CN218123375U

CN218123375U - Wafer sucking disc for gluing developing machine

Info

Publication number: CN218123375U
Application number: CN202220219997.XU
Authority: CN
Inventors: 贺武峰; 吴想
Original assignee: Jiangxi Weiyi Semiconductor Equipment Co ltd
Current assignee: Jiangxi Weiyi Semiconductor Equipment Co ltd
Priority date: 2022-01-26
Filing date: 2022-01-26
Publication date: 2022-12-23
Anticipated expiration: 2032-01-26

Abstract

The utility model discloses a wafer sucking disc for rubber coating developing machine, the on-line screen storage device comprises a base, the fixed disk body that is equipped with in base top, vacuum cavity and installation cavity have been seted up to disk body inner chamber, the vacuum cavity top is located the fixed rubber suction nozzle that is equipped with in disk body top, the installation cavity inner chamber is equipped with actuating mechanism, actuating mechanism top fixedly connected with splint, disk body top symmetry begins to have the direction spout, and electric telescopic handle can control the lifter plate and go up and down, and the lifter plate goes up and down to control the subassembly of bleeding and blow or breathe in to vacuum cavity inner chamber, and the subassembly of bleeding is breathed in vacuum cavity inner chamber and can be utilized the negative pressure to adsorb fixedly to placing the wafer at disk body top, and the subassembly of bleeding is blown to vacuum cavity inner chamber and can be taken off the wafer otherwise, and the wafer is dismantled and is changed conveniently, through setting up actuating mechanism, and control about the splint can carry out the secondary centre gripping to the not unidimensional wafer and fix, and fixed stability is high, and the wafer is difficult for rocking.

Description

Wafer sucking disc for gluing developing machine

Technical Field

The utility model relates to a wafer sucking disc for rubber coating developing machine belongs to wafer sucking disc technical field.

Background

Along with the rapid development of semiconductor and LED industries, the types of wafers are more and more, the requirements on testing are higher and higher, and the requirements on the positioning accuracy of the wafers are higher and higher, wherein in the manufacturing process of chips, a semiconductor equipment gluing developing machine is required to be used, a wafer sucker is required to be used when the gluing developing machine is used, the traditional sucker can only fix the wafer with a single size, the fixing effect is poor, and the wafer is inconvenient to disassemble and replace.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem who solves overcomes current defect, the utility model provides a wafer sucking disc for rubber coating developing machine, can fix not unidimensional wafer, it is fixed effectual, the change convenience is dismantled to the wafer, through setting up electric telescopic handle, electric telescopic handle can control the lifter plate and go up and down, the lifter plate goes up and down can control the subassembly of bleeding and blow or breathe in to the vacuum cavity inner chamber, the subassembly of bleeding is breathed in to the vacuum cavity inner chamber and can be utilized the negative pressure to adsorb fixedly placing the wafer at disk body top, otherwise the subassembly of bleeding is blown the vacuum cavity inner chamber and can be taken off the wafer, the change convenience is dismantled to the wafer, through setting up actuating mechanism, actuating mechanism can control about the splint, splint can carry out the secondary centre gripping fixedly to the wafer of not unidimensional, the fixed stability is high, the wafer is difficult for rocking, can effectively solve the problem in the background art.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model provides a wafer sucking disc for rubber coating developing machine, includes the base, the fixed disk body that is equipped with in base top, vacuum cavity and installation cavity have been seted up to disk body inner chamber, the vacuum cavity top is located the fixed rubber suction nozzle that is equipped with in disk body top, the installation cavity inner chamber is equipped with actuating mechanism, actuating mechanism top fixedly connected with splint, disk body top symmetry begins to have the direction spout, the fixed electric telescopic handle that is equipped with in base inner chamber bottom, the fixed lifter plate that is equipped with in electric telescopic handle top, the fixed subassembly that bleeds that is equipped with in lifter plate top equidistance.

As the further description of the technical scheme, the base comprises a bottom plate, a protective cover is fixedly arranged at the top of the bottom plate, and fixing holes are formed in the bottom plate and located at the four corners of the bottom plate.

As the further description of the technical scheme, the driving mechanism comprises a threaded rod, the threaded rod is rotatably arranged in the inner cavity of the installation cavity, a driving threaded sleeve is sleeved on the outer side of the threaded rod, a sliding rod is fixedly arranged at the top of the driving threaded sleeve, and a rotating handle is fixedly arranged at one end of the threaded rod.

As the further description of the technical scheme, the sliding rod penetrates through the inner cavity of the guide sliding groove, and the top end of the sliding rod is fixedly connected with the clamping plate.

As further description of the technical scheme, one side of the clamping plate is of an arc-shaped structure, and a rubber pad is fixedly arranged on the inner wall of the arc-shaped cavity.

As a further description of the above technical solution, the air extracting assembly includes a cylinder, the cylinder is connected to the vacuum chamber in a through manner, a piston is disposed in an inner cavity of the cylinder, a push-pull rod is fixedly disposed at the bottom of the piston, and the bottom end of the push-pull rod is fixedly connected to the lifting plate.

The utility model discloses beneficial effect: 1. the lifting plate can be controlled to lift by arranging the electric telescopic rod, the lifting plate can be controlled to lift to control the air suction assembly to blow or suck air into the inner cavity of the vacuum cavity, the air suction assembly sucks air into the inner cavity of the vacuum cavity, namely, the negative pressure can be used for adsorbing and fixing the wafer placed at the top of the tray body, otherwise, the air suction assembly blows air into the inner cavity of the vacuum cavity, the wafer can be taken down, and the wafer is convenient to detach and replace;

2. through setting up actuating mechanism, actuating mechanism can control splint and remove, and splint can carry out the secondary centre gripping to not unidimensional wafer fixedly, and fixed stability is high, and the wafer is difficult for rocking.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention.

Fig. 1 is a structural diagram of a wafer chuck for a glue-coating developing machine of the present invention.

Fig. 2 is a cross-sectional view of the wafer chuck for the gumming developing machine of the present invention.

Fig. 3 is an enlarged view of a position a of the wafer chuck for the gumming developer of the present invention.

Fig. 4 is a sectional view of the air exhaust assembly of the wafer chuck for the glue coating and developing machine of the present invention.

The reference numbers in the figures: 1. a base; 2. a tray body; 3. a vacuum chamber; 4. a mounting cavity; 5. a rubber suction nozzle; 6. a drive mechanism; 7. a splint; 8. a guide chute; 9. an electric telescopic rod; 10. a lifting plate; 11. an air extraction assembly; 12. a base plate; 13. a protective cover; 14. a fixing hole; 15. a threaded rod; 16. driving the threaded sleeve; 17. a slide bar; 18. rotating the handle; 19. a barrel; 20. a piston; 21. a push-pull rod.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a wafer sucking disc for rubber coating developing machine, includes base 1, the fixed disk body 2 that is equipped with in 1 top of base, vacuum cavity 3 and installation cavity 4 have been seted up to 2 inner chambers of disk body, 3 tops of vacuum cavity are located the fixed rubber suction nozzle 5 that is equipped with in 2 tops of disk body, 4 inner chambers of installation cavity are equipped with

actuating mechanism

6, 6 top fixedly connected with splint 7 of actuating mechanism, 2 top symmetries of disk body begin to have direction spout 8, the fixed electric telescopic handle 9 that is equipped with in 1 inner chamber bottom of base, the fixed lifter plate 10 that is equipped with in 9 tops of electric telescopic handle, the fixed subassembly 11 of bleeding that is equipped with in 10 top equidistance of lifter plate can control lifter plate 10 through electric telescopic handle 9 and go up and down, and lifter plate 10 goes up and down to control the subassembly 11 of bleeding and blow or breathe in the vacuum cavity inner chamber, and the subassembly 11 of bleeding is breathed in 3 inner chambers of vacuum cavity and can utilize the negative pressure to adsorb fixedly placing the wafer at 2 tops, otherwise the subassembly 11 of bleeding is blown in 3 inner chambers of vacuum cavity and can take off the wafer.

Specifically, as shown in fig. 1-2, the base 1 includes a bottom plate 12, a protective cover 13 is fixedly arranged on the top of the bottom plate 12, a fixing hole 14 is formed in the bottom plate 12 at the four corners of the bottom plate, an arc-shaped structure is arranged on one side of the clamping plate 7, a rubber pad is fixedly arranged on the inner wall of the arc-shaped cavity, and the clamping plate 7 can clamp and fix the wafer more stably by arranging the rubber pad on the arc-shaped structure.

Specifically, as shown in fig. 3 to 4, the driving mechanism 6 includes a threaded rod 15, the threaded rod 15 is rotatably disposed in an inner cavity of the installation cavity 4, a driving threaded sleeve 16 is sleeved outside the threaded rod 15, a sliding rod 17 is fixedly disposed at the top of the driving threaded sleeve 16, a rotating handle 18 is fixedly disposed at one end of the threaded rod 15, the sliding rod 17 penetrates through an inner cavity of the guide chute 8, the top end of the sliding rod 17 is fixedly connected with the clamp plate 7, the driving threaded sleeve 16 can be controlled to move left and right by rotating the handle 18, the driving threaded sleeve 16 can drive the clamp plate 7 to move left and right by the sliding rod 17, the clamp plate 7 can secondarily clamp and fix wafers of different sizes, the air exhaust assembly 11 includes a cylinder 19, the cylinder 19 is in through connection with the vacuum cavity 3, a piston 20 is disposed in the inner cavity of the cylinder 19, a push-pull rod 21 is fixedly disposed at the bottom of the piston 20, the bottom end of the push-pull rod 21 is fixedly connected with the lifting plate 10, the push-pull rod 21 can suck air into the inner cavity of the vacuum cavity 3 by pulling-pull rod 21, and blow air into the inner cavity 3 by pushing the push rod 21.

The utility model discloses the theory of operation: can control lifter plate 10 through electric telescopic handle 9 and go up and down, lifter plate 10 goes up and down to control air exhaust component 11 and blows or breathe in to the vacuum cavity inner chamber, air exhaust component 11 breathes in to 3 inner chambers of vacuum cavity and can utilize the negative pressure to adsorb fixedly placing the wafer at 2 tops of disk body, otherwise air exhaust component 11 blows to 3 inner chambers of vacuum cavity and can take off the wafer, can control drive swivel nut 16 through rotating handle 18 rotary threaded rod 15 and remove about, drive swivel nut 16 can drive splint 7 through slide bar 17 and remove about, splint 7 can carry out the secondary centre gripping to not unidimensional wafer and fix.

The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.

Claims

1. The utility model provides a wafer sucking disc for rubber coating developing machine, includes base (1), its characterized in that: base (1) top is fixed to be equipped with disk body (2), vacuum cavity (3) and installation cavity (4) have been seted up to disk body (2) inner chamber, vacuum cavity (3) top is located fixed being equipped with rubber suction nozzle (5) in disk body (2) top, installation cavity (4) inner chamber is equipped with actuating mechanism (6), actuating mechanism (6) top fixedly connected with splint (7), disk body (2) top symmetry begins to have direction spout (8), base (1) inner chamber bottom is fixed to be equipped with electric telescopic handle (9), electric telescopic handle (9) top is fixed to be equipped with lifter plate (10), lifter plate (10) top equidistance is fixed to be equipped with air bleed subassembly (11).

2. The wafer sucker for the gumming developer according to claim 1, wherein the base (1) comprises a bottom plate (12), a protective cover (13) is fixedly arranged on the top of the bottom plate (12), and fixing holes (14) are formed in the bottom plate (12) at four corners of the bottom plate.

3. The wafer sucker for the gumming developing machine as claimed in claim 2, wherein the driving mechanism (6) comprises a threaded rod (15), the threaded rod (15) is rotatably arranged in the inner cavity of the mounting cavity (4), a driving threaded sleeve (16) is sleeved outside the threaded rod (15), a sliding rod (17) is fixedly arranged at the top of the driving threaded sleeve (16), and a rotating handle (18) is fixedly arranged at one end of the threaded rod (15).

4. The wafer suction cup for the gumming developer according to claim 3, characterized in that the sliding rod (17) is arranged in the cavity of the guide chute (8) in a penetrating manner, and the top end of the sliding rod (17) is fixedly connected with the clamping plate (7).

5. The wafer chuck for the gumming developer according to claim 4, characterized in that one side of the clamping plate (7) is provided with an arc structure, and a rubber pad is fixedly arranged on the inner wall of the arc cavity.

6. The wafer chuck for the gumming developer according to claim 5, wherein the air-extracting component (11) comprises a cylinder (19), the cylinder (19) is connected with the vacuum chamber (3) in a penetrating manner, a piston (20) is arranged in the inner cavity of the cylinder (19), a push-pull rod (21) is fixedly arranged at the bottom of the piston (20), and the bottom end of the push-pull rod (21) is fixedly connected with the lifting plate (10).