CN218096673U - Electric card module and electric card refrigerating device - Google Patents
Electric card module and electric card refrigerating device Download PDFInfo
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- CN218096673U CN218096673U CN202220901309.8U CN202220901309U CN218096673U CN 218096673 U CN218096673 U CN 218096673U CN 202220901309 U CN202220901309 U CN 202220901309U CN 218096673 U CN218096673 U CN 218096673U
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 238000001816 cooling Methods 0.000 claims description 26
- 238000006073 displacement reaction Methods 0.000 claims description 26
- 230000000694 effects Effects 0.000 claims description 19
- 238000009413 insulation Methods 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 16
- 230000005611 electricity Effects 0.000 abstract description 8
- 238000005057 refrigeration Methods 0.000 abstract description 8
- 238000002360 preparation method Methods 0.000 abstract description 6
- 230000000712 assembly Effects 0.000 abstract description 4
- 238000000429 assembly Methods 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 description 16
- 239000010408 film Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009533 lab test Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application relates to the technical field of refrigeration of electronic equipment, and discloses an electric card module which comprises an electric card assembly and a plurality of electric card assemblies, wherein the electric card assembly comprises an electric card element and film electrodes attached to two opposite side surfaces of the electric card element; the heat conduction assembly comprises a first heat conduction element and a second heat conduction element which are oppositely arranged, and a hollow-out part is formed on the first heat conduction element and/or the second heat conduction element; the electric clamping component is arranged between the first heat conducting element and the second heat conducting element, the electric clamping component is in heat conducting connection with the heat conducting component, and the film electrode is embedded in the hollow portion. The first heat conducting element and/or the second heat conducting element are/is provided with the hollow parts, the film electrodes are embedded in the hollow parts, direct heat conducting contact between the electric card element and the heat conducting assembly can be achieved, heat conducting efficiency between the electric card element and the heat conducting assembly is improved, the film electrodes can be limited through the first heat conducting element and/or the second heat conducting element, stability of the whole structure of the electric card module is guaranteed, and industrial preparation and application are achieved. The application also discloses an electricity card refrigerating plant.
Description
Technical Field
The application relates to the technical field of electronic equipment refrigeration, for example, to an electric card module and an electric card refrigeration device.
Background
The novel refrigeration technology based on the electrocaloric effect does not need to use a compressor and a refrigerant required by a common refrigerator. When the electric field on the electrocaloric material is applied or removed, the material will generate heat absorption or heat release, i.e. electrocaloric effect. At present, an electric card module adopted by an electric card refrigerating device is in a single block material form, conductive liquid is smeared on two sides of the block electric card material, and a bonding lead is connected into a circuit, so that an electric field is applied to the block electric card material. However, the electric card module has low refrigerating capacity and low heat transfer efficiency, only exists in a laboratory test stage, and cannot realize industrialized preparation.
SUMMERY OF THE UTILITY MODEL
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides an electric card module and an electric card refrigerating device, which are used for improving heat transfer efficiency and realizing industrial preparation and application.
In some embodiments, the electrical card module comprises:
the electric card assembly comprises an electric card element and film electrodes attached to two opposite side surfaces of the electric card element;
the heat conduction assembly comprises a first heat conduction element and a second heat conduction element which are oppositely arranged, and a hollow part is formed on the first heat conduction element and/or the second heat conduction element;
the electric card component is arranged between the first heat conducting element and the second heat conducting element, the electric card component is in heat conducting connection with the heat conducting component, and the film electrode is embedded in the hollow portion.
In some embodiments, the first heat-conducting element has a side area greater than or equal to a side area of the electrical card element, and the second heat-conducting element has a side area greater than or equal to a side area of the electrical card element;
under the condition that the side areas of the first heat conducting element and the second heat conducting element are larger than the side area of the electric card element, a heat insulation pad is arranged between the first heat conducting element and the second heat conducting element so as to separate the first heat conducting element from the second heat conducting element.
In some embodiments, the thickness of the insulation mat is less than or equal to the thickness of the electrical card element.
In some embodiments, the first and/or second heat conducting element comprises:
a body for thermally conductive connection with the electrical card element;
and the extension part extends outwards from part of the edge of the main body to extend out and is connected with the piezoelectric displacement driver, so that the heat conduction assembly can move in a reciprocating manner under the driving of the piezoelectric displacement driver.
In some embodiments, where the first and second thermally conductive elements each include the extension, the thermal insulation pad is disposed between the extension of the first thermally conductive element and the extension of the second thermally conductive element.
In some embodiments, the pins of the thin film electrodes extend through the thermal insulating mat to connect with an external power source.
In some embodiments, the electric card cooling device comprises the electric card module provided in the previous embodiments, and the electric card module is used for being switched on or off with an external power supply to generate an electric card effect.
In some embodiments, the electric card cooling device further comprises:
the first heat exchange assembly is arranged on one side of the electric card module and is in heat conduction connection with the first heat conducting fin of the electric card module so as to transfer heat of the electric card module;
the second heat exchange assembly is arranged on the other side of the electric card module and is in heat conduction connection with the second heat conducting fins of the electric card module so as to transfer the cold energy of the electric card module;
the piezoelectric displacement driver is in driving connection with the heat conducting fin assembly of the electric card module;
the first heat exchange assembly and the second heat exchange assembly are spaced by a preset distance, so that the piezoelectric displacement driver drives the electric clamp module to move between the first heat exchange assembly and the second heat exchange assembly in a reciprocating mode.
In some embodiments, when the piezoelectric displacement driver drives the electric card module to be attached to the first heat exchange assembly for heat conduction, the electric card module is electrified to release heat, and the first heat exchange assembly transfers heat generated by the electric card module;
under the condition that the piezoelectric displacement driver drives the electric card module and the second heat exchange assembly to be attached to each other for heat conduction, the electric card module is powered off and absorbs heat, and the second heat exchange assembly transmits cold energy generated by the electric card module.
In some embodiments, the first heat exchange assembly and/or the second heat exchange assembly comprises:
the water circulation device is used for transferring the heat or cold of the electric card module;
and the heat exchanger is connected with the water circulation device so as to emit the heat transferred by the water circulation device or refrigerate by utilizing the cold transferred by the water circulation device.
The electric card module and the electric card refrigerating device provided by the embodiment of the disclosure can realize the following technical effects:
the thin film electrode is attached to the side surface of the electric card element so that the electric card element generates an electric card effect under the condition of power-on/power-off to release/absorb heat; when the electric card element releases or absorbs heat, the heat/cold quantity is respectively transmitted outwards through the first heat conduction element and the second heat conduction element; the first heat conducting element and/or the second heat conducting element are/is provided with the hollow parts, the film electrodes are embedded in the hollow parts, direct heat conducting contact between the electric card element and the heat conducting assembly can be achieved, heat conducting efficiency between the electric card element and the heat conducting assembly is improved, the film electrodes can be limited through the first heat conducting element and/or the second heat conducting element, stability of the whole structure of the electric card module is guaranteed, the electric card module is packaged for use, and industrial preparation and application are achieved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:
fig. 1 is an exploded schematic view of the electrical card module provided by an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of the first/second heat-conducting element provided in the embodiment of the present disclosure;
fig. 3 is a schematic diagram illustrating a partial explosion of the electric card cooling device provided by an embodiment of the present disclosure;
FIG. 4 is a schematic view of a partial structure of the electric card cooling device provided by the embodiment of the disclosure;
fig. 5 is a schematic diagram of a frame of the electric card cooling device provided by the embodiment of the disclosure;
fig. 6 is a schematic diagram illustrating the variation of the heat/cold capacity of the electric card refrigeration device in the power on/off condition according to the embodiment of the disclosure.
Reference numerals are as follows:
10: an electrical card assembly; 101: an electrical card element; 102: a thin film electrode; 201: a first heat conducting element; 202: a second heat conducting element; 203: a hollow-out section; 204: a main body; 205: an extension portion; 30: a heat insulating pad; 40: a piezoelectric displacement driver; 50: a first heat exchange assembly; 501: a first water cooling head; 502: a first water pump; 503: a first heat exchanger; 504: a fan; 60: a second heat exchange assembly; 601: a second water cooling head; 602: a second water pump; 603: a second heat exchanger; 100: and a power card module.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and their embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.
In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.
The term "plurality" means two or more, unless otherwise specified.
In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. For example, a and/or B, represents: a or B, or A and B.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.
With reference to fig. 1 and fig. 2, an electrical card module according to an embodiment of the present disclosure includes an electrical card assembly 10 and a heat conducting assembly, where the electrical card assembly 10 includes an electrical card element 101 and thin film electrodes 102 attached to two opposite sides of the electrical card element 101; the heat conducting assembly comprises a first heat conducting element 201 and a second heat conducting element 202 which are oppositely arranged, and the first heat conducting element 201 and/or the second heat conducting element 202 are/is configured with a hollow part 203; the electrical card assembly 10 is disposed between the first heat conducting element 201 and the second heat conducting element 202, the electrical card element 101 is connected to the heat conducting assembly in a heat conducting manner, and the film electrode 102 is embedded in the hollow portion 203.
By adopting the electrical card module 100 provided by the embodiment of the disclosure, the thin film electrode 102 is attached to the side surface of the electrical card element 101, so that the electrical card element 101 generates an electrical card effect under the conditions of power-on and power-off to release/absorb heat; when the electric card element 101 releases/absorbs heat, the heat/cold is respectively transmitted outwards through the first heat conduction element 201/the second heat conduction element 202; the first heat conducting element 201 and/or the second heat conducting element 202 are/is provided with the hollow part 203, and the film electrode 102 is embedded in the hollow part 203, so that the electric card element 101 can be in direct heat conducting contact with the heat conducting component to improve the heat conducting efficiency between the electric card element and the heat conducting component, and the film electrode 102 can be limited by the first heat conducting element 201 and/or the second heat conducting element 202 to achieve the integrity of the electric card module 100, and the electric card module 100 is packaged for use, thereby realizing industrial preparation and application.
The electrical card assembly 10 is in thermally conductive connection with the thermally conductive assembly, in particular, by disposing the electrical card assembly 10 between the first and second thermally conductive elements 201, 202. In this way, in the case that the electrical card assembly 10 releases heat, the heat released by the electrical card assembly 10 is transferred to the first heat conducting element 201, and the heat is transferred to the heat sink through the first heat conducting element 201 to be dissipated. Under the condition that the electric card assembly 10 absorbs heat, the electric card assembly 10 absorbs heat for refrigeration, and transmits the cold energy to the refrigeration device through the second heat conducting element 202, so as to achieve the purpose of refrigeration.
Alternatively, electrical card element 101 may be a circular configuration, a square configuration. Wherein the specific dimensions of electrical card element 101 are tailored as desired. The electrocaloric element 101 may be made of ferroelectric material powder by proportioning, ball milling, drying, grinding, tabletting and sintering. However, the material of the electric card element 101 is not limited to be made of a ferroelectric material.
The thin film electrode 102 is attached to the surface of the electrical card element 101, and can fill and correct the uneven surface of the electrical card element 101, so that the outer surface of the electrical card assembly 10 is flat, the effective contact area between the thermal card assembly and the thermal conductive assembly is increased, and the heat transfer efficiency between the thermal card assembly and the thermal conductive assembly is improved.
In practical applications, the first heat conducting element 201 and the second heat conducting element 202 may be configured with the hollow portion 203, or alternatively, the hollow portion 203 may be configured. In the case where the first and second heat conductive elements 201 and 202 are each configured with the hollowed-out portion 203, the connection stability between the heat conductive assembly and the electric card assembly 10 can be improved. In the case that the first heat conducting element 201 and the second heat conducting element 202 alternatively configure the hollow portion 203, the contact area between the heat conducting element not configuring the hollow portion 203 and the electrical card assembly 10 is increased, thereby improving the heat transfer efficiency therebetween.
For convenience of description and distinction, the thin film electrodes 102 on both sides of the electrical card element 101 are defined as a first thin film electrode and a second thin film electrode, respectively. The first thin film electrode is embedded in the hollow part 203 of the first heat conducting element 201 and is connected with the first heat conducting element 201 in a heat conducting manner; the second thin film electrode is embedded in the hollow portion 203 of the second heat conducting element 202 and is connected to the second heat conducting element 202 in a heat conducting manner. The first film electrode and the second film electrode are respectively provided with a pin for an external power supply.
In practical applications, in order to improve the heat conduction efficiency and ensure the safety, the first heat conduction element 201 and the second heat conduction element 202 are made of an insulating material with high heat conduction. Such as aluminum nitride, silicon carbide, gallium nitride, boron nitride, aluminum oxide, and the like. When the electrical card assembly 10 is arranged between the first heat conducting element 201 and the second heat conducting element 202 for encapsulation, an insulating sealant is filled between the first heat conducting element 201 and the second heat conducting element 202 along the circumferential direction of the electrical card assembly 10, so that the insulation effect can be achieved, and the heat preservation effect can be achieved.
Optionally, the first heat conducting element 201 is of a sheet like structure. Optionally, the second heat conducting element 202 is in a sheet structure.
Optionally, the area of the side surface of the first heat conducting element 201 is greater than or equal to the area of the side surface of the electrical card element 101, and the area of the side surface of the second heat conducting element 202 is greater than or equal to the area of the side surface of the electrical card element 101; in the case that the lateral areas of the first heat conducting element 201 and the second heat conducting element 202 are both larger than the lateral area of the electrical card element 101, the heat insulating pad 30 is disposed between the first heat conducting element 201 and the second heat conducting element 202 to separate the first heat conducting element 201 and the second heat conducting element 202.
It should be noted that the "side surface area" herein refers to the side surface area of the first heat conducting element 201 on the opposite side to the electrical card element 101.
Under the condition that the area of the side surface of the first heat conducting element 201 is greater than or equal to the area of the side surface of the electrical card element 101 and the area of the side surface of the second heat conducting element 202 is greater than or equal to the area of the side surface of the electrical card element 101, the heat or the cold transferred from the electrical card element 101 can be rapidly transferred to the first heat conducting element 201 or the second heat conducting element 202, so that the heat or the cold is separated from the electrical card element 101.
Under the condition that the side areas of the first heat conducting element 201 and the second heat conducting element 202 are both larger than the side area of the electrical card element 101, the heat insulating pad 30 is arranged between the first heat conducting element 201 and the second heat conducting element 202, so that heat or cold can be effectively prevented from being mutually transmitted between the first heat conducting element 201 and the second heat conducting element 202, and further, the loss of the cold is reduced.
Optionally, the thickness of insulation blanket 30 is less than or equal to the thickness of electrical card element 101.
By setting the thickness of the heat insulating pad 30 to be less than or equal to the thickness of the electrical card element 101, it can be avoided that the first heat conducting element 201 and the second heat conducting element 202 are jacked up relative to the electrical card element 101 due to the excessive thickness of the heat insulating pad 30, so that the contact area between the heat conducting element and the electrical card element 101 is reduced, and the heat transfer efficiency between the heat conducting element and the electrical card element 101 is affected.
In the case where the thickness of the heat insulating pad 30 is less than or equal to the thickness of the electrical card element 101, not only effective heat insulation between the first heat conducting element 201 and the second heat conducting element 202 can be achieved, but also the strength and rigidity of the electrical card module 100 can be enhanced by the heat insulating pad 30 after the electrical card module 100 is packaged for subsequent use.
Optionally, first heat conducting element 201 and/or second heat conducting element 202 comprise a main body 204 and an extension 205, main body 204 being for heat conducting connection with electrocaloric element 101; extension 205 extends outwardly from a portion of the edge of body 204 to extend beyond and connect to piezoelectric displacement actuator 40 such that the thermally conductive assembly is driven by piezoelectric displacement actuator 40 to reciprocate.
The extension 205 is coplanar with the main body 204 to ensure that the moving distance and corresponding position of the main body 204 and the electrical card assembly 10 are determined by the displacement of the driving extension 205 and the position of the extension 205.
In practical applications, the structure of each of the first heat conducting element 201 and the second heat conducting element 202 including the main body 204 and the extension portion 205 is a preferred structural design. The extending direction and the extending length of the extending portion 205 of the first heat conducting element 201 and the extending portion 205 of the second heat conducting element 202 are the same, so as to ensure the aesthetic property of the electrical card module 100.
Optionally, in case that both the first and second heat conducting elements 201 and 202 comprise the extension portion 205, an insulating pad 30 is provided between the extension portion 205 of the first heat conducting element 201 and the extension portion 205 of the second heat conducting element 202.
In the case that the heat insulation pad 30 is disposed between the extension portion 205 of the first heat conducting element 201 and the extension portion 205 of the second heat conducting element 202, not only can effective heat insulation between the first heat conducting element 201 and the second heat conducting element 202 at the extension portion 205 be achieved, but also after the electrical card module 100 is packaged, the strength and rigidity of the electrical card module 100 can be enhanced by the heat insulation pad 30, which facilitates the piezoelectric displacement driver 40 to drive the connection extension portion 205 to move.
In practical applications, the size of the thermal insulation pad 30 can be set according to practical needs, and is not limited herein.
Optionally, the pins of the film electrode 102 extend through the insulation mat 30 for connection to an external power source.
The pins of the film electrode 102 extend through the insulating mat 30 to prevent contact with the thermally conductive assembly, thereby affecting the useful life of the pins. The pins of the thin film electrodes 102 penetrate through the heat insulation pad 30, and can also play a role of limiting protection through the heat insulation pad 30 so as to prevent the pins from being bent or the pins of the two thin film electrodes 102 from being contacted, thereby influencing the on-off of the electrical card element 101 and further influencing the electrical card effect generated by the electrical card element 101.
With reference to fig. 1 to 6, an embodiment of the present disclosure provides an electric card cooling device, including the electric card module 100 provided in the foregoing embodiment, where the electric card module 100 is configured to be switched on and off with an external power source to generate an electric card effect. The electrical card module 100 comprises an electrical card assembly 10 and a heat conducting assembly, wherein the electrical card assembly 10 comprises an electrical card element 101 and film electrodes 102 attached to two opposite side surfaces of the electrical card element 101; the heat conducting assembly comprises a first heat conducting element 201 and a second heat conducting element 202 which are oppositely arranged, and a hollow-out part 203 is formed on the first heat conducting element 201 and/or the second heat conducting element 202; the electrical card assembly 10 is disposed between the first heat conducting element 201 and the second heat conducting element 202, the electrical card element 101 is connected to the heat conducting element in a heat conducting manner, and the film electrode 102 is embedded in the hollow portion 203.
By adopting the electric card refrigerating device provided by the embodiment of the disclosure, the electric card module 100 and an external power supply generate an electric card effect through power-on and power-off, so as to release/absorb heat, the generated cold quantity is separated from the electric card module 100 under the condition that the electric card module 100 absorbs heat and is transmitted outwards, and the electric card refrigerating device realizes the purpose of refrigerating by utilizing the transmitted cold quantity. The thin film electrode 102 is attached to the side surface of the electrical card element 101, so that the electrical card element 101 generates an electrical card effect under the conditions of power-on and power-off to release/absorb heat; when the electric card element 101 releases/absorbs heat, the heat/cold is respectively transmitted outwards through the first heat conduction element 201/the second heat conduction element 202; the first heat conducting element 201 and/or the second heat conducting element 202 are/is provided with the hollow part 203, and the film electrode 102 is embedded in the hollow part 203, so that the electric card element 101 can be in direct heat conducting contact with the heat conducting component to improve the heat conducting efficiency between the electric card element and the heat conducting component, and the film electrode 102 can be limited by the first heat conducting element 201 and/or the second heat conducting element 202 to achieve the integrity of the electric card module 100, and the electric card module 100 is packaged for use, thereby realizing industrial preparation and application.
Optionally, the electric card cooling device further includes a first heat exchange assembly 50, a second heat exchange assembly 60, and a piezoelectric displacement driver 40, where the first heat exchange assembly 50 is disposed at one side of the electric card module 100 and is in heat conduction connection with the first heat conducting fin of the electric card module 100 to transfer heat of the electric card module 100; the second heat exchange assembly 60 is arranged on the other side of the electric card module 100 and is in heat conduction connection with the second heat conducting fins of the electric card module 100 to transfer the cold energy of the electric card module 100; the piezoelectric displacement driver 40 is in driving connection with the heat conducting sheet assembly of the electric card module 100; the first heat exchange assembly 50 and the second heat exchange assembly 60 are spaced by a preset distance, and the preset distance allows the piezoelectric displacement driver 40 to drive the electric card module 100 to reciprocate between the first heat exchange assembly 50 and the second heat exchange assembly 60 and satisfies the heat conduction connection between the electric card module 100 and the first heat exchange assembly 50 or the second heat exchange assembly 60.
When electricity of electricity card module 100 is released heat, electricity card module 100 is connected with first heat exchange assemblies 50 heat conduction, and the heat transfer that electricity card module 100 produced carries out the heat dissipation cooling to first heat exchange assemblies 50. When the electric card module 100 is powered off and absorbs heat, the electric card module 100 is in heat conduction connection with the second heat exchange assembly 60, and cold energy generated by the electric card module 100 is transmitted to the second heat exchange assembly 60 and is transmitted to associated equipment through the second heat exchange assembly 60 to be refrigerated. The electric card module 100 is driven by the piezoelectric displacement driver 40 to reciprocate between the first heat exchange assembly 50 and the second heat exchange assembly 60, so that the effective separation and utilization of heat and cold generated by the electric card module 100 in the electric card effect are realized.
Optionally, under the condition that the piezoelectric displacement driver 40 drives the electric card module 100 to adhere to the first heat exchange assembly 50 for heat conduction, the electric card module 100 is powered on for heat release, and the first heat exchange assembly 50 transfers heat generated by the electric card module 100; under the condition that the piezoelectric displacement driver 40 drives the electric card module 100 to be attached to the second heat exchange assembly 60 for heat conduction, the electric card module 100 is powered off to absorb heat, and the second heat exchange assembly 60 transmits cold energy generated by the electric card module 100. In this way, an effective separation of the heat and cold generated by the electric card module 100 in the electric card effect can be achieved. In addition, the first heat exchange assembly 50 and the second heat exchange assembly 60 work alternately, so that sufficient time can be provided for heat dissipation of transmitted heat and transmission and utilization of transmitted cold.
Optionally, the first heat exchange assembly 50 and/or the second heat exchange assembly 60 comprise a water circulation device and a heat exchanger, wherein the water circulation device is used for transferring heat or cold of the electric card module 100; the heat exchanger is connected with the water circulation device to emit heat transferred by the water circulation device or refrigerate by using cold transferred by the water circulation device.
The water in the water circulation device flows through the electric card module 100, receives the heat or cold generated by the electric card module 100, transmits the heat or cold to the corresponding heat exchanger, and then performs the next circulation.
The water circulation device comprises a water cooling head, a water pump and a pipeline. The pipeline is connected in series with the water cooling head and the water pump, and the water pump drives water in the pipeline to flow so as to achieve the purpose of transferring heat or cold carried by the water outwards. Part of pipelines of the water circulation device are internally arranged or wound on the heat exchanger, and water in the pipelines exchanges heat with the heat exchanger. Wherein, the water-cooling head is used for being connected with the heat conduction of electricity card module 100, can realize high-efficient heat transfer with electricity card module 100 through the water-cooling head, improves heat exchange assemblies and electricity card module 100's heat transfer efficiency.
In the case where the first heat exchange assembly 50 and the second heat exchange assembly 60 each include a water circulation device and a heat exchanger, for convenience of description and distinction, the first heat exchange assembly 50 is defined to include a first water cooling head 501, a first water pump 502, and a first heat exchanger 503, and the second heat exchange assembly 60 is defined to include a second water cooling head 601, a second water pump 602, and a second heat exchanger 603. The first water-cooling head 501 is connected with the second water-cooling head 601 through a fastener, and a preset distance is arranged between the first water-cooling head 501 and the second water-cooling head 601, so that the piezoelectric displacement driver 40 drives the electric clamp module 100 to move between the first water-cooling head 501 and the second water-cooling head 601 in a reciprocating manner.
Optionally, the first heat exchange assembly 50 further includes a fan 504, the fan 504 is disposed on one side of the first heat exchanger 503, and an airflow blown by the fan 504 flows through the first heat exchanger 503 to improve the heat dissipation efficiency of the first heat exchanger 503.
The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. An electrical card module, comprising:
the electric card assembly comprises an electric card element and film electrodes attached to two opposite side surfaces of the electric card element;
the heat conduction assembly comprises a first heat conduction element and a second heat conduction element which are oppositely arranged, and a hollow part is formed on the first heat conduction element and/or the second heat conduction element;
the electric card component is arranged between the first heat conducting element and the second heat conducting element, the electric card component is in heat conducting connection with the heat conducting component, and the film electrode is embedded in the hollow portion.
2. The electrical card module of claim 1,
the side surface area of the first heat conduction element is larger than or equal to that of the electric card element, and the side surface area of the second heat conduction element is larger than or equal to that of the electric card element;
under the condition that the side areas of the first heat conducting element and the second heat conducting element are larger than the side area of the electric card element, a heat insulation pad is arranged between the first heat conducting element and the second heat conducting element so as to separate the first heat conducting element from the second heat conducting element.
3. The electrical card module of claim 2,
the thickness of the heat insulation pad is smaller than or equal to the thickness of the electric card element.
4. The electrical card module according to claim 2, characterized in that the first and/or the second heat conducting element comprises:
a body for thermally conductive connection with the electrical card element;
and the extension part extends outwards from part of the edge of the main body to extend out and is connected with the piezoelectric displacement driver, so that the heat conduction assembly moves back and forth under the driving of the piezoelectric displacement driver.
5. The electrical card module of claim 4,
in a case where the first and second heat-conducting elements each include the extension portion, the heat insulating pad is disposed between the extension portion of the first heat-conducting element and the extension portion of the second heat-conducting element.
6. The electrical card module according to any of claims 2 to 5,
and pins of the film electrodes penetrate through the heat insulation pad to be connected with an external power supply.
7. An electrical card cooling apparatus comprising an electrical card module as claimed in any one of claims 1 to 6 for switching to and from an external power source to produce an electrical card effect.
8. The electric card cooling device of claim 7, further comprising:
the first heat exchange assembly is arranged on one side of the electric card module and is in heat conduction connection with the first heat conducting fin of the electric card module so as to transfer heat of the electric card module;
the second heat exchange assembly is arranged on the other side of the electric card module and is in heat conduction connection with the second heat conducting fins of the electric card module so as to transfer the cold energy of the electric card module;
the piezoelectric displacement driver is in driving connection with the heat conducting fin assembly of the electric card module;
the first heat exchange assembly and the second heat exchange assembly are spaced by a preset distance, so that the piezoelectric displacement driver drives the electric clamp module to move between the first heat exchange assembly and the second heat exchange assembly in a reciprocating mode.
9. The electric card cooling device of claim 8,
under the condition that the piezoelectric displacement driver drives the electric card module to be attached to the first heat exchange assembly for heat conduction, the electric card module is electrified for heat release, and the first heat exchange assembly transmits heat generated by the electric card module;
under the condition that the piezoelectric displacement driver drives the electric card module and the second heat exchange assembly to be attached to each other for heat conduction, the electric card module is powered off and absorbs heat, and the second heat exchange assembly transmits the cold energy generated by the electric card module.
10. The electric card cooling device of claim 8, wherein the first heat exchange assembly and/or the second heat exchange assembly comprises:
the water circulation device is used for transferring the heat or cold of the electric card module;
and the heat exchanger is connected with the water circulation device so as to radiate heat transferred by the water circulation device or refrigerate by utilizing cold transferred by the water circulation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220901309.8U CN218096673U (en) | 2022-04-19 | 2022-04-19 | Electric card module and electric card refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220901309.8U CN218096673U (en) | 2022-04-19 | 2022-04-19 | Electric card module and electric card refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218096673U true CN218096673U (en) | 2022-12-20 |
Family
ID=84459883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220901309.8U Active CN218096673U (en) | 2022-04-19 | 2022-04-19 | Electric card module and electric card refrigerating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218096673U (en) |
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2022
- 2022-04-19 CN CN202220901309.8U patent/CN218096673U/en active Active
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