CN218167950U

CN218167950U - Semiconductor cleaning device

Info

Publication number: CN218167950U
Application number: CN202221749077.5U
Authority: CN
Inventors: 郭炳熙; 孙美玉; 周铁军
Original assignee: Guangdong Vital Micro Electronics Technology Co Ltd
Current assignee: Guangdong Vital Micro Electronics Technology Co Ltd
Priority date: 2022-07-07
Filing date: 2022-07-07
Publication date: 2022-12-30
Anticipated expiration: 2032-07-07

Abstract

The utility model relates to a semiconductor processing technology field discloses a semiconductor cleaning device, it includes the clean bench, spray mechanism and heat preservation subassembly, it includes the pipeline subassembly to spray the mechanism, the pipeline subassembly includes first pipeline, second pipeline and third pipeline, the output of second pipeline is for spraying the end, third tube coupling is between the output of feed liquor valve and second pipeline, be provided with the flowing back valve on the third pipeline, and the third pipeline extends downwards, the output of third pipeline is less than the output of second pipeline in vertical direction, the heat preservation subassembly is used for keeping warm to first pipeline. Based on above-mentioned structure, through the pressure difference of siphon phenomenon for the washing liquid in the second pipeline that is not kept warm flows back and discharges through the third pipeline from the output of second pipeline under intraductal pressure and the action of gravity, can arrange the washing liquid that can not reach the washing temperature requirement, prevents that liquid medicine from dripping to the wafer surface, has optimized the cleaning performance.

Description

Semiconductor cleaning device

Technical Field

The utility model relates to a semiconductor processing technology field especially relates to a semiconductor cleaning device.

Background

At present, the manufacturing process of semiconductor products such as wafers is complex and has many processes, different chemical materials are used in different processes, impurities such as chemical agents, particles, metals and the like are usually left on the surfaces of the wafers, and if the wafers are not cleaned in time, the impurities are gradually accumulated along with the production and manufacturing, so that the quality of the final wafer products is influenced.

According to different cleaning modes, the cleaning device can be divided into a single-chip cleaning device and a groove type cleaning device. The single-wafer type cleaning device consists of a plurality of cleaning cavities, and each wafer is sent to each cavity through the manipulator to be cleaned in a spraying mode independently, so that the cleaning effect is good, and cross contamination and contamination of a previous batch and a later batch are avoided.

The heat preservation effect of the cleaning liquid medicine of the existing single-chip type cleaning device can not completely cover the pipeline, so that the temperature of the liquid medicine of a section of pipeline can be changed due to the surrounding environment, and the process requirement can not be met. And moreover, the traditional Chinese medicine water pipeline is hung above the wafer in the cleaning process, and the quality problem caused by the fact that the surface has marks due to the fact that the liquid medicine is easy to foam, and the liquid medicine is easy to extrude out of the pipe orifice and drip on the surface of the wafer under the actions of extrusion in the pipe and gravity.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a semiconductor belt cleaning device that cleaning performance is good.

In order to achieve the above object, the present invention provides a semiconductor cleaning device, which includes:

the cleaning table is used for placing a wafer;

the spraying mechanism comprises a pipeline assembly, the pipeline assembly comprises a first pipeline, a second pipeline and a third pipeline, the output end of the first pipeline is connected with the input end of the second pipeline, a liquid inlet valve is arranged at the position, close to the input end, of the second pipeline, the output end of the second pipeline is a spraying end, the third pipeline is connected between the liquid inlet valve and the output end of the second pipeline, a liquid discharge valve is arranged on the third pipeline, the third pipeline extends downwards, and the output end of the third pipeline is lower than the output end of the second pipeline in the vertical direction;

the heat preservation assembly is used for preserving heat of the first pipeline.

In some embodiments of the present application, the pipeline assembly is provided in a plurality, and the output ends of the second pipelines of the pipeline assemblies are arranged above the cleaning platform side by side.

In some embodiments of the present application, the output end of the second pipe is bent and directed downward.

In some embodiments of the present application, the spray mechanism further comprises a moving assembly coupled to the conduit assembly for moving the conduit assembly.

In some embodiments of the present application, the moving assembly includes a moving arm and a driving device, the pipeline assembly is disposed on the moving arm, and the driving device is configured to drive the moving arm to drive the output end of the second pipeline to move.

In some embodiments of the present application, the heat preservation assembly includes a heat preservation pipe, the first pipeline is disposed in the heat preservation pipe, and the heat preservation pipe is used for containing heat preservation liquid.

In some embodiments of the present application, the thermal insulation assembly includes a temperature control circuit in communication with the thermal insulation tube, the temperature control circuit being provided with a heating component and/or a cooling component.

In some embodiments of this application, still including wasing the case, it prescribes a limit to the washing chamber to wash the case, wash the platform set up in wash the intracavity, the lateral wall that washs the case has logical groove, the second pipeline passes through it stretches into to lead to the groove wash the intracavity, and be located the top of wash platform.

In some embodiments of the present application, the wash chamber has a support base on which the wash station is mounted.

In some embodiments of the present application, the cleaning cavity defines an annular accommodating concave position, the accommodating concave position is annularly arranged outside the supporting seat, and the height of the accommodating concave position in the vertical direction is lower than that of the supporting seat.

The utility model provides a semiconductor cleaning device, compared with the prior art, its beneficial effect lies in:

the utility model provides a semiconductor cleaning device includes the clean bench, spray mechanism and heat preservation subassembly, the clean bench is used for placing the wafer, it includes the pipeline subassembly to spray the mechanism, the pipeline subassembly includes first pipeline, second pipeline and third pipeline, the output of first pipeline is connected with the input of second pipeline, the position that the second pipeline is close to the input is equipped with the feed liquor valve, the output of second pipeline is for spraying the end, third tube coupling is between the output of feed liquor valve and second pipeline, be provided with the flowing back valve on the third pipeline, and the third pipeline extends downwards, the output of third pipeline is less than the output of second pipeline in vertical direction, the heat preservation subassembly is used for keeping warm to first pipeline. Based on the structure, when the liquid inlet valve is closed and the liquid outlet valve is opened, because the output end of the third pipeline is lower than the output end of the second pipeline in the vertical direction, through the pressure difference of siphonage, the cleaning liquid in the second pipeline which is not insulated flows back from the output end of the second pipeline under the action of pressure intensity in the pipeline and gravity and is discharged through the third pipeline, on one hand, the cleaning liquid which can not meet the requirement of cleaning temperature can be discharged, on the other hand, the liquid medicine can be prevented from dropping to the surface of the wafer, and the cleaning effect is optimized; and secondly, the cleaning liquid is discharged by adopting a siphon effect, the structure is simpler, modes such as vacuum or pumping and the like are not needed, and the cost is lower.

Drawings

Fig. 1 is a schematic structural view of a semiconductor cleaning apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a pipeline assembly according to an embodiment of the present invention.

In the figure: 1. a cleaning table; 2. a spraying mechanism; 21. a tubing assembly; 211. a first pipeline; 212. a second pipeline; 212a, a spray end; 213. a third pipeline; 214. a liquid inlet valve; 215. a drain valve; 22. a moving assembly; 221. a moving arm; 3. a heat preservation assembly; 31. a heat preservation pipe; 4. a cleaning tank; 41. a cleaning chamber; 411. a through groove; 412. a supporting base; 413. the accommodating concave position.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

It will be understood that in the description of the present application, the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application. The terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, i.e. a feature defined as "first", "second" may explicitly or implicitly include one or more of such features. Further, unless otherwise specified, "a plurality" means two or more.

It should be noted that, in the description of the present application, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

As shown in fig. 1 and 2, the embodiment of the utility model provides a semiconductor cleaning device, it includes clean bench 1, spray mechanism 2 and heat preservation subassembly 3, clean bench 1 is used for placing the wafer, it includes pipeline subassembly 21 to spray mechanism 2, pipeline subassembly 21 includes first pipeline 211 and second pipeline 212, heat preservation subassembly 3 is used for keeping warm to first pipeline 211, the output of first pipeline 211 is connected with the input of second pipeline 212, the position that second pipeline 212 is close to the input is equipped with feed liquor valve 214, the output of second pipeline 212 is for spraying end 212a. The second pipe 212 needs to be close to the cleaning table 1 and may need to move, so that all pipes of the spraying mechanism 2 cannot be kept at a predetermined temperature by the heat-insulating assembly 3, and therefore, during the idle period between two times of cleaning, the cleaning liquid in the second management, which is not covered by the heat-insulating assembly 3, does not meet the temperature requirement of cleaning at the next time of cleaning, and needs to be drained, and because the output end of the second pipe 212 is the spraying end 212a, it generally needs to be directed obliquely downward or directly downward for the cleaning efficiency and accuracy, so as to flush the surface of the wafer, and this necessarily brings about a problem that the cleaning liquid easily flows out of the output end of the second pipe 212 and drops to the surface of the wafer due to the gravity of the cleaning liquid and the squeezing action in the pipe during the idle period, so as to cause marks.

In view of the above, the pipeline assembly 21 further includes a third pipeline 213, the third pipeline 213 is connected between the liquid inlet valve 214 and the output end of the second pipeline 212, a liquid outlet valve 215 is disposed on the third pipeline 213, and the third pipeline 213 extends downward, and the output end of the third pipeline 213 is lower than the output end of the second pipeline 212 in the vertical direction.

Based on the structure, the liquid inlet valve 214 is closed and the liquid outlet valve 215 is opened, and because the output end of the third pipeline 213 is lower than the output end of the second pipeline 212 in the vertical direction, through the pressure difference of the siphonage, the cleaning liquid in the second pipeline 212 which is not insulated flows back from the output end of the second pipeline 212 under the action of the pressure and gravity in the pipeline and is discharged through the third pipeline 213, so that the cleaning liquid which can not reach the cleaning temperature requirement can be discharged, and the liquid medicine can be prevented from dropping on the surface of the wafer, thereby optimizing the cleaning effect; and secondly, the cleaning liquid is discharged by adopting a siphon effect, the structure is simpler, modes such as vacuum or pumping and the like are not needed, and the cost is lower.

In order to switch the cleaning liquids quickly and ensure that the various cleaning liquids are not cross-contaminated, optionally, as shown in fig. 1 and 2, in the present embodiment, the pipeline assemblies 21 are provided in plurality, and the output ends of the second pipelines 212 of the pipeline assemblies 21 are arranged side by side above the cleaning table 1. It should be understood that the plurality of line assemblies do not generally operate simultaneously, and that it is common for the second line of each line assembly to be opened and closed in sequence for alternate spray cleaning. Therefore, when the second pipeline of one of the pipeline assemblies is sprayed and washed, the liquid inlet valves of other pipeline assemblies are closed and the liquid outlet valves are opened, so that the cleaning liquid in the second pipeline in the non-working state is discharged, and the second pipelines of other pipeline assemblies are ensured not to drip liquid medicine to the surface of the wafer in the cleaning process.

Alternatively, as shown in fig. 1 and 2, in the present embodiment, the output end of the second pipe 212 is bent and directed downward.

Optionally, as shown in fig. 1 and fig. 2, in the present embodiment, the spraying mechanism 2 further includes a moving assembly 22, and the moving assembly 22 is connected to the pipeline assembly 21 for moving the pipeline assembly 21.

Alternatively, as shown in fig. 1 and fig. 2, in the present embodiment, the moving assembly 22 includes a moving arm 221 and a driving device, the pipeline assembly 21 is disposed on the moving arm 221, and the driving device is configured to drive the moving arm 221 to move the output end of the second pipeline 212. The driving device is specifically a motor, and drives the moving arm to move through the moving guide rail structure. Of course, the driving device may also drive the moving arm 221 to move in multiple degrees of freedom through a transmission structure such as a chain wheel, a chain, a screw rod, a slider, etc.

Optionally, as shown in fig. 1 and fig. 2, in the present embodiment, the thermal insulation assembly 3 includes a thermal insulation pipe 31, the first pipeline 211 is disposed in the thermal insulation pipe 31, and the thermal insulation pipe 31 is used for containing a thermal insulation liquid.

Alternatively, as shown in fig. 1 and 2, in the present embodiment, the heat-insulating assembly 3 includes a temperature control circuit, the temperature control circuit is communicated with the heat-insulating pipe 31, and the temperature control circuit is provided with a heating component and/or a cooling component.

Alternatively, as shown in fig. 1, in the present embodiment, the semiconductor cleaning apparatus further includes a cleaning tank 4, the cleaning tank 4 defines a cleaning chamber 41, the cleaning table 1 is disposed in the cleaning chamber 41, a side wall of the cleaning tank 4 has a through groove 411, and the second pipe 212 extends into the cleaning chamber 41 through the through groove 411 and is located above the cleaning table 1. Thus, the cleaning liquid is prevented from splashing.

Alternatively, as shown in FIG. 1, in the present embodiment, the cleaning chamber 41 has a support base 412, and the cleaning station 1 is mounted on the support base 412.

Alternatively, as shown in fig. 1, in the present embodiment, the cleaning chamber 41 defines an annular receiving recess 413, the receiving recess 413 is disposed around the outer side of the supporting seat 412, and the height of the receiving recess 413 in the vertical direction is lower than that of the supporting seat 412. Thus, the accommodating concave part 413 can accommodate a large amount of waste liquid after cleaning, and the waste liquid is prevented from polluting the cleaning table 1.

Optionally, in this embodiment, the semiconductor cleaning apparatus further includes a wafer taking device, where the wafer taking device includes a robot arm, and the robot arm can grip the wafer to perform operations of taking and placing the wafer.

The embodiment of the utility model provides a semiconductor cleaning device's working process does: when cleaning is needed, the output end of the second pipe 212 is moved to a cleaning position by the moving arm 221, the drain valve 215 is closed, the inlet valve 214 is opened, and the cleaning liquid is delivered to the surface of the wafer; when the cleaning is completed, the liquid inlet valve 214 is closed and the liquid outlet valve 215 is opened, so that the residual cleaning liquid in the second pipe 212 is discharged from the third pipe 213.

To sum up, the embodiment of the utility model provides a semiconductor cleaning device, it mainly by clean bench 1, it constitutes to spray mechanism 2 and heat preservation subassembly 3, clean bench 1 is used for placing the wafer, it includes pipeline subassembly 21 to spray mechanism 2, pipeline subassembly 21 includes first pipeline 211, second pipeline 212 and third pipeline 213, the output of first pipeline 211 is connected with the input of second pipeline 212, the position that second pipeline 212 is close to the input is equipped with feed liquor valve 214, the output of second pipeline 212 is for spraying end 212a, third pipeline 213 is connected between the output of feed liquor valve 214 and second pipeline 212, be provided with flowing back valve 215 on the third pipeline 213, and third pipeline 213 extends downwards, the output of third pipeline 213 is less than the output of second pipeline 212 in vertical direction, heat preservation subassembly 3 is used for keeping warm to first pipeline 211. Compared with the prior art, the semiconductor cleaning device has the following advantages:

1. because the output end of the third pipeline is lower than the output end of the second pipeline in the vertical direction, through the pressure difference of the siphonage, the cleaning liquid in the second pipeline which is not insulated flows back from the output end of the second pipeline under the action of the pressure in the pipeline and gravity and is discharged through the third pipeline, on one hand, the cleaning liquid which can not meet the requirement of the cleaning temperature can be discharged, on the other hand, the liquid medicine can be prevented from dropping to the surface of the wafer, and the cleaning effect is optimized; and secondly, the cleaning liquid is discharged by adopting a siphon effect, the structure is simpler, modes such as vacuum or pumping and the like are not needed, and the cost is lower.

2. The cleaning box is simple and reliable in structure, so that the cleaning effect is guaranteed.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.

Claims

1. A semiconductor cleaning apparatus, comprising:

the cleaning table is used for placing a wafer;

the spraying mechanism comprises a pipeline assembly, the pipeline assembly comprises a first pipeline, a second pipeline and a third pipeline, the output end of the first pipeline is connected with the input end of the second pipeline, a liquid inlet valve is arranged at a position, close to the input end, of the second pipeline, the output end of the second pipeline is a spraying end, the third pipeline is connected between the liquid inlet valve and the output end of the second pipeline, a liquid discharge valve is arranged on the third pipeline, the third pipeline extends downwards, and the output end of the third pipeline is lower than the output end of the second pipeline in the vertical direction;

2. The semiconductor cleaning apparatus of claim 1, wherein:

the pipeline components are arranged in a plurality of numbers, and the output ends of the second pipelines of the pipeline components are arranged above the cleaning table side by side.

3. The semiconductor cleaning apparatus of claim 2, wherein:

the output end of the second pipeline bends and faces downwards.

4. The semiconductor cleaning apparatus of claim 1, wherein:

the spraying mechanism further comprises a moving assembly, and the moving assembly is connected with the pipeline assembly and used for moving the pipeline assembly.

5. The semiconductor cleaning apparatus of claim 4, wherein:

the moving assembly comprises a moving arm and a driving device, the pipeline assembly is arranged on the moving arm, and the driving device is used for driving the moving arm to drive the output end of the second pipeline to move.

6. The semiconductor cleaning apparatus of claim 1, wherein:

the heat preservation assembly comprises a heat preservation pipe, the first pipeline is arranged in the heat preservation pipe, and the heat preservation pipe is used for containing heat preservation liquid.

7. The semiconductor cleaning apparatus of claim 6, wherein:

the heat preservation assembly comprises a temperature control loop, the temperature control loop is communicated with the heat preservation pipe, and the temperature control loop is provided with a heating part and/or a refrigerating part.

8. The semiconductor cleaning apparatus of claim 1, wherein:

still including wasing the case, it prescribes a limit to and washs the chamber to wash the case, wash the platform set up in wash the intracavity, the lateral wall of wasing the case has logical groove, the second pipeline passes through it stretches into to lead to the groove wash the intracavity, and be located the top of wash platform.

9. The semiconductor cleaning apparatus of claim 8, wherein:

the cleaning cavity is provided with a supporting seat, and the cleaning table is arranged on the supporting seat.

10. The semiconductor cleaning apparatus of claim 9, wherein:

the cleaning cavity is limited to an annular containing concave position, the containing concave position is annularly arranged on the outer side of the supporting seat, and the height of the containing concave position in the vertical direction is lower than that of the supporting seat.