CN218163454U

CN218163454U - MOS pipe heat dissipation holder and power adapter

Info

Publication number: CN218163454U
Application number: CN202222494526.2U
Authority: CN
Inventors: 骆耀娣
Original assignee: Dongguan Oulutong Electronics Co ltd
Current assignee: Dongguan Oulutong Electronics Co ltd
Priority date: 2022-09-20
Filing date: 2022-09-20
Publication date: 2022-12-27
Anticipated expiration: 2032-09-20

Abstract

The application provides a MOS manages heat dissipation holder and power adapter relates to electronic components technical field, has improved MOS pipe and fixed inconvenient problem of fin. This MOS pipe heat dissipation holder includes: the clamping part has elastic deformation characteristics so that the extension part has a tendency of moving towards or away from the heat dissipation main body part, and a clamping area used for clamping the MOS tube is defined between the clamping part and the heat dissipation main body part.

Description

MOS pipe heat dissipation holder and power adapter

Technical Field

The application relates to the technical field of electronic components, in particular to a MOS tube heat dissipation clamping piece and a power adapter.

Background

The MOS transistor is often applied to products such as an inverter power supply, a solar controller, a discharge instrument, a UPS power supply, and particularly, the MOS transistor is used in a high-power supply product, and the MOS transistor is a power device, and when the MOS transistor works normally, the temperature is high, and the MOS transistor needs to be cooled by a cooling device.

The conventional MOS transistor is usually fixed to the heat sink by a connector such as a screw. The MOS tube is small in size and belongs to a fine component, and the fixing mode is troublesome, so that the mounting efficiency is influenced; the use of screws for fixation also increases the installation costs.

SUMMERY OF THE UTILITY MODEL

In view of this, the present application provides a MOS tube heat dissipation clamping member and a power adapter, so as to solve the problems of inconvenience in fixing the MOS tube and the heat sink, low assembly efficiency, and high assembly cost.

The technical scheme adopted by the application to solve the technical problems is as follows:

in a first aspect, the present application provides a MOS pipe heat dissipation holder, including:

the heat dissipation main body part is of a sheet structure;

the clamping part, the clamping part with the heat dissipation main part is connected, the clamping part have with the relative extension that sets up of heat dissipation main part, the clamping part has the elastic deformation characteristic so that the extension has the orientation or deviates from the trend that the heat dissipation main part removed, the clamping part with inject the clamping area who is used for centre gripping MOS pipe between the heat dissipation main part.

In some embodiments of the present application, the clamping portion further has a connecting portion, the connecting portion is connected between the extending portion and the heat dissipating main body portion, and the connecting portion is connected to an edge of one side of the heat dissipating main body portion.

In some embodiments of the present application, an included angle between the extending portion and the connecting portion is an acute angle.

In some embodiments of the present application, the extension portion includes a clamping section and an introduction section, the clamping section is located between the introduction section and the connection portion, and an introduction area is defined between the introduction section and the heat dissipation main body portion.

In some embodiments of the present application, a distance between the guiding section and the heat dissipating main body portion gradually increases in a direction away from the connecting portion.

In some embodiments of the present application, the heat dissipating main body has a width direction, the connecting portion protrudes from a surface of the heat dissipating main body close to the extending portion, and a length of the connecting portion along the width direction is greater than or equal to a width of the heat dissipating main body

In some embodiments of the present application, the heat dissipating main body has a width direction, and the extension portion has a width smaller than the width of the heat dissipating main body along the width direction.

In some embodiments of the present application, a pin is disposed on one side of the heat dissipating main body along the width direction, and the pin is used for mounting and fixing the heat dissipating main body.

In some embodiments of the present application, a heat dissipation auxiliary member is disposed on a side of the heat dissipation main body portion away from the clamping portion.

In a second aspect, the present application provides a power adapter, including PCB board, MOS pipe and as the first aspect MOS pipe heat dissipation holder, the MOS pipe with the PCB board is connected, MOS pipe heat dissipation holder is held the MOS pipe for it is fixed and dispel the heat to the MOS pipe clamping.

In conclusion, due to the adoption of the technical scheme, the application at least comprises the following beneficial effects:

in some embodiments of the present application, the heat dissipation main body portion is in a sheet structure, which is beneficial to increase of a heat dissipation area; through set up the clamping part on the heat dissipation main part, utilize the clamping part to realize that the centre gripping between MOS pipe and the heat dissipation main part is fixed, need not to recycle connecting pieces such as screw nut and fix MOS pipe and heat dissipation main part, it is more convenient to install, has saved fixed cost. The clamping part comprises an extension part, the extension part and the heat dissipation main body part are arranged oppositely, the extension part has a trend of moving towards or deviating from the heat dissipation main body part due to the fact that the clamping part has elastic deformation characteristics, a clamping area is defined between the extension part and the heat dissipation main body part, the MOS tube is located in the clamping area, the MOS tube can be clamped by the extension part and the heat dissipation main body part, and therefore the purpose of fixing the MOS tube is achieved. This fixed process of centre gripping only needs to promote heat dissipation main part or MOS pipe, makes both have the motion that is close to each other, makes MOS pipe installation to the centre gripping region, and extension and heat dissipation main part just can realize the centre gripping to the MOS pipe automatically, and the fixed process of centre gripping is comparatively convenient, improves the installation effectiveness.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly described below, and it should be apparent that the drawings in the following description only relate to some embodiments of the present application and are not limiting of the present application, wherein:

fig. 1 is a schematic structural view of a MOS tube heat dissipation clamping member according to an embodiment of the present disclosure;

fig. 2 is a schematic structural view of the MOS transistor clamped by the MOS transistor heat dissipation clamp.

Description of the reference numerals:

1-a heat dissipating main body portion;

2-clamping part, 21-extension, 211-clamping section, 212-introduction section, 22-connection;

3-clamping area, 31-clamping space, 32-lead-in area;

4-a pin;

5-MOS tube.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the words "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or including indicating a number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "plurality" means two or more unless specifically limited otherwise.

In the present application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as exemplary is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the application. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present application may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the present application with unnecessary detail. Thus, the present application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles disclosed herein.

To facilitate understanding of the solution of the present application, the spline curves and arrows used as reference numbers in the drawings are described herein: the part indicated for the spline curve without the arrow is a solid part, i.e., a part having a solid structure; the parts indicated for spline curves with arrows are phantom parts, i.e. parts without solid structure.

The application provides a MOS pipe heat dissipation holder, with heat dissipation device and centre gripping fixing device set as an organic whole, make it can the centre gripping MOS pipe, have radiating effect again. Referring to fig. 1 and fig. 2, the MOS tube heat dissipation clip includes:

a heat dissipation main body part 1, wherein the heat dissipation main body part 1 is of a sheet structure;

clamping part 2, clamping part 2 with heat dissipation main part 1 is connected, clamping part 2 have with the relative extension 21 that sets up of heat dissipation main part 1, clamping part 2 has the elastic deformation characteristic so that extension 21 has the orientation or deviates from the trend that heat dissipation main part 1 removed, clamping part 2 with inject the clamping area 3 that is used for centre gripping MOS pipe 5 between the heat dissipation main part 1.

This MOS pipe heat dissipation holder mainly utilizes the heat dissipation main part 1 that is sheet structure to dispel the heat to MOS pipe 5 to sheet structure is favorable to increasing heat radiating area, improves the radiating effect. The heat dissipation main body part 1 is connected with the clamping part 2, and the clamping part 2 is matched with the heat dissipation main body part 1 to clamp and fix the MOS tube 5. Specifically, the clamping portion 2 has an extension portion 21, and the extension portion 21 is disposed opposite to the heat dissipating main body portion 1 so that a space between the clamping portion 2 and the heat dissipating main body portion 1 constitutes a clamping region 3 for clamping the MOS transistor 5; clamping part 2 has the elastic deformation characteristic in addition, and when MOS pipe 5 got into clamping area 3, MOS pipe 5 can form the extrusion force to extension 21, makes extension 21 orientation deviate from the direction motion of heat dissipation main part 1, and extension 21 takes place deformation simultaneously, and deformation gives extension 21 the power that resumes deformation to have the trend that moves towards heat dissipation main part 1, dwindles clamping area 3, carries out the centre gripping to MOS pipe 5 and fixes. The heat dissipation surface of the heat dissipation main body part 1 has a heat dissipation function, and is used for being matched with the clamping part 2 and has a function of clamping and fixing the MOS tube 5. Compared with a method of fixing the heat sink and the MOS transistor 5 by using an external auxiliary fixing component such as a screw, the fixing method of the clamping portion 2 and the heat sink main body portion 1 provided in this embodiment is more convenient when fixing the MOS transistor 5, and has fewer mounting steps, higher mounting efficiency and lower cost.

In some embodiments, the clamping portion 2 further has a connecting portion 22, and the connecting portion 22 is connected between the extending portion 21 and the heat dissipating main body portion 1. Because the extension portion 21 and the heat dissipating main body portion 1 are disposed oppositely, and the connecting portion 22 is located between the extension portion 21 and the heat dissipating main body portion 1, and connects the extension portion 21 and the heat dissipating main body portion 1, a certain included angle is formed between the connecting portion 22 and the extension portion 21, and the connecting portion 22 enables the extension portion 21 and the heat dissipating main body portion 1 to be disposed at an interval. In addition, the connecting portion 22 is connected to one side edge of the heat dissipating main body portion 1, so as to avoid a sufficiently large heat dissipating area of the heat dissipating main body portion 1 as much as possible, and to make the clamping area 3 satisfy the volume of the MOS transistors 5 to be clamped as much as possible. Specifically, the connecting portion 22 is connected to one side edge of the heat dissipating main body 1, and the extension 21 has a length less than or equal to the length of the heat dissipating main body 1.

Further, the included angle between the extension portion 21 and the connection portion 22 is an acute angle. The included angle between the extension portion 21 and the connecting portion 22 is set to be an acute angle, that is, the distance between the extension portion 21 and the heat dissipation main body portion 1 is gradually reduced along the direction departing from the connecting portion 22, so that the space of the clamping area 3 defined by the heat dissipation main body portion 1 and the extension portion 21 is gradually reduced, and the heat dissipation main body portion can adapt to a large-size MOS transistor 5 and can also adapt to more small-size MOS transistors 5. And set up the contained angle between extension 21 and the connecting portion 22 to the acute angle, also be favorable to increasing the deformation power that extension 21 received to make extension 21 and the cooperation of heat dissipation main part 1 form bigger clamping-force to MOS pipe 5, fix more firm reliable to MOS pipe 5.

In some embodiments, extension 21 includes a gripping section 211 and a lead-in section 212. The clamping section 211 is located between the lead-in section 212 and the connection section 22. The holding section 211 is connected at one end to the introduction section 212. The other end of the clamping section 211 is connected to the connection portion 22. The clamping section 211 and the heat dissipating main body portion 1 define a clamping space 31 for clamping the MOS transistor 5. Be the acute angle between clamping section 211 and the connecting portion 22, make clamping section 211 and the direction that deviates from connecting portion 22 between the heat dissipation main part 1 reduce gradually, be favorable to increasing clamping section 211's deformation power, and the centre gripping to MOS pipe 5 is more firm. For the lead-in section 212, a lead-in area 32 is defined between the lead-in section and the heat dissipation main body portion 1, the lead-in area 32 is mainly used for facilitating installation and alignment of the MOS transistor 5 in the process of installing the MOS transistor 5 in the clamping space 31, and the auxiliary MOS transistor 5 is aligned with the clamping space 31, or the auxiliary clamping space 31 is aligned with the MOS transistor 5, so that installation efficiency is improved.

Further, with respect to the introduction section 212, in a direction away from the connection portion 22, a distance between the introduction section 212 and the heat dissipating main body portion 1 gradually increases, that is, an angle between an extension line of the introduction section 212 and an extension line of the connection portion 22 is an obtuse angle. By setting the distance between the lead-in section 212 and the heat dissipating main body portion 1 to be gradually increased, the opening of the lead-in area 32 is gradually increased in the direction away from the connecting portion 22, alignment between the MOS transistor 5 and the lead-in area 32 is facilitated, and difficulty in manufacturing and matching is reduced. When the MOS tube heat dissipation clamping member is pushed to make the MOS tube 5 enter the lead-in area 32, the clamping member is continuously pushed, so that the MOS tube 5 can enter the clamping space 31 along the guide of the lead-in area 32, and is clamped and fixed by the clamping section 211 and the heat dissipation main body portion 1.

In some embodiments, the heat dissipating main body portion 1 has a width direction. Along the width direction of the heat dissipation main body portion 1, the width of the extension portion 21 is smaller than that of the heat dissipation main body portion 1, so that the situation that the width of the extension portion 21 is too wide and too much shielding is formed on the MOS tube 5 to influence the heat dissipation of the MOS tube 5 is avoided. Further, in some embodiments, the MOS transistor 5 is stepped at the clamped position, the thickness of the portion close to the PCB is greater than the thickness of the portion to be clamped 2, and the extension portion 21 is located at the portion of the MOS transistor 5 far from the PCB, so that the deformation amplitude of the extension portion 21 can be effectively reduced, and the service life of the extension portion 21 can be prolonged. Moreover, the part close to the PCB board can bear the weight of the extension part 21 because the thickness of the part is larger than that of the clamped part, and the clamping piece is prevented from sliding off due to gravity. It should be noted that the MOS tube heat dissipation clamping member is not limited to clamp the MOS tube formed with the step shape, and may also form a clamping function for other shapes, such as a cube shape, an arc shape, or an irregular shape.

Furthermore, a pin 4 is disposed on one side of the heat dissipating main body 1 along the width direction thereof, and the heat dissipating main body 1 is fixed on the PCB board by the pin 4.

Besides, in some embodiments, the heat dissipating main body 1 has a width direction, the connecting portion 22 protrudes from a surface of the heat dissipating main body 1 close to the extending portion 21, and a length of the connecting portion 22 in the width direction is greater than or equal to a width of the extending portion 21. Connecting portion 22 protrusion is in the setting of heat dissipation main part 1 surface, can form spacing to MOS pipe 5 on the promotion direction, is promoted to going into MOS pipe 5 card after clamping region 3, if continue to promote MOS pipe heat dissipation clamping piece, MOS pipe 5 then can with connecting portion 22 butt to prevent the continuation of MOS pipe heat dissipation clamping piece to promote. In addition, in the present embodiment, the length of the connecting portion 22 is greater than or equal to the width of the extending portion 21, so that the MOS transistor 5 can be limited as much as possible in the width direction. In detail, the MOS tube heat dissipation clamping piece is pushed, so that the MOS tube 5 is located in the clamping area 3, and the MOS tube heat dissipation clamping piece is continuously pushed, the MOS tube 5 abuts against the connecting portion 22, if the length of the connecting portion 22 is short, the situation that the MOS tube 5 is inclined due to too large thrust can occur, and the MOS tube 5 and the PCB are damaged when being connected, and the length of the connecting portion 22 is equal to the width of the extending portion 21 or is greater than the width of the extending portion 21, so that the situation that the MOS tube 5 is mistakenly operated and continuously pushed can be avoided as much as possible, the MOS tube 5 can be inclined, and the connection between the MOS tube and the PCB is damaged due to the inclination of the MOS tube 5.

In some embodiments, a side of the heat dissipating main body 1 away from the clamping portion 2 is further provided with a heat dissipating auxiliary member (not shown in the drawings) for improving heat dissipating efficiency of the MOS transistor 5. The heat dissipation auxiliary member may be a fin structure formed by stacking a plurality of metal sheets, or other structures capable of increasing the heat dissipation effect.

In some embodiments, the present application further provides a power adapter, which includes a PCB (not shown), an MOS tube, and the MOS tube heat dissipation clamping member according to any of the previous embodiments, where the MOS tube is connected to the PCB, and the MOS tube heat dissipation clamping member clamps the MOS tube for fixing and dissipating heat of the MOS tube.

Furthermore, the lead-in area 32 of the MOS tube heat dissipation clamp has a lead-in opening, and the opening direction of the lead-in opening is parallel to the PCB. The opening direction of the lead-in port is limited to be parallel to the PCB, so that in the process that the MOS tube 5 is clamped by the MOS tube heat dissipation clamping piece, the direction of the MOS tube heat dissipation clamping piece, which is pushed towards the MOS tube 5, is parallel to the PCB, the direction of the MOS tube heat dissipation clamping piece, which is pushed towards the direction vertical to the PCB, is not needed, and the installation space needed in the direction vertical to the PCB is saved. In more detail, in the prior art, the heat sink is basically installed above the MOS transistor 5, i.e. in a direction perpendicular to the PCB, and then the heat sink and the MOS transistor 5 are pushed and compressed by the pressing sheet from top to bottom, and when the pressing sheet is pushed from top to bottom, a certain pushing space needs to be reserved in the vertical direction, which results in waste of space. The vertical direction, that is, the direction perpendicular to the PCB, is equivalent to defining the PCB as being horizontally disposed, and certainly, the placement of the PCB is not limited, and is only an example here. In the embodiment, the opening direction is parallel to the PCB, the pushing process of the MOS tube heat dissipation clamping piece is limited to be parallel to the PCB, if the PCB is horizontally placed, the MOS tube heat dissipation clamping piece is horizontally pushed in the clamping process to be close to the MOS tube 5, and the pushing space is reserved without being in the vertical direction, namely the direction perpendicular to the PCB, so that the space perpendicular to the PCB is saved; simultaneously, because the PCB board itself has certain length and width, occupy certain space in the horizontal direction, and MOS pipe heat dissipation holder promotes the shared horizontal space of at least partly can be for the PCB board in the shared space of in-process, no matter whether have MOS pipe heat dissipation holder to promote the centre gripping at the horizontal direction promptly, this part horizontal space all can be occupied by the PCB board, so MOS pipe heat dissipation holder utilizes this space that will be occupied by the PCB board as the installation space that the level promoted, also can not cause the space waste on the too much horizontal direction.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be considered merely illustrative and not restrictive of the broad application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, though not expressly described herein. Such modifications, improvements and adaptations are proposed in the present application and thus fall within the spirit and scope of the exemplary embodiments of the present application.

Also, this application uses specific language to describe embodiments of the application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means a feature, structure, or characteristic described in connection with at least one embodiment of the application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.

Similarly, it should be noted that in the preceding description of embodiments of the application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.

For each patent, patent application publication, and other material cited in this application, such as articles, books, specifications, publications, documents, and the like, the entire contents of which are hereby incorporated by reference into this application, except for application history documents that are inconsistent with or conflict with the contents of this application, and except for documents that are currently or later become incorporated into this application as though fully set forth in the claims below. It is noted that the descriptions, definitions and/or use of terms in this application shall control if they are inconsistent or contrary to the present disclosure.

Claims

1. The utility model provides a MOS pipe heat dissipation holder which characterized in that includes:

a heat dissipating main body part having a sheet structure;

2. The heat dissipating clamp of claim 1, wherein the clamp further has a connecting portion, the connecting portion is connected between the extension portion and the heat dissipating main body portion, and the connecting portion is connected to an edge of the heat dissipating main body portion.

3. The MOS tube heat-dissipating clamp of claim 2, wherein the angle between the extension portion and the connecting portion is acute.

4. The heat-dissipating clamp for a MOS transistor according to claim 2, wherein the extension portion includes a clamping section and an introduction section, the clamping section is located between the introduction section and the connecting portion, and an introduction region is defined between the introduction section and the heat-dissipating main body portion.

5. The MOS tube heat-dissipating clamp of claim 4, wherein the distance between the lead-in section and the heat-dissipating main body portion gradually increases in a direction away from the connecting portion.

6. The heat dissipating clamp of claim 2, wherein the heat dissipating body has a width direction, the connecting portion protrudes from a surface of the heat dissipating body near the extending portion, and a length of the connecting portion along the width direction is greater than or equal to a width of the extending portion.

7. The MOS tube heat sink clip of claim 1, wherein the heat sink body portion has a width direction along which a width of the extension portion is less than a width of the heat sink body portion.

8. The MOS tube heat-dissipating clamping member as claimed in claim 7, wherein a pin is disposed on one side of the heat-dissipating main body along the width direction, and the pin is used for mounting and fixing the heat-dissipating main body.

9. The MOS tube heat-dissipating clamping member as claimed in claim 1, wherein a heat-dissipating auxiliary member is disposed on a side of the heat-dissipating main body portion facing away from the clamping member.

10. A power adapter, comprising a PCB board, a MOS tube and the heat dissipating clamp of any of claims 1-9, wherein the MOS tube is connected to the PCB board, and the heat dissipating clamp clamps the MOS tube for holding, fixing and dissipating heat from the MOS tube.