CN107424977B - Smart card strip clamp plate and have its chip packaging system - Google Patents
Smart card strip clamp plate and have its chip packaging system Download PDFInfo
- Publication number
- CN107424977B CN107424977B CN201710730980.4A CN201710730980A CN107424977B CN 107424977 B CN107424977 B CN 107424977B CN 201710730980 A CN201710730980 A CN 201710730980A CN 107424977 B CN107424977 B CN 107424977B
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- China
- Prior art keywords
- strip
- chip
- pressing plate
- smart card
- platen
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Packages (AREA)
Abstract
The invention discloses a smart card strip pressing plate and a chip packaging system with the same, and relates to the technical field of smart card chip packaging. The smart card strip platen comprises: a platen base body (1), wherein a plurality of chip holes (11) are formed in the platen base body (1) along the length direction; the side of the pressing plate base body (1) contacted with the strip is provided with a convex pressing strip (12) only along the length direction of the strip, and the convex pressing strip (12) is used for pressing the strip. The chip packaging system includes a smart card tape platen as described above. The invention has the advantages that: the intelligent card strip pressing plate presses the strip by adopting the convex pressing strips, the convex pressing strips are arranged along the length direction of the pressing plate base body and are consistent with the moving direction of the strip, the chip holes are not provided with pressing strips in the width direction of the pressing plate base body, the strip cannot scratch gold wires of the chip in the moving process, the quality of chip packaging is ensured, and the stability and the service life of the chip are improved.
Description
Technical Field
The invention relates to the technical field of intelligent card chip packaging, in particular to an intelligent card strip pressing plate and a chip packaging system with the intelligent card strip pressing plate.
Background
In the smart card industry, smart card chip suppliers typically offer smart card manufacturers and developers chips packaged in strips as an important component of smart card components prior to production of finished smart cards. The strip is a circuit board of special glass fiber material similar to a film tape in appearance. The length is typically tens to hundreds of meters, and the width is typically only about 3.5 cm. Multiple rows of tens of thousands of smart card chips may be packaged on one strip. This strip is equivalent to tens of thousands of small circuit boards connected in series. This appearance and structure is well suited for fully automated production lines of smart card production lines, and thus smart card chip suppliers basically supply smart card manufacturers and developers with smart card chips packaged in strips. The manufacturing process of the smart card chip package strip mode of the smart card chip supplier comprises the steps of manufacturing a wafer of the smart card chip from a wafer factory, thinning and dicing the wafer into orderly arranged crystal grains, packaging the crystal grains of the smart card chip on the strip, then operating each crystal grain, and fixing the strip in the process of operating the crystal grains.
In the prior art, a pressing plate is generally adopted to press and fix the strip, and a chip hole is reserved on the pressing plate to perform various operations on the chip. As shown in fig. 1, the conventional pressing plate is provided with a plurality of chip holes according to the positions of the strips where chips are correspondingly placed, a convex edge is arranged on the periphery of one side, which is contacted with the strips, of each chip hole, the convex edge is contacted with the plane of the strips, and each chip position on the strips corresponds to one chip hole on the pressing plate. The raised edges on the pressing plate are easy to scratch gold wires when the strips move, the gold wires are hidden, the gold wires are difficult to find after scratch, the quality of products in batches is easy to cause, and the performance and the service life of the products are influenced.
Disclosure of Invention
It is an object of the present invention to provide a smart card strip press plate which solves or at least alleviates at least one of the problems of the prior art.
The technical scheme adopted by the invention is as follows: provided is a smart card strip platen comprising:
the chip module comprises a pressing plate substrate, a plurality of chip holes and a plurality of connecting plates, wherein the pressing plate substrate is provided with a plurality of chip holes along the length direction; the side of the pressing plate substrate, which is contacted with the strip, is only provided with a convex pressing strip along the length direction of the strip, and the convex pressing strip is used for pressing the strip.
Preferably, each chip hole on the pressing plate substrate corresponds to one chip position on the strip, and a plurality of rows of chip holes are arranged at positions corresponding to the chips on the strip.
Preferably, the plurality of raised pressing strips are arranged, and each row of chip holes is provided with one raised pressing strip on each side of the pressing plate substrate in the width direction.
Preferably, the length of the protruding pressing strip on the pressing plate base body is greater than or equal to the total length of each row of chip holes, and the total length of the chip holes is the length of each row of chip holes on the pressing plate base body.
Preferably, a plurality of rows of through grooves are formed in one side, in contact with the strip, of the pressing plate base body in the width direction, the through grooves extend in the length direction of the pressing plate base body, and each row of through grooves corresponds to a row of chip placement positions on the strip.
Preferably, the through grooves are recessed toward the inside of the platen base, each row of through grooves forms ribs on both sides of the platen base in the width direction, and the raised bead is provided on the ribs.
Preferably, in each row of chip holes on the platen base, two adjacent chip holes are separated by a partition rib which is lower than the surface of the platen base on the side away from the tape direction.
The invention also provides a chip packaging system comprising the smart card strip platen as described in any one of the above.
In the above-described chip packaging system, preferably, the chip packaging system further comprises a vacuum adsorption device; the strip conveying device is characterized in that the strip conveying device is pressed on a supporting bottom plate through a pressing plate, a plurality of through holes are formed in the supporting bottom plate, and the through holes are connected with the vacuum adsorption device and used for adsorbing the strip.
The invention has the beneficial effects that:
the smart card strip pressing plate provided by the invention has the advantages that the strip is pressed and fixed by adopting the convex pressing strips, the convex pressing strips are arranged along the length direction of the pressing plate base body and are consistent with the moving direction of the strip, the chip holes are not provided with pressing strips in the width direction of the pressing plate base body, the strip cannot scratch chips and gold wires in the moving process, the quality of chip packaging is ensured, and the stability and the service life of chips are improved.
Drawings
Fig. 1 is a schematic structural view of a prior art smart card strip platen.
Fig. 2 is a schematic structural view of a smart card strip platen of the present invention.
Wherein, 1-pressing plate base body, 11-chip hole, 12-convex pressing bar, 13-through groove, 14-rib and 15-partition rib.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention become more apparent, the technical solutions in the embodiments of the present invention will be described in more detail below with reference to the accompanying drawings in the embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of the invention. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of the present invention.
As shown in fig. 2, a smart card strip pressing plate comprises a pressing plate base body 1, wherein a plurality of chip holes 11 are formed in the pressing plate base body 1 along the length direction, and the size and the position of the chip holes 11 correspond to the size and the arrangement position of chips placed on a strip; further, the number of rows of the chip holes 11 is the same as the number of rows of chips placed on the tape.
The side of the pressing plate base 1, which is in contact with the strip, is provided with a raised bead 12 only along the length direction of the strip, and the raised bead 12 is used for pressing the strip. The device has the advantages that the raised pressing strips 12 are arranged only in the length direction of the pressing plate substrate 1, the pressing strips are not arranged in the width direction, the phenomenon that the raised pressing strips scratch the chip gold wires in the moving process of the strip is avoided, the quality of chip packaging is improved, and the stability and the service life of chips are improved.
In this embodiment, the chip holes 11 are provided in three rows of 4, and the chip holes 11 on each platen base 1 correspond to one chip position on the tape. It will be appreciated that the number of chip holes 11 may be set according to actual use, for example, in an alternative embodiment, the chip holes 11 are arranged in 2 rows on the platen base 1; in another alternative embodiment, the chip holes 11 are provided in 4 rows on the platen base 1; the chip holes 11 may be provided in a plurality of rows corresponding to the positions of the chips on the tape.
In this embodiment, the number of the raised bead 12 is 6, and each row of chip holes 11 is provided with one raised bead 12 on each side of the platen base in the width direction. The strip pressing device has the advantages that the strip pressing is firmer, the phenomenon of strip movement in the process of operating the chip is avoided, and the packaging quality of the chip is improved. It will be appreciated that, according to the actual use requirement, the raised bead 12 may be provided in a plurality of strips, for example, in an alternative embodiment, two adjacent rows of chip holes share one raised bead, which simplifies the structure, and care should be taken to ensure the flatness of the raised bead 12 in common due to the increased pressing area of the raised bead 12; in another alternative embodiment, the raised bead 12 is provided only on both sides in the width direction of the platen base 1.
In this embodiment, the length of the protruding bead 12 on the platen base 1 is equal to or greater than the total length of each row of chip holes 11, and the total length of the chip holes 11 is the length of each row of chip holes 11 on the platen base 1, that is, the length from the first chip hole 11 to the last chip hole 11.
It will be appreciated that the raised bead 12 may also be arranged in sections along the length of the platen base 1, each section corresponding to the length of one chip hole 11.
In this embodiment, a plurality of rows of through grooves 13 are disposed on a side of the platen base 1 contacting the strip in the width direction, the through grooves 13 extend along the length direction of the platen base 1 and penetrate the entire length of the platen base 1, and each row of through grooves 13 corresponds to a placement position of a row of chips on the strip. The movable groove has the advantages that a certain movable space is reserved for the movement of the strip through the groove 13, the strip is prevented from being scratched with the pressing plate base body 1 in the moving process, and gold wires on the chip are prevented from being damaged.
In the present embodiment, the through grooves 13 are recessed toward the inside of the platen base 1, each through groove 13 forming ribs 14 on both sides in the width direction of the platen base 1, and the raised bead 12 is provided on the ribs 14. This has the advantage that the weight of the platen base 1 is reduced, while the strength of the platen base can be ensured by the ribs 14.
In the present embodiment, in each row of the chip holes 11 on the platen base 1, adjacent two of the chip holes 11 are separated by the partition rib 15, and the side of the partition rib 15 in the direction away from the tape is lower than the surface of the platen base 1. The advantage is that the conversion time from one chip hole 11 to another chip hole 11 is reduced during the operation of the chip, which is advantageous for improving the working efficiency.
In the present embodiment, the barrier ribs 15 are integrally formed with the platen base 1; it will be appreciated that the ribs 15 may also be detachably connected to the platen base 1, which has the advantage that the length of the chip holes 11 may be varied according to different chips, which is advantageous for improving the versatility of the platen.
The invention also provides a chip packaging system which comprises the smart card strip pressing plate. Adopt this smart card strip clamp plate encapsulation chip, the strip can not appear cutting and rubbing the phenomenon of chip gold thread in the removal in-process, has guaranteed the quality of chip encapsulation, is favorable to improving the stability and the life of chip.
In this embodiment, the chip packaging system further includes a vacuum adsorption device; the strip conveying device is characterized in that the strip conveying device is pressed on a supporting bottom plate through a pressing plate, a plurality of through holes are formed in the supporting bottom plate, and the through holes are connected with the vacuum adsorption device and used for adsorbing the strip. The vacuum adsorption device has the advantages that the vacuum adsorption device can assist the pressing plate to fix the strip, so that the strip cannot move in various operations on the chip, and the improvement of the packaging quality of the chip is facilitated.
Finally, it should be pointed out that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting. Although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A smart card strip platen comprising:
a platen base body (1), wherein a plurality of chip holes (11) are formed in the platen base body (1) along the length direction; the side of the pressing plate base body (1) contacted with the strip is provided with a convex pressing strip (12) only along the length direction of the strip, and the convex pressing strip (12) is used for pressing the strip.
2. The smart card strip platen as claimed in claim 1, wherein: the chip holes (11) on each pressing plate base body (1) correspond to one chip position on the strip, and a plurality of rows of chip positions on the strip correspond to the chip holes (11).
3. The smart card strip platen of claim 2, wherein: the number of the convex pressing strips (12) is multiple, and each row of chip holes (11) is provided with one convex pressing strip on each side of the pressing plate substrate in the width direction.
4. A smart card strap as defined in claim 3, wherein: the length of the convex pressing strip (12) on the pressing plate base body (1) is larger than or equal to the total length of each row of chip holes (11), and the total length of the chip holes (11) is the length of each row of chip holes (11) on the pressing plate base body (1).
5. The smart card strip platen as recited in claim 4, wherein: one side of the pressing plate base body (1) contacted with the strip is provided with a plurality of rows of through grooves (13) along the width direction, the through grooves (13) extend along the length direction of the pressing plate base body (1), and each row of through grooves (13) corresponds to a row of chip placement positions on the strip.
6. The smart card strip platen as recited in claim 5, wherein: the through grooves (13) are recessed toward the inside of the pressing plate base body (1), ribs (14) are formed on both sides of the pressing plate base body (1) in the width direction of each row of the through grooves (13), and the convex pressing strips (12) are arranged on the ribs (14).
7. The smart card strip platen as recited in claim 6, wherein: in each row of chip holes (11) on a platen base (1), two adjacent chip holes (11) are separated by a partition rib (15), and the side surface of the partition rib (15) in the direction away from the strip is lower than the surface of the platen base (1).
8. A chip packaging system comprising a smart card strap press as claimed in any one of claims 1 to 7.
9. The chip packaging system according to claim 8, wherein: the chip packaging system further comprises a vacuum adsorption device; the strip conveying device is characterized in that the strip conveying device is pressed on a supporting bottom plate through a pressing plate, a plurality of through holes are formed in the supporting bottom plate, and the through holes are connected with the vacuum adsorption device and used for adsorbing the strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710730980.4A CN107424977B (en) | 2017-08-23 | 2017-08-23 | Smart card strip clamp plate and have its chip packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710730980.4A CN107424977B (en) | 2017-08-23 | 2017-08-23 | Smart card strip clamp plate and have its chip packaging system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107424977A CN107424977A (en) | 2017-12-01 |
| CN107424977B true CN107424977B (en) | 2023-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710730980.4A Active CN107424977B (en) | 2017-08-23 | 2017-08-23 | Smart card strip clamp plate and have its chip packaging system |
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| CN (1) | CN107424977B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108213733B (en) * | 2017-12-30 | 2019-11-01 | 深圳市牧激科技有限公司 | Automatic laser cutting machine |
| CN111681972B (en) * | 2020-06-19 | 2024-03-15 | 中国航空无线电电子研究所 | Frock assisting gold removal of mounted chip with pins and Jin Tangxi removal method |
| CN112366252B (en) * | 2020-11-25 | 2021-06-04 | 深圳市中科创想科技有限责任公司 | Polycrystalline silicon wafer texturing clamping strip assembling, detecting and packaging process |
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| CN102593027A (en) * | 2011-11-30 | 2012-07-18 | 歌尔声学股份有限公司 | Die bonding pressing plate |
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| CN106783650A (en) * | 2016-12-14 | 2017-05-31 | 深圳清华大学研究院 | For the fixing device of the automatic routing of semiconductor laser |
| CN206332011U (en) * | 2016-11-25 | 2017-07-14 | 江苏钜芯集成电路技术股份有限公司 | Glue-dropping tool |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6562169B2 (en) * | 2001-01-17 | 2003-05-13 | International Business Machines Corporation | Multi-level web structure in use for thin sheet processing |
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|---|---|---|---|---|
| CN1723099A (en) * | 2002-08-02 | 2006-01-18 | 赛宝技术公司 | Method and apparatus for high volume assembly of radio frequency identification tags |
| CN200944402Y (en) * | 2006-03-10 | 2007-09-05 | 上海长丰智能卡有限公司 | Carrier tape for integrated circuit package |
| CN102593027A (en) * | 2011-11-30 | 2012-07-18 | 歌尔声学股份有限公司 | Die bonding pressing plate |
| CN103681521A (en) * | 2012-09-25 | 2014-03-26 | 英飞凌科技股份有限公司 | Semiconductor housing for smart cards |
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| Publication number | Publication date |
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| CN107424977A (en) | 2017-12-01 |
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