CN105492337A - Cover film and electronic component package - Google Patents

Cover film and electronic component package Download PDF

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Publication number
CN105492337A
CN105492337A CN201480048402.7A CN201480048402A CN105492337A CN 105492337 A CN105492337 A CN 105492337A CN 201480048402 A CN201480048402 A CN 201480048402A CN 105492337 A CN105492337 A CN 105492337A
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CN
China
Prior art keywords
coverlay
styrene
electronic component
peel ply
copolymer
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Granted
Application number
CN201480048402.7A
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Chinese (zh)
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CN105492337B (en
Inventor
丰田渡
德永久次
岩崎贵之
佐佐木彰
杉本和也
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Denka Co Ltd
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Denki Kagaku Kogyo KK
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Publication of CN105492337A publication Critical patent/CN105492337A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs

Abstract

Disclosed are: a cover film in which a base material layer, an intermediate layer, a peeling layer, and a heat seal layer are disposed in the stated order, wherein the peeling layer contains a resin composition essentially comprising 50-80 mass% of one or more copolymers selected from styrene-diene block copolymers and styrene-diene graft copolymers, and 50-20 mass% of an ethylene-Alfa-olefin copolymer, the Vicat softening temperature is 55-80 DEG C, and the heat seal layer contains a styrene-(meth)acrylate copolymer having a styrene content of 50-80 mass%; and an electronic component package using the cover film as a carrier tape lid.

Description

Coverlay and electronic component packaging body
Technical field
The present invention relates to the coverlay and electronic component packaging body that use in the packaging body of electronic component.
Background technology
Along with the miniaturization of e-machine, part also to minitype high-performanceization development, and is automatically installed on a printed circuit by the electronic component used in the number of assembling steps of e-machine.Installation electronic component in surface is incorporated in the carrier band (carriertape) of the continuous embossed shaping of pocket of the shape by coordinating electronic component.After being received by electronic component, using being overlapped in the upper surface of carrier band as the coverlay of cladded material, be made into packaging body to be carried out continuously in the longitudinal direction sealing in the two ends of coverlay through the sealing band of heating.As coverlay material, be used in biaxial stretch-formed polyester film as base material, the material etc. being laminated with the hot sealing layer of thermoplastic base resin.As carrier band, main polystyrene or the polycarbonate product using thermoplastic base resin.
In recent years, the multi-form electronic components such as cond and resistor, IC, LED, adaptor union and control group are to obvious miniaturization, lightweight, slimming development, and when peeling off coverlay to take out the electronic component received from above-mentioned packaging body, required performance becomes more strict than ever.If the difference of the maxima and minima of peel strength when peeling off coverlay, that is " range wide " is large, then have carrier band high vibration and electronic component flies out, and causes installing bad situation.Further, along with the significantly lifting of surface mounting technique in recent years, more High Performance and miniaturization such as above electronic component packaging body and the electronic component to be transported etc.Electronic component so can transport because of electronic component packaging body time vibration, and have to rub by the inner surface of carrier band embossing inside face or coverlay and electronic component and produce electrostatic and damaged situation.In addition, also there is electrostatic owing to being produced when carrier band is peeled off by coverlay etc. and the situation of same case occurs.Therefore, the electrostatic countrmeasure for carrier band and coverlay is regarded as most important problem.
Electronic component is sometimes to be accommodated in the presence or absence of the status checking part of packaging body, the storage direction of part, the defect of wire or bending.In recent years, along with the miniaturization of electronic component, in order to check the part be accommodated in packaging body, require that coverlay has the high transparency.And, along with the miniaturization of part, part is attached to coverlay phenomenon because of faint electrostatic is just gradually remarkable, therefore in current coverlay on the market, as electrostatic countrmeasure, suppress the attachment (with reference to patent documentation 1) of part by adding the electrically conductive microparticle such as oxide of tin or zinc oxide in hot sealing layer.But in this method, coverlay surface is charged when peeling off coverlay, be difficult to the inhibition obtaining enough stripping charges.On the other hand, propose one and electrostatic diffusion zone is set between interlayer and hot sealing layer, suppress the method (with reference to patent documentation 2) of the electrostatic produced when carrier band is peeled off by coverlay.In addition, propose a kind of hot sealing layer to be made into double-layer structure, by the method (with reference to patent documentation 3) making it destroy cohesion when stripping one side's hot sealing layer to suppress stripping charge.But due to the miniaturization etc. of electronic component, the requirement about the scope reducing above-mentioned peel strength reaches higher level, the method for patent documentation 2 and 3 still can not meet required performance.
Patent documentation 1: Japanese Patent Laid-Open 8-258888 publication
Patent documentation 2: Japanese Patent Laid-Open 7-223674 publication
Patent documentation 3: Japanese Patent Laid-Open 2012-214252 publication
Summary of the invention
The present invention in view of the above problems with actual conditions, object be to provide a kind of inhibit the friction because of collecting article and coverlay and charged and take out electronic component time the coverlay of stripping charge.Further object is to provide a kind of by suppressing the inequality of peel strength to reduce the coverlay of the accident in installation steps.
The present inventor etc. carry out in-depth study for above-mentioned problem, found that: use specific thermoplastic base resin by hot sealing layer, and the thermoplastic base resin of specific composition is used at peel ply, and vicat softening temperature (Vicatsofteningtemperature) is located at specialized range, the coverlay overcoming problem of the present invention can be obtained, thus complete the present invention.
Namely, one embodiment of the invention provide a kind of coverlay, it is the coverlay being sequentially configured with substrate layer (A), interlayer (B), peel ply (C), hot sealing layer (D), wherein, peel ply (C) while containing the resin combination formed by the ethene-alpha-olefin copolymer being selected from more than a kind copolymer in Styrene-diene block copolymer and styrenic-diene graft copolymer and 50 ~ 20 quality % of 50 ~ 80 quality % in fact, has the vicat softening temperature of 55 ~ 80 DEG C; Hot sealing layer (D) is styrene-(methyl) acrylate copolymer of 50 ~ 80 quality % containing styrene containing ratio.
In above-mentioned embodiment, at least 1 layer in peel ply (C) or hot sealing layer (D) can contain electrically conductive microparticle.This electrically conductive microparticle is preferably threadiness or spherical.In addition, in one embodiment, the thickness of substrate layer (A) is 12 ~ 20 μm, the thickness of interlayer (B) is 10 ~ 40 μm, the thickness of peel ply (C) is 5 ~ 20 μm, and the gross thickness of coverlay is 45 ~ 65 μm.In addition, in one embodiment, the haze value of coverlay is less than 30%.
And then in other embodiments, provide a kind of electronic component packaging body, the cladded material of coverlay of the present invention as the carrier band formed with thermoplastic base resin uses by it.At this, the above-mentioned thermoplastic base resin of preferred carrier band is polycarbonate.Further, in one embodiment, electronic component packaging body is below 70V at the absolute value of the stripping charge voltage that will cover when film from support strip is peeled off.In other embodiments, the absolute value of frictional electrification voltage that electronic component packaging body produces between coverlay and carrier band is below 70V.
In the present invention, by the coverlay using the hot sealing layer with specific composition and the peel ply possessing specific composition, compositing range and vicat softening temperature, even if under the environment of low humidity, because of the friction of collecting article and coverlay and the electrostatic produced or be also suppressed significantly to take out the stripping charge produced when electronic component peels off coverlay.Therefore, as the cladded material of coverlay of the present invention as carrier band used, charged the caused accident in installation steps will obviously be improved.
Accompanying drawing explanation
Fig. 1 is the general profile chart of the coverlay of one embodiment of the invention.
Detailed description of the invention
Below, to coverlay of the present invention, carrier band and electronic component packaging body, its preferred embodiment is sequentially described.
< coverlay >
The coverlay of embodiment of the present invention is the coverlays being sequentially configured with substrate layer (A), interlayer (B), peel ply (C), hot sealing layer (D).One of formation of the coverlay of the present embodiment is illustrated in Fig. 1.
[substrate layer (A)]
Substrate layer (A) comprises biaxially stretched polyester or biaxial stretch-formed nylon and the layer formed, especially be applicable to using biaxial stretch-formed polyethylene terephthalate (PET), biaxial stretch-formed Polyethylene Naphthalate (PEN), biaxial stretch-formed 6,6-nylon and biaxial stretch-formed 6-nylon.In biaxial stretch-formed PET, biaxial stretch-formed PEN, biaxial stretch-formed 6,6-nylon and biaxial stretch-formed 6-nylon, the antistatic additive in order to electrostatic prevention process can be added.And, at a side surface of the stacked interlayer (B) of substrate layer (A), in order to promote the connectivity with interlayer (B), can two liquid response types or the thermohardening type anchor coating agent (anchorcoating-agent) such as acrylic resins of painting, polyurethane, epoxy resin, or implement Corona discharge Treatment or easy joining process etc.
The thickness of substrate layer (A) is preferably 12 ~ 20 μm.Be set to more than 12 μm by by substrate layer (A), the pulling strengrth of coverlay itself can uprise, and therefore when peeling off coverlay, " breaking of film " not easily occurs.On the other hand, be set to less than 20 μm by by substrate layer (A), the heat sealability to carrier band can be promoted.
[interlayer (B)]
Interlayer (B) is laminated in a side surface of substrate layer (A) as mentioned above across cement layers etc. as required, and is configured between substrate layer (A) and peel ply (C).As the resin forming interlayer (B), the polyolefin such as polyethylene or polypropylene can be enumerated, wherein, preferably there is flexibility with the rigidity of appropriateness and the straight-chain Low Density Polyethylene (representing with LLDPE below) of peel strength excellence at normal temperatures.Especially density is 0.880 ~ 0.925 (× 10 3kg/m 3) LLDPE, not easily occur due to heat during heat-sealing and the stripping of intermediate layer resin from coverlay end that cause of pressure, the pollution of flatiron when therefore sealing not easily produces.In addition, due to the excellent that density relaxes the stress partly produced by heat-sealing flatiron at the LLDPE of this scope, therefore when peeling off coverlay, stable peel strength is easily obtained.
In LLDPE, have with Ziegler-type catalyst polymerization person, with the Metallocene-type catalysts person of polymerization (hereinafter referred to as m-LLDPE).Because the molecular weight distribution of m-LLDPE is limited in narrow scope, so have extra high peel strength, as interlayer of the present invention (B), preferably use this m-LLDPE.
Above-mentioned m-LLDPE is the alpha-olefin that the straight-chain of the alkene of carbon number more than 3, preferably carbon number 3 ~ 18, branched, aromatic proton is substituted and the ethene copolymer as comonomer.As the monoolefine of straight-chain, can enumerate such as: propylene, 1-butylene, 1-amylene, 1-hexene, 1-octene, 1-nonene, 1-decene, 1-dodecylene, 1-tetradecylene, 1-hexadecylene, 1-octadecylene etc.In addition, as the monoolefine of branched, can enumerate such as: 3-methyl-1-butene, 3-Methyl-1-pentene, 4-methyl-1-pentene, 2-ethyl-1-hexene etc.In addition, as the monoolefine that aromatic proton is substituted, styrene etc. can be enumerated.These copolymers can alone or in combination of two kinds or more and and ethylene copolymer.In this copolymerization, also can make the polyenoid class copolymerization such as butadidenne, isoprene, 1,3-hexadiene, bicyclopentadiene, 5-ethylidene-2-ENB.
The thickness of interlayer (B) is preferably 10 ~ 40 μm.More than 10 μm are set to by by the thickness of interlayer (B), bond strength between substrate layer (A) and interlayer (B) can become good, and when coverlay is heat-sealed in carrier band, the effect easily obtaining the contact patch relaxing heat-sealing flatiron can be become.On the other hand, by being set to less than 40 μm, the gross thickness due to coverlay reaches suitable scope, when therefore coverlay being heat-sealed in carrier band, can obtain sufficient peel strength.In addition, interlayer (B) also 2 layers of example described as follows can be made into multilayer like that.
[peel ply (C)]
Coverlay of the present invention possesses peel ply (C) between interlayer (B) and hot sealing layer (D).
Peel ply (C) is formed by resin combination, and described resin combination is formed by the ethene-alpha-olefin copolymer being selected from more than a kind copolymer in Styrene-diene block copolymer and styrenic-diene graft copolymer and 50 ~ 20 quality % of 50 ~ 80 quality % in fact.Herein, " in fact by ... formed " as long as statement refer to the amount not hindering the effect reached desired by the present invention, above-mentioned resin combination does not get rid of the resinous principle comprised beyond Styrene-diene block copolymer or styrenic-diene graft copolymer and ethene-alpha-olefin copolymer.Be set to more than 50 quality % by by more than the a kind copolymer be selected from Styrene-diene block copolymer and styrenic-diene graft copolymer, can promote with the connectivity of hot sealing layer, the stable peel strength between peel ply and hot sealing layer can be obtained.In addition, by being set to below 80 quality %, the engaging force of the interlayer of peel ply and hot sealing layer can be adjusted at proper range, and the peel strength change of passing in time after can suppressing to seal and producing.At this, in order to stablize the peel strength between peel ply (C) and hot sealing layer (D) further, preferably more than the a kind copolymer be selected from Styrene-diene block copolymer and styrenic-diene graft copolymer being set to 60 ~ 75 quality %, ethene-alpha-olefin copolymer is set to 40 ~ 25 quality %.
As Styrene-diene block copolymer, the diblock copolymer of styrene and butadidenne, the triblock copolymer of s-B-S, styrene and the periodic copolymer of isoprene, the triblock copolymer of styrene-isoprene-phenylethene and their hydrogenated resin etc. can be enumerated.Wherein, from the viewpoint of heat sealability, be preferably the diblock copolymer of styrene and butadidenne.
As styrenic-diene graft copolymer, polystyrene graft can be enumerated and be polymerized and be polymerized MBS resin etc. in poly-butadiene in the impact resistant polystyrene (HI-PS) of poly-butadiene, styrene and graft polymerizing acrylonitrile with methyl methacrylate-grafted in the ABS resin of poly-butadiene and styrene.Wherein, from the viewpoint of heat sealability, be preferably impact resistant polystyrene.
As the alpha-olefin in ethene-alpha-olefin copolymer, propylene can be enumerated, 1-butylene, 2-methyl-1-propylene, 2-methyl-1-butene alkene, 3-methyl-1-butene, 1-hexene, 2-ethyl-1-butylene, 2, 3-dimethyl-1-butylene, 1-amylene, 2-Methyl-1-pentene, 3-Methyl-1-pentene, 4-methyl-1-pentene, 3, 3-dimethyl-1-butylene, 1-heptene, methyl isophthalic acid-hexene, dimethyl-1-amylene, ethyl-1-amylene, trimethyl-1-butylene, Methylethyl-1-butylene, 1-octene, Methyl-1-pentene, ethyl-1-hexene, dimethyl-1-hexene, propyl group-1-heptene, Methylethyl-1-heptene, trimethyl-1-amylene, propyl group-1-amylene, diethyl-1-butylene, 1-nonene, 1-decene, 1-hendecene, 1-dodecylene etc.Ethene-alpha-olefin copolymer can use any one in random copolymers and periodic copolymer, wherein, from the viewpoint of the intermiscibility with Styrene-diene block copolymer and styrenic-diene graft copolymer, is preferably random copolymers.And ethene-alpha-olefin copolymer also may be combined with two or more and uses.
And then peel ply (C) is 55 ~ 80 DEG C according to the vicat softening temperature of the A120 method of JISK-7206, be preferably 60 ~ 75 DEG C.By making vicat softening temperature more than 55 DEG C, the overbating of peel ply (C) when sealing coverlay and exposing of peel ply (C) can be suppressed, therefore the pollution of sealing head (sealhead) and the inequality of peel strength can be lowered.And by making vicat softening temperature below 80 DEG C, peel ply (C) can soften fully, and can obtain good peel strength.
The adjustment of vicat softening temperature can be undertaken by each copolymer of resin combination of change formation peel ply (C), the kind of monomer whose or mix proportions etc.
Further, preferably electrically conductive microparticle is contained in peel ply (C).Electrically conductive microparticle is preferably threadiness or spherical.As fibrous electrically conductive microparticle, the fibrous carbons such as CNT, carbon nano-fiber and carbon fiber can be enumerated.As spherical electrically conductive microparticle, the carbon black such as acetylene black, Ketjen black can be enumerated; The metal powders such as aluminium powder, bronze, silver powder, copper powder, nickel powder, platinum powder, palladium powder; The metal oxide powders etc. such as aluminium oxide, zinc oxide, oxide of tin.Wherein, from the viewpoint of the easiness formed dispersiveness and the seepage flow of resin, be preferably acetylene black and oxide of tin, be more preferably the oxide of tin doped with antimony.The content of electrically conductive microparticle, as long as the surface resistivity of peel ply reaches 10 ~ 10 12Ω/, preferably reach 10 6~ 10 12Ω/, does not just limit.
The thickness of peel ply (C) is preferably 5 ~ 20 μm.Being set to more than 5 μm by by the thickness of peel ply (C), sufficient peel strength can being obtained when coverlay being heat-sealed in carrier band.On the other hand, being set to less than 20 μm by by the thickness of peel ply (C), easily obtaining sufficient peel strength except becoming in hyper-speed heat-sealing, and the inequality of peel strength can be suppressed when peeling off coverlay.In addition, as described later, peel ply (C) usually can by forming the resin combination extruder heat fusing of peel ply, and the method extruded by inflating die, T-shaped mould etc. and being formed.
[hot sealing layer (D)]
Coverlay of the present invention possesses hot sealing layer (D) on the surface of peel ply (C).Hot sealing layer (D) is thermoplastic base resin system, particularly uses the copolymer of styrene and (methyl) acrylate.As (methyl) acrylate, the acrylate such as methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate can be enumerated; The methacrylates etc. such as methyl methacrylate, EMA, propyl methacrylate, butyl methacrylate and cyclohexyl methacrylate.Also methacrylate copolymers of more than two kinds can be obtained.Further, copolymerization form can use any person in the random copolymerization of styrene and (methyl) acrylate, graft copolymerization and block copolymerization etc.
The styrene containing ratio of hot sealing layer (D) in above-mentioned copolymer is 50 ~ 80 quality %, is preferably 70 ~ 80 quality %.Be set to more than 50 quality % by by styrene containing ratio, can force down the stripping charge voltage of coverlay when carrier band is peeled off, such as, the absolute value of stripping charge voltage can be made at below 70V.Further, be set to below 80 quality % by by styrene containing ratio, can force down the frictional electrification voltage with electronic component, such as, the absolute value of frictional electrification voltage can be made at below 70V, therefore the attachment of part can tail off.
Hot sealing layer (D) preferably contains aforesaid electrically conductive microparticle in peel ply (C).As making hot sealing layer (D) method containing electrically conductive microparticle, can adopt: after the resin that will form hot sealing layer (D) in advance mixes in Henschel mixer with electrically conductive microparticle, the melting mixing when extruding, and the method stacked with peel ply (C); Or after being mixed in water or organic solvent medium by the resin of the formation hot sealing layer (D) of electrically conductive microparticle with emulsification, be coated on the method on peel ply (C) surface with roll coater or sprinkling etc.
As the content of the electrically conductive microparticle in hot sealing layer (D), as long as the surface resistivity of hot sealing layer (D) is 10 ~ 10 12Ω/, preferably 10 6~ 10 12Ω/, does not just limit, and relative to the thermoplastic base resin of the formation hot sealing layer (D) of 100 mass parts, is preferably 100 ~ 700 mass parts, is more preferably 200 ~ 600 mass parts.Be set to more than 100 mass parts by by the addition of electrically conductive microparticle, good electric conductivity can be presented.Further, by being set to below 700 mass parts, the cohesion of the electrically conductive microparticle in hot sealing layer (D) can be reduced in.
The thickness of hot sealing layer (D) is preferably 0.1 ~ 5 μm, is more preferably 0.1 ~ 3 μm, most preferably is 0.1 ~ 0.5 μm.Be set to more than 0.1 μm by by the thickness of hot sealing layer (D), the good peel strength of hot sealing layer (D) can be obtained.Further, be set to less than 5 μm by by the thickness of hot sealing layer (D), not only can suppress the rising of cost, and, the inequality of peel strength when peeling off coverlay can be reduced.
The making > of < coverlay
There is no particular restriction to make the method for above-mentioned coverlay, can use usual way.Such as, by form interlayer (B) with m-LLDPE be major component resin combination with form peel ply (C) resin combination extrude from other single axle extruding machine individual, and it is stacked to utilize multi-manifold to carry out, use the duplicature being formed and be made up of interlayer (B) and peel ply (C).And then, by dry type layered manner, carry out stacked by the surface of substrate layer (A) to the biaxially oriented polyester film of the anchor coating agents such as coating polyurethane, polyester, polyolefin and duplicature, make the trilamellar membrane be made up of substrate layer, interlayer and peel ply.And then, on the surface of peel ply (C), utilize the resin combination of such as gravure coater, reverse coating machine, kiss coater, Kohler coater, Meyer rod coating formation hot sealing layer such as coating machine, dip coater (D), the coverlay as object can be obtained by this.
As other method, with methods such as T-shaped die casting or plavinis, peel ply (C) is filmed in advance, by the film of the biaxially oriented polyester film that obtains at anchor coating agent such as the coating of the surface of substrate layer (A) polyurethane, polyester, polyolefin, polyethyleneimine etc. and peel ply (C), by taking m-LLDPE as sandwich stacked (sandwichlaminate) method that the resin combination of major component is extruded from T mould as interlayer (B), be made into the trilamellar membrane be made up of substrate layer (A), interlayer (B), peel ply (C).And then, on the surface of peel ply (C), utilize the resin combination of such as gravure coater, reverse coating machine, kiss coater, Kohler coater, Meyer rod coating formation hot sealing layer such as coating machine, dip coater (D), the coverlay as object can be obtained by this.
And then, as other method, by form interlayer (B) with m-LLDPE be major component resin combination with form peel ply (C) resin combination extrude from other single axle extruding machine individual, utilize multi-manifold to carry out stacked, make the duplicature be made up of the part in interlayer (B) and peel ply (C).And then, between the biaxially oriented polyester film that the surface of substrate layer (A) is coated with the anchor coating agents such as polyurethane, polyester, polyolefin, polyethyleneimine and duplicature, taking m-LLDPE as the sandwich layered manner of the resin combination of major component by extruding from T mould as the part in interlayer (B), making the trilamellar membrane be made up of substrate layer (A), interlayer (B) and peel ply (C).And then, on the surface of peel ply (C), utilize the resin combination of such as gravure coater, reverse coating machine, kiss coater, Kohler coater, Meyer rod coating formation hot sealing layer such as coating machine, dip coater (D), the coverlay as object can be obtained by this.In the method, interlayer (B) be formed by the coextrusion with peel ply (C) layer, with and that the formed double-layer structural of layer stacked by sandwich.The thickness of the layer that above sandwich is stacked formed is generally the scope of 10 ~ 20 μm.So carry out and obtain the film that gross thickness is 45 ~ 65 μm.When gross thickness is thinner than this thickness, resistance to breaking property reduces, and time thicker than this thickness, the inequality of peel strength has the tendency that change is large.
< carrier band >
The cladded material that coverlay can be used as accommodating container, the i.e. carrier band of electronic component uses.Carrier band be have in order to housing electronic part pocket, the ribbon of width about 8mm ~ 100mm.When being sealed as cladded material by coverlay, usually, the material forming carrier band is not particularly limited, and can use commercially available product, such as, can use polystyrene, polyester, polycarbonate, polyvinylchloride etc.But, when using the present embodiment of acrylic resin in the hot sealing layer (D) of coverlay, be applicable to the carrier band of combination polystyrene or polycarbonate.In carrier band, by by carbon black or CNT is mixing gives electric conductivity in resin, also can be coated with mixing antistatic additive, conductive filler on surface or the antistatic additive of surfactant type or the conducting objects such as polypyrrole, polythiophene are scattered in the coating fluid obtained in the organic binder bonds such as acrylic acid, giving antistatic behaviour.
< electronic component packaging body >
The packaging body of housing electronic part is by such as after housing electronic part etc., using coverlay as cladded material, the both ends of the length direction of coverlay being sealed continuously, being packed, and be rolled into shaft-like and obtain in the electronic component incorporating section of carrier band.Electronic components etc. are taken care of to be packaged into this form, are transported.The packaging body of housing electronic part etc. is while use is located at transporting for the hole being called as sprocket hole (Sprocketholes) of transporting carrier band of the end of the length direction of carrier band, intermittently draw except peeling off coverlay on one side, and by apparatus for mounting part while confirm electronic component etc. existence, towards, position, while take out, such as, circuit card is installed.
Herein, drawing except when peeling off coverlay, as peel strength is low, then having and peeling off from carrier band, and receive the situation that part comes off, as excessive in peel strength, then have and becomes difficult with the stripping of carrier band, the situation simultaneously ruptured when stripping coverlay.Therefore, there is when preferably sealing at 120 ~ 220 DEG C the peel strength person of 0.05 ~ 1.0N.And, about " range wide " of difference of maxima and minima representing the peel strength when peeling off coverlay, when range wide is large, owing to having carrier band high vibration and electronic component jumps out and causes installing bad situation, therefore, range wide is preferably less than 0.4N.
Embodiment
Below, explain the present invention according to embodiment, but the present invention is not limited thereto.In embodiment and comparative example, substrate layer (A), interlayer (B), peel ply (C) and hot sealing layer (D) use following resin raw material.
Substrate layer (A):
Biaxial stretch-formed polyethylene terephthalate film (Futamura Kagaku Kabushiki Kais (Off タ system ラ chemistry society) system; " FB2001 "); Thickness 13 μm
Interlayer (B):
(b-1) (Japan Polyethylene Corp. (Japanese Port リ エ チ レ Application society) makes m-LLDPE; Harmolex (registered trade mark (RTM)), " NH745N ")
(b-2) (Yu Buwanshan polyethylene Co., Ltd. (space portion ball is apt to Port リ エ チ レ Application society) makes m-LLDPE; UMERIT (registered trade mark (RTM)), " 2040F ")
Peel ply (C):
(c-a-1) (Deuki Kagaku Kogyo Co., Ltd (Electricity mood chemical frbre industry She System) makes styrene-butadiene block copolymer; CLEAREN " 170ZR "), vicat softening temperature: 76 DEG C, styrene ratio 83 quality %
(c-a-2) (JSRCORPORATION (JSR society) makes styrene-butadiene block copolymer; " TR-2000 "), vicat softening temperature: 45 DEG C, styrene ratio 40 quality %
(c-b-1) ethene-alpha-olefin random copolymers (Japan Polyethylene Corp.'s system; Kernel (registered trade mark (RTM)) " KF270T "), vicat softening temperature: 88 DEG C
(c-b-2) ethene-alpha-olefin random copolymers (Japan Polyethylene Corp.'s system; Kernel (registered trade mark (RTM)) " KF360T "), vicat softening temperature: 72 DEG C
(c-b-3) (Mitsui Chemicals, Inc (Mitsui Chemicals society) makes ethene-alpha-olefin random copolymers; TAFMER (registered trade mark (RTM)) " A "), vicat softening temperature: 55 DEG C
(c-b-4) ethene-alpha-olefin random copolymers (Japan Polyethylene Corp.'s system; Kernel (registered trade mark (RTM)) " KS240T "), vicat softening temperature: 44 DEG C
(c-b-5) ethene-alpha-olefin random copolymers (Japan Polyethylene Corp.'s system; Kernel (registered trade mark (RTM)) " KF283 "), vicat softening temperature: 102 DEG C
(c-c-1) impact resistant polystyrene (styrene Co., Ltd. of Japan (East ocean ス チ レ Application society) system; Toyostyrol " E640N "), vicat softening temperature: 99 DEG C
Hot sealing layer (D):
(d-1) (chemical frbre industry Co., Ltd. of Xin Zhong village (chemical frbre industry society of Xin Zhong village) makes acrylic resin; NK poly-mer " EC-24 "), the emulsion of solid component concentration 35%.
(d-2) Styrene-acrylic copolymer (chemical frbre industry Co., Ltd. of Xin Zhong village system; NK poly-mer " ECS-704 "), the emulsion of styrene containing ratio 40 quality %, solid component concentration 35%.
(d-3) Styrene-acrylic copolymer (chemical frbre industry Co., Ltd. of Xin Zhong village system; NK poly-mer " ECS-705 "), the emulsion of styrene containing ratio 50 quality %, solid component concentration 35%.
(d-4) Styrene-acrylic copolymer (chemical frbre industry Co., Ltd. of Xin Zhong village system; NK poly-mer " ECS-706 "), the emulsion of styrene containing ratio 60 quality %, solid component concentration 35%.
(d-5) Styrene-acrylic copolymer (chemical frbre industry Co., Ltd. of Xin Zhong village system; NK poly-mer " ECS-707 "), the emulsion of styrene containing ratio 70 quality %, solid component concentration 35%.
(d-6) Styrene-acrylic copolymer (chemical frbre industry Co., Ltd. of Xin Zhong village system; NK poly-mer " ECS-708 "), the emulsion of styrene containing ratio 80 quality %, solid component concentration 35%.
(d-7) Styrene-acrylic copolymer (chemical frbre industry Co., Ltd. of Xin Zhong village system; NK poly-mer " ECS-709 "), the emulsion of styrene containing ratio 90 quality %, solid component concentration 35%.
(d-8) oxide of tin (electrically conductive microparticle) of spherical doped antimony, (Ishihara Sangyo Kaisha, Ltd.'s (stone originates in industry society) system, " SN-100D "), number average bead diameter 110nm, water dispersion pulp liquid.
(embodiment 1)
Rotary drum is used to carry out (c-a-1) styrene-butadiene block copolymer 52.5 mass parts, (c-a-2) styrene-butadiene block copolymer 12.5 mass parts and the premixed of (c-b-1) ethene-alpha-olefin random copolymers 35 mass parts, use single axle extruding machine mixing extrusion at 210 DEG C of diameter 40mm, obtain the resin combination of peel ply.(b-2) m-LLDPE of the formation interlayer (2) this resin combination and table 1 and table 2 recorded extrudes from other single axle extruding machine individual, at 225 DEG C, use that branch manifold T die extruder is stacked to be extruded, obtain the duplicature of peel ply thickness 5 μm, interlayer (2) thickness 20 μm by this.
On the other hand, on the biaxial stretch-formed polyethylene terephthalate film FE2001 (thickness 13 μm) forming substrate layer, use roll-coater coating two-package curing type polyurethane type anchor coating agent, between the face of the interlayer (2) of this coated face and above-mentioned duplicature, at 330 DEG C, (b-1) m-LLDPE forming the melting of interlayer (1) is extruded in the mode of the thickness becoming 13 μm, and obtain stacked film by sandwich layered manner.
After Corona discharge Treatment is carried out to the peel ply surface of this stacked film, use gravure coater, (d-3) Styrene-acrylic copolymer 100 mass parts made in advance as hot sealing layer, the mode that becomes 0.5 μm with solid constituent thickness with the aqueous dispersions of the solid component concentration 30% of oxide of tin 400 mass parts of (d-8) spherical doped antimony are coated with, obtain the coverlay of the layer structure with substrate layer (A)/interlayer (B)/peel ply (C)/hot sealing layer (D).The characteristic of this coverlay is shown in table 1 and table 2.
(embodiment 2 to 9, comparative example 1 to 8)
Except using the raw materials such as the resin of record in table 1 and table 2 to be formed except peel ply (C) and hot sealing layer (D), carrying out similarly to Example 1 and making coverlay.
(comparative example 9)
Except not arranging peel ply (C), and using the raw materials such as the resin described in table 2 to be formed outside hot sealing layer (D), when being formed with the fusion shown in table 2, carry out similarly to Example 1 and make coverlay.
(comparative example 10)
Except not arranging interlayer (B), and sequentially being formed outside peel ply (C) and hot sealing layer (D) on the substrate layer (A) of thickness 25 μm, carrying out similarly to Example 1 and making coverlay.
(comparative example 11)
Except not arranging hot sealing layer (D), and the raw materials such as the resin using table 2 to record are formed outside interlayer (B) and peel ply (C), carry out similarly to Example 1 and make coverlay.
< evaluation method >
About the carrier band coverlay of the electronic component made in each embodiment and each comparative example, carry out following shown evaluation.Result is also summarized in table 1 and table 2 respectively.
(vicat softening temperature)
Use the single axle extruding machine of diameter 40mm to extrude at 210 DEG C the resin combination forming peel ply, obtain the particle of resin combination.By the particle of gained press molding at 210 DEG C, obtain the test piece of thickness 5mm, width 10mm, length 100mm.By test piece according to the A120 method of JISK-7206, with load 10N, 120 DEG C/h heat up, measure vicat softening temperature.
(haze value)
According to the determination method A of JISK7105:1998, integrating sphere type determinator is used to measure haze value.
(range wide of peel strength)
Use belting machine (Shibuya Kogyo K.K. (Se paddy industry society), ETM-480), with sealing head width 0.5mm × 2, sealing head length 32mm, sealing load 0.1MPa, feed length 4mm, Sealing period 0.1 second × 8 times, and sealing flatiron temperature rises to 190 DEG C with 20 DEG C of intervals from 130 DEG C, the mode that the coverlay of 5.5mm width becomes 0.4N with the peel strength of the polystyrene carrier band (Deuki Kagaku Kogyo Co., Ltd's system) relative to 8mm is sealed.Place after 24 hours under the environment of temperature 23 DEG C, relative humidity 50%, in the same manner 23 DEG C, under the environment of relative humidity 50%, peel off coverlay with the speed of per minute 300mm, peel angle 170 to 180 °.The difference (range wide) of the maxima and minima of peel strength is measured according to the figure of gained when peeling off the coverlay of 100mm on direction of delaminate.Be being designated as " excellent ", exceeding 0.2N and being designated as " good ", exceeding being designated as " poor " of 0.4N at below 0.4N of below 0.2N by the range wide of peel strength.
(frictional electrification voltage)
Seal in the mode that the peel strength of the carrier band (Deuki Kagaku Kogyo Co., Ltd's system) for the prior polycarbonate built with LED becomes in the scope of 0.4 ± 0.05N.Packaging body after sealing is placed in high speed vibrating machine (CM-1000), apply the elliptical vibration of 30 minutes with 1000rpm, make LED (PG1111C that StanleyCorporation (ス タ Application レ mono-society) makes) and coverlay produce frictional electrification.Packaging body is placed on a metal plate with the ventricumbent state of coverlay, and carrier band is peeled off, LED is exposed.LED is engaged with conductive double-sided tape, contacts supine mode with coverlay and be fixed on metal platform.Use electrometer (MONROEELECTRONICSISOPROBEELECTROSTATICVOLTMETERMODEL279) and measurement terminal (1034EH type), measure the electrified voltage of fixing LED with ambient temperature 23 DEG C, ambient humidity 50RH%.Herein, from LED to the distance of potential probes be set to 0.5mm, the spatial resolution (Spatialresolution) of potential probes is set to Φ 1.5mm.5 LED are implemented and measures, using the frictional electrification voltage of the maxim of absolute value in acquired results as this mensuration.Being designated as " good ", exceeding by the value of frictional electrification voltage being designated as " excellent ", exceeding within ± 50V ± 50V and within ± 70V ± 70V is designated as " poor ".
(stripping charge voltage)
Seal in the mode become in the scope of 0.4 ± 0.05N the peel strength of polycarbonate carrier band (Deuki Kagaku Kogyo Co., Ltd's system).Peel off coverlay, use above-mentioned electrometer and measurement terminal, at ambient temperature 23 DEG C, ambient humidity 50RH%, to Width 8mm, length direction 30mm, every the measurement interval of 0.5mm, measure the electrified voltage of coverlay and (D) hot sealing layer respectively.Now, peel off from coverlay that position to the distance of potential probes is set to 0.5mm, the spatial resolution of potential probes is set to Φ 1.5mm.Using the stripping charge voltage of the maxim of absolute value in acquired results as this mensuration.Being designated as " good ", exceeding by the value of stripping charge voltage being designated as " excellent ", exceeding within ± 50V ± 50V and within ± 70V ± 70V is designated as " poor ".Be shown in the release band electric fence of table 1 and table 2.
(surface resistivity)
Use ohmer (Mitsubishi chemical Co., Ltd's system, " Hiresta-UPMCP-HT450 "), with the method for JISK6911, measure the sheet resistance value of hot sealing layer with ambient temperature 23 DEG C, ambient humidity 50RH%, external voltage 10V.
[table 1]
[table 2]
Nomenclature
1 coverlay
2 substrate layers
3 interlayers
4 peel plies
5 hot sealing layers

Claims (9)

1. a coverlay, it is the coverlay being sequentially configured with substrate layer (A), interlayer (B), peel ply (C) and hot sealing layer (D), it is characterized in that,
Peel ply (C) containing the resin combination formed by the ethene-alpha-olefin copolymer being selected from more than a kind copolymer in Styrene-diene block copolymer and styrenic-diene graft copolymer and 50 ~ 20 quality % of 50 ~ 80 quality % in fact, and
There is the vicat softening temperature of 55 ~ 80 DEG C;
Hot sealing layer (D) is styrene-(methyl) acrylate copolymer of 50 ~ 80 quality % containing styrene containing ratio.
2. coverlay as claimed in claim 1, is characterized in that, at least 1 layer in peel ply (C) or hot sealing layer (D) containing electrically conductive microparticle.
3. coverlay as claimed in claim 2, is characterized in that, electrically conductive microparticle is threadiness or spherical.
4. the coverlay as described in any one in claims 1 to 3, it is characterized in that, the thickness of substrate layer (A) is 12 ~ 20 μm, and the thickness of interlayer (B) is 10 ~ 40 μm, the thickness of peel ply (C) is 5 ~ 20 μm, and gross thickness is 45 ~ 65 μm.
5. the coverlay as described in any one in Claims 1-4, is characterized in that, haze value is less than 30%.
6. an electronic component packaging body, the cladded material of the coverlay such as according to any one of claim 1 to 5 as the carrier band of thermoplastic base resin uses by it.
7. electronic component packaging body as claimed in claim 6, it is characterized in that, thermoplastic base resin is polycarbonate.
8. electronic component packaging body as claimed in claims 6 or 7, is characterized in that, is below 70V by the absolute value of the stripping charge voltage covered when film from support strip is peeled off.
9. the electronic component packaging body as described in any one in claim 6 to 8, is characterized in that, the absolute value of the frictional electrification voltage produced between coverlay and carrier band is below 70V.
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