CN113083611B - Ceramic wafer greasing device for IGBT module - Google Patents

Ceramic wafer greasing device for IGBT module Download PDF

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Publication number
CN113083611B
CN113083611B CN202110269035.5A CN202110269035A CN113083611B CN 113083611 B CN113083611 B CN 113083611B CN 202110269035 A CN202110269035 A CN 202110269035A CN 113083611 B CN113083611 B CN 113083611B
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China
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igbt module
tray
lifting
column
positioning
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CN113083611A (en
Inventor
郭斌
马欣欣
李静伟
田建威
蒋诚杰
郭必伟
何伟顺
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Hangzhou Wolei Intelligent Technology Co ltd
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Hangzhou Wolei Intelligent Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles

Abstract

The invention discloses a ceramic chip greasing device for an IGBT module, and aims to provide a ceramic chip greasing device for an IGBT module, which can effectively solve the problem that the position deviation of the ceramic chip spraying surface of the IGBT module causes the influence on the silicone grease quality of the ceramic chip due to the adoption of different trays for positioning the IGBT module in the existing IGBT module assembly line. It comprises a frame; a plurality of trays; the tray is supported on the conveying track and conveyed through the conveying track; a tray stopping device; the combined type lifting positioning and supporting device comprises a tray lifting column, an IGBT module supporting column, a tray positioning block and a second lifting execution device, wherein the tray positioning block is positioned above the conveying track; and the silicone grease coating device is arranged on the rack and used for coating silicone grease on the ceramic wafer supported on the IGBT module supporting column.

Description

Ceramic wafer greasing device for IGBT module
Technical Field
The invention relates to a silicone grease coating device, in particular to a ceramic chip grease coating device of an IGBT module.
Background
In the assembly process of the IGBT module, a layer of silicone grease needs to be sprayed on the surface of the ceramic wafer. The existing IGBT module assembly line generally comprises a conveying track and a plurality of assembly stations which are sequentially distributed along the conveying track, wherein a plurality of trays are sequentially distributed on the conveying track, the trays are supported on the conveying track and conveyed through the conveying track, the trays are used for placing IGBT modules, and the IGBT modules are positioned on the trays; the assembling station comprises a silicone grease coating station, the silicone grease coating station comprises a tray stopping device and a silicone grease coating device, and the tray stopping device is used for stopping the tray on the conveying track; and the silicone grease coating device is used for coating silicone grease on the ceramic wafer on the IGBT module of the stopping tray. The existing IGBT module assembly line has the following defects: because a plurality of trays are sequentially distributed on the conveying track, each IGBT module is positioned on one tray, and because of the influence of processing precision, a positioning structure for positioning the IGBT module on each tray is determined to have deviation, so that the position of a ceramic wafer (the spraying surface of the ceramic wafer) of the IGBT module on each tray has deviation (for example, the height, the flatness and the like of the spraying surface of the ceramic wafer have deviation), and the silicone grease coating process of the ceramic wafer of the IGBT module has higher requirement on the positioning precision of the IGBT module, and the position deviation of the spraying surface of the ceramic wafer can influence the consistency of a silicone grease layer sprayed on the ceramic wafer (the thickness of the silicone grease layer is different), and the silicone grease coating quality of the ceramic wafer is influenced.
Disclosure of Invention
The invention aims to provide a ceramic chip greasing device for an IGBT module, which can effectively solve the problem that the position deviation of the ceramic chip spraying surface of the IGBT module exists and the quality of the ceramic chip greasing is influenced because different trays are adopted to position the IGBT module in the existing IGBT module assembly line.
The technical scheme of the invention is as follows:
a ceramic wafer greasing device for an IGBT module comprises:
a frame;
the tray is used for placing the IGBT module, and positioning pins are arranged on the tray and used for positioning the IGBT module;
the trays are sequentially distributed along the conveying track, and the trays are supported on the conveying track and conveyed through the conveying track;
the tray stopping device comprises a blocking piece and a first lifting execution device which is arranged on the rack and used for lifting the blocking piece, and the blocking piece is used for stopping the tray;
the combined lifting positioning and supporting device comprises a tray lifting column, an IGBT module supporting column, a tray positioning block and a second lifting executing device, wherein the tray positioning block is positioned above the conveying track, the second lifting executing device is used for lifting the tray lifting column, a tray stopped by a blocking piece is jacked up and is enabled to be propped against the tray positioning block, the second lifting executing device is used for lifting the IGBT module supporting column, an IGBT module positioned on the tray is jacked up, and the IGBT module is enabled to be supported on the IGBT module supporting column;
and the silicone grease coating device is arranged on the rack and used for coating silicone grease on the ceramic wafer supported on the IGBT module supporting column.
The ceramic chip greasing device of the IGBT module works as follows:
the IGBT module is provided with a ceramic plate and is positioned on the tray through a positioning pin on the tray, and specifically, the IGBT module is provided with a fabrication hole which is matched with the positioning pin; the tray is conveyed by the conveying track.
In the process of conveying the tray along the conveying track, after the tray on the conveying track is stopped by the blocking piece, the second lifting execution device of the combined type lifting positioning and supporting device lifts the tray lifting column, jacks up the tray stopped by the blocking piece and enables the tray to abut against the tray positioning block, and therefore the tray is separated from the conveying track and fixed; the second lifting execution device lifts the IGBT module support column to jack up the IGBT module positioned on the tray, so that the IGBT module is supported on the IGBT module support column;
then, the silicone grease coating device coats silicone grease on the ceramic wafer on the IGBT module supported on the IGBT module support column; thus, although a plurality of trays are sequentially distributed on the conveying track, each IGBT module is positioned on one tray; when the IGBT module on each tray is coated with silicone grease, the trays are separated from the conveying track and fixed, so that the influence of the conveying track on the silicone grease spraying process can be avoided; more importantly, when the IGBT module on each tray is coated with silicone grease, the IGBT module is supported on the IGBT module support column (namely, when the IGBT module on each tray on the conveying track is coated with silicone grease, the IGBT module is supported and positioned by the same IGBT module support column), so that the problem that the silicone grease coating quality of the ceramic chip is influenced due to the position deviation of the ceramic chip spraying surface of the IGBT module caused by the positioning of the IGBT module by adopting different trays in the existing IGBT module assembly line can be effectively solved;
then, the second lifting execution device drives the tray lifting column and the IGBT module support column to descend, the sprayed IGBT module is placed on the tray again and positioned, and the tray is placed on the conveying track again; then the first lifting execution device drives the blocking piece to descend, the tray of the well-sprayed IGBT module is released, and the tray is conveyed to the next station through the conveying rail; and finally, the first lifting execution device drives the blocking piece to move upwards and reset so as to prepare for blocking the next tray.
Preferably, the combined positioning and supporting device further comprises a lifting platform located below the conveying track, a first vertical guide sleeve arranged on the rack and located above the lifting platform, a floating flat plate located above the first vertical guide sleeve, and a sliding guide rod arranged on the floating flat plate and in sliding fit with the first vertical guide sleeve, the second lifting execution device comprises a lifting cylinder arranged on the rack, the lifting cylinder is used for lifting the lifting platform, the tray lifting column comprises a vertical sleeve fixed on the lifting platform, a sliding lifting column sliding along the vertical sleeve, and a compression spring arranged in the vertical sleeve, and the compression spring is located below the sliding lifting column and used for supporting the sliding lifting column; the floating flat plate is supported at the upper end of the first vertical guide sleeve, the sliding guide rod is positioned above the lifting platform, the IGBT module support column is arranged on the floating flat plate, and the tray is provided with a support column through hole; after the tray is stopped by the blocking piece, the lifting cylinder drives the lifting platform to ascend, the lifting platform drives the tray lifting column to ascend at first, and the tray stopped by the blocking piece is jacked until the tray abuts against the tray positioning block; and then, the lifting cylinder overcomes the elastic force of the compression spring and compresses the compression spring to drive the lifting platform to continuously ascend, so that the floating flat plate and the IGBT module supporting column are driven to ascend together through the sliding guide rod, the IGBT module positioned on the tray is jacked up, and the IGBT module is supported on the IGBT module supporting column.
In the existing mechanical structure, two parts which have different actions and different action displacement strokes are generally respectively driven by a driving part, because the tray lifting column is used for jacking up the tray, the IGBT module supporting column is used for jacking up the IGBT module, and the lifting stroke of the tray lifting column is different from the lifting stroke of the IGBT module supporting column, therefore, in the existing mechanical structure, the tray lifting column and the IGBT module supporting column need to be lifted by the air cylinders respectively (namely the tray lifting column corresponds to one air cylinder, and the IGBT module supporting column corresponds to one air cylinder), and are lifted by the air cylinders respectively, so that an operator needs to operate according to a standard operation sequence during operation, after the tray is stopped by the blocking piece, the air cylinder of the tray lifting column needs to be pressed down first, and the tray is jacked up by the tray lifting column, so that the tray is separated from the conveying track and is fixed; then, pressing down the air cylinder of the IGBT module support column, jacking the IGBT module positioned on the tray, and enabling the IGBT module to be supported on the IGBT module support column; if the operation sequence is wrong, firstly pressing down the air cylinder of the IGBT module support column to separate the IGBT module on the tray from the positioning pin on the tray, and then pressing down the air cylinder of the tray lifting column, in the process, the position of the tray is likely to deviate under the influence of the transmission of the conveying track, after the silicone grease is sprayed, the IGBT module support column descends, and when the IGBT module is placed on the tray, the positioning pin cannot be inserted into the technical hole of the IGBT module due to the deviation of the position of the tray, so that the positioning of the IGBT module on the tray fails;
similarly, after the silicone grease is sprayed, the operation is also required to be carried out according to the standard operation sequence, the air cylinder of the support column of the IGBT module is required to be pressed down, and the sprayed IGBT module is placed and positioned on the tray again; then the cylinder of the tray lifting column is pressed down, if the operation sequence is wrong, the cylinder of the tray lifting column is pressed down first, the tray is placed on the conveying track first, then the cylinder of the IGBT module support column is pressed down, and the IGBT module is placed down;
therefore, according to the existing mechanical structure, the tray lifting column and the IGBT module supporting column need to be lifted by adopting air cylinders respectively, so that the problems that due to negligence of an operator, the operation sequence is wrong, a positioning pin cannot be inserted into a technical hole of the IGBT module, and the positioning of the IGBT module on the tray fails can easily occur; in order to solve the problem, the scheme is provided with a special combined positioning and supporting device which adopts the same lifting cylinder to realize different lifting requirements of a tray lifting column and an IGBT module supporting column so as to solve the problem, in particular,
after the tray is stopped by the blocking piece, the lifting cylinder drives the lifting platform to ascend, the lifting platform drives the tray lifting column to ascend, and the tray stopped by the blocking piece is jacked until the tray abuts against the tray positioning block; then, the lifting cylinder overcomes the elastic force of the compression spring and compresses the compression spring to drive the lifting platform to continuously ascend, so that the floating flat plate and the IGBT module supporting column are driven to ascend together through the sliding guide rod, the IGBT module positioned on the tray is jacked up, and the IGBT module is supported on the IGBT module supporting column; then, the silicone grease coating device coats silicone grease on the ceramic wafer on the IGBT module supported on the IGBT module support column; similarly, after the silicone grease is sprayed, the lifting air cylinder drives the lifting platform to descend, in the process, the IGBT module support column firstly descends, and the sprayed IGBT module is placed and positioned on the tray again; then, after the compression spring is reset, the tray lifting column descends, and the tray is placed on the conveying track; so, realize tray through same lift cylinder and lift the different lift needs of post and IGBT module support column, not only greatly simplified operation, can avoid moreover because of operator's carelessness, the operation order is makeed mistakes, and appears the locating pin and will unable in the fabrication hole that inserts the IGBT module for the problem of the location failure of IGBT module on the tray.
Preferably, the lower end of the vertical sleeve is provided with a pull rod through hole, the upper end of the sliding lifting column is located above the vertical sleeve, the lower end of the sliding lifting column is located in the vertical sleeve, the lower end of the sliding lifting column is provided with a pull rod which extends downwards, the lower end of the pull rod penetrates through the pull rod through hole, the lower end of the pull rod is provided with a pull rod stop block, the compression spring is sleeved on the pull rod, the lower end of the compression spring abuts against the inner bottom surface of the vertical sleeve, and the upper end of the compression spring abuts against the lower end surface of the sliding lifting column.
Preferably, the combined positioning and supporting device further comprises an upper limiting block and a lower limiting block which are arranged on the rack and used for limiting the lifting platform, and the lifting platform is located between the upper limiting block and the lower limiting block.
Preferably, the upper end of the IGBT module support column is provided with a positioning hole for matching with a limit pin on the IGBT module. So, after IGBT module support column jack-up IGBT module, can fix a position the IGBT module through spacer pin and locating hole cooperation.
Preferably, the silicone grease coating device comprises a mounting bracket, a gluing nozzle arranged on the mounting bracket and a manipulator arranged on the frame and used for moving the mounting bracket.
Preferably, the silicone grease coating device further comprises a laser sensor arranged on the mounting bracket, and the laser sensor is used for detecting the position of the ceramic piece on the IGBT module. Therefore, before spraying the silicone grease, the position of the ceramic chip on the IGBT module can be detected through a laser sensor, for example, the flatness and the position height of the spraying surface of the ceramic chip, the position of the ceramic chip on the IGBT module is unqualified and the ceramic chip is not sprayed; and the positions of the ceramic plates on the IGBT module are qualified, and spraying is carried out, so that the spraying quality is ensured.
Preferably, a tray inductive switch is further arranged on the rack and used for sensing the tray stopped by the blocking piece.
Preferably, the rack is further provided with a material detection switch, and the material detection switch is used for sensing the IGBT module on the tray stopped by the blocking piece.
The invention has the beneficial effects that: the problem that the quality of silicone grease coating on the ceramic chip is influenced due to the position deviation of the ceramic chip spraying surface of the IGBT module caused by the fact that different trays are used for positioning the IGBT module in the existing IGBT module assembly line can be effectively solved.
Drawings
Fig. 1 is a front view of a ceramic sheet greasing device of an IGBT module of the present invention.
Fig. 2 is a schematic partial structure diagram of a three-dimensional view angle of the ceramic chip greasing device of the IGBT module according to the present invention.
Fig. 3 is a partially enlarged view of a portion a in fig. 1.
In the figure:
a frame 1;
a conveying track 2;
a tray 3 and a positioning pin 3.1;
an IGBT module 4;
the tray stopping device 5, the blocking piece 5.1 and the first lifting executing device 5.2;
the device comprises a silicone grease coating device 6, a mounting bracket 6.1, a gluing nozzle 6.2, a manipulator 6.3 and a laser sensor 6.4;
the device comprises a combined type positioning and supporting device 7, a tray positioning block 7.1, a tray lifting column 7.2, a vertical sleeve 7.21, a sliding lifting column 7.22, a compression spring 7.23, a pull rod 7.24, a pull rod stop 7.25, an IGBT module supporting column 7.3, a second lifting execution device 7.4, a lifting platform 7.5, a first vertical guide sleeve 7.6, a floating flat plate 7.7, a sliding guide rod 7.8 and a second vertical guide sleeve 7.9.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention are clearly explained and illustrated below with reference to the accompanying drawings, but the following embodiments are only preferred embodiments of the present invention, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative effort belong to the protection scope of the present invention.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present scheme, and are not construed as limiting the scheme of the present invention.
These and other aspects of embodiments of the invention will be apparent with reference to the following description and attached drawings. In the description and drawings, particular embodiments of the invention have been disclosed in detail as being indicative of some of the ways in which the principles of the embodiments of the invention may be practiced, but it is understood that the scope of the embodiments of the invention is not limited thereby. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
In the description of the present invention, it is to be understood that the terms "thickness", "upper", "lower", "horizontal", "top", "bottom", "inner", "outer", "circumferential", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., and "several" means one or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The first embodiment is as follows: as shown in fig. 1 and 2, a ceramic wafer greasing device for an IGBT module includes a frame 1, a plurality of trays 3, a conveying track 2, a tray stopping device 5, a combined lifting positioning and supporting device 7, and a greasing device 6.
The tray 3 is used for placing the IGBT module 4, and positioning pins 3.1 are arranged on the tray and used for positioning the IGBT module; in this embodiment, the locating pins are distributed vertically. The trays are sequentially distributed along the conveying track, and the trays are supported on the conveying track and conveyed through the conveying track. In this embodiment, the conveying track comprises two conveying monorail, and the tray supports and two conveying monorail. The conveying tracks are horizontally distributed.
The tray stopping device 5 comprises a stopping piece 5.1 and a first lifting execution device 5.2 which is arranged on the rack and used for lifting the stopping piece, wherein the stopping piece is used for stopping the tray. The first lifting execution device is a lifting cylinder. In this embodiment, the pallet stop device is located between the two conveying monorail. Baffle or stop block that the barrier vertically distributes.
The combined positioning and supporting device 7 comprises a tray lifting column 7.2, an IGBT module supporting column 7.3, a tray positioning block 7.1 positioned above the conveying track and a second lifting execution device 7.4. The tray locating piece passes through the connecting piece to be fixed in the frame, and in this embodiment, the tray locating piece is two, and the tray lifts the post and is 2 or 3 or more, and the IGBT module support column is 3 or 4 or more. The second lifting execution device is used for lifting the tray lifting column, jacking the tray stopped by the blocking piece and enabling the tray to abut against the tray positioning block, and lifting the IGBT module supporting column, jacking the IGBT module positioned on the tray and enabling the IGBT module to be supported on the IGBT module supporting column.
And the silicone grease coating device 6 is arranged on the rack and used for coating silicone grease on the ceramic wafer supported on the IGBT module supporting column. The silicone grease coating device comprises a mounting bracket 6.1, a gluing spray head 6.2 arranged on the mounting bracket and a manipulator 6.3 arranged on the frame and used for moving the mounting bracket. In this embodiment, the manipulator is a three-axis manipulator, and the three-axis manipulator is used for driving the mounting bracket to move in the direction of the X, Y, Z axis; the Z axis is vertical, the X axis is vertical to the conveying direction of the conveying track, and the Y axis is parallel to the conveying direction of the conveying track.
In this embodiment, still be equipped with tray inductive switch in the frame, tray inductive switch is used for the response to be blockked the tray that stops. Still be equipped with the material in the frame and examine the switch, the material is examined the switch and is used for responding to being blocked the IGBT module on keeping off the tray that stops. The tray lifting column and the IGBT module supporting column of the combined positioning and supporting device are both positioned between the two conveying single rails.
The ceramic sheet greasing device of the IGBT module of the present embodiment specifically works as follows:
the IGBT module is provided with a ceramic plate and is positioned on the tray through a positioning pin on the tray, and specifically, the IGBT module is provided with a fabrication hole which is matched with the positioning pin; the tray is conveyed by the conveying track.
In the process of conveying the tray along the conveying track, after the tray on the conveying track is stopped by the blocking piece, the second lifting execution device of the combined type lifting positioning and supporting device lifts the tray lifting column, jacks up the tray stopped by the blocking piece and enables the tray to abut against the tray positioning block, and therefore the tray is separated from the conveying track and fixed; the second lifting execution device lifts the IGBT module support column to jack up the IGBT module positioned on the tray, so that the IGBT module is supported on the IGBT module support column;
then, the silicone grease coating device coats silicone grease on the ceramic wafer on the IGBT module supported on the IGBT module support column; thus, although a plurality of trays are sequentially distributed on the conveying track, each IGBT module is positioned on one tray; when the IGBT module on each tray is coated with silicone grease, the trays are separated from the conveying track and fixed, so that the influence of the conveying track on the silicone grease spraying process can be avoided; more importantly, when the IGBT module on each tray is coated with silicone grease, the IGBT module is supported on the IGBT module support column (namely, when the IGBT module on each tray on the conveying track is coated with silicone grease, the IGBT module is supported and positioned by the same IGBT module support column), so that the problem that the silicone grease coating quality of the ceramic chip is influenced due to the position deviation of the ceramic chip spraying surface of the IGBT module caused by the positioning of the IGBT module by adopting different trays in the existing IGBT module assembly line can be effectively solved;
then, the second lifting execution device drives the tray lifting column and the IGBT module support column to descend, the sprayed IGBT module is placed on the tray again and positioned, and the tray is placed on the conveying track again; then the first lifting execution device drives the blocking piece to descend, the tray of the well-sprayed IGBT module is released, and the tray is conveyed to the next station through the conveying rail; and finally, the first lifting execution device drives the blocking piece to move upwards and reset so as to prepare for blocking the next tray.
Further, as shown in fig. 1, fig. 2, and fig. 3, the combined positioning and supporting device further includes a lifting platform 7.5 located below the conveying track, a first vertical guide sleeve 7.6 disposed on the frame and located above the lifting platform, a floating plate 7.7 located above the first vertical guide sleeve, and a sliding guide rod 7.8 disposed on the floating plate and slidably engaged with the first vertical guide sleeve. The second lifting execution device comprises a lifting cylinder arranged on the rack, and the lifting cylinder is used for lifting the lifting platform. The tray lifting column 7.2 comprises a vertical sleeve 7.21 fixed on the lifting platform, a sliding lifting column 7.22 sliding along the vertical sleeve and a compression spring 7.23 arranged in the vertical sleeve. The compression spring is positioned below the sliding lifting column and used for supporting the sliding lifting column; specifically, the lower extreme of vertical sheathed tube is equipped with the pull rod via hole, and the upper end that the post was lifted in the slip is located vertical sheathed tube top, and the lower extreme that the post was lifted in the slip is located vertical sheathed tube, and the lower extreme that the post was lifted in the slip is equipped with down to extend and is pull rod 7.24, and the lower extreme of pull rod passes the pull rod via hole, and the lower extreme of pull rod is equipped with pull rod dog 7.25, and compression spring cover is established on the pull rod, and compression spring's lower extreme supports on vertical sheathed tube inner bottom surface, and compression spring's upper end supports on the lower terminal surface that the post was lifted in the slip. The floating flat plate is supported at the upper end of the first vertical guide sleeve, the sliding guide rod is positioned above the lifting platform, the IGBT module support column is arranged on the floating flat plate, and the support column through hole is formed in the tray.
In this embodiment, the rack is further provided with a second vertical guide sleeve 7.9, and the sliding lifting column passes through the second vertical guide sleeve and slides along the second vertical guide sleeve.
After the tray is stopped by the blocking piece, the lifting cylinder drives the lifting platform to ascend, the lifting platform drives the tray lifting column to ascend at first, and the tray stopped by the blocking piece is jacked until the tray abuts against the tray positioning block; and then, the lifting cylinder overcomes the elastic force of the compression spring and compresses the compression spring to drive the lifting platform to continuously ascend, so that the floating flat plate and the IGBT module supporting column are driven to ascend together through the sliding guide rod, the IGBT module positioned on the tray is jacked up, and the IGBT module is supported on the IGBT module supporting column.
In the existing mechanical structure, two parts which have different actions and different action displacement strokes are generally respectively driven by a driving part, because the tray lifting column is used for jacking up the tray, the IGBT module supporting column is used for jacking up the IGBT module, and the lifting stroke of the tray lifting column is different from the lifting stroke of the IGBT module supporting column, therefore, in the existing mechanical structure, the tray lifting column and the IGBT module supporting column need to be lifted by the air cylinders respectively (namely the tray lifting column corresponds to one air cylinder, and the IGBT module supporting column corresponds to one air cylinder), and are lifted by the air cylinders respectively, so that an operator needs to operate according to a standard operation sequence during operation, after the tray is stopped by the blocking piece, the air cylinder of the tray lifting column needs to be pressed down first, and the tray is jacked up by the tray lifting column, so that the tray is separated from the conveying track and is fixed; then, pressing down the air cylinder of the IGBT module support column, jacking the IGBT module positioned on the tray, and enabling the IGBT module to be supported on the IGBT module support column; if the operation sequence is wrong, firstly pressing down the air cylinder of the IGBT module support column to separate the IGBT module on the tray from the positioning pin on the tray, and then pressing down the air cylinder of the tray lifting column, in the process, the position of the tray is likely to deviate under the influence of the transmission of the conveying track, after the silicone grease is sprayed, the IGBT module support column descends, and when the IGBT module is placed on the tray, the positioning pin cannot be inserted into the technical hole of the IGBT module due to the deviation of the position of the tray, so that the positioning of the IGBT module on the tray fails;
similarly, after the silicone grease is sprayed, the operation is also required to be carried out according to the standard operation sequence, the air cylinder of the support column of the IGBT module is required to be pressed down, and the sprayed IGBT module is placed and positioned on the tray again; then the cylinder of the tray lifting column is pressed down, if the operation sequence is wrong, the cylinder of the tray lifting column is pressed down first, the tray is placed on the conveying track first, then the cylinder of the IGBT module support column is pressed down, and the IGBT module is placed down;
therefore, according to the existing mechanical structure, the tray lifting column and the IGBT module supporting column need to be lifted by adopting air cylinders respectively, so that the problems that due to negligence of an operator, the operation sequence is wrong, a positioning pin cannot be inserted into a technical hole of the IGBT module, and the positioning of the IGBT module on the tray fails can easily occur; in order to solve the problem, the scheme is provided with a special combined positioning and supporting device which adopts the same lifting cylinder to realize different lifting requirements of a tray lifting column and an IGBT module supporting column so as to solve the problem, in particular,
after the tray is stopped by the blocking piece, the lifting cylinder drives the lifting platform to ascend, the lifting platform drives the tray lifting column to ascend, and the tray stopped by the blocking piece is jacked until the tray abuts against the tray positioning block; then, the lifting cylinder overcomes the elastic force of the compression spring and compresses the compression spring to drive the lifting platform to continuously ascend, so that the floating flat plate and the IGBT module supporting column are driven to ascend together through the sliding guide rod, the IGBT module positioned on the tray is jacked up, and the IGBT module is supported on the IGBT module supporting column; then, the silicone grease coating device coats silicone grease on the ceramic wafer on the IGBT module supported on the IGBT module support column; similarly, after the silicone grease is sprayed, the lifting air cylinder drives the lifting platform to descend, in the process, the IGBT module support column firstly descends, and the sprayed IGBT module is placed and positioned on the tray again; then, after the compression spring is reset, specifically, after the pull rod stop block abuts against the lower end of the vertical sleeve, the tray lifting column descends, and the tray is placed on the conveying track; so, realize tray through same lift cylinder and lift the different lift needs of post and IGBT module support column, not only greatly simplified operation, can avoid moreover because of operator's carelessness, the operation order is makeed mistakes, and appears the locating pin and will unable in the fabrication hole that inserts the IGBT module for the problem of the location failure of IGBT module on the tray.
Furthermore, the combined positioning and supporting device further comprises an upper limiting block and a lower limiting block which are arranged on the rack and used for limiting the lifting platform, and the lifting platform is positioned between the upper limiting block and the lower limiting block. When the lifting platform abuts against the upper limiting block, the tray is jacked up and abuts against the tray positioning block, and the IGBT module is supported on the IGBT module supporting column; when the lifting platform is abutted to the lower limiting block, the IGBT module is supported and positioned on the tray, and the tray is supported on the conveying track.
Furthermore, the upper end of the IGBT module support column is provided with a positioning hole for matching with a limit pin on the IGBT module. So, after IGBT module support column jack-up IGBT module, can fix a position the IGBT module through spacer pin and locating hole cooperation.
Further, as shown in fig. 1, the silicone grease coating device further includes a laser sensor 6.4 disposed on the mounting bracket, and the laser sensor is used for detecting the position of the ceramic wafer on the IGBT module. Therefore, before spraying the silicone grease, the position of the ceramic chip on the IGBT module can be detected through a laser sensor, for example, the flatness and the position height of the spraying surface of the ceramic chip, the position of the ceramic chip on the IGBT module is unqualified and the ceramic chip is not sprayed; and the positions of the ceramic plates on the IGBT module are qualified, and spraying is carried out, so that the spraying quality is ensured.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and all simple modifications, alterations and equivalents of the above embodiments according to the technical spirit of the present invention are still within the protection scope of the technical solution of the present invention.

Claims (8)

1. The utility model provides a potsherd fat liquoring device of IGBT module which characterized by includes:
a frame;
the tray is used for placing the IGBT module, and positioning pins are arranged on the tray and used for positioning the IGBT module;
the trays are sequentially distributed along the conveying track, and the trays are supported on the conveying track and conveyed through the conveying track;
the tray stopping device comprises a blocking piece and a first lifting execution device which is arranged on the rack and used for lifting the blocking piece, and the blocking piece is used for stopping the tray;
the combined lifting positioning and supporting device comprises a tray lifting column, an IGBT module supporting column, a tray positioning block and a second lifting executing device, wherein the tray positioning block is positioned above the conveying track, the second lifting executing device is used for lifting the tray lifting column so as to jack up a tray stopped by a blocking piece and enable the tray to be abutted against the tray positioning block, and the second lifting executing device is used for lifting the IGBT module supporting column so as to jack up an IGBT module positioned on the tray and enable the IGBT module to be supported on the IGBT module supporting column;
the silicone grease coating device is arranged on the rack and used for coating silicone grease on the ceramic wafer on the IGBT module supported on the IGBT module support column;
the combined lifting positioning and supporting device further comprises a lifting platform, a first vertical guide sleeve, a floating flat plate and a sliding guide rod, wherein the lifting platform is positioned below the conveying track, the first vertical guide sleeve is arranged on the rack and positioned above the lifting platform, the floating flat plate is positioned above the first vertical guide sleeve, the sliding guide rod is arranged on the floating flat plate and is in sliding fit with the first vertical guide sleeve, the second lifting execution device comprises a lifting cylinder arranged on the rack, the lifting cylinder is used for lifting the lifting platform, the tray lifting column comprises a vertical sleeve fixed on the lifting platform, a sliding lifting column sliding along the vertical sleeve and a compression spring arranged in the vertical sleeve, and the compression spring is positioned below the sliding lifting column and used for supporting the sliding lifting column; the floating flat plate is supported at the upper end of the first vertical guide sleeve, the sliding guide rod is positioned above the lifting platform, the IGBT module support column is arranged on the floating flat plate, and the tray is provided with a support column through hole;
after the tray is stopped by the blocking piece, the lifting cylinder drives the lifting platform to ascend, the lifting platform drives the tray lifting column to ascend at first, and the tray stopped by the blocking piece is jacked until the tray abuts against the tray positioning block; and then, the lifting cylinder overcomes the elastic force of the compression spring and compresses the compression spring to drive the lifting platform to continuously ascend, so that the floating flat plate and the IGBT module supporting column are driven to ascend together through the sliding guide rod, the IGBT module positioned on the tray is jacked up, and the IGBT module is supported on the IGBT module supporting column.
2. The ceramic plate greasing device for the IGBT module as claimed in claim 1, wherein the lower end of the vertical sleeve is provided with a pull rod through hole, the upper end of the sliding lifting column is located above the vertical sleeve, the lower end of the sliding lifting column is located in the vertical sleeve, the lower end of the sliding lifting column is provided with a pull rod extending downwards, the lower end of the pull rod passes through the pull rod through hole, the lower end of the pull rod is provided with a pull rod stop block, the compression spring is sleeved on the pull rod, the lower end of the compression spring abuts against the inner bottom surface of the vertical sleeve, and the upper end of the compression spring abuts against the lower end surface of the sliding lifting column.
3. The ceramic wafer greasing device for the IGBT module according to claim 1 or 2, wherein the combined lifting, positioning and supporting device further comprises an upper limiting block and a lower limiting block which are arranged on the frame and used for limiting a lifting platform, and the lifting platform is positioned between the upper limiting block and the lower limiting block.
4. The ceramic plate greasing device for the IGBT module according to claim 1 or 2, wherein the upper end of the IGBT module support column is provided with a positioning hole for matching with a limit pin on the IGBT module.
5. The ceramic wafer greasing device for the IGBT module as claimed in claim 1 or 2, wherein the greasing device comprises a mounting bracket, a glue spray head arranged on the mounting bracket and a manipulator arranged on the frame for moving the mounting bracket.
6. The ceramic wafer greasing device for the IGBT module as claimed in claim 5, wherein the greasing device further comprises a laser sensor disposed on the mounting bracket, the laser sensor being used to detect the position of the ceramic wafer on the IGBT module.
7. The ceramic plate greasing device for the IGBT module as claimed in claim 1 or 2, wherein a tray inductive switch is further arranged on the frame, and the tray inductive switch is used for sensing the tray stopped by the blocking piece.
8. The ceramic plate greasing device for the IGBT module as claimed in claim 1 or 2, wherein a material detection switch is further arranged on the frame, and the material detection switch is used for sensing the IGBT module on the tray stopped by the blocking piece.
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