CN218163008U - Multilayer intercommunication circuit board - Google Patents

Multilayer intercommunication circuit board Download PDF

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Publication number
CN218163008U
CN218163008U CN202222175993.9U CN202222175993U CN218163008U CN 218163008 U CN218163008 U CN 218163008U CN 202222175993 U CN202222175993 U CN 202222175993U CN 218163008 U CN218163008 U CN 218163008U
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China
Prior art keywords
circuit board
erection column
board body
column
mounting
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CN202222175993.9U
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Chinese (zh)
Inventor
温群霞
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Meizhou Shiya Electronic Co ltd
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Meizhou Shiya Electronic Co ltd
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Priority to CN202222175993.9U priority Critical patent/CN218163008U/en
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Abstract

The application relates to the field of circuit boards and discloses a multilayer intercommunication circuit board. In this application, including the circuit board body, the wiring mounting groove has been seted up on the surface of circuit board body, both ends fixedly connected with side mounting bar about the circuit board body, the side of side mounting bar and circuit board body runs through and has seted up the regulation hole, and the inside activity grafting of regulation hole has last erection column and lower erection column. According to the position that the circuit board body needs the adjustment, will go up the erection column and peg graft the inside of regulation hole with lower erection column, later go up the surface that one side end meeting butt at the mounted position of erection column or lower erection column, go up the rubber bulge on erection column or lower erection column top can produce the friction with the surface of mounted position, thereby make and go up the erection column and can not take place easily with lower erection column and slide, the circuit board body also can rotate around the erection column and lower erection column simultaneously, thereby conveniently adjust the circuit board body when the installation, the convenience when using has been improved.

Description

Multilayer intercommunication circuit board
Technical Field
The application belongs to the technical field of circuit boards, and particularly relates to a multilayer intercommunication circuit board.
Background
The multilayer circuit board is a printed board which is formed by laminating at least three conductive pattern layers and insulating materials positioned between two adjacent conductive pattern layers, and the patterns on the conductive pattern layers are interconnected as required. The multilayer wiring board is a product of the development of electronic information technology toward high speed, multifunction, large capacity, small volume, thinning and light weight. At present, the multilayer circuit board mostly adopts the production process of drilling and copper deposition after single-sided board stacking and laminating.
As disclosed in application with publication number CN213403634U a multilayer circuit board, including first base plate, second base plate and reinforcing mechanism, the utility model discloses a reinforcing mechanism has been set up in first base plate and second base plate outside, absorb the heat that first base plate and second base plate use process produced through heat conduction copper and heat conduction aluminum sheet, and with connecting hose connection on outside cold wind equipment, then the outside cold wind equipment of accessible is leading-in to connecting the hose with air conditioning, and cold wind flows through the guide duct and enters into the cavity piece and the inboard hot gas of through-hole absorbs the derivation, go on further reinforcing through U type splint and to first base plate and second base plate simultaneously, reached and carried out quick heat dissipation to multilayer circuit board, and made first base plate and second base plate at the beneficial effect that use and later stage processing are more stable.
However, when the multilayer circuit board is mounted, when the circuit board needs to be adjusted by rotation, the whole circuit board is deviated, which affects the convenience of mounting.
SUMMERY OF THE UTILITY MODEL
The purpose of this application lies in: to solve the above-mentioned problems, a multilayer interconnection board is provided.
The technical scheme adopted by the application is as follows: the utility model provides a multilayer intercommunication circuit board, includes the circuit board body, the wiring mounting groove has been seted up on the surface of circuit board body, both ends fixedly connected with side mounting bar about the circuit board body, the side of side mounting bar and circuit board body runs through and has seted up the regulation hole, and the inside activity grafting of regulation hole has last erection column and lower erection column.
By adopting the technical scheme, when the circuit board body is installed, the lower mounting column and the upper mounting column can be taken out from the inside of the mounting column placing groove on the side edge of the side mounting bar at the moment, the plug connector at the tail end of the upper mounting column is inserted into the inside of the plug groove, so that the upper mounting column and the lower mounting column are fixed, and the positions of the upper mounting column and the lower mounting column are adjusted according to the position of the circuit board body, the upper mounting column and the lower mounting column are inserted into the adjusting hole, the tail end of one side of the upper mounting column or the lower mounting column can be abutted against the surface of the mounting position, the rubber bulge at the top end of the upper mounting column or the lower mounting column can generate friction with the surface of the mounting position, so that the upper mounting column and the lower mounting column can not easily slide, meanwhile, the circuit board body can also rotate around the upper mounting column and the lower mounting column, the circuit board body is conveniently adjusted during installation, and the convenience in use is improved.
In a preferred embodiment, the side surface of the side mounting bar is provided with a mounting post accommodating groove, and the left side surface and the right side surface of the mounting post accommodating groove are adhered with extrusion cotton pads.
Through adopting above-mentioned technical scheme, after will going up erection column and lower erection column equipment, can the butt in the inside of erection column standing groove to be convenient for accomodate last erection column and lower erection column, the convenience when having improved the use.
In a preferred embodiment, the upper surface of the lower mounting post is provided with a plug-in slot.
In a preferred embodiment, the bottom surface of the upper mounting column is bonded with a plug, and the surface of the plug is fixedly connected with a resistance strip, and the length of the resistance strip is greater than the width of the plug groove.
By adopting the technical scheme, when the upper mounting column and the lower mounting column are connected, the length of the resistance strip is greater than the width of the insertion groove, so that the friction force between the resistance strip and the inner wall of the insertion groove is increased, and the friction force between the upper mounting column and the lower mounting column is improved.
In a preferred embodiment, the top ends of the upper mounting column and the lower mounting column are fixedly connected with rubber resistance heads, and rubber bulges are adhered to the outer end surfaces of the rubber resistance heads.
Through adopting above-mentioned technical scheme, increased the frictional force between with ground, increased the stability of circuit board body when the installation.
In conclusion, due to the adoption of the technical scheme, the beneficial effects of the application are as follows:
in this application, when installing the circuit board body, this moment can be followed the inside of the erection column standing groove of side mounting bar side and will be followed erection column and last erection column and take out down, will go up after the terminal bayonet joint of erection column inserts the inside of inserting groove, make and form fixedly between last erection column and the lower erection column, later according to the position that the circuit board body needs the adjustment, will go up the erection column and insert the inside of adjusting hole with lower erection column, later go up the surface that one side end meeting butt at the mounted position of erection column or lower erection column can, go up the rubber bulge on erection column or lower erection column top can produce the friction with the surface of mounted position, thereby make and go up the erection column and can not take place easily to slide with lower erection column, the circuit board body also can rotate around the erection column and lower erection column simultaneously, thereby conveniently adjust the circuit board body when the installation, convenience when using has been improved.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board body according to the present application;
FIG. 2 is a schematic view of the upper mounting post structure of the present application;
fig. 3 is a schematic view of the structure of the lower mounting post in the present application.
The labels in the figure are: 1. a circuit board body; 2. a wiring installation groove; 3. mounting a column; 4. a lower mounting post; 5. side mounting bars; 6. mounting a column placing groove; 7. pressing the cotton pad; 8. an adjustment hole; 9. a rubber resistance head; 10. a plug-in connector; 11. a resistance strip; 12. and (4) inserting grooves.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
With reference to figures 1-3 of the drawings,
example (b):
the utility model provides a multilayer intercommunication circuit board, including circuit board body 1, wiring mounting groove 2 has been seted up on the surface of circuit board body 1, both ends fixedly connected with side mounting bar 5 about circuit board body 1, side mounting bar 5 and circuit board body 1's side run through and have seted up regulation hole 8, and the inside activity grafting of regulation hole 8 has last erection column 3 and erection column 4 down, when installing circuit board body 1, can take out erection column 4 and last erection column 3 down from the inside of erection column standing groove 6 of side mounting bar 5 side this moment, after will going up 3 terminal bayonet joint 10 of erection column and inserting groove 12, make and form fixedly between erection column 3 and the erection column 4 down, later according to the position that circuit board body 1 needs the adjustment, will go up erection column 3 and the inside of regulation hole 8 of 4 grafting, later, the terminal can the butt surface at the erection position of one side of erection column 3 or lower erection column 4, go up the rubber bulge on erection column 3 or the top of erection column 4 can produce the friction with the surface of erection position, thereby make the erection column 3 and the lower erection column 4 can not easily take place around the circuit board body and can not rotate when installing circuit board body 1, thereby the convenience is installed.
Mounting post standing groove 6 has been seted up to the side surface of side mounting bar 5, and the left and right sides face of mounting post standing groove 6 bonds and has extrudeed cotton pad 7, will go up the erection column 3 and assemble well with erection column 4 down after, can the butt in the inside of mounting post standing groove 6 to be convenient for accomodate last erection column 3 and lower erection column 4, improved the convenience when using.
Inserting groove 12 has been seted up to the upper surface of erection column 4 down, the bottom surface of going up erection column 3 bonds and has bayonet joint 10, and the fixed surface of bayonet joint 10 is connected with resistance strip 11, and the length of resistance strip 11 is greater than the width of inserting groove 12, when being connected last erection column 3 with lower erection column 4, this moment because the length of resistance strip 11 is greater than the width of inserting groove 12, thereby increased the frictional force between the inner wall of resistance strip 11 and inserting groove 12, thereby improved the frictional force between last erection column 3 and lower erection column 4.
Go up the terminal fixedly connected with rubber resistance head 9 in top of erection column 3 and lower erection column 4, and the outer end surface bonding of rubber resistance head 9 has the rubber arch, increased with the ground between frictional force, increased the stability of circuit board body 1 when installing.
The implementation principle of the embodiment of the multilayer interconnection circuit board is as follows: when the circuit board is used, when the circuit board body 1 is installed, the lower mounting column 4 and the upper mounting column 3 can be taken out from the inside of the mounting column placing groove 6 on the side edge of the side mounting bar 5, the plug-in connector 10 at the tail end of the upper mounting column 3 is inserted into the plug-in groove 12, so that the upper mounting column 3 and the lower mounting column 4 are fixed, then the upper mounting column 3 and the lower mounting column 4 are plugged into the adjusting hole 8 according to the position of the circuit board body 1 to be adjusted, then the tail end of one side of the upper mounting column 3 or the lower mounting column 4 can be abutted against the surface of the mounting position, the rubber bulge at the top end of the upper mounting column 3 or the lower mounting column 4 can generate friction with the surface of the mounting position, so that the upper mounting column 3 and the lower mounting column 4 cannot easily slide, meanwhile, the circuit board body 1 can also rotate around the upper mounting column 3 and the lower mounting column 4, so that the circuit board body 1 is conveniently adjusted when the circuit board is installed, and convenience in use is improved.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (5)

1. A multilayer intercommunication circuit board, includes circuit board body (1), its characterized in that: wiring mounting groove (2) have been seted up on the surface of circuit board body (1), both ends fixedly connected with side mounting strip (5) about circuit board body (1), side mounting strip (5) run through with the side of circuit board body (1) and have seted up regulation hole (8), and the inside activity of regulation hole (8) is pegged graft and is had last erection column (3) and lower erection column (4).
2. The multilayer interconnect board of claim 1, wherein: mounting post standing groove (6) have been seted up to the side surface of side mounting bar (5), and the left and right sides face of mounting post standing groove (6) bonds and has extrudees cotton pad (7).
3. The multilayer interconnect circuit of claim 1, wherein: the upper surface of the lower mounting column (4) is provided with a plug-in groove (12).
4. The multilayer interconnect board of claim 1, wherein: the bottom surface of the upper mounting column (3) is bonded with a plug connector (10), the surface of the plug connector (10) is fixedly connected with a resistance strip (11), and the length of the resistance strip (11) is greater than the width of the plug-in groove (12).
5. The multilayer interconnect board of claim 1, wherein: the top ends of the upper mounting column (3) and the lower mounting column (4) are fixedly connected with rubber resistance heads (9), and rubber bulges are bonded on the outer end surfaces of the rubber resistance heads (9).
CN202222175993.9U 2022-08-18 2022-08-18 Multilayer intercommunication circuit board Active CN218163008U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222175993.9U CN218163008U (en) 2022-08-18 2022-08-18 Multilayer intercommunication circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222175993.9U CN218163008U (en) 2022-08-18 2022-08-18 Multilayer intercommunication circuit board

Publications (1)

Publication Number Publication Date
CN218163008U true CN218163008U (en) 2022-12-27

Family

ID=84550101

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222175993.9U Active CN218163008U (en) 2022-08-18 2022-08-18 Multilayer intercommunication circuit board

Country Status (1)

Country Link
CN (1) CN218163008U (en)

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