CN218101219U - Jacking platform and support plate taking system - Google Patents

Abstract

The embodiment of the application provides a piece system is got to jack-up platform and support plate relates to solar cell production technical field. The jacking platform is used for jacking the silicon wafers loaded in the silicon wafer grooves of the support plate, the jacking platform comprises a support plate, a plurality of groups of elastic jacking pieces are arranged on the support plate, jacking surfaces of all the elastic jacking pieces are located on the same plane, and when the support plate is arranged below the support plate, each group of elastic jacking pieces can stretch into one silicon wafer groove and jack up the silicon wafer therein. The support plate taking system comprises a taking device and the jacking platform, wherein the taking device is arranged above the jacking platform and comprises a plurality of groups of suckers arranged in a hanging manner, and each group of suckers is used for sucking a silicon wafer in a silicon wafer groove on a support plate below the sucker. The jacking platform and the support plate taking system can jack all the silicon wafers on the support plate to the same plane, so that the stability of batch picking of the silicon wafers is improved, and the phenomena of missing picking and fragments are reduced.

Description

Jacking platform and support plate taking system

Technical Field

The application relates to the technical field of solar cell production, in particular to a jacking platform and a support plate taking system.

Background

At present, in the process of coating a batch of silicon wafers, a plurality of silicon wafers are required to be placed on a carrier plate on the same surface, and then the carrier plate is conveyed into coating equipment to complete coating. As shown in fig. 1, a carrier plate 01 is generally rectangular, a plurality of silicon wafer grooves 02 for loading silicon wafers are formed in the front surface of the carrier plate 01, the bottom surfaces of the silicon wafer grooves 02 are hollowed-out 03, and in order to meet the increasing demand for mass production, the larger the area size of the silicon wafer carrier plate 01 is, the longer the side length can reach 1700-1800mm. And the carrier plate finishes the feeding of the silicon wafer cloth in the atmospheric environment outside the equipment, then enters the coating equipment to finish coating, and then returns to the atmospheric environment to take and unload the silicon wafer. After a large-sized metal carrier plate is repeatedly heated and cooled due to film coating, the middle of the carrier plate usually sinks by about 2-4mm, and the difficulty in batch chip taking is increased due to sinking of the middle of the carrier plate. The sinking degree of the middle part of the currently adopted 1720X 1740mm carrier plate can reach 4mm, and a suction nozzle on the material taking gantry cannot effectively pick up the silicon wafer due to the sinking of the middle part of the carrier plate, so that the phenomenon of picking up is missed.

And the silicon chip is light, thin and fragile, the larger the area of the carrier plate is, the more serious the sinking of the middle area is, and the improper taking and placing actions in actual production easily cause the collision and scratching of the silicon chip. When the silicon chip is taken, the periphery of the silicon chip in the silicon chip groove of the support plate is contacted with the frame, the middle part of the silicon chip is suspended, and if the suction nozzle directly presses down to act on the surface of the silicon chip to take the silicon chip, the silicon chip is easy to crack, and especially the edge part of the silicon chip is easy to crack.

SUMMERY OF THE UTILITY MODEL

In order to solve at least one of the above technical problems, an object of the embodiments of the present application is to provide a jacking platform and a carrier plate taking system, which can jack up all silicon wafers on a carrier plate to a same plane, improve stability of batch picking of the silicon wafers, and reduce phenomena of missing picking and fragments.

In a first aspect, an embodiment of the present application provides a jacking platform, configured to jack up silicon wafers loaded in each silicon wafer slot of a carrier plate, where the bottom of each silicon wafer slot is hollow, the jacking platform includes a supporting plate, multiple sets of elastic jacking members are arranged on the supporting plate, jacking surfaces of all the elastic jacking members are located on the same plane, and when the supporting plate is arranged below the carrier plate, each set of elastic jacking member can extend into one silicon wafer slot and jack up a silicon wafer therein.

In the implementation process, the supporting plate supports all the elastic jacking pieces to move upwards simultaneously from the lower part of the supporting plate, each group of elastic jacking pieces extends into the corresponding silicon wafer groove and jacks up the silicon wafers in the silicon wafer groove, the jacking surfaces of the elastic jacking pieces are in direct contact with the lower surfaces of the silicon wafers, the silicon wafers are jacked up, and the jacking surfaces of all the elastic jacking pieces are located on the same plane, so that all the silicon wafers on the supporting plate can be jacked up to the same plane, the problem that the silicon wafers are not located on the same plane due to sinking of the middle part of the supporting plate is solved, the wafer taking device is convenient to take wafers in batches at different positions on the same plane, the wafer leakage phenomenon is reduced, the problem that the silicon wafers cannot be picked up due to sinking of the supporting plate is solved, the collision scratch to the silicon wafers during the wafer taking is reduced, and the batch picking up stability of the silicon wafers is improved.

And after each silicon chip passes through a group of elastic jacking parts, when a suction nozzle of the chip taking device presses down the silicon chip to take the silicon chip, the silicon chip is supported by the elastic jacking parts, so that fragments caused by chip taking by the suction nozzle are reduced, and the effect of stable material taking and no loss of the silicon chip are achieved.

In one possible implementation mode, the elastic jacking piece is made of high-strength rubber; and/or the jacking surface of the elastic jacking piece is circular and has the diameter of 10-20mm.

In the above-mentioned realization process, the jack-up face of elasticity jack-up piece contact silicon chip is circular shape plane shape, and the material is the rubber material of excelling in, and excelling in is glued to excelling in and is a novel material between plastics and rubber, and elasticity is good, and when jack-up silicon chip and suction nozzle pushed down and got the piece, elasticity jack-up piece is the plane in order to correspond to circular shape suction nozzle, and elastic jack-up face can not cause the extrusion fish tail of silicon chip, does not appear the fish tail phenomenon in the actual production.

In a possible implementation manner, different groups of elastic jacking pieces are arranged in different areas of the upper surface of the supporting plate, the number of each group of elastic jacking pieces is at least 3, and the elastic jacking pieces are dispersedly arranged in each area.

In the implementation process, the support plate and the support plate are vertically stacked, each group of elastic jacking parts on the support plate are located under the corresponding silicon wafer groove, and a plurality of elastic jacking parts dispersed in the region can stably jack up the silicon wafer in the silicon wafer groove to leave the silicon wafer groove so as to facilitate the wafer taking device to take wafers.

In one possible implementation manner, the middle of the area where the supporting plate is provided with the group of elastic jacking pieces is provided with a hollow hole, and each group of elastic jacking pieces is arranged around the hollow hole.

In the implementation process, the design of the hollow holes can reduce the dead weight of the supporting plate, and the hollow holes in each area can be overlapped with the hollow parts of the bottoms of the corresponding silicon wafer grooves so as to facilitate the wafer taking.

In a possible implementation, each elastic jacking member is fixed on the supporting plate through an upright post, and the upright post is vertically arranged relative to the supporting plate.

In a possible implementation manner, the jacking platform further comprises a lifting driving mechanism, and the lifting driving mechanism is located below the supporting plate and can drive the supporting plate to move up and down.

In the implementation process, the supporting plate is driven to ascend through the lifting driving mechanism, so that the elastic jacking piece is driven to move upwards to jack up the silicon wafer.

In a second aspect, an embodiment of the present application provides a support plate taking system, which includes a material taking device and a jacking platform provided in the first aspect, wherein the material taking device is disposed above the jacking platform, the material taking device includes multiple groups of suckers suspended in suspension, and each group of suckers is used for sucking a silicon wafer jacked up by a group of elastic jacking members on a support plate located below the sucker.

In the implementation process, the elastic jacking piece on the supporting plate directly contacts the lower surface of the silicon wafer, and the silicon wafer is jacked in the same plane by the elastic jacking piece, so that a plurality of groups of suckers can move to various positions for batch suction conveniently; and the elastic jacking piece enables the lower part of the silicon wafer to be supported, and when the sucking disc presses the silicon wafer to suck the silicon wafer, the silicon wafer is not easy to crack.

In a possible implementation mode, all the suckers acting on the silicon wafers in the same silicon wafer groove correspond to all the elastic jacking pieces one by one up and down, and the corresponding suckers and the elastic jacking pieces act on the same positions of the upper surface and the lower surface of the silicon wafer respectively.

In the implementation process, the pressure applying position of the sucker acting on the upper surface of the silicon wafer corresponds to the supporting position of the elastic jacking piece acting on the lower surface of the silicon wafer, and the silicon wafer is balanced in stress and not easy to crack.

In a possible realization mode, the diameter of the jacking surface of the elastic jacking piece acting on the same silicon wafer is not less than that of the corresponding sucker.

In the implementation process, the position of the silicon wafer picked up by the sucker is deviated, the diameter of the jacking surface of the elastic jacking piece is designed to be larger than that of the corresponding sucker, so that the sucking position of the sucker on the silicon wafer is kept in the area of the jacking surface of the elastic jacking piece on the silicon wafer, the stability of taking the silicon wafer is further ensured, and fragments cannot be sucked by the sucker.

In a possible implementation mode, the material taking device comprises a mounting rack capable of translating and lifting, a plurality of groups of suckers are mounted below the mounting rack in a hanging mode, and each group of suckers are independently mounted through connecting pieces.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a carrier in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a carrier sheet taking system according to a first embodiment of the present application;

fig. 3 is a schematic view of fig. 2 from another view angle.

Icon: 100-a carrier plate taking system; 111-a pallet; 112-a resilient jack-up member; 113-upright post; 121-a sucker; 122-track; 123-a mounting rack; 124-connecting rod; 125-cross-shaped plate; 01-a carrier plate; 02-a silicon wafer groove; 03-hollowing out.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally laid out when products of the application are used, and are only used for convenience in describing the application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the application.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

First embodiment

Referring to fig. 1 to 3, a carrier plate taking system 100 provided in this embodiment is used for jacking up and taking a silicon wafer loaded on a carrier plate 01, where a carrier plate 01 in the implementation of the present application mainly refers to a carrier plate 01 with a large area, each carrier plate 01 is rectangular, the side length of each carrier plate 01 is greater than 1500mm, a plurality of silicon wafer slots 02 for loading silicon wafers are arranged in a middle area of an upper surface of each carrier plate, the bottom of each silicon wafer slot 02 is hollow 03, and generally, the middle area occupies 1/2-2/3 of the area of the whole carrier plate 01; each carrier plate 01 is composed of different sub-carrier plates 01 side by side, in the embodiment, each carrier plate 01 is composed of 4 long strip-shaped sub-carrier plates 01 which are tiled side by side, two rows of silicon wafer grooves 02 which are arranged along the length direction are orderly arranged on each sub-carrier plate 01, each row of silicon wafer grooves 02 contains 8 silicon wafer grooves 02, each carrier plate 01 is provided with 8 x 8 silicon wafer grooves 02, and the bottom of each silicon wafer groove 02 is provided with a rectangular hollow 03.

The carrier plate taking system 100 comprises a jacking platform for jacking up the silicon wafer on the carrier plate 01, and a taking device for sucking the taken wafer, wherein the taking device is arranged above the jacking platform. When the carrier plate taking system 100 works, the carrier plate 01 is horizontally arranged, silicon wafers are loaded in each silicon wafer groove 02 on the upper surface, and one silicon wafer is loaded in each silicon wafer groove 02; the material taking platform is positioned below the support plate 01 and can move up and down so as to jack up the silicon wafers loaded in the silicon wafer grooves 02 on the support plate 01; the material taking device is positioned above the carrier plate 01 and can absorb the jacked silicon wafers.

Locally, the jacking platform comprises a supporting plate 111 located below the supporting plate 01, a plurality of groups of elastic jacking pieces 112 corresponding to the silicon wafer grooves 02 one by one are arranged on the supporting plate 111, each elastic jacking piece 112 is fixed on the supporting plate 111 through a stand column 113, the stand columns 113 are vertically arranged relative to the supporting plate 111, jacking surfaces (end surfaces far away from the supporting plate 111) of all the elastic jacking pieces 112 are located on the same plane, and each group of elastic jacking pieces 112 can stretch into the corresponding silicon wafer grooves 02 and jack up the silicon wafers therein. The upper surface of the supporting plate 111 is divided into a plurality of jacking areas which are located right below the silicon wafer grooves 02 on the supporting plate 01, a group of elastic jacking pieces 112 are arranged in each jacking area, the number of the elastic jacking pieces 112 is at least 3, the elastic jacking pieces are dispersedly arranged in the jacking areas, hollow holes are formed in the middle of each jacking area of the supporting plate 111, and the elastic jacking pieces 112 in the jacking areas are arranged around the hollow holes.

In this embodiment, the supporting plate 111 is rectangular and is located right below a middle region (a slide region where the silicon wafer groove 02 is located) of the supporting plate 01 and has the same size, the upper surface of the supporting plate 111 is divided into 8 × 8 jacking regions, each jacking region is correspondingly located right below one silicon wafer groove 02, 4 upright posts 113 are arranged in each jacking region, an elastic jacking member 112 is fixed at the top end of each upright post 113, that is, the number of each group of elastic jacking members 112 is 4, and the 4 elastic jacking members 112 can extend into the silicon wafer groove 02 from four corner positions of a rectangular hollow 03 corresponding to the bottom of the silicon wafer groove 02; the hollow holes surrounded by two adjacent groups of elastic jacking pieces 112 on the supporting plate 111 are connected together to form a long hollow hole, and the whole body is of a frame structure so as to reduce the dead weight and ensure the overall strength.

In the embodiment of the present application, the elastic jack-up member 112 has a certain elasticity, and the jack-up surface thereof is generally circular and has a diameter of 10 to 20mm. In this embodiment, the elastic lifting member 112 is in the shape of a rubber cap, and is made of acrylic rubber, and the elastic lifting member 112 is a cylinder coaxially fixed to the top end of the upright post 113, and has a diameter of 15mm. It should be noted that the material of the elastic jacking member 112 in the embodiment of the present application is limited to acrylic rubber, the shape is not limited to a cylinder, the jacking surface is not limited to a circle, and for example, the jacking surface may be a cube with a side length of 15mm, and the surface of the jacking surface is parallel to the supporting plate 111.

The jacking platform further comprises a lifting driving mechanism, and the lifting driving mechanism is located below the supporting plate 111 and can drive the supporting plate 111 to move in a lifting mode. In one embodiment, the lifting driving mechanism is a jacking cylinder, and the driving end of the jacking cylinder directly acts on the lower surface of the supporting plate 111.

Locally, the material taking device comprises a portal frame and a plurality of groups of suckers 121 arranged in a hanging manner, and each group of suckers 121 is used for sucking the silicon wafer in one silicon wafer groove 02 on the carrier plate 01 below the group of suckers 121. The number of the suckers 121 acting on the silicon wafer in the same silicon wafer groove 02 is equal to that of the elastic jacking members 112, the suckers 121 and the elastic jacking members 112 are in one-to-one correspondence, the corresponding suckers 121 and the corresponding elastic jacking members 112 respectively act on the same position of the upper surface and the lower surface of the silicon wafer (namely the acting positions are overlapped up and down), and the diameter of the jacking surface of the elastic jacking member 112 acting on the same silicon wafer is not less than that of the corresponding sucker 121.

In this embodiment, a pair of level of portal frame sets up and track 122 that is parallel to each other, connects between the track 122 to be provided with the translation pole, and the translation pole can be followed track 122 and removed, is connected with mounting bracket 123 under the translation pole, and mounting bracket 123 can be for translation pole elevating movement, realizes mounting bracket 123 translation and elevating movement. A plurality of groups of suckers 121, specifically 8 × 2 groups of suckers 121, are suspended below the mounting frame 123 to suck two rows of silicon wafers on the carrier plate 01 in batch. Every sucking disc 121 contains 4 sucking discs 121, and every sucking disc 121 is circular, and the diameter is 10cm, and every sucking disc 121 of every group is independently installed through the connecting piece respectively, and concrete mounting means is: the lower surface of the horizontally arranged mounting frame 123 is connected with a vertically arranged connecting rod 124, the bottom end of the connecting rod 124 is connected with a cross-shaped plate 125,4 sucking discs 121 which are respectively hung and mounted at the cross-shaped end of the cross-shaped plate 125.

The film taking method adopting the carrier plate film taking system 100 comprises the following steps:

s1, a carrier plate 01 loaded with silicon wafers moves to a material taking position and is just positioned between a jacking platform and a material taking device, a lifting driving mechanism drives a supporting plate 111 to lift, all elastic jacking pieces 112 are driven to move upwards to directly contact the lower surfaces of the silicon wafers, all the silicon wafers are jacked to the same plane, and the lifting driving mechanism stops.

S2, the mounting frame 123 translates to drive all the suckers 121 to translate to the positions corresponding to two rows of silicon chips along the rails 122, each group of sucker 121 pairs is located on one group of elastic jacking pieces 112, the mounting frame 123 descends to drive all the suckers 121 to downwards press and suck the silicon chips supported by the elastic jacking pieces 112, and the pressure application action areas of the suckers 121 are aligned with the jacking action areas of the elastic jacking pieces 112; the mounting rack 123 raises up the silicon wafer with the suction, and translates to the wafer placing position for placing the wafer.

In the embodiment, the shape of the jacking surface of each elastic jacking piece 112 is designed to be circular, phi 15mm, the area of the jacking surface contacting with the silicon wafer is larger than the phi 10 suction nozzle in alignment, and the silicon wafer is not cracked; in addition, the situation that the jacking surface of the elastic jacking piece 112 is phi 5mm is tested, the fragment rate is extremely high, and the elastic jacking piece cannot be practically used.

And S3, repeating the step S2 until batch sucking and placing of all the rows of silicon chips are completed, wherein the silicon chips are in the same plane, so that the suction nozzles can pick up the silicon chips at various positions conveniently.

Second embodiment

The difference between the present embodiment and the first embodiment is that 8 × 8 groups of suction cups are suspended and installed below the mounting frame of the present embodiment to synchronously suck all silicon wafers on the carrier.

Third embodiment

The difference between the system for taking a chip from a carrier plate provided by this embodiment and the first embodiment is that this embodiment further includes a conveying mechanism for conveying the carrier plate and two sets of clamping mechanisms for clamping and fixing the carrier plate, the conveying mechanism extends to above the carrier plate, the two sets of clamping mechanisms are respectively located at two side edges of the carrier plate along the conveying direction, the two sets of clamping mechanisms can move up and down and can move relative to each other to the two side edges of the carrier plate, and a rubber wheel is arranged at a position where the clamping mechanism contacts the carrier plate.

In this embodiment, when the conveying mechanism carries the carrier plate and moves to the material taking position along the conveying direction, the clamping mechanism ascends and moves relatively to clamp the two side edges of the carrier plate, so as to fix the carrier plate and then jack up and take the sheet.

To sum up, the jacking platform and the support plate taking system of the embodiment of the application can jack up all silicon wafers on the support plate to the same plane, improve the stability of batch picking of the silicon wafers and reduce the phenomena of missing picking and fragments.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. The utility model provides a jack-up platform for the silicon chip of jack-up loading in each silicon chip inslot of support plate, the tank bottom fretwork in silicon chip groove, its characterized in that, the jack-up platform includes the layer board, be provided with multiunit elasticity jack-up spare on the layer board, all the jack-up face of elasticity jack-up spare is located the coplanar, when the layer board set up in when the support plate below, every group elasticity jack-up spare can stretch into one silicon chip inslot and jack-up silicon chip wherein.

2. The jacking platform of claim 1, wherein the resilient jacking members are made of a high-gravity rubber; and/or the jacking surface of the elastic jacking piece is circular and has the diameter of 10-20mm.

3. The jacking platform of claim 1, wherein different groups of said resilient jacking members are disposed in different areas of the upper surface of said supporting plate, and the number of said resilient jacking members in each group is at least 3, and said resilient jacking members are disposed in each area in a distributed manner.

4. The jacking platform of claim 3, wherein the middle of the region of the supporting plate provided with one group of the elastic jacking members is provided with a hollowed-out hole, and each group of the elastic jacking members is arranged around the hollowed-out hole.

5. The jacking platform of claim 1, wherein each of the resilient jacking members is secured to the platform by an upright, the upright being disposed vertically with respect to the platform.

6. The jacking platform of claim 1, further comprising a lift drive mechanism located below the pallet and capable of driving the pallet to move up and down.

7. A carrier plate taking system, comprising a taking device and a jacking platform according to any one of claims 1 to 6, wherein the taking device is arranged above the jacking platform, the taking device comprises a plurality of groups of suspended suckers, and each group of suckers is used for sucking a silicon wafer which is positioned below the taking device and is jacked up by a group of elastic jacking pieces.

8. The system of claim 7, wherein all the suckers and all the elastic lifters acting on the silicon wafer in the same silicon wafer slot correspond to each other one by one, and the corresponding suckers and the elastic lifters act on the same position of the upper and lower surfaces of the silicon wafer respectively.

9. The system of claim 8, wherein the diameter of the lifting surface of the elastic lifting member acting on the same silicon wafer is not less than the diameter of the corresponding suction cup.

10. The system of claim 7, wherein the material extracting device comprises a mounting rack capable of translating and lifting, a plurality of groups of suckers are hung below the mounting rack, and each group of suckers are independently mounted through a connecting piece.

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