CN116951811A - Electric card refrigerating system and equipment - Google Patents
Electric card refrigerating system and equipment Download PDFInfo
- Publication number
- CN116951811A CN116951811A CN202210407545.9A CN202210407545A CN116951811A CN 116951811 A CN116951811 A CN 116951811A CN 202210407545 A CN202210407545 A CN 202210407545A CN 116951811 A CN116951811 A CN 116951811A
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- Prior art keywords
- heat
- electric card
- card module
- heat exchange
- exchange assembly
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- 238000012546 transfer Methods 0.000 claims abstract description 78
- 238000005057 refrigeration Methods 0.000 claims abstract description 32
- 230000000694 effects Effects 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
- 238000009413 insulation Methods 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 238000000926 separation method Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 11
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/001—Details of machines, plants or systems, using electric or magnetic effects by using electro-caloric effects
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application relates to the technical field of electronic equipment refrigeration, and discloses an electric card refrigeration system which comprises: the electric card module is used for generating an electric card effect by switching on and switching off an external power supply; the first heat exchange component is arranged on one side of the electric card module and is in heat conduction connection with the electric card module so as to exchange heat with the electric card module, transfer heat of the electric card module and dissipate heat of the electric card module; the second heat exchange component is arranged on the other side of the electric card module and is in heat conduction connection with the electric card module so as to transfer the cold energy of the electric card module; the first heat exchange assembly and the second heat exchange assembly work alternately and correspond to the power on or power off of the electric card module respectively, so that heat and cold generated by the electric card module in an electric card effect are separated. The first heat exchange assembly and the second heat exchange assembly work alternately, so that the effective separation of heat and cold generated by the electric card module is realized, the cold transferred by the second heat exchange assembly is utilized, and the purpose of industrial mass production application is realized. The application also discloses equipment.
Description
Technical Field
The application relates to the technical field of electronic equipment refrigeration, in particular to an electric card refrigeration system and equipment.
Background
The novel refrigeration technology based on the electric card effect does not need to use a compressor and a refrigerant which are required by a common refrigerator. When an electric field is applied or removed from the electrocaloric material, the material will produce an endothermic or exothermic phenomenon, the electrocaloric effect. However, at present, the refrigeration technology based on the electric card effect is only based on a single electric card material to carry out a test experiment in a laboratory, and although the electric card material can generate heat/cold through applying/removing an electric field, cold and heat separation cannot be effectively realized, so that the cold quantity cannot be utilized, and further industrial mass production application cannot be carried out.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.
The embodiment of the disclosure provides an electric card refrigerating system and equipment to realize effective cold and hot separation, thereby realizing the application of generated cold energy and further realizing industrialized mass production application.
In some embodiments, the electrical card refrigeration system includes:
the electric card module is used for generating an electric card effect by switching on and switching off an external power supply;
the first heat exchange component is arranged on one side of the electric card module and is in heat conduction connection with the electric card module so as to exchange heat with the electric card module, transfer heat of the electric card module and dissipate heat of the electric card module;
the second heat exchange component is arranged on the other side of the electric card module and is in heat conduction connection with the electric card module so as to transfer the cold energy of the electric card module;
the first heat exchange assembly and the second heat exchange assembly work alternately and correspond to the power on or power off of the electric card module respectively, so that heat and cold generated by the electric card module in an electric card effect are separated.
In some embodiments, the electrical card module comprises:
the electric card assembly comprises an electric card element and film electrodes which are covered on and attached to two opposite sides of the electric card element;
the heat conduction assembly comprises a first heat conduction element and a second heat conduction element which are oppositely arranged, and the first heat conduction element and the second heat conduction element are respectively in heat conduction connection with two opposite sides of the electric card assembly so as to transfer heat with the electric card assembly.
In some embodiments, the electrical card module further comprises:
the heat insulation element is in a block or sheet structure;
the heat insulation element is provided with a hollowed-out part for accommodating the electric card assembly and the heat conduction assembly.
In some embodiments, the first heat exchange assembly comprises:
the first heat transfer element is used for being in heat conduction connection with the electric card module;
the first heat exchanger is used for radiating heat;
the first water pump assembly comprises a first water pump and a first pipeline which is communicated with the first heat transfer element and the first heat exchanger, and the first water pump is arranged on the first pipeline and controls the on-off of the first pipeline.
In some embodiments, the first heat exchange assembly further comprises:
the fan is arranged at the side part of the first heat exchanger to blow out air flow to accelerate heat dissipation of the first heat exchanger.
In some embodiments, the second heat exchange assembly comprises:
the second heat transfer element is used for being in heat conduction connection with the electric card module;
the second heat exchanger is used for refrigerating;
the second water pump assembly comprises a second water pump and a second pipeline which is communicated with the second heat transfer element and the second heat exchanger, and the second water pump is arranged on the second pipeline and controls the on-off of the second pipeline.
In some embodiments, the electrical card module is fixedly connected with the first heat exchange assembly and the second heat exchange assembly; or alternatively, the first and second heat exchangers may be,
the electric card module is movably connected with the first heat exchange assembly and the second heat exchange assembly.
In some embodiments, in the case that the electrical card module is movably connected to the first heat exchange assembly and the second heat exchange assembly, the method further comprises:
the driving assembly is connected with the electric card module to drive the electric card module to move towards the first heat exchange assembly so as to be in heat conduction connection with the first heat exchange assembly, or drive the electric card module to move towards the second heat exchange assembly so as to be in heat conduction connection with the second heat exchange assembly.
In some embodiments, in the case that the electric card module is fixedly connected with the first heat exchange assembly and the second heat exchange assembly, the first heat transfer element of the first heat exchange assembly and the second heat transfer element of the second heat exchange assembly are respectively and fixedly connected to two sides of the heat insulation element of the electric card module, so as to accelerate heat or cold transfer.
In some embodiments, the apparatus includes the electrical card refrigeration system provided in the previous embodiments.
The electric card refrigerating system and the electric card refrigerating equipment provided by the embodiment of the disclosure can realize the following technical effects:
the heat generated by the electric card module is transferred to the first heat exchange assembly to cool, and the cold generated by the electric card module is transferred to the second heat exchange assembly and is transferred to the associated equipment for refrigeration through the second heat exchange assembly; the first heat exchange component works when the electric card module generates heat when being electrified; the electric card module generates cold when in power failure, the second heat exchange assembly works, the first heat exchange assembly and the second heat exchange assembly work alternately, effective separation of heat and cold generated by the electric card module is achieved, the cold transferred by the second heat exchange assembly is utilized, and the purpose of industrial mass production application is achieved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:
FIG. 1 is a schematic diagram of a frame of the electrical card refrigeration system provided by embodiments of the present disclosure;
FIG. 2 is a schematic diagram of the variation of heat/cold in the on/off condition of the electric card refrigeration system according to the embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a partial structure of the electric card refrigeration system provided by an embodiment of the present disclosure;
FIG. 4 is another schematic diagram of the electrical card refrigeration system provided by an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of the electrical card module according to the embodiment of the present disclosure.
Reference numerals:
10: an electrical card module; 101: an electrical card assembly; 102: a first heat conductive element; 103: a second heat conductive element; 104: a heat insulating element; 105: a hollowed-out part; 20: a first heat exchange assembly; 201: a first heat transfer element; 202: a first heat exchanger; 203: a first water pump; 204: a first pipeline; 205: a blower; 30: a second heat exchange assembly; 301: a second heat transfer element; 302: a second heat exchanger; 303: a second water pump; 304: and a second pipeline.
Detailed Description
So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.
The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are used primarily to better describe embodiments of the present disclosure and embodiments thereof and are not intended to limit the indicated device, element, or component to a particular orientation or to be constructed and operated in a particular orientation. Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the embodiments of the present disclosure will be understood by those of ordinary skill in the art in view of the specific circumstances.
In addition, the terms "disposed," "connected," "secured" and "affixed" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.
The term "plurality" means two or more, unless otherwise indicated.
In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.
It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other.
Referring to fig. 1 to 5, an embodiment of the present disclosure provides an electric card refrigeration system, which includes an electric card module 10, a first heat exchange assembly 20 and a second heat exchange assembly 30, where the electric card module 10 is used to generate an electric card effect when being connected to and disconnected from an external power supply; the first heat exchange component 20 is arranged on one side of the electric card module 10 and is in heat conduction connection with the electric card module 10 so as to exchange heat with the electric card module 10, transfer heat of the electric card module 10 and dissipate heat of the electric card module 10; the second heat exchange component 30 is arranged on the other side of the electric card module 10 and is in heat conduction connection with the electric card module 10 so as to transfer the cold energy of the electric card module 10; the first heat exchange assembly 20 and the second heat exchange assembly 30 work alternately and correspond to the power on or power off of the electric card module 10 respectively, so that heat and cold generated in the electric card effect of the electric card module 10 are separated.
By adopting the electric card refrigeration system provided by the embodiment of the disclosure, heat generated by the electric card module 10 is transferred to the first heat exchange assembly 20 for heat dissipation and temperature reduction, and cold generated by the electric card module 10 is transferred to the second heat exchange assembly 30 and is transferred to associated equipment for refrigeration through the second heat exchange assembly 30; wherein, the electric card module 10 generates heat when electrified, and the first heat exchange assembly 20 works; the electric card module 10 generates cold energy when power is off, the second heat exchange assembly 30 works, the first heat exchange assembly 20 and the second heat exchange assembly 30 work alternately, the effective separation of heat and cold energy generated by the electric card module 10 is realized, the cold energy transferred by the second heat exchange assembly 30 is utilized, and the purpose of industrial mass production application is realized.
The electric card module 10 is connected with an external power supply, the external power supply is periodically electrified and powered off with the electric card module 10, and the electric card module 10 realizes periodic heat release and heat absorption, and the first heat exchange assembly 20 and the second heat exchange assembly 30 alternately work. Under the condition that the external power supply is electrified with the electric card module 10, the electric card module 10 releases heat, and the heat is transferred to the first heat exchange assembly 20 and is radiated and cooled through the first heat exchange assembly 20. When the external power supply and the electric card module 10 are powered off in the power-on state, the electric card module 10 absorbs heat, the second heat exchange assembly 30 is connected with the electric card module 10, the cold energy generated when the electric card module 10 absorbs heat is transferred to the second heat exchange assembly 30, and the cold energy is transferred to corresponding external devices or equipment through the second heat exchange assembly 30, so that the aim of refrigeration is fulfilled. Wherein the second heat exchange assembly 30 is not operated in the case where the first heat exchange assembly 20 is operated. In the case where the second heat exchange assembly 30 is operated, the first heat exchange assembly 20 is not operated. In this way, an efficient separation of heat and cold generated by the electric card module 10 in the electric card effect can be achieved.
Optionally, the electrical card module 10 includes: the electric card assembly 101 comprises an electric card element and film electrodes which are covered on and attached to two opposite sides of the electric card element; the heat conducting assembly comprises a first heat conducting element 102 and a second heat conducting element 103 which are oppositely arranged, and the first heat conducting element 102 and the second heat conducting element 103 are respectively connected to two opposite sides of the electric card assembly 101 in a heat conducting mode so as to be in heat transfer with the electric card assembly 101.
The thin film electrode covers and is attached to the side face of the electric card element to form the electric card assembly 101, so that the electric card element is powered on and powered off to generate an electric card effect, and the surface of the electric card assembly 101 is smooth, so that when the electric card assembly 101 is in heat conduction connection with the heat conduction assembly, the effective contact area between the electric card assembly 101 and the heat conduction assembly can be ensured, and the heat transfer efficiency between the electric card assembly 101 and the heat conduction assembly is improved. In addition, in the electric card module 10, the electric card assembly 101 is arranged between the first heat conducting element 102 and the second heat conducting element 103, so that the electric card assembly 101 can be packaged for use, and industrial preparation and application of the electric card module 10 are realized.
The electrical card element may be one or more. The number of the electric card elements can be selected according to actual needs, so that the electric card module 10 achieves the purpose of controllable cooling capacity. In the case where the electrical card assembly 101 includes a plurality of electrical card elements, the plurality of electrical card elements are arranged side by side and lie in the same plane.
The film electrode covers and is attached to two sides of the electric card element, and the film electrode is externally connected with a power supply through a wire, so that the effect of fixing the electric card element can be realized, and an electric field can be applied to the electric card element, thereby generating an electric card effect. In addition, after the thin film electrode covers the side surface of the electric card element, the uneven surface of the electric card element can be filled, so that the outer surface of the electric card assembly 101 is kept level, and the problem that the heat transfer efficiency of the electric card element with the heat conducting plate is low due to the uneven surface is solved.
The electrical card assembly 101 is in thermally conductive connection with the thermally conductive assembly, in particular by providing the electrical card assembly 101 between the first thermally conductive element 102 and the second thermally conductive element 103. Thus, in the case where the card assembly 101 emits heat, the heat emitted from the card assembly 101 is transferred to the first heat conductive member 102, and the heat is transferred to the first heat exchange assembly 20 through the first heat conductive member 102 for heat dissipation. In the case that the electric card assembly 101 absorbs heat, the electric card assembly 101 absorbs heat and cools, the generated cold is transferred to the second heat exchange assembly 30 through the second heat conduction element 103, and the cold is transferred to the outside through the second heat exchange assembly 30, so as to achieve the purpose of cooling.
Alternatively, the first heat conductive element 102 may be a heat conductive sheet. Alternatively, the second heat conductive element 103 may be a heat conductive sheet.
Alternatively, the electrical card element may be of circular, square configuration. Wherein the specific dimensions of the electrical card element are tailored to the requirements. The electric card element can be made of ferroelectric material powder through proportioning, ball milling, drying, grinding, tabletting and sintering. However, the material of the electrical card element is not limited to being made of ferroelectric material.
For convenience of description and distinction, the thin film electrodes on both sides of the electrical card element are defined as a first thin film electrode and a second thin film electrode, respectively. The first thin film electrode is in heat conduction connection with the first heat conduction element 102, and the second thin film electrode is in heat conduction connection with the second heat conduction element 103. The first film electrode and the second film electrode are respectively provided with pins for externally connecting a power supply.
In practical applications, in order to improve heat conduction efficiency and ensure safety, the first heat conduction element 102 and the second heat conduction element 103 are made of insulating materials with high heat conduction. Such as aluminum nitride, silicon carbide, gallium nitride, boron nitride, aluminum oxide, and the like. In addition, the first and second heat conductive members 102 and 103 may have a certain thickness to store cold or heat.
Optionally, conductive paint is coated on two opposite sides of the electric card element, so that the electric card element is attached to and electrically connected with the film electrode.
The two opposite sides of the electric card element are coated with conductive paint, so that the electric card element is attached to the thin film electrode and is in conductive connection, and uneven parts on the surface of the electric card element can be filled, so that the outer side surface of the electric card assembly 101 formed by the electric card element and the thin film electrode is kept flat. In the case where the electric card assembly 101 is thermally connected with the thermally conductive sheet assembly, an effective contact area of the side surface of the electric card assembly 101 and the side surface of the thermally conductive sheet is ensured, and heat transfer efficiency is improved.
Alternatively, the conductive paint may be selected from conductive silver paste. The conductive silver paste can ensure not only the electrical conductivity between the electric card element and the film electrode, but also the thermal conductivity between the electric card element and the film electrode. In addition, the conductive silver paste can be filled in the uneven area of the surface of the electric card element so as to level the surface of the electric card element. The film electrode can be adhered to the electric card element through conductive silver paste, so that the film electrode and the electric card element can be assembled in a adhering mode.
Optionally, the side of the electrical card assembly 101 is provided with a heat conducting medium to be in heat conducting connection with the heat conducting assembly.
The side of the electric card assembly 101 is provided with a heat-conducting medium, and heat or cold generated by the electric card effect of the electric card element can be quickly transferred to the heat-conducting assembly through the heat-conducting medium. In addition, not only can heat or cold be transferred from the electric card assembly 101 to the heat-conducting assembly through the heat-conducting medium, but also the purpose of fixedly connecting the electric card assembly 101 and the heat-conducting fin assembly is achieved. The electrical card assembly 101 is bonded to the thermally conductive assembly by a thermally conductive medium.
The side of the card assembly 101, i.e., the surface of the membrane electrode. The uneven area may exist on the surface of the thin film electrode, and the uneven area on the surface of the thin film electrode is filled with the heat conducting medium, so that the effective contact area between the electric card assembly 101 and the heat conducting fin is ensured, and the heat transfer efficiency between the electric card assembly 101 and the heat conducting fin is ensured.
Optionally, the electric card module 10 further includes: the heat insulating element 104 is in a block or sheet structure; the heat insulating element 104 is configured with a hollow portion 105 to accommodate the electrical card assembly 101 and the heat conducting assembly.
Through the hollowed-out part 105 constructed by the heat insulation element 104, the electric card assembly 101 and the heat conduction assembly are embedded in the heat insulation element 104, which is equivalent to sealing treatment along the circumferential direction of the electric card assembly 101 and the heat conduction assembly. Thus, the electric card module 10 not only has an insulating function, but also has a heat preservation function, so that heat or cold generated by the electric card module 10 is transferred to the first heat exchange assembly 20 or the second heat exchange assembly 30, and loss of the heat or cold to the surrounding environment is reduced.
The insulating element 104 is made of a material with low thermal conductivity so as to perform a thermal insulation function.
In practice, the insulating element 104 also serves to space the first heat exchange assembly 20 from the second heat exchange assembly 30. In this way, the heat insulation element 104 can effectively space the first heat exchange assembly 20 and the second heat exchange assembly 30, and the heat or cold generated by the electric card assembly 101 is repeatedly diffused between the two, so as to affect the refrigeration effect.
Alternatively, pins of the electrical card assembly 101 may be connected to an external power source through the insulating element 104, or the insulating element 104 may have a connector embedded therein for conducting an external power source, with pins of the electrical card assembly 101 being conductively connected to the connector.
Optionally, the first heat exchange assembly 20 includes: a first heat transfer element 201 for thermally conductive connection with the electrical card module 10; a first heat exchanger 202 for heat dissipation; the first water pump 203 assembly comprises a first water pump 203 and a first pipeline 204 which is communicated with the first heat transfer element 201 and the first heat exchanger 202, wherein the first water pump 203 is arranged on the first pipeline 204 and controls the on-off of the first pipeline 204.
The first conduit 204 is connected in series with the first heat transfer element 201, the first water pump 203 and the first heat exchanger 202. A heat-transferable liquid flows in the first conduit 204. Wherein the first pipeline 204 controls the flow of liquid through the first water pump 203. The heat-transferable liquid may be water, refrigerant or other heat-transferable medium capable of being heated for phase change.
In the case of the electricity card module 10 being energized to release heat, the first heat exchange assembly 20 operates, the first heat transfer element 201 is in heat conductive connection with the electricity card module 10, and the first water pump 203 in the first water pump 203 assembly operates to circulate the liquid in the first pipe 204. When the liquid in the first pipeline 204 flows through the first heat transfer element 201, the liquid exchanges heat with the electric card module 10, receives heat of the electric card module 10, then continues to flow, transfers the heat to the first heat exchanger 202, and performs heat dissipation and temperature reduction through the first heat exchanger 202.
Optionally, the first heat exchange assembly 20 further includes: the fan 205 is disposed at a side portion of the first heat exchanger 202 to blow out air flow to accelerate heat dissipation of the first heat exchanger 202.
The fan 205 is arranged at the side part of the first heat exchanger 202, when the liquid with higher temperature flows through the first heat exchanger 202, the liquid in the first pipeline 204 can not only exchange heat with the first heat exchanger 202 to perform heat dissipation and cooling, but also can work through the fan 205, the blown air flow acts on the first heat exchanger 202 to accelerate the heat dissipation of the first heat exchanger 202, so that the heat dissipation efficiency of the first heat exchange assembly 20 is improved.
Optionally, the second heat exchange assembly 30 includes: a second heat transfer element 301 for thermally conductive connection with the electrical card module 10; a second heat exchanger 302 for cooling; the second water pump 303 assembly comprises a second water pump 303 and a second pipeline 304 which is communicated with the second heat transfer element 301 and the second heat exchanger 302, and the second water pump 303 is arranged on the second pipeline 304 and controls the on-off of the second pipeline 304.
The second conduit 304 is connected in series with the second heat transfer element 301, the second water pump 303 and the second heat exchanger 302. A heat-transferable liquid flows in the second conduit 304. Wherein the second pipe 304 controls the flow of liquid by means of a second water pump 303. The heat-transferable liquid may be water, refrigerant or other heat-transferable medium capable of being heated for phase change.
In the case of power failure and heat absorption of the electric card module 10, the second heat exchange assembly 30 works, the second heat transfer element 301 is in heat conduction connection with the electric card module 10, and the second water pump 303 in the second water pump 303 assembly works so as to enable the liquid in the second pipeline 304 to circularly flow. When the liquid in the second pipeline 304 flows through the second heat transfer element 301, the liquid exchanges heat with the electric card module 10, the cold generated by the electric card module 10 is transferred to the second heat transfer element 301, then the liquid continues to flow, and the cold is transferred to the second heat exchanger 302, so that the purpose of refrigeration is achieved.
The disclosed embodiments efficiently transfer heat and cold generated by the electrical card module 10 in the electrical card effect by using an intermittent fluid heat transfer manner, thereby achieving effective separation of heat and cold.
Alternatively, the first heat transfer element may be a water cooled head. However, the first heat transfer member is not limited to the water-cooled head, and may be, for example, other member structures having a function of transferring heat and allowing liquid to flow therein.
Alternatively, the second heat transfer element may be a water cooled head. However, the second heat transfer member is not limited to the water-cooled head, and may be, for example, other member structures having a function of transferring heat and allowing liquid to flow therein.
Optionally, the electric card module 10 is fixedly connected with the first heat exchange assembly 20 and the second heat exchange assembly 30; or, the electric card module 10 is movably connected to the first heat exchange assembly 20 and the second heat exchange assembly 30.
In the case where the electric card module 10 is fixedly connected to the first heat exchange assembly 20 and the second heat exchange assembly 30, it can be understood that: the electric card module 10, the first heat exchange assembly 20 and the second heat exchange assembly 30 are relatively fixed, and the first heat exchange assembly 20 and the second heat exchange assembly 30 are respectively arranged on two sides of the electric card module 10. The first heat exchange assembly 20 and the second heat exchange assembly 30 are protected from heat or cold relative diffusion therebetween by the insulating element 104.
In the case that the electric card module 10 is movably connected to the first heat exchange assembly 20 and the second heat exchange assembly 30, the electric card module 10 is powered on, and then the electric card module 10 is in direct contact with the first heat exchange assembly 20 to transfer heat. When the electric card module 10 is powered off, the electric card module 10 moves from the first heat exchange assembly 20 to the second heat exchange assembly 30 and is in direct contact with the second heat exchange assembly 30 to transfer cold energy, so that the effective separation of heat and cold energy generated by the electric card module 10 in the electric card effect is realized.
Optionally, in the case that the electric card module 10 is movably connected to the first heat exchange assembly 20 and the second heat exchange assembly 30, the method further includes: the driving assembly is connected with the electric card module 10 to drive the electric card module 10 to move towards the first heat exchange assembly 20 so as to be in heat conduction connection with the first heat exchange assembly 20, or drive the electric card module 10 to move towards the second heat exchange assembly 30 so as to be in heat conduction connection with the second heat exchange assembly 30.
The driving assembly drives the electric card module 10 to reciprocate between the first heat exchange assembly 20 and the second heat exchange assembly 30, so that the electric card module 10 is adapted to the conditions of periodical power on and off and periodical heat release and heat absorption, and the effective separation of heat and cold generated by the electric card module 10 in an electric card effect is realized.
The electric card module 10 is powered on, and the driving assembly drives the electric card module 10 to move to the first heat exchange assembly 20, so that the electric card module 10 is in heat conduction connection with the first heat exchange assembly 20 to transfer heat. The electric card module 10 is powered off, and the driving assembly drives the electric card module 10 to move to the second heat exchange assembly 30, so that the electric card module 10 is in heat conduction connection with the second heat exchange assembly 30 to transfer cold energy.
Optionally, in the case that the electric card module 10 is fixedly connected to the first heat exchange assembly 20 and the second heat exchange assembly 30, the first heat transfer element 201 of the first heat exchange assembly 20 and the second heat transfer element 301 of the second heat exchange assembly 30 are respectively fixedly connected to two sides of the heat insulation element 104 of the electric card module 10, so as to accelerate heat or cold transfer.
The first heat transfer element 201 of the first heat exchange assembly 20 and the second heat transfer element 301 of the second heat exchange assembly 30 are respectively and fixedly connected with two sides of the heat insulation element 104 of the electric card module 10, so that not only can the relative diffusion of heat or cold between the first heat transfer element 201 and the second heat transfer element 301 be avoided, but also the effective separation of the hot end and the cold end, namely the effective interval between the first heat transfer element 201 and the second heat transfer element 301, can be realized.
In practical application, the electric card module 10 is fixedly connected with the first heat exchange assembly 20 and the second heat exchange assembly 30, so that on one hand, the structure is stable and reliable, on the other hand, the loss of corresponding components is reduced, and in addition, the effective contact area between the electric card module 10 and the first heat exchange assembly 20 and the second heat exchange assembly 30 can be ensured, so that the heat transfer efficiency between the electric card module 10 and the first heat exchange assembly 20 and the second heat exchange assembly 30 is ensured.
Optionally, the side area of the insulating element 104 is larger than the heat transfer area of the first heat transfer element 201. Optionally, the side area of the insulating element 104 is larger than the heat transfer area of the second heat transfer element 301. In this way, the first heat transfer element 201 and the second heat transfer element 301 can be better isolated.
Optionally, the first heat transfer element 201 and the second heat transfer element 301 are each detachably connected to the insulating element 104. Optionally, the first heat transfer element 201 and the second heat transfer element 301 are connected by fasteners, wherein the fasteners extend through the insulating element 104. In this way, an effective fixed connection between the first heat transfer element 201, the heat insulating element 104 and the second heat transfer element 301 can be ensured. It should be noted that the fastener used herein is preferably an insulating plastic to reduce heat transfer.
As shown in conjunction with fig. 1-5, embodiments of the present disclosure provide an apparatus including the electrical card refrigeration system provided in the above-described embodiments. The electric card refrigerating system comprises an electric card module 10, a first heat exchange assembly 20 and a second heat exchange assembly 30, wherein the electric card module 10 is used for generating an electric card effect with the on-off of an external power supply; the first heat exchange component 20 is arranged on one side of the electric card module 10 and is in heat conduction connection with the electric card module 10 so as to exchange heat with the electric card module 10, transfer heat of the electric card module 10 and dissipate heat of the electric card module 10; the second heat exchange component 30 is arranged on the other side of the electric card module 10 and is in heat conduction connection with the electric card module 10 so as to transfer the cold energy of the electric card module 10; the first heat exchange assembly 20 and the second heat exchange assembly 30 work alternately and correspond to the power on or power off of the electric card module 10 respectively, so that heat and cold generated in the electric card effect of the electric card module 10 are separated.
With the device provided by the embodiment of the present disclosure, heat generated by the electric card module 10 is transferred to the first heat exchange assembly 20 to perform heat dissipation and cooling, and cold generated by the electric card module 10 is transferred to the second heat exchange assembly 30 and is transferred to the associated device through the second heat exchange assembly 30 to perform refrigeration; wherein, the electric card module 10 generates heat when electrified, and the first heat exchange assembly 20 works; the electric card module 10 generates cold energy when power is off, the second heat exchange assembly 30 works, the first heat exchange assembly 20 and the second heat exchange assembly 30 work alternately, the effective separation of heat and cold energy generated by the electric card module 10 is realized, the cold energy transferred by the second heat exchange assembly 30 is utilized, the purpose of refrigeration is realized, and the purpose of industrial mass production application can be realized.
The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may include structural and other modifications. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. An electrical card refrigeration system comprising:
the electric card module is used for generating an electric card effect by switching on and switching off an external power supply;
the first heat exchange component is arranged on one side of the electric card module and is in heat conduction connection with the electric card module so as to exchange heat with the electric card module, transfer heat of the electric card module and dissipate heat of the electric card module;
the second heat exchange component is arranged on the other side of the electric card module and is in heat conduction connection with the electric card module so as to transfer the cold energy of the electric card module;
the first heat exchange assembly and the second heat exchange assembly work alternately and correspond to the power on or power off of the electric card module respectively, so that heat and cold generated in the electric card effect of the electric card module are separated.
2. The electrical card refrigeration system of claim 1, wherein the electrical card module comprises:
the electric card assembly comprises an electric card element and film electrodes which are covered on and attached to two opposite sides of the electric card element;
the heat conduction assembly comprises a first heat conduction element and a second heat conduction element which are oppositely arranged, and the first heat conduction element and the second heat conduction element are respectively in heat conduction connection with two opposite sides of the electric card assembly so as to transfer heat with the electric card assembly.
3. The electrical card refrigeration system of claim 2, wherein the electrical card module further comprises:
the heat insulation element is in a block or sheet structure;
the heat insulation element is provided with a hollowed-out part for accommodating the electric card assembly and the heat conduction assembly.
4. The electrical card refrigeration system of claim 1, wherein the first heat exchange assembly comprises:
the first heat transfer element is used for being in heat conduction connection with the electric card module;
the first heat exchanger is used for radiating heat;
the first water pump assembly comprises a first water pump and a first pipeline which is communicated with the first heat transfer element and the first heat exchanger, and the first water pump is arranged on the first pipeline and controls the on-off of the first pipeline.
5. The electrical card refrigeration system of claim 4, wherein the first heat exchange assembly further comprises:
the fan is arranged at the side part of the first heat exchanger to blow out air flow to accelerate heat dissipation of the first heat exchanger.
6. The electrical card refrigeration system of claim 1, wherein the second heat exchange assembly comprises:
the second heat transfer element is used for being in heat conduction connection with the electric card module;
the second heat exchanger is used for refrigerating;
the second water pump assembly comprises a second water pump and a second pipeline which is communicated with the second heat transfer element and the second heat exchanger, and the second water pump is arranged on the second pipeline and controls the on-off of the second pipeline.
7. The electric card refrigeration system of any one of claims 1 to 6 wherein said electric card module is fixedly connected to said first heat exchange assembly and said second heat exchange assembly; or alternatively, the first and second heat exchangers may be,
the electric card module is movably connected with the first heat exchange assembly and the second heat exchange assembly.
8. The electrical card refrigeration system of claim 7, wherein, with the electrical card module movably coupled to the first heat exchange assembly and the second heat exchange assembly, further comprising:
the driving assembly is connected with the electric card module to drive the electric card module to move towards the first heat exchange assembly so as to be in heat conduction connection with the first heat exchange assembly, or drive the electric card module to move towards the second heat exchange assembly so as to be in heat conduction connection with the second heat exchange assembly.
9. The electrical card refrigeration system of claim 7, wherein,
under the condition that the electric card module is fixedly connected with the first heat exchange assembly and the second heat exchange assembly, the first heat transfer element of the first heat exchange assembly and the second heat transfer element of the second heat exchange assembly are respectively and fixedly connected to two sides of the heat insulation element of the electric card module so as to accelerate heat or cold transfer.
10. An apparatus comprising the electrical card refrigeration system of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210407545.9A CN116951811A (en) | 2022-04-19 | 2022-04-19 | Electric card refrigerating system and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210407545.9A CN116951811A (en) | 2022-04-19 | 2022-04-19 | Electric card refrigerating system and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116951811A true CN116951811A (en) | 2023-10-27 |
Family
ID=88447874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210407545.9A Pending CN116951811A (en) | 2022-04-19 | 2022-04-19 | Electric card refrigerating system and equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116951811A (en) |
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2022
- 2022-04-19 CN CN202210407545.9A patent/CN116951811A/en active Pending
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