CN209806153U

CN209806153U - Multilayer circuit board

Info

Publication number: CN209806153U
Application number: CN201920063569.0U
Authority: CN
Inventors: 张瑞春
Original assignee: Huizhou Zhongxin Tiancheng Karwi Electronics Development Ltd
Current assignee: Huizhou Zhongxin Tiancheng Karwi Electronics Development Ltd
Priority date: 2019-01-15
Filing date: 2019-01-15
Publication date: 2019-12-17
Anticipated expiration: 2029-01-15

Abstract

The utility model discloses a multilayer circuit board, which comprises a first substrate, a ground layer and a high-speed signal transmission layer are fixedly arranged inside the first substrate, the ground layer is fixedly arranged at the bottom of the high-speed signal transmission layer, a second substrate is fixedly arranged at the top end of the first substrate, a hollow three-dimensional square insulating cavity is fixedly arranged inside the second substrate, copper posts connected with the top end and the bottom end of the second substrate are fixedly arranged on the outer walls of four sides of the insulating cavity, a third substrate is fixedly arranged at the top end of the second substrate, the connecting column arranged at the side of each substrate can ensure that the multilayer circuit board can be continuously used when a single substrate is damaged, the high-speed transmission of signals is ensured by the arranged high-speed transmission signal layer, the circuit board is prevented from receiving electromagnetic interference by the arranged electromagnetic shielding film, the elastic reporting frame plays a role in protecting the circuit board when the circuit board is collided.

Description

Multilayer circuit board

Technical Field

The utility model relates to a circuit board, in particular to multilayer circuit board belongs to circuit board technical field.

Background

Because the gradual improvement of electronic product production technology, required electronic component is more and more accurate, traditional single-layer board and double-layer board have not satisfied the needs of production, the event has produced the multiply wood, the multiply wood has a plurality of plate bodys, because the zonulae occludens between the plate body, a base plate destroys and just probably leads to whole multilayer circuit board to be out of use, and simultaneously, be different from single-layer board and double-layer board, the multiply wood is because a plurality of plate bodys stack, probably because a large amount of air exist with connect in the hole, produce the effect of thermal barrier shrinkage, lead to the size stability variation of circuit board or even warp, all the life of the multilayer circuit board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multilayer circuit board to destroy a base plate that proposes in solving above-mentioned background art and lead to unable and the problem that multilayer board air escape can not influence the life of multilayer board.

In order to achieve the above object, the utility model provides a following technical scheme: a multilayer circuit board comprises a first substrate, wherein a ground layer and a high-speed transmission signal layer are fixedly arranged inside the first substrate, the ground layer is fixedly arranged at the bottom of the high-speed transmission signal layer, a second substrate is fixedly arranged at the top end of the first substrate, a hollow three-dimensional square insulating cavity is fixedly arranged inside the second substrate, copper columns connected with the top end and the bottom end of the second substrate are fixedly arranged on the outer walls of four sides of the insulating cavity, a third substrate is fixedly arranged at the top end of the second substrate, a leakage-blocking interlayer and a light-blocking layer are fixedly arranged inside the third substrate, a fourth substrate is fixedly arranged at the top end of the third substrate, a plurality of strip-shaped heat-radiating guide grooves are respectively formed in the top end and the bottom end of the fourth substrate, a fifth substrate is fixedly arranged at the top end of the fourth substrate, and a flame-retardant layer and a core plate are fixedly arranged inside the fifth substrate, the core plate is fixedly installed at the top of the flame-retardant layer, the printing layer is fixedly installed at the top of the fifth substrate, the power supply layer is fixedly installed at the bottom of the printing layer, and the patch board is fixedly installed at the top of the power supply layer.

As a preferred technical scheme of the utility model, the length of first base plate is greater than the length of second base plate, the length of second base plate is greater than the length of third base plate, the length of third base plate is greater than the length of fourth base plate, the length of fourth base plate is greater than the length of fifth base plate, the length of fifth base plate is greater than the length of printing layer.

As a preferred technical scheme of the utility model, one side parallel and level of first base plate, second base plate, third base plate, fourth base plate, fifth base plate is fixed, and the spliced pole is installed to the equal fixed interlude of another avris.

As a preferred technical scheme of the utility model, the outer wall and the equal fixed mounting in surface of four avris of first base plate, second base plate, third base plate, fourth base plate, fifth base plate and printing layer have electromagnetic shielding film, four avris fixed mounting of electromagnetic shielding film have elastic cladding frame.

As an optimal technical scheme of the utility model, the junction of copper post and spliced pole and first base plate, second base plate, third base plate, fourth base plate and fifth base plate all is scribbled the negative light type light-blocking agent of making by the polyimide or the positive light type light-blocking agent of making by the polyimide.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to a multilayer circuit board, which can ensure the multilayer circuit board to be continuously used when a single substrate is damaged through a connecting column arranged at the side of each substrate, the high-speed transmission of signals is ensured by the arranged high-speed transmission signal layer, the circuit board is prevented from receiving electromagnetic interference by the arranged electromagnetic shielding film, the elastic reporting frame plays a role in protecting the circuit board when the circuit board is collided, and the leakage-proof interlayer prevents excessive adhesives among the multilayer circuit boards from influencing the functions of the circuit board, the insulating cavity and the copper column are arranged to play the roles of insulating and connecting external circuits, the light-blocking layer is arranged to prevent the multilayer circuit board from being influenced by the irradiation of light to prolong the service life, the strip-shaped heat dissipation guide groove plays a role in heat dissipation of the multilayer circuit board, and various surface mount components can be added through the surface mount layer to realize different functions of the circuit board.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: 1. a first substrate; 2. a second substrate; 3. a third substrate; 4. a fourth substrate; 5. a fifth substrate; 6. printing layer; 7. a ground plane; 8. a high-speed transmission signal layer; 9. a copper pillar; 10. an electromagnetic shielding film; 11. coating the frame; 12. an insulating cavity; 13. a leakage-resistant interlayer; 14. a light-blocking layer; 15. a strip-shaped heat dissipation guide groove; 16. a flame retardant layer; 17. a core board; 18. a power layer; 19. a patch board; 20. connecting columns.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, the present invention provides a multilayer circuit board, including a first substrate 1, a ground layer 7 and a high-speed transmission signal layer 8 fixedly disposed inside the first substrate 1, the ground layer 7 fixedly disposed at the bottom of the high-speed transmission signal layer 8, a second substrate 2 fixedly disposed at the top of the first substrate 1, an insulating cavity 12 having a hollow three-dimensional square shape fixedly disposed inside the second substrate 2, copper pillars 9 fixedly disposed on the outer walls of four sides of the insulating cavity 12 and connected to the top and bottom of the second substrate 2, a third substrate 3 fixedly disposed at the top of the second substrate 2, a leakage-blocking interlayer 13 and a light-blocking layer 14 fixedly disposed inside the third substrate 3, a fourth substrate 4 fixedly disposed at the top of the third substrate 3, a plurality of strip-shaped heat dissipation guide slots 15 disposed at the top and bottom of the fourth substrate 4, and a fifth substrate 5 fixedly disposed at the top of the fourth substrate 4, the flame-retardant layer 16 and the core board 17 are fixedly mounted inside the fifth substrate 5, the core board 17 is fixedly mounted at the top of the flame-retardant layer 16, the printing layer 6 is fixedly mounted at the top of the fifth substrate 5, the power supply layer 18 is fixedly mounted at the bottom of the printing layer 6, and the patch board 19 is fixedly mounted at the top of the power supply layer 18.

Preferably, the length of the first substrate 1 is greater than that of the second substrate 2, the length of the second substrate 2 is greater than that of the third substrate 3, the length of the third substrate 3 is greater than that of the fourth substrate 4, the length of the fourth substrate 4 is greater than that of the fifth substrate 5, the length of the fifth substrate 5 is greater than that of the printed layer 6, and the difference length is used for mounting the connection post 20.

Preferably, one side of the first substrate 1, the second substrate 2, the third substrate 3, the fourth substrate 4 and the fifth substrate 5 is flush, the other side is fixedly inserted with the connecting column 20, and the multilayer circuit board can be layered through the connecting column 20.

Preferably, the electromagnetic shielding films 10 are fixedly mounted on the outer walls and the surfaces of the four sides of the first substrate 1, the second substrate 2, the third substrate 3, the fourth substrate 4, the fifth substrate 5 and the printing layer 6, the elastic covering frames 11 are fixedly mounted on the four sides of the electromagnetic shielding films 10, the electromagnetic shielding films 10 play a role in preventing electromagnetic interference, and the provided covering frames 11 play a role in protecting the circuit board.

Preferably, the surfaces of the joints of the copper columns 9 and the connecting columns 20 and the substrate are fixedly coated with negative light type light-blocking agents made of polyimide or positive light type light-blocking agents made of polyimide, so that the connecting columns 20 are prevented from being influenced by light to generate resistance change.

When the multilayer circuit board is used, the multilayer circuit board is connected with other electronic devices through the connecting column 20, when a single base plate is damaged, the use of the circuit board can be ensured through the connecting column 20, various patch components are arranged on the surface of the patch board 19 to realize different functions of the printed circuit board, the arrangement of the flame-retardant layer 16 and the strip-shaped heat dissipation guide groove 15 ensures the heat dissipation function of the multilayer circuit board, the core board 17 improves the conductivity of the circuit board, the leakage-proof interlayer 13 prevents the situation that the adhesive between the base plate and the base plate carelessly affects the circuit board too much, when the multilayer circuit board is subjected to electromagnetic interference during use, the electromagnetic shielding film 10 can reduce the influence caused by the electromagnetic interference, when the multilayer circuit board falls carelessly in the transportation process and the like, the coating frame 11 is arranged to play a role in protecting the multilayer circuit board, in order to avoid the multilayer circuit board from generating larger resistance when in use, the insulation cavity 12 is arranged to play an insulation role, and the high-speed signal transmission layer 8 is arranged to ensure the speed and the capacity of the multilayer board for transmitting signals.

In the description of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A multilayer circuit board comprises a first substrate (1) and is characterized in that a ground layer (7) and a high-speed transmission signal layer (8) are fixedly arranged inside the first substrate (1), the ground layer (7) is fixedly arranged at the bottom of the high-speed transmission signal layer (8), a second substrate (2) is fixedly arranged at the top end of the first substrate (1), a hollow three-dimensional square insulating cavity (12) is fixedly arranged inside the second substrate (2), copper columns (9) connected with the top end and the bottom end of the second substrate (2) are fixedly arranged on the outer walls of four sides of the insulating cavity (12), a third substrate (3) is fixedly arranged at the top end of the second substrate (2), a leakage-resistant interlayer (13) and a light-resistant layer (14) are fixedly arranged inside the third substrate (3), and a fourth substrate (4) is fixedly arranged at the top end of the third substrate (3), a plurality of strip-shaped heat dissipation guide grooves (15) are formed in the top end and the bottom end of the fourth substrate (4), a fifth substrate (5) is fixedly mounted on the top end of the fourth substrate (4), a flame-retardant layer (16) and a core plate (17) are fixedly mounted inside the fifth substrate (5), the core plate (17) is fixedly mounted at the top of the flame-retardant layer (16), a printing layer (6) is fixedly mounted at the top of the fifth substrate (5), a power supply layer (18) is fixedly mounted at the bottom of the printing layer (6), and a patch plate (19) is fixedly mounted at the top of the power supply layer (18).

2. A multilayer circuit board according to claim 1, wherein: the length of the first substrate (1) is greater than that of the second substrate (2), the length of the second substrate (2) is greater than that of the third substrate (3), the length of the third substrate (3) is greater than that of the fourth substrate (4), the length of the fourth substrate (4) is greater than that of the fifth substrate (5), and the length of the fifth substrate (5) is greater than that of the printing layer (6).

3. A multilayer circuit board according to claim 1, wherein: the side flush of first base plate (1), second base plate (2), third base plate (3), fourth base plate (4), fifth base plate (5) is fixed, and spliced pole (20) are all fixed to alternate to install on another avris.

4. A multilayer circuit board according to claim 1, wherein: the outer wall and the equal fixed mounting in surface of four avris of first base plate (1), second base plate (2), third base plate (3), fourth base plate (4), fifth base plate (5) and printing layer (6) have electromagnetic shielding film (10), four avris fixed mounting of electromagnetic shielding film (10) have elastic cladding frame (11).

5. A multilayer circuit board according to claim 1, wherein: the junction of the copper column (9) and the connecting column (20) with the first substrate (1), the second substrate (2), the third substrate (3), the fourth substrate (4) and the fifth substrate (5) is coated with a negative light type light-blocking agent made of polyimide or a positive light type light-blocking agent made of polyimide.