CN218143296U

CN218143296U - Self-adhesive upper cover tape and carrier tape

Info

Publication number: CN218143296U
Application number: CN202222189467.8U
Authority: CN
Inventors: 吉山东
Original assignee: Suzhou Yuchi Optoelectronics Co ltd
Current assignee: Suzhou Yuchi Optoelectronics Co ltd
Priority date: 2022-08-19
Filing date: 2022-08-19
Publication date: 2022-12-27
Anticipated expiration: 2032-08-19

Abstract

The utility model discloses a self-adhesive upper cover tape, including two-layer plastic film and colloid layer, the colloid layer is located between two-layer plastic film for bond two-layer plastic film, the width of plastic film of lower floor is less than the width of the plastic film of upper strata, the both sides of colloid layer extend to the plastic film direction of lower floor respectively, form side colloid layer, side colloid layer is located the both sides of the plastic film of lower floor; the carrier tape comprises a carrier tape body, wherein a row of electronic element grooves for storing electronic elements are formed in the carrier tape body, and the self-adhesive upper cover tape is attached to the upper part of each row of electronic element grooves; a carrier tape including the self-adhesive upper cover tape is also disclosed. The utility model has the advantages of can reduce the whole thickness of self-adhesive upper cover area, reduce the colloid quantity, low in production cost, colloid are not excessive and compare traditional self-adhesive upper cover area, as long as very little pressfitting power can be in order to seal the carrier band during the use.

Description

Self-adhesive upper cover tape and carrier tape

Technical Field

The utility model relates to a self-adhesive upper cover tape and carrier band.

Background

General electronic components (such as resistance, electric capacity and transistor etc.) packing adopts the carrier band to bear, is equipped with a plurality of electronic component tanks on the carrier band, puts corresponding electronic components in the electronic component tank of carrier band, and self-adhesive upper cover laminating is on the carrier band, covers electronic component ware groove top, covers electronic component tank and forms closed putting the thing groove to protect electronic components not to pollute in the transit, and the carrier band is finally collected in a roll.

As shown in fig. 1, the current self-adhesive upper cover tape comprises two plastic films 1' and a glue layer 2', wherein the glue layer 2' is located between the two plastic films 1', the plastic film 1' of the lower layer has a narrower width than the plastic film 1' of the upper layer, the plastic film 1' of the lower layer covers the upper part of the electronic element slot 3', and the glue layer is pressed on the two sides of the plastic film 1' of the lower layer by pressing the plastic film 1' of the upper layer until the two sides of the glue layer penetrate to the two sides of the plastic film 1' of the lower layer and are bonded with the two sides of the electronic element slot 3', and at this time, the upper cover tape is bonded on the two sides of the electronic element slot 3 '. This approach has several problems:

firstly, colloids on two sides of the plastic film 1' on the lower layer are pressed to two sides of the plastic film 1' on the lower layer through a pressing machine, so that a colloid layer of the colloid layer needs to have a certain thickness (H2), the whole thickness of the existing self-adhesive upper cover tape is 62um, wherein the thickness H2 of the colloid layer 2' is 25um, the thickness H1 of the plastic film 1' on the upper layer is 25um, and the thickness H3 of the plastic film 1' on the lower layer is 12um;

secondly, the colloid layer 2' is thicker, so the production cost is high;

thirdly, colloid overflows in the pressing process, and the pressing equipment can remain colloid to influence next adhesion;

fourthly, the two ends of the colloid layer 2 'can be pressed to the two sides of the plastic film 1' of the lower layer only by a larger pressing force.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above drawbacks, an object of the present invention is to provide an auto-adhesive cover tape that can reduce the overall thickness of the auto-adhesive cover tape, reduce the amount of adhesive, reduce the production cost, prevent the adhesive from overflowing, and reduce the pressing force.

In order to achieve the above purpose, the utility model discloses a technical scheme is: the utility model provides a self-adhesive upper cover tape, includes two-layer plastic film and colloid layer, the colloid layer is located in the middle of the two-layer plastic film, is used for bonding two-layer plastic film, lower floor the width of plastic film is less than the width of the plastic film on upper strata, the both sides on colloid layer extend to the plastic film direction of lower floor respectively, form side colloid layer, the colloid layer forms the plastic film groove with the side colloid layer of both sides, lower floor the plastic film embedding the plastic film groove.

Preferably, the lower end surfaces of the side colloid layers on the two sides are flush with the lower end surface of the plastic film on the lower layer.

Preferably, the outer side surfaces of the side colloid layers on two sides are respectively flush with the end surfaces of two ends of the plastic film on the upper layer.

Preferably, the colloid layer and the side colloid layers on the two sides are formed by curing, and the plastic film groove is formed by curing.

Preferably, the two layers of plastic films are made of one of PET, PC, PP, CPP and PS. The plastic film is made of plastic film according to the requirement.

Preferably, the non-adhesive side of the two plastic films can be coated with an antistatic layer according to the requirement of a customer, so that the self-adhesive upper cover tape has an antistatic effect and is used for protecting electronic elements.

Preferably, the thickness of the colloid layer is 4-6um, and the thickness of the side colloid layer is 10-14um.

The utility model provides a carrier band, includes the carrier band body, set up one row of electronic component tank that is used for depositing the electronic component ware on the carrier band body, one row the top subsides of electronic component tank are equipped with self-adhesive upper cover tape, self-adhesive upper cover tape adopts above-mentioned arbitrary one self-adhesive upper cover tape, the plastic film of lower floor covers at one row of electronic component tank, both sides the side colloid layer bonds with the carrier band body up end of one row of electronic component ware groove both sides respectively.

The utility model discloses the beneficial effect of self-adhesive upper cover tape and carrier band is, this application has changed the structure of colloid layer, has the side colloid layer in the both sides integrated into one piece of colloid layer, and the bottom surface of side colloid layer bottom surface and the plastic film of lower floor is in a plane, make the plastic film embedding of lower floor by the colloid layer with the plastic film inslot that the side colloid layer of both sides formed, before pressfitting self-adhesive upper cover tape and carrier band, two-layer side colloid layer has already been shaped, therefore only need less pressfitting power with the plastic film pressfitting of upper plastic film and lower floor can; the glue at the two ends of the glue layer is forced to permeate into the plastic film at the lower layer without strong force pressing, so that the thickness of the glue layer can be reduced, the production cost is reduced, the glue overflowing phenomenon is not easy to occur, and no glue is left on the pressing equipment.

Drawings

Fig. 1 is a schematic view of a conventional self-adhesive upper cover tape;

FIG. 2 is a schematic view of the self-adhesive upper cover tape of the present embodiment;

FIG. 3 is a top view of a carrier tape body of the carrier tape of this embodiment;

FIG. 4 is a top view of the carrier tape body with a self-adhesive cover tape attached thereon in the carrier tape of this embodiment;

FIG. 5 is a side view of the carrier tape of the present embodiment with a self-adhesive cover tape attached to the carrier tape body along the length direction;

fig. 6 is a cross-sectional view of the carrier tape body of the carrier tape of this embodiment with a self-adhesive cover tape attached thereto in the width direction.

In the figure:

1' -a plastic film; 2' -a colloidal layer; 3' -the electrical cell slot;

1-a plastic film; 2-a colloidal layer; 3-a colloidal layer; 4-self-adhesive upper cover tape; 5-a carrier tape body; 5 a-electrical component slot.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.

Referring to fig. 2, the present embodiment discloses a self-adhesive upper cover tape 4, which comprises two plastic films 1 and a colloid layer 2, wherein the colloid layer 2 is located between the two plastic films 1, the colloid layer 2 is used for bonding the two plastic films 1, and the width of the plastic film 1 at the lower layer is smaller than that of the plastic film 1 at the upper layer.

Unlike the prior art, in the present embodiment, both sides of the glue layer 2 extend in the direction of the lower plastic film 1 to form the side glue layer 3, the glue layer 2 and the side glue layers 3 on both sides form the plastic film grooves, and the lower plastic film 1 is embedded in the plastic film grooves and bonded by the glue layer 2.

In specific implementation, the colloid layer 2 and the side colloid layers 3 on both sides are solidified into a plastic film groove.

In another embodiment, the lower end surfaces of the side colloid layers 3 on the two sides are flush with the lower end surface of the plastic film 1 on the lower layer, after the side colloid layers 3 on the two sides are solidified, redundant colloid can be cut off in a cutting mode, the lower end surfaces of the side colloid layers 3 are guaranteed to be flush with the lower end surface of the plastic film 1 on the lower layer, and the plastic film 1 on the lower layer can be guaranteed to be attached to the upper surface of the carrier tape.

In another embodiment, the outer side surfaces of the side colloid layers 3 on both sides are respectively flush with the end surfaces of both ends of the upper plastic film 1, and similarly, after the side colloid layers 3 on both sides are cured, the excess colloid can be cut off by adopting a cutting mode.

The two plastic films 1 in this embodiment are made of the same material, and are both plastic films such as PET.

In other embodiments, the material of the plastic film 1 may be one of plastic films such as PC, PP, CPP, PS, etc., the material of the upper plastic film 1 and the material of the lower plastic film 1 may be the same or different, and the material may be selected according to the customer's requirement or the electronic component in the carrier tape.

In another embodiment, the non-adhesive surfaces of the two plastic films may be coated with antistatic layers, specifically, the antistatic layers are coated on the upper surface of the upper plastic film 1 and the lower surface of the lower plastic film, so as to reduce the possibility of static electricity generated by the self-adhesive upper cover tape.

After adopting above-mentioned structure, can be at 4-6um with the thickness control of colloid layer 2, the thickness control of side colloid layer 3 is at 10-14um, more specifically, the thickness h2 of colloid layer 2 in this embodiment is 5um, and the thickness h3 of side colloid layer 3 is 12um. As in the prior art, the thickness h1 of the upper plastic film 1 is 25um, so that the thickness of the self-adhesive upper cover tape 4 in the embodiment is 42um, the overall thickness is reduced, and the self-adhesive upper cover tape has better extensibility and elasticity.

As shown in fig. 3-6, a carrier tape, the same as the prior art, includes a carrier tape body 5, a row of electronic component slots 5a for storing electronic components are formed on the carrier tape body 5, a self-adhesive upper cover tape 4 is attached above the row of electronic component slots 5a, different from the prior art, the self-adhesive upper cover tape 4 adopts the above-mentioned self-adhesive upper cover tape 4, the plastic film 1 of the lower layer covers the row of electronic component slots 5a, and the side colloid layers 3 on both sides are respectively bonded with the upper end faces of the carrier tape body 5 on both sides of the row of electronic component slots 5 a. The upper surface of the carrier tape is rolled up after being attached to the self-adhesive upper cover tape 4.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims

1. The utility model provides a self-adhesive upper cover tape (4), includes two-layer plastic film (1) and colloid layer (2), colloid layer (2) are located in the middle of two-layer plastic film (1), are used for bonding two-layer plastic film (1), lower floor the width of plastic film (1) is less than the width of the plastic film (1) on upper strata, its characterized in that:

the two sides of the colloid layer (2) extend towards the plastic film (1) on the lower layer respectively to form side colloid layers (3), the colloid layer (2) and the side colloid layers (3) on the two sides form a plastic film groove, and the plastic film (1) on the lower layer is embedded into the plastic film groove.

2. Self-adhesive upper cover tape (4) according to claim 1, characterized in that: the lower end surfaces of the side colloid layers (3) on the two sides are flush with the lower end surface of the plastic film (1) on the lower layer.

3. Self-adhesive upper cover tape (4) according to claim 1, characterized in that: the outer side surfaces of the side colloid layers (3) on the two sides are respectively flush with the end surfaces of the two ends of the plastic film (1) on the upper layer.

4. Self-adhesive upper cover tape (4) according to claim 1, characterized in that: the colloid layer (2) and the side colloid layers (3) on the two sides are solidified to form the glue.

5. Self-adhesive upper cover tape (4) according to claim 1, characterized in that: the two layers of plastic films (1) are made of one of PET, PC, PP, CPP and PS.

6. Self-adhesive upper cover tape (4) according to any one of claims 1 to 5, characterized in that: and the non-adhesive surfaces of the two layers of plastic films (1) are coated with antistatic layers.

7. Self-adhesive upper cover tape (4) according to claim 1, characterized in that: the thickness of colloid layer (2) is 4-6um, the thickness of side colloid layer (3) is 10-14um.

8. The utility model provides a carrier band, includes carrier band body (5), offer one row of electronic component groove (5 a) that are used for depositing electronic component ware on carrier band body (5), one row the top subsides of electronic component groove (5 a) are equipped with self-adhesive upper cover tape (4), its characterized in that: the self-adhesive upper cover tape (4) adopts the self-adhesive upper cover tape (4) of any one of claims 1 to 7, the plastic film (1) of the lower layer covers a row of electronic element grooves (5 a), and the side colloid layers (3) on two sides are respectively bonded with the upper end faces of the carrier tape bodies (5) on two sides of the row of electronic element grooves (5 a).