CN218056573U - Copper-based circuit board transferring tool - Google Patents
Copper-based circuit board transferring tool Download PDFInfo
- Publication number
- CN218056573U CN218056573U CN202222142659.3U CN202222142659U CN218056573U CN 218056573 U CN218056573 U CN 218056573U CN 202222142659 U CN202222142659 U CN 202222142659U CN 218056573 U CN218056573 U CN 218056573U
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- China
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- circuit board
- copper
- board
- based circuit
- epoxy resin
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Abstract
The utility model provides a frock is transported to copper base circuit board, include: the epoxy board is formed with a plurality of rectangle standing grooves that are the array and arrange on the epoxy board, and the inner wall edge of rectangle standing groove is provided with a plurality of backup pads to the inboard of rectangle standing groove with protruding, and the bottom surface of backup pad flushes with the bottom surface of epoxy board, and the backup pad thickness is less than the epoxy board thickness, and the top of backup pad forms the space of placing that is used for placing copper base circuit board, and the backup pad sets up corresponding to the high frequency material part of copper base circuit board. The utility model discloses not only can avoid the high frequency material part pressurized on the circuit board pit or damage, fall the board scheduling problem appear in front and back process moving in-process, still can improve production efficiency.
Description
Technical Field
The utility model relates to a circuit board field of making, in particular to frock is transported to copper base circuit board.
Background
The copper-based circuit board is composed of a high-frequency material and a copper base (a copper plate with the thickness of 3-5 mm), the high-frequency material (PTFE) on the copper-based circuit board is soft and is easy to generate pits when being pressed, and the copper base is generally designed with steps.
SUMMERY OF THE UTILITY MODEL
The utility model provides a frock is transported to copper base circuit board to solve at least one above-mentioned technical problem.
In order to solve the above problem, as an aspect of the present invention, there is provided a copper-based circuit board transfer tool, including: the novel copper-based circuit board comprises an epoxy resin board, wherein a plurality of rectangular placing grooves arranged in an array mode are formed in the epoxy resin board, a plurality of supporting plates are arranged at the edge of the inner wall of each rectangular placing groove in a protruding mode towards the inner side of each rectangular placing groove, the bottom surfaces of the supporting plates are flush with the bottom surface of the epoxy resin board, the thickness of each supporting plate is smaller than that of the epoxy resin board, a placing space for placing a copper-based circuit board is formed above each supporting plate, and the supporting plates are arranged corresponding to high-frequency material portions of the copper-based circuit board.
Preferably, the support plate is disposed at least one corner of the rectangular placement groove.
Preferably, at least one support plate is arranged at the straight edge of the rectangular placement groove.
Preferably, the thickness of the epoxy resin plate is 3-5mm, and the thickness of the supporting plate is 1-1.5mm.
Since the technical scheme is used, the utility model discloses can put into the rectangle standing groove with the line face of copper base circuit board to the direction of backup pad when using, then remove the epoxy board, can be with circuit board operation to next process on it, still can the utility model discloses make all copper base circuit boards on it cross horizontal chemical processor simultaneously after wholly filling with copper base circuit board, not only can avoid the high frequency material part pressurized on the circuit board to appear the pit or bump, fall the board scheduling problem in front and back process moving in-process, still can improve production efficiency.
Drawings
Fig. 1 schematically shows a partial enlarged view of the invention.
Reference numbers in the figures: 1. an epoxy board; 2. a rectangular placing groove; 3. and a support plate.
Detailed Description
The following detailed description of the embodiments of the invention, however, is intended to cover by the appended claims a number of different forms which may be practiced.
As an aspect of the utility model, a copper base circuit board transports frock is provided, especially can be used to in copper base circuit board semi-manufactured goods operation and the chemical treatment process, include: the circuit board comprises an epoxy resin board 1, wherein a plurality of rectangular placing grooves 2 arranged in an array are formed in the epoxy resin board 1, a plurality of supporting plates 3 are arranged at the edges of the inner walls of the rectangular placing grooves 2 and protrude towards the inner sides of the rectangular placing grooves 2, the bottom surfaces of the supporting plates 3 are flush with the bottom surface of the epoxy resin board 1, the thickness of each supporting plate 3 is smaller than that of the epoxy resin board 1, and a placing space for placing a copper-based circuit board is formed above each supporting plate 3. The epoxy board 1 is preferably rectangular. When the copper-based circuit board is processed, steps can be routed at positions corresponding to four corners or edges of the circuit board to form the supporting plate 3, and the supporting plate 3 is arranged corresponding to the high-frequency material part of the copper-based circuit board.
Preferably, the supporting plate 3 is disposed at least one corner of the rectangular placement groove 2. Preferably, at least one of the support plates 3 is provided at a straight edge of the rectangular placement groove 2. Thus, the corner portions and the edge portions of the copper-based circuit board in the rectangular placement groove 2 can be supported.
Preferably, the thickness of the epoxy resin plate 1 is 3-5mm, and the thickness of the support plate 3 is 1-1.5mm.
During the use, put into the copper base circuit board that needs rotate or chemical treatment in every rectangle standing groove 2 of epoxy board 1 to can move copper base circuit board between the front and back process, when the chemical treatment production line was crossed to needs, can directly put the product the utility model discloses go up the chemical treatment production line, improved production efficiency greatly, in addition the utility model discloses repeatedly usable has saved the cost.
Since the technical scheme is used, the utility model discloses can put into rectangle standing groove 2 with the line face of copper base circuit board to the direction of backup pad 3 when using, then remove epoxy board 1, can be with circuit board operation to next process on it, still can the utility model discloses wholly fill and make all copper base circuit boards on it cross horizontal chemical processor simultaneously behind the copper base circuit board, not only can avoid the high frequency material part pressurized on the circuit board to appear the pit or bump, fall the board scheduling problem in front and back process moving in-process, still can improve production efficiency.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The utility model provides a copper base circuit board transports frock which characterized in that includes: the copper-based circuit board comprises an epoxy resin board (1), wherein a plurality of rectangular placing grooves (2) arranged in an array are formed in the epoxy resin board (1), a plurality of supporting plates (3) are arranged at the edges of the inner walls of the rectangular placing grooves (2) in a protruding mode towards the inner sides of the rectangular placing grooves (2), the bottom surfaces of the supporting plates (3) are flush with the bottom surface of the epoxy resin board (1), the thickness of the supporting plates (3) is smaller than that of the epoxy resin board (1), a placing space for placing the copper-based circuit board is formed above the supporting plates (3), and the supporting plates (3) are arranged corresponding to the high-frequency material portion of the copper-based circuit board.
2. Copper-based circuit board transfer tooling according to claim 1, wherein the support plate (3) is arranged at least one corner of the rectangular placing groove (2).
3. Copper-based circuit board transferring tool according to claim 1, wherein at least one support plate (3) is arranged at a straight edge of the rectangular placing groove (2).
4. The copper-based circuit board transfer tool according to claim 1, wherein the thickness of the epoxy resin plate (1) is 3-5mm, and the thickness of the support plate (3) is 1-1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222142659.3U CN218056573U (en) | 2022-08-12 | 2022-08-12 | Copper-based circuit board transferring tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222142659.3U CN218056573U (en) | 2022-08-12 | 2022-08-12 | Copper-based circuit board transferring tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218056573U true CN218056573U (en) | 2022-12-16 |
Family
ID=84404203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222142659.3U Active CN218056573U (en) | 2022-08-12 | 2022-08-12 | Copper-based circuit board transferring tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218056573U (en) |
-
2022
- 2022-08-12 CN CN202222142659.3U patent/CN218056573U/en active Active
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| GR01 | Patent grant | ||
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