanism and second electric cabinet, one side fixed mounting of back temperature rabbling mechanism has the bar code scanning device, the internally mounted of shell has the comdenstion water collecting box.
Preferably, the feeding rack comprises feeding supports fixed with the shell, a plurality of layers of feeding placing plates are fixedly mounted between the two feeding supports, feeding placing grooves are formed in the upper surfaces of the feeding placing plates, and photoelectric sensors are mounted inside the feeding placing grooves.
Preferably, the front and rear transfer mechanism comprises transfer supports fixed to the housing, top plates are mounted on top ends of the two transfer supports, transfer guide rails and rodless cylinders are fixedly mounted on the upper surface of each top plate, transfer sliding blocks are mounted on outer sides of the transfer guide rails and the rodless cylinders in a sliding mode, a transfer motor is mounted on top of each transfer sliding block, and a positioning seat is mounted at an output end of each transfer motor.
Preferably, the temperature-returning stirring mechanism comprises a frame, a stirring device is installed on the lower portion of the inner side of the frame, a temperature-returning motor is installed at the top end of the frame, and a turret main body located inside the frame is installed at the output end of the temperature-returning motor.
Preferably, one side of the shell is provided with a two-dimensional code reader, an IC card reader and an empty bottle putting port, and the inside of the shell is provided with an empty bottle recycling box.
The utility model provides a manager is stored to intelligence tin cream, beneficial effect lies in: the beat time is shortened by half compared with the original time; the structure load is small, the efficiency is high, and the stability is good; the storage quantity is multiplied: the refrigerating mechanism can be designed in a modularized mode, and the ground rail on the corresponding rear grabbing mechanism is extended; a feeding rack is added, and each position is provided with a photoelectric sensor for detecting the placement position of the solder paste; the condensate water tank is internally arranged, so that an additional placing area is not occupied, and the liquid level sensor in the condensate water tank detects the water level, thereby avoiding the situation of overflowing when the water tank is full of water.
Drawings
Fig. 1 is a schematic view of an external structure of an intelligent solder paste storage manager according to the present invention;
FIG. 2 is a schematic view of a first view structure inside the intelligent solder paste storage manager according to the present invention;
FIG. 3 is a schematic view of a second view structure inside the intelligent solder paste storage manager according to the present invention;
fig. 4 is a schematic structural view of a feeding rack of the intelligent solder paste storage manager of the present invention;
FIG. 5 is a schematic structural view of a front grabbing mechanism of the intelligent solder paste storage manager of the present invention;
FIG. 6 is a schematic structural view of a front and rear transfer mechanism of the intelligent solder paste storage manager of the present invention;
fig. 7 is a schematic structural view of the cold storage mechanism of the intelligent solder paste storage manager provided by the utility model;
FIG. 8 is a schematic structural view of a temperature-returning stirring mechanism of the intelligent solder paste storage manager of the present invention;
fig. 9 is the utility model provides a snatch mechanism structure schematic diagram behind manager is stored to intelligence tin cream.
In the figure: the device comprises a shell 1, an industrial personal computer 2, a two-dimensional code reader 3, an IC card reader 4, a three-color lamp 5, a feeding hole 6, a feeding rack 7, a feeding support 71, a feeding placing plate 72, a feeding placing groove 73, an empty bottle putting port 8, a front grabbing mechanism 9, a first electric cabinet 10, a refrigerating mechanism 11, a rear grabbing mechanism 12, an empty bottle recycling box 13, a front and rear shifting mechanism 14, a shifting support 141, a shifting guide rail 142, a rodless cylinder 143, a shifting motor 144, a positioning seat 145, a shifting slider 146, a top plate 147, a refrigerating mechanism 15, a condensed water collecting box 16, a temperature returning stirring mechanism 17, a temperature returning motor 171, a turret main body 172, a frame 173, a stirring device 174, a discharging hole 18, a code scanner device 19 and a second electric cabinet 20.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-9, an intelligent solder paste storage manager comprises a housing 1, an industrial personal computer 2 is installed on one side of the housing 1, a feed port 6 and a discharge port 18 are arranged on one side of the housing 1, a three-color lamp 5 is fixedly installed on the top end of the housing 1, a first electric cabinet 10 is installed on the upper portion of the inner side of the housing 1, a feed rack 7 is installed on the lower surface of the inner side of the housing 1 at a position close to the feed port 6, solder paste can be placed on the feed rack 7, a front grabbing mechanism 9 is installed on the lower surface of the inner side of the housing 1 at a position close to the feed rack 7, the front grabbing mechanism 9 is equivalent to a three-coordinate manipulator, a photoelectric sensor is installed on the inner side of a clamping jaw of the front grabbing mechanism 9, the front grabbing mechanism 9 can place solder paste on the feed rack 7 into a front and rear transfer mechanism 14, the front and rear transfer mechanism 14 can transport solder paste, and the front and rear transfer mechanism 14 is installed on the lower surface of the inner side of the housing 1, the front and back transfer mechanism 14 penetrates through the inner lower parts of the front and back transfer mechanism 14 and the front and back transfer mechanism 14, the middle part of the inner lower surface of the shell 1 is provided with a temperature returning stirring mechanism 17, the temperature returning stirring mechanism 17 can carry out temperature returning and shaking stirring on solder paste, the inner lower surface of the shell 1 is provided with a refrigerating mechanism 11 and a back grabbing mechanism 12, the refrigerating mechanism 11 can refrigerate the solder paste, the back grabbing mechanism 12 can grab the solder paste on the front and back transfer mechanism 14 to the refrigerating mechanism 11 and can transfer the solder paste in the refrigerating mechanism 11 to the temperature returning stirring mechanism 17, the back grabbing mechanism 12 is equivalent to a three-coordinate manipulator, the inside of the shell 1 is provided with a refrigerating mechanism 15 and a second electric cabinet 20, the refrigerating mechanism 15 provides circulating cold air for the refrigerating mechanism 11, the low temperature can convert water in the air from a gas state to a liquid state, the liquid level of the condensed water collecting box 16 rises and contacts with a liquid level sensor, can indicate on the industrial computer display screen to pour water and remind, one side fixed mounting of rewarming rabbling mechanism 17 has bar code collector device 19, and the internally mounted of shell 1 has comdenstion water collecting box 16, and bar code collector device 19 can move the solder paste that moves on the mechanism 14 around and sweep a yard record.
The feeding rack 7 comprises feeding supports 71 fixed with the shell 1, a plurality of layers of feeding placing plates 72 are fixedly installed between the two feeding supports 71, feeding placing grooves 73 are formed in the upper surfaces of the feeding placing plates 72, and photoelectric sensors are installed inside the feeding placing grooves 73.
The front and rear transfer mechanism 14 includes transfer brackets 141 fixed to the housing 1, top plates 147 are mounted on top ends of the two transfer brackets 141, transfer guide rails 142 and rodless cylinders 143 are fixedly mounted on an upper surface of the top plate 147, transfer sliders 146 are mounted on outer sides of the transfer guide rails 142 and the rodless cylinders 143 in a sliding manner, a transfer motor 144 is mounted on a top of the transfer sliders 146, and positioning seats 145 are mounted on an output end of the transfer motor 144.
The tempering and stirring mechanism 17 includes a frame 173, a stirring device 174 is mounted at the lower part of the inner side of the frame 173, a tempering motor 171 is mounted at the top end of the frame 173, and a turret main body 172 positioned inside the frame 173 is mounted at the output end of the tempering motor 171.
Two-dimensional code reader 3, IC card reader 4, empty bottle input port 8 are installed to one side of shell 1, and the internally mounted of shell 1 has empty bottle collection box 13.
The working principle is as follows: clicking a control machine to feed, automatically ejecting a feed inlet, and putting solder paste into a feed rack 7 (a photoelectric sensor is arranged below each storage position to detect whether the solder paste exists in the storage position); or the photoelectric sensor is arranged on the material taking clamping jaw of the front grabbing mechanism 9 to detect each storage position of the material loading rack), and the door is closed after the solder paste is placed;
the front grabbing mechanism 9 grabs the solder paste detected by the photoelectric sensor from the feeding rack 7, places the solder paste on the positioning seat 145 on the front and rear transferring mechanism 14, the transferring motor 144 drives the solder paste to rotate, and the rodless cylinder 143 drives the solder paste to move to the rear;
the code scanning device 19 works, the top and the side scan codes, the code scanning is carried out while rotating, the code scanning is finished, and the transferring motor 144 stops rotating;
the rear grabbing mechanism 12 grabs the solder paste to a feed inlet of the refrigerating mechanism 11, the feed inlet is opened, the solder paste is withdrawn after being placed in a refrigerating position, and the feed inlet of the refrigerating mechanism 11 is closed;
the rear grabbing mechanism 12 grabs the solder paste from the refrigerating mechanism 11 and puts the solder paste into the turret main body 172 of the temperature returning stirring mechanism 17 for temperature returning;
after the temperature returns, the rear grabbing mechanism 12 grabs the solder paste from the turret main body 172 to the stirring device 174, and after the stirring is completed, the turret main body 172 is placed again to wait for discharging;
and discharging, wherein the rear grabbing mechanism 12 grabs solder paste from the turret main body 172 and places the solder paste on the front and rear transfer mechanisms 14, the front and rear transfer mechanisms 14 convey the solder paste to the discharging port 18, and the discharging door 18 pops open.
And (4) recovering the empty bottle, and automatically bouncing the empty bottle throwing port 8 to open through the two-dimensional code reader 3 and the IC card reader 4 and closing after throwing.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The intelligent solder paste storage manager comprises a shell (1) and is characterized in that an industrial personal computer (2) is installed on one side of the shell (1), a feed inlet (6) and a discharge outlet (18) are arranged on one side of the shell (1), the top end of the shell (1) is fixedly provided with a three-color lamp (5), the upper part of the inner side of the shell (1) is provided with a first electric cabinet (10), the lower surface of the inner side of the shell (1) is provided with a feeding rack (7) close to the feeding hole (6), the lower surface of the inner side of the shell (1) is provided with a front grabbing mechanism (9) close to the feeding rack (7), the lower surface of the inner side of the shell (1) is provided with a front and back transfer mechanism (14), the front and back transfer mechanism (14) penetrates through the front and back transfer mechanism (14) and the inner lower part of the front and back transfer mechanism (14), the middle part of the lower surface of the inner side of the shell (1) is provided with a temperature returning stirring mechanism (17), the lower surface of the inner side of the shell (1) is provided with a refrigerating mechanism (11) and a rear grabbing mechanism (12), a refrigerating mechanism (15) and a second electric cabinet (20) are arranged in the shell (1), a code scanner device (19) is fixedly arranged on one side of the temperature return stirring mechanism (17), and a condensed water collecting box (16) is arranged in the shell (1).
2. The intelligent solder paste storage manager according to claim 1, wherein the feeding frame (7) comprises feeding brackets (71) fixed with the housing (1), a plurality of layers of feeding placing plates (72) are fixedly installed between the two feeding brackets (71), a feeding placing groove (73) is formed in the upper surface of each feeding placing plate (72), and a photoelectric sensor is installed inside each feeding placing groove (73).
3. The intelligent solder paste storage manager as claimed in claim 1, wherein the front and rear transfer mechanism (14) comprises transfer brackets (141) fixed to the housing (1), top plates (147) are mounted on top ends of the two transfer brackets (141), transfer guide rails (142) and rodless cylinders (143) are fixedly mounted on upper surfaces of the top plates (147), transfer sliders (146) are slidably mounted on outer sides of the transfer guide rails (142) and the rodless cylinders (143), a transfer motor (144) is mounted on top of the transfer sliders (146), and positioning seats (145) are mounted on output ends of the transfer motors (144).
4. The intelligent solder paste storage manager according to claim 1, wherein the temperature-returning stirring mechanism (17) comprises a frame (173), the stirring device (174) is installed at the lower part of the inner side of the frame (173), the temperature-returning motor (171) is installed at the top end of the frame (173), and the turret main body (172) located inside the frame (173) is installed at the output end of the temperature-returning motor (171).
5. The intelligent solder paste storage manager according to claim 1, wherein a two-dimensional code reader (3), an IC card reader (4) and an empty bottle putting port (8) are installed on one side of the housing (1), and an empty bottle recycling box (13) is installed inside the housing (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221785735.6U CN218230278U (en) | 2022-07-09 | 2022-07-09 | Intelligent solder paste storage manager |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221785735.6U CN218230278U (en) | 2022-07-09 | 2022-07-09 | Intelligent solder paste storage manager |
Publications (1)
Publication Number | Publication Date |
---|---|
CN218230278U true CN218230278U (en) | 2023-01-06 |
Family
ID=84676049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202221785735.6U Expired - Fee Related CN218230278U (en) | 2022-07-09 | 2022-07-09 | Intelligent solder paste storage manager |
Country Status (1)
Country | Link |
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CN (1) | CN218230278U (en) |
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2022
- 2022-07-09 CN CN202221785735.6U patent/CN218230278U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230106 |