CN218275496U - Rubber-insulated-wire lamp encapsulation equipment - Google Patents

Abstract

The utility model discloses a belt lamp packaging device, which comprises a base, a chip transfer component and an assembling mechanism, wherein the base is provided with a wire guide mechanism which is used for conveying a belt line; the chip transfer component is movably arranged on the base; assembly devices includes fixing base, driving piece, install in fixing base and drive the elevating system of driving piece motion along upper and lower direction with install in two of driving piece expand the line structure, two expand the line structure and be in can open and shut under the drive of driving piece, two expand the line structure and be used for stretching into from belt line below between two wires of belt line, with will two wires of belt line expand outward, chip transfer subassembly is used for putting into the chip between two wires of belt line. The utility model discloses technical scheme can reduce the risk of chip because of scraping and damaging with the wire when putting into between two wires of belt line.

Description

Rubber-insulated-wire lamp encapsulation equipment

Technical Field

The utility model relates to a ornament lamp manufacturing field, in particular to leather line lamp encapsulation equipment.

Background

The rubber-insulated-wire lamp is also called as a PVC flexible wire lamp string, the rubber-insulated-wire lamp comprises a conducting wire, a rubber wire coated outside the conducting wire and a chip packaged on the conducting wire, and the lamp cap is integrated on the chip. In the production process, a rubber-covered wire tape (including a lead and a rubber-covered wire covering the lead) is usually molded (or purchased) in advance, and then a chip integrated with a lamp cap is packaged on the rubber-covered wire tape on a packaging device.

The chip on present chip material area is usually the level and places, but under some circumstances, need install the chip vertically between two wires of belt line, to this kind of belt line lamp, if directly get into the chip between two wires through the manipulator, lead to the chip to damage like this easily, the product yields is lower.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a belt line lamp encapsulation equipment, because of scraping the risk of damaging with the wire when aiming at reducing the chip and putting into between two wires of belt line.

In order to achieve the above object, the utility model provides a rubber-insulated-wire lamp encapsulation equipment, include:

the base is provided with a wire guide mechanism, and the wire guide mechanism is used for conveying a belt line;

the chip transfer component is movably arranged on the base; and

assembly devices, including fixing base, driving piece, install in fixing base and drive the driving piece is along the elevation structure of up-and-down direction motion with install in two of driving piece expand the line structure, two expand the line structure and be in can open and shut under the drive of driving piece, two expand the line structure and be used for stretching into from belt line below between two wires of belt line, with will two wires of belt line expand outward, chip transfer subassembly is used for putting into the chip between two wires of belt line.

Optionally, each of the wire expanding structures is provided with two wire expanding portions, the two wire expanding portions of the wire expanding structures are distributed at intervals along the conveying direction of the belt line, the two wire expanding portions of the wire expanding structures are arranged in a one-to-one opposite mode and are used for extending into the space between two wires of the belt line, and the chip transferring assembly is used for placing a chip into the space between the two wire expanding portions of the wire expanding structures.

Optionally, every expand the line structure and all be equipped with and be used for stretching into expand the portion between two wires of belt line, every expand line structure's expand line portion upper end and all be equipped with the spigot surface, the spigot surface is another dorsad expand the line structure setting, just the spigot surface from the bottom up is towards being close to another gradually expand the direction slope of line structure and extend.

Optionally, the wire expanding structure comprises a fixing piece and a wire expanding piece, the fixing piece is installed on the driving piece, the wire expanding piece is detachably installed on the fixing piece, and the wire expanding piece is provided with a wire expanding portion used for extending into the space between the two wires of the belt line.

Optionally, the wire guiding mechanism has two parallel conveying positions, each conveying position is used for conveying one belt line, the assembling mechanism includes two driving pieces, each driving piece is provided with two wire expanding structures, and each driving piece is provided with two wire expanding structures corresponding to one conveying position.

Optionally, the two driving members are distributed at intervals along the conveying direction of the belt line, the two expanding structures on the driving members are arranged in an opposite direction, and an avoidance gap is formed at the side of each expanding structure on each driving member, which faces the other expanding structure on the driving member.

Optionally, the lifting structure includes a lifting cylinder and a supporting seat, the lifting cylinder is installed on the fixing seat, the supporting seat is installed on a piston rod of the lifting cylinder, the supporting seat is slidably installed on the fixing seat along the up-down direction, and the driving member is installed on the supporting seat.

Optionally, the driving member is a pneumatic clamping finger, one of the wire expansion structures is mounted on one clamping finger of the pneumatic clamping finger, and the other wire expansion structure is mounted on the other clamping finger of the pneumatic clamping finger.

Optionally, the rubber-insulated-wire lamp packaging device further comprises a chip feeding mechanism and a turnover mechanism, the chip feeding mechanism is arranged on the base and is arranged on one side of the assembling mechanism at intervals, and the chip feeding mechanism is used for providing a chip material belt;

the turnover mechanism comprises an installation seat and a turnover seat, the installation seat is installed on the base, the turnover seat is provided with a chip placement position, and the turnover seat is rotatably installed on the installation seat and has a horizontal state that a chip is horizontally placed on the chip placement position and a vertical state that the chip is vertically placed on the chip placement position;

the chip transfer assembly comprises a first transfer mechanism and a second transfer mechanism, the first transfer mechanism is movably arranged on the base, and the first transfer mechanism is used for transferring the chips on the chip material belt to the chip placement position in the horizontal state; the second transfer mechanism is movably arranged on the base and used for taking the chip at the chip placement position in the vertical state and transferring the chip to the assembly position.

Optionally, the flipping base has a first side surface and a second side surface which are adjacent to each other, the chip placement position includes a containing groove and a position limiting structure formed at a joint of the first side surface and the second side surface, the containing groove has a position limiting groove wall, the position limiting groove wall is spaced from the first side surface and is connected to the second side surface, in the horizontal state, the position limiting groove wall is horizontally placed, in the vertical state, the position limiting groove wall is vertically placed, the position limiting structure is at least partially arranged in the containing groove and is located between the position limiting groove wall and the first side surface, and the position limiting structure is used for fixing a chip;

the limiting structure comprises a negative pressure air passage and a negative pressure port communicated with the negative pressure air passage, and the negative pressure port is positioned between the limiting groove wall and the first side surface;

the turnover mechanism further comprises a turnover cylinder and a connecting rod, the cylinder body of the turnover cylinder is mounted on the mounting seat, one end of the connecting rod is fixed with the rotating shaft of the turnover seat, the other end of the connecting rod is rotatably connected with the piston rod of the turnover cylinder, and the rotating axis between the piston rod of the turnover cylinder and the connecting rod is perpendicular to the rotating shaft of the turnover seat;

the overturning seat comprises a rotating seat body and an accommodating seat body, the rotating seat body is rotatably arranged on the mounting seat, and the accommodating seat body is provided with the chip placing position and is detachably arranged on the rotating seat body;

the base is provided with a support frame, the support frame is provided with a first guide structure and a second guide structure, the first transfer mechanism is slidably mounted on the first guide structure, and the second transfer mechanism is slidably mounted on the second guide structure; the first guide structure and the second guide structure are arranged in parallel.

The utility model discloses technical scheme is through setting up assembly devices on rubber-insulated-wire lamp encapsulation equipment, assembly devices includes fixing base, driving piece, installs in fixing base and drive driving piece along the elevation structure of up-and-down direction motion and install in two of driving piece expand the line structure, and two expand the line structure and can open and shut under the drive of driving piece. When the mounting position on the leather belt moves to the assembly position, the wire expansion structures on the driving piece and the driving piece can be driven to move upwards through the lifting structure, and therefore the two wire expansion structures extend into the position between two wires of the mounting position of the leather belt from the lower portion of the leather belt. Open each other through two line structures that expand of driving piece drive afterwards to make two wires of belt line mounted position expand outward, thereby be convenient for chip transfer subassembly put into the chip between two wires of belt line, thereby can reduce the risk of damage because of scraping with the wire when the chip is put into between two wires of belt line, can promote leather-covered wire area encapsulation yield.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of a leather-covered wire lamp packaging device of the present invention;

FIG. 2 is an enlarged view of FIG. 1 at A;

FIG. 3 is a schematic view of the assembly mechanism of FIG. 1;

FIG. 4 is an enlarged view at B in FIG. 3;

FIG. 5 is a schematic view of a portion of the assembly mechanism of FIG. 3;

FIG. 6 is an enlarged view at C of FIG. 5;

FIG. 7 is a schematic view of another angle of the package device of the covered wire lamp of FIG. 1;

FIG. 8 is an enlarged view taken at D in FIG. 7;

FIG. 9 is a schematic structural view of the turnover mechanism in FIG. 8, wherein the turnover seat is in a horizontal state;

FIG. 10 is an enlarged view at E in FIG. 9;

FIG. 11 is a schematic view of the tilting mechanism of FIG. 9 at another angle, wherein the tilting base is in a vertical position;

FIG. 12 is an enlarged view at F of FIG. 11;

FIG. 13 is an exploded view of the roll-over seat of FIG. 11;

FIG. 14 is a schematic view of the chip transfer assembly of FIG. 1;

FIG. 15 is a schematic view of a portion of the first transfer mechanism of FIG. 14;

fig. 16 is a partial structural schematic view of the second transfer mechanism in fig. 14.

The reference numbers indicate:

10. a base; 11. a support frame; 111. a guide structure; 12. a wire guide mechanism; 20. a chip feeding mechanism; 30. a turnover mechanism; 31. a mounting base; 32. a turning seat; 321. rotating the base body; 322. a containing seat body; 323. a first side surface; 324. a second side surface; 331. a containing groove; 332. limiting groove walls; 333. placing the groove wall; 334. avoiding the notch; 335. a negative pressure port; 336. a first air passage; 34. turning over the air cylinder; 35. a connecting rod; 40. a chip transfer assembly; 41. a first transfer mechanism; 411. a first sliding seat; 412. a negative pressure suction head; 413. a first motor; 414. a first transmission assembly; 415. a first cylinder; 416. a first fixed block; 42. a second transfer mechanism; 421. a second sliding seat; 422. a clamping assembly; 4221. a pneumatic clamping finger; 4222. clamping arms; 423. a second motor; 424. a second transmission assembly; 425. a second cylinder; 426. a second fixed block; 50. a wire stripping mechanism; 60. an assembly mechanism; 601. assembling the position; 61. a fixed seat; 611. a support table; 62. a drive member; 63. a lifting structure; 631. a lifting cylinder; 632. a supporting base; 64. a wire expanding structure; 641. a fixing member; 642. avoiding the gap; 643. a wire expanding member; 644. a line enlarging part; 645. a guide surface; 65. a lifting mechanism; 651. a third cylinder; 652. a fixed mount; 66. pressing a plate; 661. a notch; 70. a welding mechanism; 80. a glue sealing mechanism; 91. a blanking mechanism; 92. a material receiving mechanism.

The realization, the functional characteristics and the advantages of the utility model are further explained by combining the embodiment and referring to the attached drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear \8230;) are involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship between the components in a specific posture (as shown in the attached drawings), the motion situation, etc., and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a rubber-insulated-wire lamp encapsulation equipment for the encapsulation rubber-insulated-wire lamp, rubber-insulated-wire lamp include wire, cladding insulating layer (rubber-insulated-wire) outside the wire and encapsulate the chip on the wire, and luminescent device integrates on the chip. In the process of packaging the rubber-insulated-wire lamp, a rubber-insulated-wire tape (including a wire and a rubber-insulated wire wrapped around the wire) is usually pre-molded (or purchased), and then a chip integrated with a light-emitting element is packaged on the rubber-insulated-wire tape on a rubber-insulated-wire lamp packaging device.

In the embodiment of the present invention, as shown in fig. 1 to 16, the rubber-insulated-wire lamp packaging device includes a base 10, a chip transfer assembly 40 and an assembling mechanism 60, wherein a wire mechanism 12 is arranged on the base 10, and the wire mechanism 12 is used for conveying a belt line; the chip transfer assembly 40 is movably mounted on the base 10; the assembling mechanism 60 comprises a fixed seat 61, a driving member 62, a lifting structure 63 which is installed on the fixed seat 61 and drives the driving member 62 to move in the up-down direction, and two wire expanding structures 64 which are installed on the driving member 62, wherein the two wire expanding structures 64 can be opened and closed under the driving of the driving member 62, the two wire expanding structures 64 are used for extending into two wires of the belt line from the lower part of the belt line so as to expand the two wires of the belt line, and the chip transferring assembly 40 is used for placing a chip between the two wires of the belt line.

In this embodiment, the rubber-insulated-wire lamp packaging device further includes a blanking mechanism 91 and a receiving mechanism 92 respectively disposed on two opposite sides of the base 10, and the blanking mechanism is used for placing the rubber-insulated-wire belt material roll, and the receiving mechanism 92 is used for rolling up the rubber-insulated-wire lamp after the packaging is completed. The blanking mechanism 91 and the receiving mechanism 92 may be mounted on the base 10, or may be disposed outside the base 10.

Optionally, the rubber-insulated-wire lamp packaging device further includes a wire stripping mechanism 50, a welding mechanism 70 and a glue sealing mechanism 80, the wire stripping mechanism 50, the assembling mechanism 60, the welding mechanism 70 and the glue sealing mechanism 80 are sequentially distributed along a direction in which the discharging mechanism 91 points to the receiving mechanism 92, and the guiding mechanism 12 is used for guiding a rubber-insulated belt extending from a rubber-insulated-wire belt coil of the discharging mechanism 91 to the receiving mechanism 92 after passing through the wire stripping mechanism 50, the assembling mechanism 60, the welding mechanism 70 and the glue sealing mechanism 80. The soldering mechanism 70 is used for soldering the chip and the lead at the mounting position, and the sealing mechanism 80 is used for sealing the chip at the mounting position. Wherein, unloading mechanism 91, receiving agencies 92, wire mechanism 12, wire stripping mechanism 50, welding mechanism 70 and sealing machine construct 80 and can refer to the structure among the prior art, the utility model discloses no longer give unnecessary detail to this one by one.

The wire stripping mechanism 50 is used to strip the insulation of the tape to form a mounting location, and the fitting mechanism 60 has a fitting bit 601. When the installation position on the belt line is moved to the assembly position 601, the lifting structure 63 drives the driving member 62 and the wire expanding structure 64 on the driving member 62 to move upward, so that the two wire expanding structures 64 extend into the space between the two wires at the installation position of the belt line from the lower part of the belt line. The two spreading structures 64 are then driven by the drive 62 to open one another, so that the two lines of the belt line installation site are spread. When the chip transfer assembly 40 puts the chip between two wires of the belt line, the driving member 62 drives the two wire expanding structures 64 to approach each other, so that the two wires which are contracted clamp the chip, the driving member 62 and the wire expanding structures 64 move downwards under the driving of the lifting structure 63, the chip transfer assembly 40 is moved away from the mounting position, and thus, the process of putting the chip between the two wires is completed at one time. Under the action of the wire guiding mechanism 12, the rubber-covered wire belt sequentially passes through the welding mechanism 70 for welding and the glue sealing mechanism 80 for sealing glue and then is wound on the material receiving mechanism 92.

Of course, in other embodiments, an upper layer structure and a lower layer structure located below the upper layer structure may be disposed on the base 10, the wire stripping mechanism 50 and the assembling mechanism 60 are disposed on the upper layer structure, and the welding mechanism 70 and the glue sealing mechanism 80 are disposed on the lower layer structure, or the wire stripping mechanism 50 and the assembling mechanism 60 are disposed on the lower layer structure, and the welding mechanism 70 and the glue sealing mechanism 80 are disposed on the upper layer structure. The blanking mechanism 91 and the receiving mechanism 92 are disposed on the same side of the base 10 and distributed up and down. In other embodiments, the feeding mechanism 91 and the receiving mechanism 92 may not be provided, and feeding and receiving may be performed by another device.

The utility model discloses technical scheme is through setting up assembly devices 60 on rubber-insulated-wire lamp encapsulation equipment, assembly devices 60 include fixing base 61, driving piece 62, install in fixing base 61 and drive driving piece 62 along the elevation structure 63 of up-and-down direction motion and install in two of driving piece 62 and expand line structure 64, and two expand line structure 64 can open and shut under driving piece 62's drive. When the installation position on the leather belt is moved to the assembly position 601, the lifting structure 63 can drive the driving member 62 and the wire expansion structure 64 on the driving member 62 to move upwards, so that the two wire expansion structures 64 extend into the space between the two wires at the installation position of the leather belt from the lower part of the leather belt. Two expand line structure 64 through driving piece 62 drive each other afterwards and open to make two wires of belt line mounted position expand outward, thereby be convenient for chip transfer subassembly 40 put into the chip between two wires of belt line, thereby can reduce the risk of damage because of scraping with the wire when the chip is put into between two wires of belt line, can promote belt line area encapsulation yield.

In some embodiments, each of the wire expanding structures 64 is provided with two wire expanding portions 644, the two wire expanding portions 644 of the wire expanding structures 64 are distributed at intervals along the conveying direction of the belt line, the wire expanding portions 644 of the two wire expanding structures 64 are arranged in a one-to-one manner and are used for extending between two conducting wires of the belt line, and the chip transferring assembly 40 is used for placing a chip between the two wire expanding portions 644 of the wire expanding structures 64. So set up, when two flaring portion 644 through two flaring structure 64 expand the wire jointly, can make two wires partly roughly parallel arrangement between two flaring portion 644 of flaring structure 64 (namely two wires are roughly the same width arrangement in the part between two flaring portion 644 of flaring structure 64), can be convenient for put into between two wires with the chip, and after two flaring structure 64 shrink, make the wire of chip front and back side shrink roughly simultaneously, thereby make chip front and back side atress comparatively even, reduce the chip because of the risk that the upset takes place for the front and back side atress inequality when two wires shrink, guarantee that the chip can stabilize the centre gripping between two wires. Of course, in other embodiments, only one wire expansion portion 644 may be provided on each wire expansion structure 64.

In some embodiments, each wire expansion structure 64 is provided with a wire expansion portion 644 for extending between two conducting wires of the belt line, the upper end of the wire expansion portion 644 of each wire expansion structure 64 is provided with a guiding surface 645, the guiding surface 645 is arranged opposite to the other wire expansion structure 64, and the guiding surface 645 gradually extends in an inclined manner from bottom to top towards the other wire expansion structure 64. Therefore, the upper end of the part (the two opposite flaring portions 644) of the two flaring structures 64 extending between the two conducting wires is small in size, so that the part can extend between the two conducting wires, and after the flaring portions 644 extend between the two conducting wires, the conducting wires can slide along the guide surfaces 645 along with the upward movement of the flaring structures 64, so that the two conducting wires can be expanded. Meanwhile, the arrangement enables the lower end of the wire expanding part 644 to be large in size and high in structural strength, and reduces the deformation risk of the wire expanding part 644. The number of the wire expanding portions 644 on each wire expanding structure 64 may be one or two. In other embodiments, the widening portion 644 may have a sheet shape.

In some embodiments, the wire expanding structure 64 includes a fixing member 641 and a wire expanding member 643, the fixing member 641 is mounted to the driving member 62, the wire expanding member 643 is detachably mounted to the fixing member 641, and the wire expanding member 643 is provided with a wire expanding portion 644 for extending between two wires of the belt line. That is, the fixing element 641 is mainly used for connecting the wire expanding element 643 and the driving element 62, so that even if the wire expanding element 643 is damaged, only the wire expanding element 643 needs to be replaced, and the entire wire expanding structure 64 does not need to be replaced, thereby reducing the maintenance cost. In some embodiments, two wire-expanding portions 644 are disposed on the wire-expanding element 643. In other embodiments, the wire expanding part 643 is provided with an expanding part 644. In addition, in other embodiments, the fixing member 641 and the wire expanding member 643 are fixed by welding. Or flare structure 64 may be a unitary structure.

In some embodiments, the thread guiding mechanism 12 has two parallel conveying positions, each conveying position is used for conveying one belt thread, the assembling mechanism 60 includes two driving members 62, each driving member 62 is provided with two thread enlarging structures 64, and the two thread enlarging structures 64 on each driving member 62 are arranged corresponding to one conveying position. So set up, can carry two belt lines simultaneously and encapsulate, can promote encapsulation efficiency. The chip transfer assembly 40 has two chip holding positions, and the two chip holding positions and the two conveying positions are arranged in a one-to-one correspondence manner. Of course, in other embodiments, the wire guide mechanism 12 may be provided with only one delivery site. In addition, a group or a plurality of groups of lead mechanisms 12 can be arranged on the rubber-insulated-wire lamp packaging equipment, and each group of guide mechanism can be provided with one or two conveying positions.

In some embodiments, the two driving members 62 are spaced apart along the conveying direction of the belt line, and the wire expansion structures 64 of the two driving members 62 are disposed facing each other, and the side of the wire expansion structure 64 of each driving member 62 facing the wire expansion structure 64 of the other driving member 62 is formed with a space-avoiding gap 642. This allows the wire extension structures 64 on the two driving members 62 to be arranged compactly in the direction of the two transfer positions, and also allows the chip transfer assembly 40 to be compact.

In some embodiments, the lifting structure 63 includes a lifting cylinder 631 and a supporting seat 632, the lifting cylinder 631 is mounted on the fixing seat 61, the supporting seat 632 is mounted on the piston rod of the lifting cylinder 631, the supporting seat 632 is slidably mounted on the fixing seat 61 in the up-down direction, and the driving member 62 is mounted on the supporting seat 632. So set up, can be so that elevation structure 63's simple structure is reliable. Of course, in other embodiments, the drive member 62 may be driven up and down by a motor.

In some embodiments, the actuator 62 is a pneumatic gripping finger 4221, wherein one wire expansion structure 64 is mounted to one gripping finger of the pneumatic gripping finger 4221 and the other wire expansion structure 64 is mounted to the other gripping finger of the pneumatic gripping finger 4221. Specifically, the two clamp fingers of the pneumatic clamp finger 4221 can be opened and closed under the driving of the cylinder, and when the two wire expansion structures 64 are respectively arranged on the two clamp fingers, the opening and closing of the two wire expansion structures 64 can be realized. By using the pneumatic gripper fingers 4221 as the driving member 62, the structure of the driving member 62 can be simplified and made compact.

In some embodiments, the fixing base 61 has a supporting base 611, the supporting base 611 is located above the driving element 62 and the wire expanding structure 64, a through hole is formed in the supporting base 611, an assembling position 601 is formed at the through hole, the assembling mechanism 60 further includes a lifting structure and a pressing plate 66, the lifting structure is installed above the fixing base 61, the pressing plate 66 is installed on the lifting structure and located above the supporting base 611, a wire passing space is formed between the pressing plate 66 and the supporting base 611, the lifting structure is used for driving the pressing plate 66 to move in an up-down direction, and the pressing plate 66 has a limiting position for pressing the rubber-covered wire onto the supporting base 611. The pressing plate 66 is provided with a yielding notch 661 corresponding to the through hole of the assembling position 601, and the yielding notch 661 is used for exposing the belt so as to allow the chip to be installed between two guides of the belt. That is, when the chip is loaded, the pressing plate 66 is driven by the lifting structure to move downwards to the limiting position, so that the belt line is pressed on the supporting table 611, the belt line can be prevented from being jacked and shifted, and the belt line and the chip can be accurately positioned. Of course, in other embodiments, a pressure plate 66 rotatably mounted to the support base 611 may be provided to press the belt against the support base 611.

In one embodiment, the lifting mechanism 65 includes a third cylinder 651 and a fixed frame 652, the fixed frame 652 is mounted on the support base 611, the third cylinder 651 is mounted on the second fixed frame 652, a piston rod of the third cylinder 651 extends in the vertical direction, and the pressing plate 66 is mounted on the piston rod of the third cylinder 651. This makes the lifting structure simple in construction.

In some embodiments, a positioning groove is disposed on the support platform 611, the positioning groove is communicated with the thread passing space, and the pressing plate 66 is used for pressing the leather-covered thread into the positioning groove when in the limiting position. This allows accurate positioning of the belt on the support 611.

In some embodiments, the rubber-insulated-wire lamp packaging apparatus further includes a chip feeding mechanism 20 and a turnover mechanism 30, the chip feeding mechanism 20 is disposed on the base 10 and spaced apart from one side of the assembling mechanism 60, and the chip feeding mechanism 20 is configured to provide a chip material tape.

Tilting mechanism 30 includes mount pad 31 and upset seat 32, and mount pad 31 is installed in base 10, and upset seat 32 is equipped with the chip and places the position, and upset seat 32 rotationally installs in mount pad 31 to have the horizontal state that makes the chip place the position level and place the vertical state of a vertical place at the chip.

Chip transfer assembly 40 movably installs in base 10, and chip transfer assembly 40 is used for placing the position with the chip transfer on the chip material area to the chip that is in the horizontality on, and chip transfer assembly 40 still is used for taking the chip that the position was placed to the chip under the vertical state to shift the chip to assembly position 601.

Through set up tilting mechanism 30 on base 10, when chip transfer assembly 40 takes the chip from chip feed mechanism 20 like this, can be so that tilting mechanism 30's upset seat 32 upset to the horizontality, after chip transfer assembly 40 takes the chip that the level was placed from chip feed mechanism 20, can directly remove to upset seat 32 department, place the position at the chip with the chip level, make upset seat 32 upset to vertical state afterwards, thereby make the chip that the position was placed to the chip overturn to vertical state along with upset seat 32. Finally, the chip transfer unit 40 transfers the vertically placed chip to the mounting position 601 of the mounting mechanism 60 so that the chip can be vertically mounted between two wires of the tape. So set up, chip transfer mechanism only need take the chip that the level was placed to shift to the chip that is in the horizontality to place the position with chip material, rotate to vertical state back from the horizontality at upset seat 32, chip transfer assembly 40 also only need take the chip place the chip of the vertical placement of position to shift the chip to assembly position 601 can. In this way, in the process of transferring the chip from the chip feeding mechanism 20 to the assembling mechanism 60, the chip transferring assembly 40 is not required to turn over the chip, that is, a rotating structure is not required to be arranged on the chip transferring assembly 40, so that the structure of the chip transferring assembly 40 can be simplified. And tilting mechanism 30 can be fixed on base 10 through mount pad 31, and need not remove relative chip feed mechanism 20 and assembly devices 60, also can make tilting mechanism 30's simple structure, realizes that the chip is vertical to be installed and simplifies the structure of chip feed mechanism under the belt line condition, can reduce the cost of rubber-insulated-wire lamp encapsulation equipment.

There are various positions where the turnover mechanism 30 is disposed on the base 10, for example, in some embodiments, the turnover mechanism 30 is disposed between the chip feeding mechanism 20 and the assembling mechanism 60. Therefore, the chip transfer assembly 40 can move linearly between the chip feeding mechanism 20 and the assembling position 601 of the assembling mechanism 60, the moving stroke of the chip transfer assembly 40 can be reduced, the risk of error increase caused by long stroke of the chip transfer assembly 40 is reduced, and the positioning accuracy of the chip transfer assembly 40 can be higher.

In other embodiments, the chip feeding mechanism 20 and the turnover mechanism 30 are spaced apart in the feeding direction of the linear lamps in the assembling mechanism 60. This is advantageous in reducing the size of the covered wire lamp packaging device in the direction in which the chip feeding mechanism 20 is directed to the mounting mechanism 60.

In some embodiments, the chip transfer assembly 40 includes a first transfer mechanism 41 and a second transfer mechanism 42, the first transfer mechanism 41 is movably mounted on the base 10, the first transfer mechanism 41 is used for transferring the chip on the chip tape to a chip placement position in a horizontal state; the second transfer mechanism 42 is movably mounted on the base 10, and the second transfer mechanism 42 is used for taking the chip at the chip placement position in the vertical state and transferring the chip to the assembly position 601.

Specifically, the first transfer mechanism 41 transfers the chip on the chip tape to the chip placement position in the horizontal state, and after the flip seat 32 rotates to the vertical state, the second transfer mechanism 42 takes the chip at the chip placement position in the vertical state and transfers the chip to the assembly position 601. This can reduce the respective movement strokes of the first transfer mechanism 41 and the second transfer mechanism 42, and reduce the risk of an increase in error of the first transfer mechanism 41 and the second transfer mechanism 42 due to a long stroke. And after the first transfer mechanism 41 places the chip at the chip placement position, the first transfer mechanism 41 may move toward the chip feeding mechanism 20 to take the next chip, while the second transfer mechanism 42 takes the chip from the chip placement position and transfers the chip to the mounting position 601. That is, the first transfer mechanism 41 and the second transfer mechanism 42 can be operated at the same time, so that the chip loading efficiency can be improved.

Of course, in other embodiments, the chips on the chip carrier tape may be transferred to the chip placement position in the horizontal state by a transfer mechanism, and the chips on the chip placement position in the vertical state may be taken out and transferred to the assembly position 601.

In some embodiments, the flipping base 32 has a first side 323 and a second side 324 adjacent to each other, the chip placement position includes a containing slot 331 formed at a connection portion of the first side 323 and the second side 324 and a position-limiting structure, the containing slot 331 has a position-limiting slot wall 332, the position-limiting slot wall 332 is spaced apart from the first side 323 and connected to the second side 324, in a horizontal state, the position-limiting slot wall 332 is horizontally disposed, in a vertical state, the position-limiting slot wall 332 is vertically disposed, the position-limiting structure is at least partially disposed in the containing slot 331 and located between the position-limiting slot wall 332 and the first side 323, and the position-limiting structure is configured to fix the chip.

Specifically, the first side 323 and the second side 324 are substantially perpendicular to each other, the notch of the receiving slot 331 penetrates through the first side 323 and the second side 324, the receiving slot 331 further has a placing slot wall 333, the placing slot wall 333 is spaced from the second side 324 and connected to the first side 323, the placing slot wall 333 and the limiting slot wall 332 are substantially perpendicular to each other, and the limiting structure is disposed on the placing slot wall 333. The containing groove 331 is formed in the chip containing position, and the limiting structure is arranged in the containing groove 331, so that the chip can be conveniently positioned and placed. In this embodiment, chip transfer assembly 40 may include first transfer mechanism 41 and second transfer mechanism 42, or chip transfer assembly 40 may include only one transfer mechanism.

In addition, in other embodiments, the chip placement station includes a carrier provided at a junction of the first side 323 and the second side 324 and a jig provided on the carrier, and the chip is held by the jig.

In some embodiments, the retaining structure includes a negative pressure air passageway and a negative pressure port 335 in communication with the negative pressure air passageway, the negative pressure port 335 being located between the retaining groove wall 332 and the first side 323. Specifically, the end of the negative pressure channel far from the negative pressure port 335 is used for connecting a negative pressure device, when the chip transfer assembly 40 places the chip in the containing groove 331 and is located at the negative pressure port 335, the negative pressure generated by the negative pressure port 335 can adsorb and fix the chip, so that the situation that the chip is displaced or falls off in the rotating process of the turnover seat 32 can be avoided, and the structure in the containing groove 331 can be simplified. Of course, in other embodiments, the limiting structure includes a clamp disposed on the placing groove wall 333, and the chip is clamped by the clamp.

In some embodiments, the turnover mechanism 30 further includes a turnover cylinder 34 and a connecting rod 35, a cylinder body of the turnover cylinder 34 is mounted on the mounting base 31, one end of the connecting rod 35 is fixed to the rotating shaft of the turnover base 32, the other end of the connecting rod 35 is rotatably connected to a piston rod of the turnover cylinder 34, and a rotation axis between the piston rod of the turnover cylinder 34 and the connecting rod 35 is perpendicular to the rotating shaft of the turnover base 32. The turnover cylinder 34 is used for driving the turnover seat 32 to rotate, so that the structure is simple, and the turnover seat 32 is convenient to position. In addition, in other embodiments, the turning seat 32 can be driven to rotate by a motor.

In some embodiments, the flipping base 32 includes a rotating base body 321 and a receiving base body 322, the rotating base body 321 is rotatably mounted on the mounting base 31, and the receiving base body 322 is provided with a chip placing position and is detachably mounted on the rotating base body 321. Specifically, the rotation base 321 is provided with a rotation shaft, the rotation base 321 is rotatably installed on the installation base 31 through the rotation shaft, and the accommodation base 322 is detachably connected to the rotation base 321, so that the accommodation base 322 can be conveniently replaced, for example, the corresponding accommodation base 322 can be replaced for chips of different specifications, and the like. Of course, in other embodiments, the flipping base 32 may be a one-piece structure.

In some embodiments, the negative pressure air passage includes a first air passage 336 and a second air passage, the first air passage 336 is disposed on the rotating base 321, the second air passage is disposed on the accommodating base 322, the first air passage 336 is communicated with the second air passage, an end of the first air passage 336 far away from the second air passage is used for communicating the negative pressure pipeline, and an end of the second air passage far away from the first air passage 336 is communicated with the negative pressure port 335. Specifically, the negative pressure pipeline is used for connecting a negative pressure device, that is, the negative pressure pipeline is installed on the rotating seat body 321, so that when the accommodating seat body 322 is disassembled, the negative pressure pipeline does not need to be disassembled, and the accommodating seat body 322 is convenient to replace. Of course, in other embodiments, the negative pressure air channel may be only disposed on the receiving seat 322.

In some embodiments, the first transfer mechanism 41 is provided with a negative pressure suction head 412, and the negative pressure suction head 412 is used for sucking the chip. The negative pressure suction head 412 is used for connecting a negative pressure device, when the first transfer mechanism 41 moves to the position above the chip feeding mechanism 20, the negative pressure device generates negative pressure at the negative pressure suction head 412, so that the chip can be sucked on the negative pressure suction head 412, and when the chip is moved to the chip placement position, the negative pressure device is closed or the passage between the negative pressure device and the negative pressure suction head 412 is cut off, so that the negative pressure generation at the negative pressure suction head 412 is stopped, and the chip falls to the chip placement position. This allows the negative pressure suction head 412 to be used to facilitate removal of a horizontally positioned chip from the chip feeder mechanism 20.

In some embodiments, the second transfer mechanism 42 is provided with a clamping assembly 422, the clamping assembly 422 is used for clamping the chip at the chip placement position in the vertical state, and the limiting groove wall 332 is provided with 334 for avoiding the clamping assembly 422. Specifically, the clamping assembly 422 includes a pneumatic clamping finger 4221 and two clamping arms 4222, wherein one clamping arm 4222 is mounted on one of the pneumatic clamping fingers 4221, and the other clamping arm 4222 is mounted on the other clamping finger of the pneumatic clamping finger 4221, so that the two clamping arms 4222 can be driven to open and close by the pneumatic clamping finger 4221, thereby clamping and releasing the chip. When the chip is in the vertical state, the chip is easier to clamp by the clamping component 422.

In some embodiments, at least two chip placement locations are disposed on the flipping seat 32, and the chip placement locations are spaced apart from each other. Therefore, a plurality of chips can be transferred simultaneously, and the chip loading efficiency is improved.

In some embodiments, the supporting frame 11 is disposed on the base 10, the guiding structure 111 is disposed on the supporting frame 11, and the first transferring mechanism 41 and the second transferring mechanism 42 are slidably mounted on the guiding structure 111. Specifically, the first transfer mechanism 41 includes a first motor 413, a first transmission assembly 414, a first sliding seat 411, a first cylinder 415, a first fixed block 416, and a negative pressure suction head 412, the first motor 413 is mounted on the supporting frame 11, the first sliding seat 411 is slidably mounted on the first guiding structure 111, and the first motor 413 is connected to the first sliding seat 411 through the first transmission assembly 414 for driving the first sliding seat 411 to slide relative to the guiding structure 111. The first cylinder 415 is installed on the first sliding seat 411, the negative pressure suction head 412 is installed on the first fixing block 416, and the first fixing block 416 is connected with the piston rod of the first cylinder 415 and is slidably installed on the first sliding seat 411 in the up-down direction, so that the negative pressure suction head 412 is driven to move up and down by the first cylinder 415.

The second transferring mechanism 42 includes a second motor 423, a second transmission assembly 424, a second sliding seat 421, a second air cylinder 425, a second fixing block 426 and a clamping assembly 422, the second motor 423 is mounted on the supporting frame 11, the second sliding seat 421 is slidably mounted on the second guiding structure 111, and the second motor 423 is connected with the second sliding seat 421 through the second transmission assembly 424 to drive the second sliding seat 421 to slide relative to the guiding structure 111. The second cylinder 425 is installed on the second sliding seat 421, the clamping assembly 422 is installed on the second fixing block 426, and the second fixing block 426 is connected with the piston rod of the second cylinder 425 and is installed on the second sliding seat 421 in a sliding manner in the up-and-down direction, so that the clamping assembly 422 is driven by the second cylinder 425 to move up and down.

With this arrangement, the first transfer mechanism 41 and the second transfer mechanism 42 can slide easily, so that the first transfer mechanism 41 and the second transfer mechanism 42 have high moving accuracy, and the first transfer mechanism 41 and the second transfer mechanism 42 share the guide structure 111, thereby simplifying the structure of the chip transfer unit 40. The guiding structure 111 may include at least one linear slide rail, and may also include two linear optical axes. In addition, the first transmission assembly 414 and the second transmission assembly 424 may be a rack and pinion transmission structure, or the first transmission assembly 414 and the second transmission assembly 424 may also be a lead screw nut pair (a sliding lead screw, a ball screw, a planetary roller screw, or the like). In addition, in other embodiments, the first transfer mechanism 41 and the second transfer mechanism 42 may also be rotatably mounted to the base 10.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims (10)

1. A leather filament lamp packaging apparatus, comprising:

the base is provided with a wire guide mechanism, and the wire guide mechanism is used for conveying a belt line;

the chip transfer component is movably arranged on the base; and

assembly devices, including fixing base, driving piece, install in fixing base and drive the elevating system of driving piece motion from top to bottom with install in two of driving piece expand the line structure, two expand the line structure and be in can open and shut under the drive of driving piece, two expand the line structure and be used for stretching into from belt line below between two wires of belt line, in order to incite somebody to action two wires of belt line expand outward, chip transfer subassembly is used for putting into the chip between two wires of belt line.

2. The covered wire lamp packaging device according to claim 1, wherein each of the wire expanding structures is provided with two wire expanding portions, the two wire expanding portions of the wire expanding structure are distributed at intervals along the conveying direction of the belt line, the wire expanding portions of the two wire expanding structures are arranged in a one-to-one manner and are used for extending into a space between two wires of the belt line, and the chip transferring assembly is used for placing a chip between the two wire expanding portions of the wire expanding structure.

3. The covered wire lamp packaging device according to claim 1, wherein each of the wire expansion structures is provided with a wire expansion portion for extending into a space between two wires of the belt line, a guide surface is arranged at an upper end of the wire expansion portion of each of the wire expansion structures, the guide surface is arranged back to the other wire expansion structure, and the guide surface gradually extends in an inclined manner from bottom to top towards a direction close to the other wire expansion structure.

4. The covered wire lamp packaging device according to claim 1, wherein the wire expanding structure comprises a fixing member and a wire expanding member, the fixing member is mounted on the driving member, the wire expanding member is detachably mounted on the fixing member, and the wire expanding member is provided with a wire expanding part for extending into a space between two wires of the belt line.

5. The package apparatus of claim 1, wherein the wire guiding mechanism has two parallel feeding positions, each feeding position is used for feeding a belt line, the assembling mechanism includes two driving members, each driving member has two wire expanding structures, and the two wire expanding structures on each driving member are disposed corresponding to one feeding position.

6. The packaging apparatus of claim 5, wherein the two driving members are spaced apart from each other along the conveying direction of the belt line, and the wire expanding structures of the two driving members are disposed facing each other, and an avoiding gap is formed at a side of the wire expanding structure of each driving member facing the wire expanding structure of the other driving member.

7. The rubber-insulated-wire lamp packaging apparatus of claim 1, wherein the lifting structure comprises a lifting cylinder and a supporting base, the lifting cylinder is mounted on the fixing base, the supporting base is mounted on a piston rod of the lifting cylinder, the supporting base is slidably mounted on the fixing base in an up-down direction, and the driving member is mounted on the supporting base.

8. The covered wire lamp packaging apparatus according to any one of claims 1 to 7, wherein the driving member is a pneumatic clamping finger, wherein one of the wire expansion structures is mounted to one clamping finger of the pneumatic clamping finger, and the other wire expansion structure is mounted to the other clamping finger of the pneumatic clamping finger.

9. The covered wire lamp packaging apparatus according to any one of claims 1 to 7, wherein the covered wire lamp packaging apparatus further comprises a chip feeding mechanism and a turning mechanism,

the chip feeding mechanism is arranged on the base and is arranged on one side of the assembling mechanism at intervals and used for providing a chip material belt;

the turnover mechanism comprises an installation seat and a turnover seat, the installation seat is installed on the base, the turnover seat is provided with a chip placement position, and the turnover seat is rotatably installed on the installation seat and has a horizontal state that a chip is horizontally placed on the chip placement position and a vertical state that the chip is vertically placed on the chip placement position;

the chip transfer assembly comprises a first transfer mechanism and a second transfer mechanism, the first transfer mechanism is movably arranged on the base, and the first transfer mechanism is used for transferring the chips on the chip material belt to the chip placement positions in the horizontal state; the second transfer mechanism is movably installed on the base, the assembly mechanism is provided with an assembly position, and the second transfer mechanism is used for taking the chip at the chip placement position in the vertical state and transferring the chip to the assembly position.

10. The covered wire lamp packaging device according to claim 9, wherein the flip base has a first side and a second side adjacent to each other, the chip placement site includes a receiving slot and a limiting structure formed at a junction of the first side and the second side, the receiving slot has a limiting slot wall, the limiting slot wall is spaced apart from the first side and connected to the second side, the limiting slot wall is horizontally disposed in the horizontal state, the limiting slot wall is vertically disposed in the vertical state, the limiting structure is at least partially disposed in the receiving slot and located between the limiting slot wall and the first side, and the limiting structure is configured to fix the chip;

the limiting structure comprises a negative pressure air passage and a negative pressure port communicated with the negative pressure air passage, and the negative pressure port is positioned between the limiting groove wall and the first side surface;

the turnover mechanism further comprises a turnover cylinder and a connecting rod, the cylinder body of the turnover cylinder is mounted on the mounting seat, one end of the connecting rod is fixed with the rotating shaft of the turnover seat, the other end of the connecting rod is rotatably connected with the piston rod of the turnover cylinder, and the rotating axis between the piston rod of the turnover cylinder and the connecting rod is vertical to the rotating shaft of the turnover seat;

the overturning seat comprises a rotating seat body and an accommodating seat body, the rotating seat body is rotatably arranged on the mounting seat, and the accommodating seat body is provided with the chip placing position and is detachably arranged on the rotating seat body;

the base is provided with a support frame, the support frame is provided with a first guide structure and a second guide structure, the first transfer mechanism is slidably mounted on the first guide structure, and the second transfer mechanism is slidably mounted on the second guide structure; the first guide structure and the second guide structure are arranged in parallel.

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