CN115194438A

CN115194438A - Rubber-insulated-wire lamp encapsulation equipment

Info

Publication number: CN115194438A
Application number: CN202211012728.7A
Authority: CN
Inventors: 李富
Original assignee: Shenzhen Xinzhongli Intelligent Technology Co ltd
Current assignee: Shenzhen Xinzhongli Intelligent Technology Co ltd
Priority date: 2022-08-23
Filing date: 2022-08-23
Publication date: 2022-10-18

Abstract

The invention discloses a rubber-insulated-wire lamp packaging device which comprises a base, a wire stripping mechanism, an assembling mechanism, a chip transferring assembly, a welding mechanism and a glue sealing mechanism, wherein the base is provided with a wire guiding mechanism which is used for conveying a rubber-insulated wire belt; the wire stripping mechanism is arranged on the base and used for stripping an insulating layer of a wire belt to form an installation position; the assembling mechanism is arranged on the base and is positioned on the downstream side of the wire stripping mechanism along the conveying direction of the leather belt, and the assembling mechanism is provided with an assembling position which is used for exposing the mounting position on the leather belt; the chip transfer assembly is arranged on the base and used for loading the chip between the two leads of the mounting position at the assembling position; the welding mechanism is positioned on the downstream side of the assembling mechanism along the conveying direction of the rubber-covered wire belt and is used for welding the chip with a lead at the mounting position; the glue sealing mechanism is arranged on the base and is positioned on the downstream side of the welding mechanism along the conveying direction of the rubber-covered wire belt. The technical scheme of the invention can improve the production efficiency.

Description

Rubber-insulated-wire lamp encapsulation equipment

Technical Field

The invention relates to the field of decorative lamp production and manufacturing, in particular to a leather-covered lamp packaging device.

Background

Pi Xiandeng, also called as a PVC soft light string, a rubber-insulated-wire lamp includes a wire, a rubber-insulated wire wrapped around the wire, and a chip packaged on the wire, and a lamp cap is integrated on the chip. In the production process, a rubber-covered wire tape (including a lead and a rubber-covered wire covering the lead) is usually pre-molded (or purchased), and then a chip integrated with a lamp cap is packaged on the rubber-covered wire tape on a packaging device.

Chip on present chip material area is usually the level and places, but under some circumstances, need install the chip vertically between two wires in leather belt, to this kind of leather belt lamp, remove the chip to welding mechanism department through the chip manipulator at present usually and weld, should accomplish the counterpoint clamping work of chip and leather belt in welding mechanism department like this, still accomplish weldment work, can make the leather belt at welding mechanism department dwell time overlength, can influence whole production rhythm, cause great influence to whole production efficiency.

Disclosure of Invention

The invention mainly aims to provide a leather-covered lamp packaging device, aiming at improving the production efficiency.

In order to achieve the above object, the present invention provides a package device for a covered wire lamp, comprising:

the device comprises a base, a wire guide mechanism and a control mechanism, wherein the wire guide mechanism is arranged on the base and used for conveying a leather belt;

the wire stripping mechanism is arranged on the base and used for stripping an insulating layer of the belt to form an installation position;

the assembling mechanism is arranged on the base and is positioned on the downstream side of the wire stripping mechanism along the conveying direction of the leather belt, and the assembling mechanism is provided with an assembling position which is used for exposing the installing position on the leather belt;

a chip transfer assembly disposed on the base, the chip transfer assembly being configured to load a chip between the two wires of the mounting location at the mounting location;

the welding mechanism is arranged on the base and is positioned on the downstream side of the assembling mechanism along the conveying direction of the belt, and the welding mechanism is used for welding the chip with the lead at the mounting position; and

and the glue sealing mechanism is arranged on the base and is positioned on the downstream side of the welding mechanism along the conveying direction of the rubber belt, and the glue sealing mechanism is used for sealing glue to the chip at the mounting position.

According to the technical scheme, the wire stripping mechanism, the assembling mechanism, the welding mechanism and the glue sealing mechanism are arranged on the base, when the leather line lamp is packaged, the insulating layer of the leather line belt can be stripped through the wire stripping mechanism to form a mounting position, when the mounting position on the leather line belt is moved to the assembling position through the wire guiding mechanism on the base, the chip is installed between two wires of the mounting position through the chip transferring assembly, and then when the mounting position on the leather line belt with the chip clamped therein is moved to the welding mechanism, the chip is welded with the wires of the mounting position through the welding mechanism. And finally, sealing glue on the chip at the mounting position through a glue sealing mechanism, thereby completing the packaging of the rubber-insulated wire lamp. The clamping position (assembly mechanism) and the welding position (welding mechanism) of the chip and the belt are separately arranged, so that the belt is moved to the welding mechanism for welding after the chip is clamped at the assembly mechanism. Compared with the situation that the chip and the belt are clamped and welded at the same position, the clamping and welding device can avoid the situation that the structure is complex when the assembling mechanism and the welding mechanism are combined together under the situation of realizing clamping and welding. And can reduce the dwell time of leather-covered wire area in welding mechanism department like this for the dwell time of leather-covered wire area in each mechanism department is comparatively close, has accelerated the production rhythm, can promote leather-covered wire lamp production efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of a package apparatus for a covered wire lamp according to the present invention;

FIG. 2 is an enlarged view taken at A in FIG. 1;

FIG. 3 is a schematic view of the assembly mechanism of FIG. 1;

FIG. 4 is a schematic view of a portion of the assembly mechanism of FIG. 3;

FIG. 5 is an enlarged view at B in FIG. 3;

FIG. 6 is an enlarged view at C of FIG. 5;

FIG. 7 is a schematic view of another angle of the rubber-insulated-wire lamp packaging apparatus in FIG. 1;

FIG. 8 is an enlarged view taken at D in FIG. 7;

FIG. 9 is a schematic structural view of the turnover mechanism in FIG. 8, wherein the turnover seat is in a horizontal state;

FIG. 10 is a schematic view of the tilting mechanism of FIG. 9 at another angle, wherein the tilting base is in a vertical position;

FIG. 11 is an enlarged view at E in FIG. 9;

FIG. 12 is an enlarged view at F of FIG. 10;

FIG. 13 is an exploded view of the roll-over seat of FIG. 11;

FIG. 14 is a schematic view of the chip transfer assembly of FIG. 1;

FIG. 15 is a schematic view of a portion of the first transfer mechanism of FIG. 14;

FIG. 16 is a schematic view of a portion of the second transfer mechanism of FIG. 14;

FIG. 17 is a schematic structural view of the wire stripping mechanism of FIG. 1;

FIG. 18 is a schematic view of a portion of the welding mechanism of FIG. 1;

FIG. 19 is a schematic view of the heating element, feeding element and blowing element of FIG. 18;

FIG. 20 is a schematic view of a spot tin assembly of the soldering mechanism of FIG. 1;

fig. 21 is a schematic structural view of the packaging mechanism in fig. 1.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a leather wire lamp packaging device which is used for packaging leather wire lamps. In the process of packaging the rubber-insulated-wire lamp, a rubber-insulated-wire tape (including a wire and a rubber-insulated wire wrapped around the wire) is usually pre-molded (or purchased), and then a chip integrated with a light-emitting element is packaged on the rubber-insulated-wire tape on a rubber-insulated-wire lamp packaging device.

In the embodiment of the present invention, as shown in fig. 1 to 21, the rubber-insulated-wire lamp packaging apparatus includes a base 10, a wire stripping mechanism 50, an assembling mechanism 60, a chip transfer assembly 40, a welding mechanism 70, and a glue sealing mechanism 80, wherein the base 10 is provided with a wire guiding mechanism 12, and the wire guiding mechanism 12 is used for conveying Pi Xiandai; the wire stripping mechanism 50 is arranged on the base 10, and the wire stripping mechanism 50 is used for stripping an insulating layer of a wire belt to form an installation position; the assembling mechanism 60 is arranged on the base 10 and is positioned on the downstream side of the wire stripping mechanism 50 along the conveying direction of the leather belt, the assembling mechanism 60 is provided with an assembling position 601, and the assembling position 601 is used for exposing the installing position on the leather belt; a chip transfer assembly 40 is provided on the base 10, the chip transfer assembly 40 being adapted to load a chip between two wires of a mounting location at an assembly location 601; the welding mechanism 70 is arranged on the base 10 and is positioned on the downstream side of the assembling mechanism 60 along the conveying direction of the rubber-covered wire belt, and the welding mechanism 70 is used for welding the chip and a lead wire at the mounting position; the glue sealing mechanism 80 is arranged on the base 10 and located on the downstream side of the welding mechanism 70 along the conveying direction of the rubber-covered wire belt, and the glue sealing mechanism 80 is used for sealing glue on the chip at the mounting position.

In this embodiment, the rubber-insulated-wire lamp packaging device further includes a blanking mechanism 91 and a receiving mechanism 92 respectively disposed on two opposite sides of the base 10, and the blanking mechanism is used for placing the rubber-insulated-wire belt material roll, and the receiving mechanism 92 is used for rolling up the rubber-insulated-wire lamp after the packaging is completed. The blanking mechanism 91 and the receiving mechanism 92 may be mounted on the base 10, or may be disposed outside the base 10.

Optionally, the thread peeling mechanism 50, the assembling mechanism 60, the welding mechanism 70 and the glue sealing mechanism 80 are sequentially distributed along the direction in which the blanking mechanism 91 points to the receiving mechanism 92, and the guiding mechanism 12 is used for guiding the rubber-covered belt extending from the rubber-covered belt coil of the blanking mechanism 91 to the receiving mechanism 92 after passing through the thread peeling mechanism 50, the assembling mechanism 60, the welding mechanism 70 and the glue sealing mechanism 80.

The wire stripping mechanism 50 is used to strip the insulation of the tape to form a mounting location, and the fitting mechanism 60 has a fitting bit 601. The chip transfer unit 40 loads the chip between two wires of the mounting position when the mounting position on the rubber-covered wire tape is moved to the mounting position 601, and then the bonding mechanism 70 bonds the chip with the wires of the mounting position when the mounting position on the rubber-covered wire tape with the chip sandwiched therebetween is moved to the bonding mechanism 70. Finally, the chip at the mounting position is sealed by the sealing mechanism 80, thereby completing the packaging of the rubber-insulated wire lamp.

Of course, in other embodiments, an upper layer structure and a lower layer structure located below the upper layer structure may be disposed on the base 10, the wire stripping mechanism 50 and the assembling mechanism 60 are disposed on the upper layer structure, the welding mechanism 70 and the glue sealing mechanism 80 are disposed on the lower layer structure, or the wire stripping mechanism 50 and the assembling mechanism 60 are disposed on the lower layer structure, and the welding mechanism 70 and the glue sealing mechanism 80 are disposed on the upper layer structure. The blanking mechanism 91 and the receiving mechanism 92 are disposed on the same side of the base 10 and distributed up and down. In addition, in other embodiments, the feeding mechanism 91 and the receiving mechanism 92 may not be provided, and feeding and receiving may be performed by another device.

According to the technical scheme, the wire stripping mechanism 50, the assembling mechanism 60, the welding mechanism 70 and the glue sealing mechanism 80 are arranged on the base 10, when a rubber-covered wire lamp is packaged, an insulating layer of a rubber-covered wire belt can be stripped through the wire stripping mechanism 50 to form a mounting position, when the mounting position on the rubber-covered wire belt is moved to the assembling position 601 by the wire guide mechanism 12 on the base 10, the chip is loaded between two wires of the mounting position by the chip transfer assembly 40, and then when the mounting position on the rubber-covered wire belt with the chip clamped is moved to the welding mechanism 70, the chip is welded with the wires of the mounting position by the welding mechanism 70. Finally, the chip at the mounting position is sealed by the sealing mechanism 80, thereby completing the packaging of the rubber-insulated wire lamp. Thus, the clamping position (the assembling mechanism 60) and the welding position (the welding mechanism 70) of the chip and the belt are separately arranged, so that the belt is moved to the welding mechanism 70 for welding after the chip is clamped at the assembling mechanism 60. Compared with the situation that the chip and the belt are clamped and welded at the same position, the situation that the structure is complex when the assembling mechanism 60 and the welding mechanism 70 are combined together can be avoided under the situation that clamping and welding are achieved. And can reduce the dwell time of leather-covered wire area in welding mechanism 70 department like this for the dwell time of leather-covered wire area in each mechanism department is comparatively close, has accelerated the production rhythm, can promote leather-covered wire lamp production efficiency.

In some embodiments, the wire stripping mechanism 50 includes a wire stripping base 51, a saddle 52, a pressing assembly 53, and a wire stripping assembly 54, the wire stripping base 51 is mounted on the base 10, the saddle 52, the pressing assembly 53, and the wire stripping assembly 54 are all mounted on the wire stripping base 51, the wire stripping assembly 54 is located on a side of the saddle 52 facing away from the electrical measuring mechanism, and the pressing assembly 53 is located above the saddle 52 for pressing the rubber-covered wire against the saddle 52. Specifically, during stripping, the belt is held in place by pressing the belt against the saddle 52 by moving the pinch assembly 53 downward, and the insulation of the belt can then be stripped off by the stripping assembly 54. Therefore, the situation that the rubber-covered wire belt shakes in the process that the wire stripping assembly 54 strips the insulating layer of the rubber-covered wire belt can be avoided, and the wire stripping is reliable. Of course, in other embodiments, the insulation of the belt may be melted by the heating structure.

In some embodiments, the wire stripping assembly 54 comprises a first wire stripping cylinder 542, a sliding seat, a second wire stripping cylinder 543 and a wire stripping clamp 544, wherein the first wire stripping cylinder 542 is mounted on the wire stripping seat 51, the sliding seat is slidably mounted on the wire stripping seat 51 along a direction of the wire stripping mechanism 50 pointing to the electrical measuring mechanism, the first wire stripping cylinder 542 is connected with the sliding seat, and the second wire stripping cylinder 543 is mounted on the sliding seat;

the wire stripping clamp 544 is provided with a cutting edge and a wire avoiding opening arranged on the cutting edge, the wire stripping clamp 544 is mounted on the second wire stripping cylinder 543 and has an open state and a closed state in which a leather belt is clamped by the cutting edge, in the closed state, the wire avoiding opening is used for a lead of the leather belt to stretch into, and the first wire stripping cylinder 542 is used for driving the sliding seat to move towards a direction far away from the pressing component 53 when the wire stripping clamp 544 is in the closed state in which the leather belt is clamped.

Specifically, the wire stripping clamp 544 includes two clamping members 545, the two clamping members 545 are connected to the first wire stripping cylinder 542, cutting edges are disposed on the sides of the two clamping members 545 facing each other, and the first wire stripping cylinder 542 can drive the two clamping members 545 to switch between a closed state and an open state. When the first wire stripping cylinder 542 drives the two clamping pieces 545 to close, the insulating layer of the leather belt can be cut through the cutting edges of the two clamping pieces 545 together, and at the moment, the lead of the leather belt can extend into the wire avoiding opening, so that the cutting edges are prevented from cutting the lead. When the wire stripping clamp 544 is in a closed state to clamp the belt, the first wire stripping cylinder 542 drives the sliding seat to move in a direction away from the pressing component 53, so as to drive the second wire stripping cylinder 543 and the wire stripping clamp 544 to move in a direction away from the pressing component 53, that is, the insulation layer of the belt can be disconnected from the clamping position of the wire stripping clamp 544, and the insulation layer of the belt can move in a direction away from the pressing component 53, so that the wires of the belt are exposed, and an installation position is formed. The wire stripping mode is simple and convenient, the wire stripping operation can be simplified, and the condition of cutting off a lead can be avoided. Of course, in other embodiments, the insulation layer around the conductor may be cut by the circular cutter, and then the insulation layer of the circular cut portion may be peeled by the transverse cutter. Additionally, in other embodiments, the two clamps 545 may also be hinged together (e.g., with reference to a scissors shape).

In some embodiments, the pressing assembly 53 includes a pressing cylinder 531 and a pressing member 532 mounted on a piston rod of the pressing cylinder 531, the pressing cylinder 531 is mounted on the wire stripping base 51, the piston rod of the pressing cylinder 531 extends in the up-down direction, and the pressing member 532 is disposed above the saddle 52 in parallel. In other embodiments, the pressing assembly 53 includes a pressing cylinder 531 and a pressing member 532 mounted on a piston rod of the pressing cylinder 531, the piston rod of the pressing cylinder 531 extends in the up-down direction, and the pressing member 532 is rotatably mounted on one side of the supporting platform 52. In other embodiments, hold-down assembly 53 includes a hydraulic cylinder and hold-down member 532 mounted to the piston rod of the hydraulic cylinder; or hold down assembly 53 includes a hydraulic cylinder and hold down 532 mounted to the piston rod of the hydraulic cylinder.

In some embodiments, the glue sealing mechanism 80 includes a glue applying structure 81 and a curing structure 82, the glue applying structure 81 is provided with a glue applying portion, the curing structure 82 is located at a downstream side of the glue applying structure 81 along a conveying direction of the rubber-covered belt, the curing structure 82 is provided with a line passage, and an ultraviolet curing lamp is arranged in the line passage. The photosensitive adhesive is used for packaging, so that the solidification speed of the sealing adhesive position is increased, and the production speed can be increased. Of course, in other embodiments, the encapsulation may be performed by a melt adhesive.

In some embodiments, the gluing structure 81 comprises a gluing base 811, a gluing cylinder 812 and a gluing member 813, the gluing base 811 is mounted on the base 10, the gluing cylinder 812 is mounted on the gluing base 811, the gluing member 813 is connected with a piston rod of the gluing cylinder 812, and the gluing cylinder 812 is used for driving the gluing member 813 to move in the up-and-down direction. Specifically, the gluing member 813 may be driven to move downward by the gluing cylinder 812 to apply the glue at the gluing part to the chips during gluing, and after gluing, the gluing member 813 may be driven to move upward by the gluing cylinder 812 to separate from the belt, and when the next belt moves to a position below the gluing member 813 for mounting another chip, gluing may be performed by repeating the above steps. Therefore, the movement stroke of the gluing piece 813 can be reduced, and the matching error of the gluing piece 813 and the rubber-covered wire belt can be reduced. Of course, in other embodiments, the glue may be applied by lifting the rubber-covered wire strip to match the glue application portion.

In some embodiments, the base 10 is provided with a mounting rail, one of the glue sealing mechanisms 80 extends in a direction pointing to the other glue sealing mechanism 80, and both the glue sealing mechanism 80 and the welding mechanism 70 are mounted on the mounting rail. Therefore, the assembly reference of the glue sealing mechanism 80 and the assembly reference of the welding structure are consistent, and the matching precision of the glue sealing mechanism 80 and the welding mechanism 70 is good.

In some embodiments, the lower surface of the glue coating portion is provided with a glue containing groove, and a glue outlet hole is formed in the glue containing groove. So set up, can make from the glue that goes out the gluey hole outflow can gather in a large number at holding gluey groove department and not drip to make the glue of coating in chip department more, can promote to seal and glue the effect.

In some embodiments, the groove wall of the glue containing groove is arc-shaped. So can be so that hold the smooth setting in gluey groove, be convenient for clear up the incomplete glue of holding gluey inslot.

In some embodiments, the welding mechanism 70 includes a support base 632, a mounting bracket 72, a welding cylinder 73, a heating element 74 and a feeding element 75, the support base 632 is mounted on the base 10, the welding cylinder 73 is mounted on the support base 632, and the mounting bracket 72 is mounted on a piston rod of the welding cylinder 73; the heating element 74 and the feeding element 75 are both mounted on the assembly frame 72, the heating element 74 is provided with an upward welding plane, the feeding element 75 is positioned above the heating element 74, the feeding element 75 is provided with a discharge head facing the welding plane, and the discharge head is used for conveying welding flux to the welding plane.

Specifically, the heating element 74 has a welding position moved to the welding plane near the belt and a feeding position located below the welding position; in the feed position, the discharge head is used to feed solder to the soldering plane. During welding, the heating element 74 is electrified to be heated, when the heating element 74 is at a material supplementing position, the welding flux is conveyed to the welding plane through the discharging head of the feeding element 75, the heating element 74 can heat and melt the welding flux on the welding plane, and then the heating element 74 is driven to move upwards to the welding position through the welding cylinder 73, so that the welding plane is in contact with the lead and the chip leg of the rubber-covered wire belt in the wire passing space, the welding flux on the welding plane is in contact with the lead and the chip leg of the rubber-covered wire belt, and the lead and the chip can be welded after the welding flux is solidified. Compare in the mode of blowing welding, when realizing the welding like this, avoid the wire to be heated the high condition that and fuse of temperature, when sending the solder to wire and chip leg department through the welding plane in addition, the area of welding plane is great, can make the solder on the welding plane fully take contact with each wire in rubber-insulated-wire area and each leg of chip, has promoted the welding accuracy to promote chip encapsulation yield.

In some embodiments, the welding mechanism 70 further includes a blowing member 76, the blowing member 76 being mounted to the jig 72 and fixed relative to the heating member 74, and a blowing opening of the blowing member 76 being disposed toward the welding plane. Specifically, after soldering, that is, after the heating member 74 moves from the soldering position to the feeding position, air can be blown toward the soldering plane by the air blowing member 76 to remove excess solder on the heating member 74, so that mixing of residual solder from the previous soldering with newly supplied solder from the next soldering can be avoided, the solder can be cleaned during each soldering, and the soldering quality can be improved. Of course, in other embodiments, the blowing member 76 may not be provided.

In some embodiments, the welding mechanism 70 further includes a welding box 77, the welding box 77 is mounted on the supporting seat 632, the welding box 77 has two opposite first side walls, two opposite second side walls, and an opening defined by the upper ends of the two first side walls and the upper ends of the two second side walls, the two first side walls are provided with first notches 771, the first notches 771 are used for the strap to pass through, at least one of the second side walls is provided with a second notch 772, and the heating component 74 and the air blowing component 76 extend into the welding box 77 from the second notch 772. Specifically, the first notch 771 and the second notch 772 are extended in the up-and-down direction, and the heating member 74 can move up and down in the second notch 772 when the welding cylinder 73 drives the jig 72 to move up and down. By the arrangement of the solder pot 77, the excessive solder can be collected intensively, and the excessive solder can be prevented from being splashed to other positions.

In some embodiments, the welding cartridge 77 is provided with a scrap discharge passage 773 at the bottom, the scrap discharge passage 773 extending obliquely downward and extending laterally of the welding cartridge 77. The waste material that falls into welding box 77 like this can be discharged along waste material escape way 773, can avoid dismantling the condition that welding box 77 emptys the waste material, can avoid dismantling welding box 77 and emptys the waste material and influence the condition of production rhythm.

In some embodiments, the soldering mechanism 70 further includes a solder dispensing assembly 78 disposed between the support base 632 and the assembling mechanism 60, the solder dispensing assembly 78 includes a solder dispensing seat 781, a solder bath 782, a lifting cylinder 783, a solder dispensing member 785 and a rotary driving member 784, the lifting cylinder 783 and the rotary driving member 784 are mounted to the solder dispensing seat 781 in a spaced manner, a piston rod of the lifting cylinder 783 extends upward, the solder dispensing member 785 is mounted to the piston rod of the lifting cylinder 783 and has a dispensing portion extending into the solder bath 782, and the solder bath 782 is mounted to the rotary driving member 784 to drive the solder bath 782 to rotate by the rotary driving member 784. Specifically, the upper surface of the material taking part is provided with a groove, when the material taking part works, the lifting cylinder 783 can drive the point tin piece 785 to move downwards into the solder pool 782, so that solder is adhered to the groove, and then the lifting cylinder 783 can drive the point tin piece 785 to move upwards, so that the solder on the material taking part is coated on the lead of the rubber-covered wire belt and the solder foot of the chip, and the tin dispensing process is completed. Compared with the syringe injection type tin dispensing, the method can avoid the possibility of needle tube blockage and improve the tin dispensing reliability. Wherein the rotary drive 784 may be a motor or a rotary cylinder. Of course, in other embodiments, the dot tin assembly 78 may not be provided.

In some embodiments, the assembling mechanism 60 includes a fixed seat 61, a driving member 62, a lifting structure 63 mounted on the fixed seat 61 and driving the driving member 62 to move up and down, and two wire expanding structures 64 mounted on the driving member 62, wherein the two wire expanding structures 64 are driven by the driving member 62 to open and close, the two wire expanding structures 64 are used for extending into the two wires of the belt from the lower side of the belt to expand the two wires of the belt, and the chip transferring assembly 40 is used for placing the chip between the two wires of the belt.

In operation, when the mounting position on the belt is moved to the mounting position 601, the lifting mechanism 63 drives the driving member 62 and the wire expanding structure 64 on the driving member 62 to move upward, so that the two wire expanding structures 64 extend from below the belt into the space between the two wires at the mounting position of the belt. The two flaring structures 64 are then driven open relative to each other by the drive 62 to flare the two wires in the position where the belt is installed. When the chip transfer assembly 40 places the chip between two wires of the belt, the driving member 62 drives the two wire expanding structures 64 to close each other, so that the two wires which are contracted clamp the chip, the driving member 62 and the wire expanding structures 64 move downwards under the driving of the lifting structure 63, the chip transfer assembly 40 is moved away from the mounting position, and thus, the process of placing the chip between the two wires is completed once.

Thus, when the installation position on the belt is moved to the assembly position 601, the lifting mechanism 63 can drive the driving member 62 and the wire expanding structure 64 on the driving member 62 to move upward, so that the two wire expanding structures 64 extend into the space between the two wires at the installation position of the belt from below the belt. Two expand line structure 64 through driving piece 62 drive afterwards and open each other to two wires that make the leather-covered belt mounted position expand outward, thereby be convenient for chip transfer assembly 40 put into the chip between two wires in the leather-covered belt, thereby can reduce the risk that the chip damaged because of scratching with the wire when putting into between two wires in the leather-covered belt, can promote the leather-covered belt encapsulation yield.

In some embodiments, each of the wire expanding structures 64 is provided with two wire expanding portions 644, the two wire expanding portions 644 of the wire expanding structures 64 are distributed at intervals along the conveying direction of the leather belt, the wire expanding portions 644 of the two wire expanding structures 64 are arranged in a one-to-one manner and are used for extending between two wires of the leather belt, and the chip transferring assembly 40 is used for placing the chips between the two wire expanding portions 644 of the wire expanding structures 64. With the arrangement, when the two wire expansion parts 644 of the two wire expansion structures 64 expand the wires together, the two wires can be arranged approximately in parallel between the two wire expansion parts 644 of the wire expansion structures 64 (namely, the two wires are arranged approximately in equal width between the two wire expansion parts 644 of the wire expansion structures 64), so that the chip can be conveniently placed between the two wires, and after the two wire expansion structures 64 contract, the wires on the front side and the rear side of the chip contract approximately simultaneously, so that the stress on the front side and the rear side of the chip is uniform, the risk of overturning of the chip due to uneven stress on the front side and the rear side when the two wires contract is reduced, and the chip can be stably clamped between the two wires. Of course, in other embodiments, only one wire expansion portion 644 may be provided on each wire expansion structure 64.

In some embodiments, each of the wire expansion structures 64 is provided with a wire expansion portion 644 for extending into between two wires of the leather-covered wire, the upper end of the wire expansion portion 644 of each of the wire expansion structures 64 is provided with a guide surface 645, the guide surface 645 is arranged opposite to the other wire expansion structure 64, and the guide surface 645 gradually extends obliquely from bottom to top toward the other wire expansion structure 64. Therefore, the upper end of the part (the two opposite flaring portions 644) of the two flaring structures 64 extending between the two conducting wires is small in size, so that the part can extend between the two conducting wires, and after the flaring portions 644 extend between the two conducting wires, the conducting wires can slide along the guide surfaces 645 along with the upward movement of the flaring structures 64, so that the two conducting wires can be expanded. Meanwhile, the arrangement enables the lower end of the wire expanding part 644 to be large in size and high in structural strength, and reduces the deformation risk of the wire expanding part 644. The number of the extension parts 644 on each extension structure 64 may be one or two. In other embodiments, the widening portion 644 may have a sheet shape.

In some embodiments, the wire expanding structure 64 includes a fixing member 641 and a wire expanding member 643, the fixing member 641 is mounted to the driving member 62, the wire expanding member 643 is detachably mounted to the fixing member 641, and the wire expanding member 643 is provided with a wire expanding portion 644 for extending between two wires of the leather-covered wire. That is, the fixing element 641 is mainly used for connecting the wire expanding element 643 and the driving element 62, so that even if the wire expanding element 643 is damaged, only the wire expanding element 643 needs to be replaced, and the entire wire expanding structure 64 does not need to be replaced, thereby reducing the maintenance cost. Wherein, in some embodiments, two wire expansion parts 644 are provided on the wire expansion part 643 at intervals. In other embodiments, the wire expanding part 643 is provided with an expanding part 644. In addition, in other embodiments, the fixing member 641 and the wire expanding member 643 are fixed by welding. Or flare structure 64 may be a unitary structure.

In some embodiments, the wire guiding mechanism 12 has two parallel feeding positions, each for feeding one Pi Xiandai, and the assembling mechanism 60 includes two driving members 62, each driving member 62 has two wire expanding structures 64, and the two wire expanding structures 64 on each driving member 62 are disposed corresponding to one feeding position. So set up, can carry two rubber-insulated-wire bands simultaneously and encapsulate, can promote encapsulation efficiency. The chip transfer assembly 40 has two chip holding positions, and the two chip holding positions and the two conveying positions are arranged in a one-to-one correspondence manner. Of course, in other embodiments, the wire mechanism 12 may be provided with only one delivery site. In addition, one or more groups of wire guiding mechanisms 12 can be arranged on the rubber-insulated-wire lamp packaging equipment, and each group of guiding mechanisms can be provided with one or two conveying positions.

In some embodiments, the two driving members 62 are spaced apart along the conveying direction of the belt, and the wire expansion structures 64 of the two driving members 62 are disposed facing each other, and the side of the wire expansion structure 64 of each driving member 62 facing the wire expansion structure 64 of the other driving member 62 is formed with an escape notch 642. This allows the wire extension structures 64 on the two driving members 62 to be arranged compactly in the direction of the two transfer positions, and also allows the chip transfer assembly 40 to be compact.

In some embodiments, the lifting structure 63 includes a lifting cylinder 631 and a supporting seat 632, the lifting cylinder 631 is mounted on the fixing seat 61, the supporting seat 632 is mounted on the piston rod of the lifting cylinder 631, the supporting seat 632 is slidably mounted on the fixing seat 61 in the up-down direction, and the driving member 62 is mounted on the supporting seat 632. So set up, can be so that elevation structure 63's simple structure is reliable. Of course, in other embodiments, the drive member 62 may be driven up and down by a motor.

In some embodiments, the drive member 62 is a pneumatic gripper finger 4221, wherein one wire expansion structure 64 is mounted to one gripper finger of the pneumatic gripper finger 4221 and the other wire expansion structure 64 is mounted to the other gripper finger of the pneumatic gripper finger 4221. Specifically, the two clamp fingers of the pneumatic clamp finger 4221 can be opened and closed under the driving of the cylinder, and when the two wire expansion structures 64 are respectively arranged on the two clamp fingers, the opening and closing of the two wire expansion structures 64 can be realized. By using the pneumatic gripper fingers 4221 as the driving member 62, the structure of the driving member 62 can be simplified and made compact.

In some embodiments, the fixing base 61 has a supporting base 611, the supporting base 611 is located above the driving element 62 and the wire expanding structure 64, a through hole is formed in the supporting base 611, an assembling position 601 is formed at the through hole, the assembling mechanism 60 further includes a lifting structure and a pressing plate 66, the lifting structure is installed above the fixing base 61, the pressing plate 66 is installed on the lifting structure and located above the supporting base 611, a wire passing space is formed between the pressing plate 66 and the supporting base 611, the lifting structure is used for driving the pressing plate 66 to move in an up-down direction, and the pressing plate 66 has a limiting position for pressing the rubber-covered wire onto the supporting base 611. The pressing plate 66 has a notch 661 corresponding to the through hole of the mounting position 601, and the notch 661 is used for exposing the tape for the chip to be mounted between the two guides of the tape. When the chip is installed, the pressing plate 66 can be driven by the lifting structure to move downwards to the limiting position, so that the belt is pressed on the supporting table 611, the belt can be prevented from being jacked and deviated, and the belt and the chip can be accurately positioned. Of course, in other embodiments, a pressure plate 66 rotatably mounted to the support base 611 may be provided to press the tape against the support base 611.

In one embodiment, the lifting mechanism 65 includes a third cylinder 651 and a fixed frame 652, the fixed frame 652 is mounted to the support table 611, the third cylinder 651 is mounted to the second fixed frame 652, a piston rod of the third cylinder 651 extends in the up-down direction, and the pressing plate 66 is mounted to the piston rod of the third cylinder 651. This makes the lifting structure simple in construction.

In some embodiments, a positioning groove is disposed on the support platform 611, the positioning groove is communicated with the thread passing space, and the pressing plate 66 is used for pressing the leather-covered thread into the positioning groove when in the limiting position. This allows accurate positioning of the belt on the support 611.

In some embodiments, the rubber-insulated-wire lamp packaging device further includes a chip feeding mechanism 20 and a turnover mechanism 30, the chip feeding mechanism 20 is disposed on the base 10 and spaced apart from one side of the assembling mechanism 60, and the chip feeding mechanism 20 is configured to provide a chip tape. Tilting mechanism 30 includes mount pad 31 and upset seat 32, and mount pad 31 installs in base 10, and upset seat 32 is equipped with the chip and places the position, and upset seat 32 rotationally installs in mount pad 31 to have and make the chip place the horizontal state that the position level was placed at the chip and make the chip place the vertical state of a vertical place at the chip.

Chip transfer assembly 40 movably installs in base 10, and chip transfer assembly 40 is used for shifting the chip on the chip material area to the chip that is in the horizontality and places the position on, and chip transfer assembly 40 still is used for taking the chip that the position was placed to the chip under the vertical state to shift the chip to assembly position 601.

Through set up tilting mechanism 30 on base 10, when chip transfer assembly 40 takes the chip from chip feed mechanism 20 like this, can be so that tilting mechanism 30's upset seat 32 upset to the horizontality, after the chip that chip transfer assembly 40 took the level from chip feed mechanism 20 and placed, can directly move to upset seat 32 department, place the position at the chip with the chip level, make upset seat 32 upset to vertical state afterwards, thereby make the chip that the position was placed to the chip along with upset seat 32 upset to vertical state. Finally, the chip transfer unit 40 transfers the vertically placed chip to the mounting position 601 of the mounting mechanism 60 so that the chip can be vertically mounted between two wires of the tape. So set up, chip transfer mechanism only need take the chip that the level was placed to chip that is in the horizontality with the chip material and transfer to and place the position, rotate to vertical state back from the horizontality at upset seat 32, chip transfer assembly 40 also only need take the chip and place the chip of the vertical placement of position to it can to transfer the chip to assembly position 601. In this way, in the process of transferring the chip from the chip feeding mechanism 20 to the assembling mechanism 60, the chip transfer unit 40 does not need to turn over the chip, that is, a rotating structure is not required to be provided on the chip transfer unit 40, so that the structure of the chip transfer unit 40 can be simplified. And tilting mechanism 30 can be fixed on base 10 through mount pad 31, and need not remove relative chip feed mechanism 20 and assembly devices 60, also can make tilting mechanism 30's simple structure, realizes that the chip is vertical to be installed and simplifies the structure of chip feed mechanism under the rubber-insulated-wire belt condition, can reduce the cost of rubber-insulated-wire lamp encapsulation equipment.

There are various positions where the turnover mechanism 30 is disposed on the base 10, for example, in some embodiments, the turnover mechanism 30 is disposed between the chip feeding mechanism 20 and the assembling mechanism 60. Therefore, the chip transfer assembly 40 can move linearly between the chip feeding mechanism 20 and the assembling position 601 of the assembling mechanism 60, the moving stroke of the chip transfer assembly 40 can be reduced, the risk of error increase caused by long stroke of the chip transfer assembly 40 is reduced, and the positioning precision of the chip transfer assembly 40 is high.

In other embodiments, the chip feeding mechanism 20 and the flipping mechanism 30 are spaced apart in the direction of conveyance of the linear lamps in the mounting mechanism 60. This is advantageous in reducing the size of the covered wire lamp packaging device in the direction in which the chip feeding mechanism 20 is directed to the mounting mechanism 60.

In some embodiments, the chip transfer assembly 40 includes a first transfer mechanism 41 and a second transfer mechanism 42, the first transfer mechanism 41 is movably mounted on the base 10, the first transfer mechanism 41 is used for transferring the chip on the chip tape to a chip placement position in a horizontal state; the second transfer mechanism 42 is movably mounted on the base 10, and the second transfer mechanism 42 is used for taking the chip at the chip placement position in the vertical state and transferring the chip to the assembly position 601.

Specifically, the first transfer mechanism 41 transfers the chip on the chip tape to the chip placement position in the horizontal state, and after the flipping base 32 is rotated to the vertical state, the second transfer mechanism 42 takes the chip at the chip placement position in the vertical state and transfers the chip to the assembly position 601. This can reduce the respective movement strokes of the first transfer mechanism 41 and the second transfer mechanism 42, and reduce the risk of an increase in error of the first transfer mechanism 41 and the second transfer mechanism 42 due to a long stroke. And after the first transfer mechanism 41 places the chip at the chip placing position, the first transfer mechanism 41 may move toward the chip feeding mechanism 20 to take the next chip, while the second transfer mechanism 42 takes the chip from the chip placing position and transfers the chip to the fitting position 601. That is, the first transfer mechanism 41 and the second transfer mechanism 42 may operate simultaneously, so that the chip loading efficiency may be improved.

Of course, in other embodiments, the chips on the chip carrier tape may be transferred to the chip placement position in the horizontal state by a transfer mechanism, and the chips on the chip placement position in the vertical state may be taken out and transferred to the assembly position 601.

In some embodiments, the flipping base 32 has a first side 323 and a second side 324 adjacent to each other, the chip placement site includes a receiving slot 331 formed at a junction of the first side 323 and the second side 324 and a limiting structure, the receiving slot 331 has a limiting slot wall 332, the limiting slot wall 332 is spaced apart from the first side 323 and connected to the second side 324, the limiting slot wall 332 is horizontally disposed in the horizontal state, the limiting slot wall 332 is vertically disposed in the vertical state, the limiting structure is at least partially disposed in the receiving slot 331 and located between the limiting slot wall 332 and the first side 323, and the limiting structure is configured to fix the chip.

Specifically, the first side surface 323 and the second side surface 324 are substantially vertically arranged, the notch of the accommodating groove 331 penetrates through the first side surface 323 and the second side surface 324, the accommodating groove 331 further has a placing groove wall 333, the placing groove wall 333 is spaced from the second side surface 324 and connected with the first side surface 323, the placing groove wall 333 is substantially vertically arranged with the limiting groove wall 332, and the limiting structure is arranged on the placing groove wall 333. Through placing the position at the chip and setting up storage tank 331 to set up limit structure in storage tank 331, can be convenient for the chip location like this and place. In this embodiment, chip transfer assembly 40 may include first transfer mechanism 41 and second transfer mechanism 42, or chip transfer assembly 40 may include only one transfer mechanism.

In addition, in other embodiments, the chip placement station includes a carrier provided at a junction of the first side 323 and the second side 324 and a jig provided on the carrier, and the chip is held by the jig.

In some embodiments, the retaining structure includes a negative pressure air passage and a negative pressure port 335 in communication with the negative pressure air passage, the negative pressure port 335 being located between the retaining groove wall 332 and the first side 323. Specifically, the end of the negative pressure channel far from the negative pressure port 335 is used for connecting a negative pressure device, when the chip transfer assembly 40 places the chip in the containing groove 331 and is located at the negative pressure port 335, the negative pressure generated by the negative pressure port 335 can adsorb and fix the chip, so that the situation that the chip is displaced or falls off in the rotating process of the turnover seat 32 can be avoided, and the structure in the containing groove 331 can be simplified. Of course, in other embodiments, the limiting structure comprises a clamp disposed on the placing slot wall 333, through which the chip is clamped.

In some embodiments, the turnover mechanism 30 further includes a turnover cylinder 34 and a connecting rod 35, a cylinder body of the turnover cylinder 34 is mounted on the mounting base 31, one end of the connecting rod 35 is fixed to the rotating shaft of the turnover base 32, the other end of the connecting rod 35 is rotatably connected to a piston rod of the turnover cylinder 34, and a rotation axis between the piston rod of the turnover cylinder 34 and the connecting rod 35 is perpendicular to the rotating shaft of the turnover base 32. The turnover cylinder 34 is used for driving the turnover seat 32 to rotate, so that the structure is simple, and the turnover seat 32 is convenient to position. In addition, in other embodiments, the turning seat 32 can be driven to rotate by a motor.

In some embodiments, the flipping base 32 includes a rotating base body 321 and a receiving base body 322, the rotating base body 321 is rotatably mounted on the mounting base 31, and the receiving base body 322 is provided with a chip placing position and is detachably mounted on the rotating base body 321. Specifically, the rotation base 321 is provided with a rotation shaft, the rotation base 321 is rotatably installed on the installation base 31 through the rotation shaft, and the accommodation base 322 is detachably connected to the rotation base 321, so that the accommodation base 322 can be conveniently replaced, for example, the corresponding accommodation base 322 can be replaced for chips of different specifications, and the like. Of course, in other embodiments, the flipping base 32 may be a one-piece structure.

In some embodiments, the negative pressure air passage includes a first air passage 336 and a second air passage, the first air passage 336 is disposed on the rotating base 321, the second air passage is disposed on the accommodating base 322, the first air passage 336 is communicated with the second air passage, an end of the first air passage 336 far away from the second air passage is used for communicating the negative pressure pipeline, and an end of the second air passage far away from the first air passage 336 is communicated with the negative pressure port 335. Specifically, the negative pressure pipeline is used for connecting a negative pressure device, that is, the negative pressure pipeline is installed on the rotating seat body 321, so that when the accommodating seat body 322 is disassembled, the negative pressure pipeline does not need to be disassembled, and the accommodating seat body 322 is convenient to replace. Of course, in other embodiments, the negative pressure air passage may be only disposed on the accommodation seat 322.

In some embodiments, the first transfer mechanism 41 is provided with a negative pressure suction head 412, and the negative pressure suction head 412 is used for sucking up the chip. The negative pressure suction head 412 is used for connecting a negative pressure device, when the first transfer mechanism 41 moves to the position above the chip feeding mechanism 20, the negative pressure device generates negative pressure at the negative pressure suction head 412, so that the chip can be sucked on the negative pressure suction head 412, and when the chip is moved to the chip placement position, the negative pressure device is closed or the passage between the negative pressure device and the negative pressure suction head 412 is cut off, so that the negative pressure generation at the negative pressure suction head 412 is stopped, and the chip falls to the chip placement position. This allows the suction head 412 to be used in a manner that facilitates removal of a horizontally positioned chip from the chip feeding mechanism 20.

In some embodiments, the second transfer mechanism 42 is provided with a clamping assembly 422, the clamping assembly 422 is used for clamping the chip at the chip placement position in the vertical state, and the limiting groove wall 332 is provided with an avoiding notch 334 for avoiding the clamping assembly 422. Specifically, the clamping assembly 422 comprises a pneumatic clamping finger 4221 and two clamping arms 4222, wherein one clamping arm 4222 is mounted on one clamping finger of the pneumatic clamping finger 4221, and the other clamping arm 4222 is mounted on the other clamping finger of the pneumatic clamping finger 4221, so that the two clamping arms 4222 can be driven to open and close by the pneumatic clamping finger 4221, and thus the chip can be clamped and released. When the chip is in the vertical state, the chip is easier to clamp by the clamping component 422.

In some embodiments, at least two chip placement locations are disposed on the flipping seat 32, and the chip placement locations are spaced apart from each other. Therefore, a plurality of chips can be transferred simultaneously, and the chip loading efficiency is improved.

In some embodiments, the base 10 is provided with a supporting frame 11, the supporting frame 11 is provided with a guiding structure 111, and the first transferring mechanism 41 and the second transferring mechanism 42 are both slidably mounted on the guiding structure 111. Specifically, the first transfer mechanism 41 includes a first motor 413, a first transmission assembly 414, a first sliding seat 411, a first cylinder 415, a first fixed block 416, and a negative pressure suction head 412, the first motor 413 is mounted on the supporting frame 11, the first sliding seat 411 is slidably mounted on the first guiding structure 111, and the first motor 413 is connected to the first sliding seat 411 through the first transmission assembly 414 for driving the first sliding seat 411 to slide relative to the guiding structure 111. The first air cylinder 415 is installed on the first sliding seat 411, the negative pressure suction head 412 is installed on the first fixing block 416, and the first fixing block 416 is connected with a piston rod of the first air cylinder 415 and is slidably installed on the first sliding seat 411 in an up-and-down direction, so that the negative pressure suction head 412 is driven to move up and down through the first air cylinder 415.

The second transfer mechanism 42 includes a second motor 423, a second transmission assembly 424, a second sliding seat 421, a second cylinder 425, a second fixing block 426 and a clamping assembly 422, the second motor 423 is mounted on the supporting frame 11, the second sliding seat 421 is slidably mounted on the second guiding structure 111, and the second motor 423 is connected with the second sliding seat 421 through the second transmission assembly 424 to drive the second sliding seat 421 to slide relative to the guiding structure 111. The second cylinder 425 is installed on the second sliding seat 421, the clamping assembly 422 is installed on the second fixing block 426, and the second fixing block 426 is connected with the piston rod of the second cylinder 425 and is installed on the second sliding seat 421 in a sliding manner in the up-and-down direction, so that the clamping assembly 422 is driven by the second cylinder 425 to move up and down.

With such an arrangement, the first transfer mechanism 41 and the second transfer mechanism 42 can slide conveniently, so that the moving accuracy of the first transfer mechanism 41 and the second transfer mechanism 42 is high, and the first transfer mechanism 41 and the second transfer mechanism 42 share the guide structure 111, so that the structure of the chip transfer assembly 40 can be simplified. The guiding structure 111 may include at least one linear slide rail, and may also include two linear optical axes. In addition, the first transmission assembly 414 and the second transmission assembly 424 may be a rack and pinion transmission structure, or the first transmission assembly 414 and the second transmission assembly 424 may also be a lead screw nut pair (a sliding lead screw, a ball screw, a planetary roller screw, or the like). In addition, in other embodiments, the first transfer mechanism 41 and the second transfer mechanism 42 may also be rotatably mounted to the base 10.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or any other related technical fields, which are directly or indirectly applied to the present invention, are included in the scope of the present invention.

Claims

1. A leather-wire lamp packaging apparatus, comprising:

the device comprises a base, a wire guide mechanism and a wire guide mechanism, wherein the wire guide mechanism is arranged on the base and used for conveying a leather belt;

the wire stripping mechanism is arranged on the base and is used for stripping an insulating layer of the belt to form an installation position;

the assembling mechanism is arranged on the base and is positioned on the downstream side of the wire stripping mechanism along the conveying direction of the leather belt, and the assembling mechanism is provided with an assembling position which is used for exposing the mounting position on the leather belt;

and the glue sealing mechanism is arranged on the base and is positioned on the downstream side of the welding mechanism along the conveying direction of the rubber belt, and the glue sealing mechanism is used for sealing glue on the chip at the mounting position.

2. The rubber-insulated-wire lamp packaging device of claim 1, wherein the rubber sealing mechanism comprises a rubber coating structure and a curing structure, the curing structure is located at the downstream side of the rubber coating structure along the conveying direction of the rubber-insulated wire belt, the curing structure is provided with a wire passage, and an ultraviolet curing lamp is arranged in the wire passage; the gluing structure comprises a gluing seat, a gluing cylinder and a gluing piece, the gluing seat is arranged on the base, the gluing cylinder is arranged on the gluing seat, the gluing piece is connected with a piston rod of the gluing cylinder, and the gluing cylinder is used for driving the gluing piece to move in the vertical direction;

the glue coating piece is provided with a downward glue coating part, the lower surface of the glue coating part is provided with a glue containing groove, and a glue outlet hole is formed in the glue containing groove; the groove wall of the glue containing groove is arranged in an arc shape.

3. The covered wire lamp packaging apparatus according to claim 1, wherein the welding mechanism includes a support base, a mounting bracket, a welding cylinder, a heating member, and a feeding member, the support base being mounted to the base, the welding cylinder being mounted to the support base, the mounting bracket being mounted to a piston rod of the welding cylinder;

the heating element and the feeding element are both mounted on the assembly frame, the heating element is provided with an upward welding plane, the feeding element is located above the heating element, the feeding element is provided with a discharging head facing the welding plane, and the discharging head is used for conveying welding flux to the welding plane.

4. The covered wire lamp packaging apparatus according to claim 3, wherein the welding mechanism further comprises a blowing member, the blowing member is mounted to the mounting bracket and fixed with respect to the heating member, and a blowing port of the blowing member is disposed toward the welding plane.

5. The covered wire lamp encapsulation device according to claim 4, wherein the welding mechanism further comprises a welding box, the welding box is mounted on the support base, the welding box has two opposite first side walls, two opposite second side walls and two openings defined by the upper ends of the first side walls and the upper ends of the second side walls, the two first side walls are provided with first notches for the belt to pass through, at least one of the second side walls is provided with a second notch, and the heating element and the blowing element extend into the welding box from the second notches.

6. The covered wire lamp packaging apparatus according to claim 5, wherein the bottom of the solder box is provided with a scrap discharge passage, and the scrap discharge passage extends obliquely downward and laterally of the solder box.

7. The covered wire lamp encapsulation apparatus of claim 1,

assembly devices includes fixing base, driving piece, install in fixing base and drive the driving piece is along the elevation structure of upper and lower direction motion and install in two of driving piece expand the line structure, two expand the line structure and be in can open and shut under the drive of driving piece, two expand the line structure and be used for stretching into from the belt below between two wires in belt, with will two wires in belt expand outward.

8. The covered wire lamp packaging device according to claim 7, wherein each of the wire expansion structures is provided with two wire expansion parts, the two wire expansion parts of the wire expansion structure are distributed at intervals along the conveying direction of the covered wire belt, the wire expansion parts of the two wire expansion structures are arranged in a one-to-one manner and are used for extending into the space between two wires of the covered wire belt, and the chip transfer assembly is used for placing a chip between the two wire expansion parts of the wire expansion structure.

9. The covered wire lamp encapsulation apparatus according to any one of claims 1 to 8, wherein the Pi Xiandeng encapsulation apparatus further comprises a chip feeding mechanism and a turnover mechanism,

the chip feeding mechanism is arranged on the base and is arranged on one side of the assembling mechanism at intervals, and the chip feeding mechanism is used for providing a chip material belt;

the turnover mechanism comprises an installation seat and a turnover seat, the installation seat is installed on the base, the turnover seat is provided with a chip placement position, and the turnover seat is rotatably installed on the installation seat and has a horizontal state that a chip is horizontally placed on the chip placement position and a vertical state that the chip is vertically placed on the chip placement position;

the chip transfer assembly comprises a first transfer mechanism and a second transfer mechanism, the first transfer mechanism is movably arranged on the base, and the first transfer mechanism is used for transferring the chips on the chip material belt to the chip placement positions in the horizontal state; the second transfer mechanism is movably arranged on the base and used for taking the chip at the chip placement position in the vertical state and transferring the chip to the assembly position.

10. The covered wire lamp packaging device according to claim 9, wherein the flip base has a first side and a second side adjacent to each other, the chip placement site includes a receiving slot and a limiting structure formed at a junction of the first side and the second side, the receiving slot has a limiting slot wall, the limiting slot wall is spaced apart from the first side and connected to the second side, the limiting slot wall is horizontally disposed in the horizontal state, the limiting slot wall is vertically disposed in the vertical state, the limiting structure is at least partially disposed in the receiving slot and located between the limiting slot wall and the first side, and the limiting structure is configured to fix the chip;

the limiting structure comprises a negative pressure air passage and a negative pressure port communicated with the negative pressure air passage, and the negative pressure port is positioned between the limiting groove wall and the first side surface;

the turnover mechanism further comprises a turnover cylinder and a connecting rod, the cylinder body of the turnover cylinder is mounted on the mounting seat, one end of the connecting rod is fixed with the rotating shaft of the turnover seat, the other end of the connecting rod is rotatably connected with the piston rod of the turnover cylinder, and the rotating axis between the piston rod of the turnover cylinder and the connecting rod is perpendicular to the rotating shaft of the turnover seat;

the overturning seat comprises a rotating seat body and an accommodating seat body, the rotating seat body is rotatably arranged on the mounting seat, and the accommodating seat body is provided with the chip placing position and is detachably arranged on the rotating seat body;

the base is provided with a support frame, the support frame is provided with a first guide structure and a second guide structure, the first transfer mechanism is slidably mounted on the first guide structure, and the second transfer mechanism is slidably mounted on the second guide structure; the first guide structure and the second guide structure are arranged in parallel.