CN218229595U - Rubber-insulated-wire lamp encapsulation equipment - Google Patents

Abstract

The utility model discloses a leather line lamp encapsulation equipment, including base, encapsulation subassembly, chip feed mechanism, tilting mechanism and chip transfer subassembly, the base is located to chip feed mechanism to locate one side of encapsulation subassembly at an interval, chip feed mechanism is used for providing the chip material area. Tilting mechanism includes mount pad and upset seat, and the mount pad is installed in the base, and the upset seat is equipped with the chip and places the position, and the upset seat is rotationally installed in the mount pad to have the level state that makes the chip place the position level place at the chip, and make the chip place the vertical state of a vertical place at the chip. Chip transfer assembly movably installs in the base, and chip transfer assembly is used for placing the position to the chip that is in the horizontality with the chip transfer on the chip material area, still is used for taking the chip that the position was placed to the chip under the vertical state to shift the chip to the equipment position of encapsulation subassembly. The utility model discloses technical scheme can realize the vertical structure of installing under the belt line condition of chip and simplify chip feed mechanism.

Description

Rubber-insulated-wire lamp encapsulation equipment

Technical Field

The utility model relates to a ornament lamp manufacturing field, in particular to leather line lamp encapsulation equipment.

Background

The rubber-insulated-wire lamp is also called as a PVC flexible wire lamp string, the rubber-insulated-wire lamp comprises a conducting wire, a rubber wire coated outside the conducting wire and a chip packaged on the conducting wire, and the lamp cap is integrated on the chip. In the production process, a rubber-covered wire tape (including a lead and a rubber-covered wire covering the lead) is usually molded (or purchased) in advance, and then a chip integrated with a lamp cap is packaged on the rubber-covered wire tape on a packaging device.

The chip on present chip material area is usually the level and places, but in some cases, need install the chip vertically between two wires of belt line, some present schemes are realized through adopting the feed mechanism that can take the chip and remove and also can rotate the change chip state like six-axis manipulator, but such feed mechanism structure is complicated, and the cost is higher, can increase the cost of rubber-insulated-wire lamp encapsulation equipment.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a belt line lamp encapsulation equipment aims at realizing the vertical structure of installing chip feed mechanism under the belt line condition of chip.

In order to achieve the above object, the utility model provides a rubber-insulated-wire lamp encapsulation equipment, include:

a base;

a package assembly disposed on the base, the package assembly having an assembly location;

the chip feeding mechanism is arranged on the base and is arranged on one side of the packaging assembly at intervals, and the chip feeding mechanism is used for providing a chip material belt;

the turnover mechanism comprises an installation seat and a turnover seat, the installation seat is installed on the base, the turnover seat is provided with a chip placement position, and the turnover seat is rotatably installed on the installation seat and has a horizontal state that a chip is horizontally placed on the chip placement position and a vertical state that the chip is vertically placed on the chip placement position;

the chip transfer assembly is movably installed on the base and used for transferring the chips on the chip material belt to the chip placing positions in the horizontal state, and the chip transfer assembly is further used for taking the chips on the chip placing positions in the vertical state and transferring the chips to the assembling positions.

Optionally, the turnover mechanism is arranged between the chip feeding mechanism and the packaging assembly; or the chip feeding mechanism and the turnover mechanism are distributed at intervals in the conveying direction of the linear lamps on the packaging component.

Optionally, the chip transferring assembly includes a first transferring mechanism and a second transferring mechanism, the first transferring mechanism is movably mounted on the base, and the first transferring mechanism is configured to transfer the chips on the chip tape to the chip placing position in the horizontal state; the second transfer mechanism is movably arranged on the base and used for taking the chip at the chip placement position in the vertical state and transferring the chip to the assembly position.

Optionally, the upset seat has adjacent first side and second side, the chip is placed the position including the shaping in first side with storage tank and limit structure of second side junction, the storage tank has limit slot wall, limit slot wall with first side interval, and with the second side is connected the horizontality, limit slot wall level is placed vertical state, the vertical placement of limit slot wall, limit structure at least part is located in the storage tank, and is located limit slot wall with between the first side, limit structure is used for fixed chip.

Optionally, the limiting structure includes a negative pressure air passage and a negative pressure port communicated with the negative pressure air passage, and the negative pressure port is located between the limiting groove wall and the first side surface.

Optionally, the turnover mechanism further comprises a turnover cylinder and a connecting rod, the cylinder body of the turnover cylinder is mounted on the mounting seat, one end of the connecting rod is fixed to the rotating shaft of the turnover seat, the other end of the connecting rod is rotatably connected with the piston rod of the turnover cylinder, and the piston rod of the turnover cylinder is perpendicular to the rotating shaft of the turnover seat along the rotating axis between the connecting rods.

Optionally, the turning base includes a rotating base and an accommodating base, the rotating base is rotatably mounted on the mounting base, and the accommodating base is provided with the chip placing position and is detachably mounted on the rotating base.

Optionally, the negative pressure air passage includes a first air passage and a second air passage, the first air passage is disposed on the rotary seat body, the second air passage is disposed on the accommodating seat body, the first air passage is communicated with the second air passage, one end of the first air passage, which is far away from the second air passage, is used for communicating with the negative pressure pipeline, and one end of the second air passage, which is far away from the first air passage, is communicated with the negative pressure port.

Optionally, the second transfer mechanism is provided with a clamping assembly, the clamping assembly is used for clamping the chip at the chip placement position in the vertical state, and the limiting groove wall is provided with an avoidance notch for avoiding the clamping assembly; and/or the first transfer mechanism is provided with a negative pressure suction head, and the negative pressure suction head is used for sucking the chip.

Optionally, a support frame is arranged on the base, a guide structure is arranged on the support frame, and the first transfer mechanism and the second transfer mechanism are both slidably mounted on the guide structure; and/or the overturning seat is provided with at least two chip placing positions, and the chip placing positions are arranged at intervals.

The utility model discloses technical scheme is through setting up tilting mechanism on the base, when the chip shifts the subassembly and takes the chip from chip feed mechanism like this, can be so that tilting mechanism's upset seat upset to the horizontality, after the chip shifts the subassembly and takes the chip that the water level was placed from chip feed mechanism, can directly move to upset seat department to place the chip level and place the position at the chip, make the upset seat upset to vertical state afterwards, thereby make the chip that the position was placed to the chip overturn to vertical state along with the upset seat. And finally, the chip transfer assembly transfers the vertically placed chip to the assembly position of the packaging assembly so as to vertically install the chip between the two leads of the belt. So set up, chip transfer mechanism only need take the chip that the level was placed to chip that is in the horizontality with the chip material and transfer to and place the position, rotate to vertical state back at upset seat from the horizontality, chip transfer assembly also only need take the chip and place the chip of the vertical placement of position to it can to transfer the chip to the equipment position. Therefore, in the process of transferring the chip from the chip feeding mechanism to the packaging assembly, the chip transferring assembly is not required to turn over the chip, namely, a rotating structure is not required to be arranged on the chip transferring assembly, and therefore the structure of the chip transferring assembly can be simplified. And tilting mechanism can pass through the mount pad to be fixed on the base, and need not remove relative chip feed mechanism and encapsulation subassembly, also can make tilting mechanism's simple structure, realizes that the chip is vertical to be installed and simplifies the structure of chip feed mechanism under the belt line condition, can reduce the cost of rubber-insulated-wire lamp encapsulation equipment.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of a leather-covered wire lamp packaging device of the present invention;

FIG. 2 is an enlarged view taken at A in FIG. 1;

FIG. 3 is a schematic structural view of the turnover mechanism in FIG. 2, wherein the turnover seat is in a horizontal state;

FIG. 4 is an enlarged view at B in FIG. 3;

FIG. 5 is a schematic view of the turnover mechanism in FIG. 2 at another angle, where the turnover seat is in a vertical state;

FIG. 6 is an enlarged view at C of FIG. 5;

FIG. 7 is an exploded view of the roll-over stand of FIG. 5;

FIG. 8 is a schematic diagram of the chip transfer assembly of FIG. 1;

FIG. 9 is a schematic view of a portion of the first transfer mechanism of FIG. 8;

fig. 10 is a partial structural schematic view of the second transfer mechanism in fig. 8.

The reference numbers illustrate:

10. a base; 11. a support frame; 111. a guide structure; 20. a chip feeding mechanism; 30. a turnover mechanism; 31. a mounting seat; 32. a turning seat; 321. rotating the base; 322. a containing seat body; 323. a first side; 324. a second side surface; 331. a containing groove; 332. a limiting groove wall; 333. placing the groove wall; 334. avoiding the notch; 335. a negative pressure port; 336. a first air passage; 34. turning over the air cylinder; 35. a connecting rod; 40. a chip transfer assembly; 41. a first transfer mechanism; 411. a first sliding seat; 412. a negative pressure suction head; 413. a first motor; 414. a first transmission assembly; 415. a first lifting cylinder; 416. a first fixed block; 42. a second transfer mechanism; 421. a second sliding seat; 422. a clamping assembly; 4221. pneumatic clamping fingers; 4222. clamping arms; 423. a second motor; 424. a second transmission assembly; 425. a second lifting cylinder; 426. a second fixed block; 50. a package assembly; 51. a wire stripping mechanism; 52. an assembly mechanism; 521. assembling positions; 53. a welding mechanism; 54. a glue sealing mechanism; 55. a wire guide mechanism; 61. a blanking mechanism; 62. a material receiving mechanism; 70. and (3) a chip.

The realization, the functional characteristics and the advantages of the utility model are further explained by combining the embodiment and referring to the attached drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear \8230;) are involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship between the components in a specific posture (as shown in the attached drawings), the motion situation, etc., and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a rubber-insulated-wire lamp encapsulation equipment for the encapsulation rubber-insulated-wire lamp, rubber-insulated-wire lamp include wire, cladding insulating layer (rubber-insulated-wire) outside the wire and encapsulate the chip on the wire, and luminescent device integrates on the chip. In the process of packaging the rubber-insulated-wire lamp, a rubber-insulated-wire tape (including a wire and a rubber-insulated wire wrapped around the wire) is usually pre-molded (or purchased), and then a chip integrated with a light-emitting element is packaged on the rubber-insulated-wire tape on a rubber-insulated-wire lamp packaging device.

In an embodiment of the present invention, as shown in fig. 1 to 10, the rubber-insulated-wire lamp packaging apparatus includes a base 10, a packaging assembly 50, a chip feeding mechanism 20, a turnover mechanism 30 and a chip transferring assembly 40, wherein the packaging assembly 50 is disposed on the base 10, and the packaging assembly 50 has a packaging position 521; the die feeding mechanism 20 is disposed on the base 10 and spaced apart from one side of the package 50, and the die feeding mechanism 20 is used for providing a tape of the die 70.

Tilting mechanism 30 includes mount pad 31 and upset seat 32, and mount pad 31 is installed in base 10, and upset seat 32 is equipped with the chip and places the position, and upset seat 32 rotationally installs in mount pad 31 to have the horizontality that makes chip 70 place the position level and place the vertical state of a vertical placement at the chip and make chip 70.

Chip shifts subassembly 40 movably and installs in base 10, and chip shifts subassembly 40 is used for shifting chip 70 on the chip 70 material area to being in the chip of horizontal state and placing on the position, and chip shifts subassembly 40 still is used for taking the chip 70 that chip placed the position under the vertical state to shift chip 70 to assembly position 521.

In this embodiment, the rubber-insulated-wire lamp packaging device further comprises a discharging mechanism 61 and a receiving mechanism 62 which are respectively arranged on two opposite sides of the base 10 and used for placing the rubber-insulated-wire belt material coil, and the receiving mechanism 62 is used for coiling the rubber-insulated-wire lamp packaged by the packaging component 50. The blanking mechanism 61 and the receiving mechanism 62 may be mounted on the base 10, or may be disposed outside the base 10.

Optionally, the packaging assembly 50 includes a wire guiding mechanism 55, a wire stripping mechanism 51, an assembling mechanism 52, a welding mechanism 53, and a glue sealing mechanism 54, the wire stripping mechanism 51, the assembling mechanism 52, the welding mechanism 53, and the glue sealing mechanism 54 are sequentially distributed along a direction in which the discharging mechanism 61 points to the receiving mechanism 62, and the wire guiding mechanism 55 is configured to guide the rubber-covered belt extending from the rubber-covered belt roll of the discharging mechanism 61 to the receiving mechanism 62 after passing through the wire stripping mechanism 51, the assembling mechanism 52, the welding mechanism 53, and the glue sealing mechanism 54. Wherein, can set up the structure of expanding the line (for example pneumatic clamp indicates) on assembly devices 52 to make the structure of expanding the line locate the below of assembly position 521, move chip 70 to assembly position top at chip transfer subassembly 40, stretch into between two wires of leather-covered wire area through the structure of expanding the line (can be with the structure of expanding the line liftable or can stretch out and draw back the setting), and make two wire expansions, after removing the chip to between two wires, the structure of expanding the line withdraws from, two wires reset and clip the chip, chip transfer subassembly 40 can leave assembly position 521 afterwards. Alternatively, a wire extension structure may be provided on chip transfer assembly 40.

Wherein, unloading mechanism 61, receiving agencies 62, wire mechanism 55, wire stripping mechanism 51, welding mechanism 53 and sealing machine construct 54 and can refer to the structure among the prior art, the utility model discloses no longer describe repeatedly one by one this.

The wire stripping mechanism 51 is used for stripping the insulation layer of the rubber-covered wire belt to form a mounting position, and the assembling mechanism 52 is provided with an assembling position 521, when the mounting position on the rubber-covered wire belt moves to the assembling position 521, the chip transfer component 40 places the chip 70 on the mounting position on the rubber-covered wire belt. The soldering mechanism 53 is used for soldering the chip 70 with the lead of the mounting position, and the sealing mechanism 54 is used for sealing the chip 70 of the mounting position.

Of course, in other embodiments, an upper structure and a lower structure located below the upper structure may be provided on the base 10, the wire stripping mechanism 51 and the assembling mechanism 52 are provided on the upper structure, the welding mechanism 53 and the glue sealing mechanism 54 are provided on the lower structure, or the wire stripping mechanism 51 and the assembling mechanism 52 are provided on the lower structure, and the welding mechanism 53 and the glue sealing mechanism 54 are provided on the upper structure. The blanking mechanism 61 and the receiving mechanism 62 are disposed on the same side of the base 10 and distributed up and down. In addition, in other embodiments, the feeding mechanism 61 and the receiving mechanism 62 may not be provided, and feeding and receiving may be performed by another device.

The utility model discloses technical scheme is through setting up tilting mechanism 30 on the base, when chip transfer assembly 40 takes chip 70 from chip feed mechanism 20 like this, can be so that tilting mechanism 30's upset seat 32 upset to the horizontality, after chip transfer assembly 40 takes the chip 70 that the level was placed from chip feed mechanism 20, can directly move to upset seat 32 department, place the position at the chip with chip 70 level, make upset seat 32 upset to vertical state afterwards, thereby make the chip 70 that the position was placed to the chip overturn to vertical state along with upset seat 32. Finally, the chip transfer module 40 transfers the vertically positioned chip 70 to the assembly site 521 of the packaging module 50 so that the chip 70 can be vertically mounted between two wires of the tape. So set up, chip 70 shifts the mechanism and only need shift chip 70 that chip 70 material area level was placed to the chip that is in the horizontality and place the position on, rotate to vertical state back at upset seat 32 from the horizontality, chip shift subassembly 40 also only need take the chip and place the chip 70 that the position was vertically placed to shift chip 70 to the equipment position 521 can. In this way, the chip transfer unit 40 does not need to turn the chip 70 over, i.e., a rotating structure is not required to be disposed on the chip transfer unit 40, during the process of transferring the chip 70 from the chip feeding mechanism 20 to the enclosure 50, so that the structure of the chip transfer unit 40 can be simplified. Moreover, the turnover mechanism 30 can be fixed on the base 10 through the mounting seat 31, and does not need to move relative to the chip feeding mechanism 20 and the packaging assembly 50, so that the turnover mechanism 30 is simple in structure, the structure of the chip 70 feeding mechanism is simplified under the condition that the chip 70 is vertically mounted on the belt line, and the cost of the rubber-insulated-wire lamp packaging equipment can be reduced.

There are various positions for the turnover mechanism 30 to be disposed on the base 10, for example, in some embodiments, the turnover mechanism 30 is disposed between the chip feeding mechanism 20 and the packaging assembly 50. Thus, the chip transfer assembly 40 can move linearly between the chip feeding mechanism 20 and the assembling position 521 of the packaging assembly 50, the moving stroke of the chip transfer assembly 40 can be reduced, the risk of error increase caused by long stroke of the chip transfer assembly 40 can be reduced, and the positioning precision of the chip transfer assembly 40 can be higher.

In other embodiments, the chip feeding mechanism 20 and the turnover mechanism 30 are spaced apart in the transport direction of the linear lamps on the package assembly 50. This is advantageous for reducing the size of the filament lamp packaging apparatus in the direction in which the chip feeding mechanism 20 points toward the package assembly 50.

In some embodiments, the chip transfer assembly 40 includes a first transfer mechanism 41 and a second transfer mechanism 42, the first transfer mechanism 41 is movably mounted on the base 10, the first transfer mechanism 41 is used for transferring the chip 70 on the chip 70 tape to a chip placement position in a horizontal state; the second transfer mechanism 42 is movably mounted on the base 10, and the second transfer mechanism 42 is used for taking the chip 70 at the chip placement position in the vertical state and transferring the chip 70 to the assembly position 521.

Specifically, the first transfer mechanism 41 transfers the chip 70 on the chip 70 tape to the chip placement position in the horizontal state, and after the inverting base 32 is rotated to the vertical state, the second transfer mechanism 42 takes the chip 70 at the chip placement position in the vertical state and transfers the chip 70 to the assembly position 521. This can reduce the respective movement strokes of the first transfer mechanism 41 and the second transfer mechanism 42, and reduce the risk of an increase in error of the first transfer mechanism 41 and the second transfer mechanism 42 due to a long stroke. Further, after the first transfer mechanism 41 places the chip 70 at the chip placement position, the first transfer mechanism 41 may move toward the chip feed mechanism 20 to take the next chip 70, while the second transfer mechanism 42 takes the chip 70 from the chip placement position and transfers the chip 70 to the mounting position 521. That is, the first transfer mechanism 41 and the second transfer mechanism 42 may operate simultaneously, so that the efficiency of loading the chips 70 may be improved.

Of course, in other embodiments, the chip 70 on the chip 70 tape may be transferred to the chip placement position in the horizontal state by a transfer mechanism, and the chip 70 in the chip placement position in the vertical state may be taken out, so that the chip 70 is transferred to the assembly position 521.

In some embodiments, the flipping base 32 has a first side 323 and a second side 324 adjacent to each other, the chip placement site includes a receiving slot 331 formed at a junction of the first side 323 and the second side 324 and a limiting structure, the receiving slot 331 has a limiting slot wall 332, the limiting slot wall 332 is spaced apart from the first side 323 and connected to the second side 324, the limiting slot wall 332 is horizontally disposed in the horizontal state, the limiting slot wall 332 is vertically disposed in the vertical state, the limiting structure is at least partially disposed in the receiving slot 331 and located between the limiting slot wall 332 and the first side 323, and the limiting structure is configured to fix the chip 70.

Specifically, the first side surface 323 and the second side surface 324 are substantially vertically arranged, the notch of the accommodating groove 331 penetrates through the first side surface 323 and the second side surface 324, the accommodating groove 331 further has a placing groove wall 333, the placing groove wall 333 is spaced from the second side surface 324 and connected with the first side surface 323, the placing groove wall 333 is substantially vertically arranged with the limiting groove wall 332, and the limiting structure is arranged on the placing groove wall 333. The chip 70 can be conveniently positioned and placed by arranging the accommodating groove 331 at the chip placing position and arranging the limiting structure in the accommodating groove 331. In this embodiment, chip transfer assembly 40 may include first transfer mechanism 41 and second transfer mechanism 42, or chip transfer assembly 40 may include only one transfer mechanism.

In addition, in other embodiments, the chip placement site includes a carrier provided at the junction of the first side 323 and the second side 324 and a jig provided on the carrier, by which the chip 70 is held.

In some embodiments, the retaining structure includes a negative pressure air passage and a negative pressure port 335 in communication with the negative pressure air passage, the negative pressure port 335 being located between the retaining groove wall 332 and the first side 323. Specifically, the end of the negative pressure channel far from the negative pressure port 335 is used for connecting a negative pressure device, when the chip transfer assembly 40 places the chip 70 in the containing groove 331 and is located at the negative pressure port 335, the negative pressure generated by the negative pressure port 335 can adsorb and fix the chip 70, so that the situation that the chip 70 is displaced or falls off in the rotating process of the flip seat 32 can be avoided, and the structure in the containing groove 331 can be simplified. Of course, in other embodiments, the limiting structure includes a clamp disposed on the placing groove wall 333, and the chip 70 is clamped by the clamp.

In some embodiments, the turnover mechanism 30 further includes a turnover cylinder 34 and a connecting rod 35, a cylinder body of the turnover cylinder 34 is mounted on the mounting base 31, one end of the connecting rod 35 is fixed to the rotating shaft of the turnover base 32, the other end of the connecting rod 35 is rotatably connected to a piston rod of the turnover cylinder 34, and a rotation axis between the piston rod of the turnover cylinder 34 and the connecting rod 35 is perpendicular to the rotating shaft of the turnover base 32. The turnover cylinder 34 is used for driving the turnover seat 32 to rotate, so that the structure is simple, and the turnover seat 32 is convenient to position. In addition, in other embodiments, the turning seat 32 can be driven to rotate by a motor.

In some embodiments, the flipping base 32 includes a rotating base body 321 and a receiving base body 322, the rotating base body 321 is rotatably mounted on the mounting base 31, and the receiving base body 322 is provided with a chip placing position and is detachably mounted on the rotating base body 321. Specifically, the rotation base 321 is provided with a rotation shaft, the rotation base 321 is rotatably installed on the installation base 31 through the rotation shaft, and the accommodation base 322 is detachably connected to the rotation base 321, so that the accommodation base 322 can be conveniently replaced, for example, the corresponding accommodation base 322 can be replaced for chips 70 of different specifications, and the like. Of course, in other embodiments, the flipping base 32 may be a one-piece structure.

In some embodiments, the negative pressure air passage includes a first air passage 336 and a second air passage, the first air passage 336 is disposed on the rotating base 321, the second air passage is disposed on the accommodating base 322, the first air passage 336 is communicated with the second air passage, an end of the first air passage 336 far away from the second air passage is used for communicating the negative pressure pipeline, and an end of the second air passage far away from the first air passage 336 is communicated with the negative pressure port 335. Specifically, the negative pressure pipeline is used for connecting a negative pressure device, that is, the negative pressure pipeline is installed on the rotating seat body 321, so that when the accommodating seat body 322 is disassembled, the negative pressure pipeline does not need to be disassembled, and the accommodating seat body 322 is convenient to replace. Of course, in other embodiments, the negative pressure air passage may be only disposed on the accommodation seat 322.

In some embodiments, the first transfer mechanism 41 is provided with a negative pressure suction head 412, and the negative pressure suction head 412 is used for sucking up the chip 70. The negative pressure suction head 412 is used for connecting a negative pressure device, when the first transfer mechanism 41 moves to above the chip feeding mechanism 20, the negative pressure device generates a negative pressure at the negative pressure suction head 412, so that the chip 70 can be sucked on the negative pressure suction head 412, and when the chip 70 moves to the chip placing position, the negative pressure device is closed or a passage between the negative pressure device and the negative pressure suction head 412 is cut off, so that the negative pressure generation at the negative pressure suction head 412 is stopped, and the chip 70 falls to the chip placing position. This allows the suction head 412 to be used in a manner that facilitates the removal of the horizontally positioned chip 70 from the chip feeding mechanism 20.

In some embodiments, the second transfer mechanism 42 is provided with a clamping assembly 422, the clamping assembly 422 is used for clamping the chip 70 at the chip placement position in the vertical state, and the limiting groove wall 332 is provided with an avoiding notch 334 for avoiding the clamping assembly 422. Specifically, the clamping assembly 422 includes a pneumatic clamping finger 4221 and two clamping arms 4222, wherein one clamping arm 4222 is mounted on one of the pneumatic clamping fingers 4221, and the other clamping arm 4222 is mounted on the other clamping finger of the pneumatic clamping finger 4221, so that the two clamping arms 4222 can be driven to open and close by the pneumatic clamping finger 4221, thereby clamping the chip 70 and releasing the chip 70. When the chip 70 is in the vertical state, the chip 70 is more easily gripped by the gripper assembly 422.

In some embodiments, at least two chip placement sites are disposed on the flipping seat 32, and the chip placement sites are spaced apart from each other. Therefore, a plurality of chips 70 can be transferred at the same time, and the feeding efficiency of the chips 70 is improved.

In some embodiments, the base 10 is provided with a supporting frame 11, the supporting frame 11 is provided with a guiding structure 111, and the first transferring mechanism 41 and the second transferring mechanism 42 are both slidably mounted on the guiding structure 111. Specifically, the first transfer mechanism 41 includes a first motor 413, a first transmission assembly 414, a first sliding seat 411, a first lifting cylinder 415, a first fixed block 416, and a negative pressure suction head 412, the first motor 413 is mounted on the supporting frame 11, the first sliding seat 411 is slidably mounted on the first guiding structure 111, and the first motor 413 is connected to the first sliding seat 411 through the first transmission assembly 414 to drive the first sliding seat 411 to slide relative to the guiding structure 111. The first lifting cylinder 415 is installed on the first sliding seat 411, the negative pressure suction head 412 is installed on the first fixing block 416, and the first fixing block 416 is connected with the piston rod of the first lifting cylinder 415 and is slidably installed on the first sliding seat 411 in the up-down direction, so that the negative pressure suction head 412 is driven to move up and down by the first lifting cylinder 415.

The second transfer mechanism 42 includes a second motor 423, a second transmission assembly 424, a second sliding seat 421, a second lifting cylinder 425, a second fixing block 426 and a clamping assembly 422, the second motor 423 is mounted on the supporting frame 11, the second sliding seat 421 is slidably mounted on the second guiding structure 111, and the second motor 423 is connected with the second sliding seat 421 through the second transmission assembly 424 to drive the second sliding seat 421 to slide relative to the guiding structure 111. The second lifting cylinder 425 is installed on the second sliding seat 421, the clamping assembly 422 is installed on the second fixing block 426, and the second fixing block 426 is connected with the piston rod of the second lifting cylinder 425 and is slidably installed on the second sliding seat 421 in the up-down direction, so that the clamping assembly 422 is driven by the second lifting cylinder 425 to move up and down.

With such an arrangement, the first transfer mechanism 41 and the second transfer mechanism 42 can slide conveniently, so that the moving accuracy of the first transfer mechanism 41 and the second transfer mechanism 42 is high, and the first transfer mechanism 41 and the second transfer mechanism 42 share the guide structure 111, so that the structure of the chip transfer assembly 40 can be simplified. The guiding structure 111 may include at least one linear slide rail, and may also include two linear optical axes. In addition, the first transmission assembly 414 and the second transmission assembly 424 may be a rack and pinion transmission structure, or the first transmission assembly 414 and the second transmission assembly 424 may also be a lead screw nut pair (a sliding lead screw, a ball screw, a planetary roller screw, or the like). In addition, in other embodiments, the first transfer mechanism 41 and the second transfer mechanism 42 may also be rotatably mounted to the base 10.

The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the inventive concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims (10)

1. A leather-wire lamp packaging apparatus, comprising:

a base;

the packaging assembly is arranged on the base and provided with a packaging position;

the chip feeding mechanism is arranged on the base and is arranged on one side of the packaging assembly at intervals, and the chip feeding mechanism is used for providing a chip material belt;

the turnover mechanism comprises an installation seat and a turnover seat, the installation seat is installed on the base, the turnover seat is provided with a chip placement position, and the turnover seat is rotatably installed on the installation seat and has a horizontal state that a chip is horizontally placed on the chip placement position and a vertical state that the chip is vertically placed on the chip placement position;

the chip transfer assembly is movably installed on the base and used for transferring the chips on the chip material belt to the chips in the horizontal state and the chip placement positions, and the chip transfer assembly is further used for taking the chips in the chip placement positions in the vertical state and transferring the chips to the assembly positions.

2. The filament lamp packaging apparatus of claim 1, wherein the turnover mechanism is disposed between the chip feeding mechanism and the packaging assembly; or the chip feeding mechanism and the turnover mechanism are distributed at intervals in the conveying direction of the linear lamps on the packaging component.

3. The covered wire lamp packaging apparatus according to claim 1, wherein said chip transfer assembly comprises a first transfer mechanism and a second transfer mechanism, said first transfer mechanism being movably mounted to said base, said first transfer mechanism being adapted to transfer chips on said chip carrier tape to said chip placement position in said horizontal state; the second transfer mechanism is movably arranged on the base and used for taking the chip at the chip placement position in the vertical state and transferring the chip to the assembly position.

4. The rubber-insulated-wire lamp packaging device of claim 3, wherein the flip base has a first side and a second side adjacent to each other, the chip placement site includes a receiving groove formed at a junction of the first side and the second side and a limiting structure, the receiving groove has a limiting groove wall, the limiting groove wall is spaced apart from the first side and connected to the second side, the limiting groove wall is horizontally disposed in the horizontal state, and the limiting groove wall is vertically disposed in the vertical state, the limiting structure is at least partially disposed in the receiving groove and located between the limiting groove wall and the first side, and the limiting structure is configured to fix the chip.

5. The covered wire lamp encapsulation device according to claim 4, wherein the position limiting structure comprises a negative pressure air passage and a negative pressure port communicated with the negative pressure air passage, and the negative pressure port is located between the wall of the position limiting groove and the first side surface.

6. The rubber-insulated-wire lamp packaging device of claim 5, wherein the turnover mechanism further comprises a turnover cylinder and a connecting rod, the cylinder body of the turnover cylinder is mounted on the mounting seat, one end of the connecting rod is fixed with the rotating shaft of the turnover seat, the other end of the connecting rod is rotatably connected with the piston rod of the turnover cylinder, and the rotating axis between the piston rod of the turnover cylinder and the connecting rod is perpendicular to the rotating shaft of the turnover seat.

7. The rubber-insulated-wire lamp packaging device of claim 6, wherein the turning base comprises a rotating base and an accommodating base, the rotating base is rotatably mounted on the mounting base, and the accommodating base is provided with the chip placing position and is detachably mounted on the rotating base.

8. The package apparatus of claim 7, wherein the negative pressure air channel comprises a first air channel and a second air channel, the first air channel is disposed on the rotary base, the second air channel is disposed on the receiving base, the first air channel is communicated with the second air channel, an end of the first air channel away from the second air channel is used for communicating with a negative pressure pipeline, and an end of the second air channel away from the first air channel is communicated with the negative pressure port.

9. The rubber-insulated-wire lamp packaging device according to claim 4, wherein the second transfer mechanism is provided with a clamping assembly for clamping the chip at the chip placement position in the vertical state, and the wall of the limiting groove is provided with an avoiding gap for avoiding the clamping assembly; and/or the first transfer mechanism is provided with a negative pressure suction head, and the negative pressure suction head is used for sucking the chip.

10. The rubber-insulated-wire lamp packaging device of any one of claims 3 to 8, wherein a support frame is arranged on the base, a guide structure is arranged on the support frame, and the first transfer mechanism and the second transfer mechanism are both slidably mounted on the guide structure; and/or the overturning seat is provided with at least two chip placing positions, and the chip placing positions are arranged at intervals.

Images